CN204795855U

CN204795855U - Wet -type plated metal base plate of prebored hole

Info

Publication number: CN204795855U
Application number: CN201520227737.7U
Authority: CN
Inventors: 陈宗仪; 滨泽晃久; 陈文钦; 邱建峰; 范士诚
Original assignee: Pomiran Metalization Research Co Ltd; Arakawa Chemical Industries Ltd; Taimide Tech Inc
Current assignee: Pomiran Metalization Research Co Ltd; Arakawa Chemical Industries Ltd; Taimide Tech Inc
Priority date: 2015-04-16
Filing date: 2015-04-16
Publication date: 2015-11-18
Anticipated expiration: 2025-04-16

Abstract

The utility model relates to a wet -type plated metal base plate of prebored hole, it is including a polyimide film, form a plurality of through holes on this polyimide film, a first metal layer is on polyimide film surface and through hole wall, and a second metal level is on this the first metal layer. Be a FCCL before the metallization operation earlier in preset position drilling, the operation of metallizing again can effectively reach reduction in production cost and reach the demand of fine rule, micropore and high density.

Description

The wet type plated metal substrate of prebored hole

Technical field

The utility model relates to a kind of wet type plated metal substrate of prebored hole.

Background technology

Pliability copper foil laminates (Flexiblecoppercladlaminate, FCCL) be widely used in electronic industry as circuit substrate (PCB), FCCL is except having light, thin and flexible advantage, also have outside the feature of electrical property, hot property and excellent heat resistance with polyimide film, its lower dielectric constant (Dk) property, the signal of telecommunication is transmitted fast, good hot property, assembly can be made to be easy to cooling, higher vitrification point (Tg), can make assembly well run at a higher temperature.

Flexible copper foil base material will be divided into two large classes, one is tradition then formulation three layers of flexible board substrate (3FCCL), another kind is novel without the large class of solid two layers of flexible board substrate (2FCCL) two, this two classes substrate material, its manufacture method is different, and its application product project is also different, and three layers of flexible board substrate are generally applied on large soft board product, two layers of flexible board substrate have compact advantage, can be applicable to higher-order soft board and manufacture.With regard to the manufacture method of existing two layers of flexible board substrate, application type (CastingType), pressing-type (Lamination), sputter type and four kinds, wet type plating method type can be divided into, it all forms metal level on a dielectric material, to complete the making of flexible metal substrate, described manufacture method is all prior art, does not add repeat in this.

And the manufacture of existing flexible circuit board, first aforementioned flexible copper foil substrate is holed, as shown in Figures 1 and 2, a substrate 12 with layers of copper 10 first carries out bore operation, make substrate 12 to be formed multiple perforation 14, conducting medium 16 is formed again (as traditional copper in perforation 14, the metallization such as electro-coppering and conventional conductive graphite micropore, to form conducting medium 16), finally carry out plating secondary copper 18 by flexible metal substrate 12 again, make above layers of copper 10 and form secondary copper 18 in perforation 14, and made on substrate 12, lower circuit turn-on, comparatively loaded down with trivial details in the manufacture of this kind of existing flexible circuit board, and cost is higher, and secondary copper 18 is formed again on the copper 10 of substrate 12, increase causing the thickness of circuit board, be unfavorable for fine rule and highdensity demand, and conventional conductive interlayer 16 production method in perforation 14 is (as traditional copper, the metallization such as electro-coppering and conventional conductive graphite micropore), its thickness is larger, also the demand of microporous is unfavorable for.

Utility model content

For solving the shortcoming of above-mentioned existing flexible circuit board and making, the purpose of this utility model is to provide a kind of wet type plating method metal substrate of prebored hole.

The utility model is a kind of wet type plated metal substrate of prebored hole, and it includes a polyimide film; This polyimide film forms multiple perforation; One the first metal layer is formed on polyimide film surface and perforation wall, and one second metal level is formed on this first metal layer.

Preferred embodiment, this first metal layer be with electroless nickel deposition one nickel dam on this polyimide film surface and perforation wall.

Preferred embodiment, this second metal level deposits a layers of copper on this nickel dam with electrocoppering, makes the surface of this polyimide film and perforation wall form a nickel dam and a layers of copper.

Preferred embodiment, this first metal layer thickness is 0.05-0.2 micron.

Preferred embodiment, this second metal layer thickness is 0.2-12 micron.

The beneficial effects of the utility model: the wet type plated metal substrate of the utility model prebored hole, are that a kind of FCCL first holes in precalculated position before metallization operation, polyimide film carry out bore operation, makes it form multiple perforation; Carry out metallization operation again, effectively can reach and reduce production cost and reach fine rule, micropore and highdensity demand.

Accompanying drawing explanation

Fig. 1 is the cutaway view of existing flexible circuit board.

Fig. 2 is the cutaway view that Fig. 1 holes.

Fig. 3 is the cutaway view of the utility model polyimide film.

Fig. 4 is the cutaway view of the utility model polyimide film prebored hole.

Fig. 5 is the cutaway view that Fig. 4 forms the first metal layer.

Fig. 6 is the cutaway view that Fig. 5 forms the second metal level.

Fig. 7 is manufacturing flow chart of the present utility model.

[symbol description]

Layers of copper 10

Substrate 12

Perforation 14

Conducting medium 16

Secondary copper 18

Polyimide film 20

Perforation 22

The first metal layer 24

Second metal level 26

Embodiment

For making the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with specific embodiment, and with reference to accompanying drawing, the utility model is further described.

The wet type plated metal substrate of the utility model prebored hole, refers to shown in Fig. 3 to Fig. 6, and it includes a polyimide film 20, it is formed with multiple perforation 22; Being provided with a first metal layer 24 in polyimide film 20 is positioned on its surface and perforation 22 wall, it can be nickel metal, thickness can be 0.05-0.2 micron and one second metal level 26 is located on the first metal layer 24, and the second metal level 26 is copper, and its thickness is 0.2-12 micron.

The manufacture method of the wet type plated metal substrate of the utility model prebored hole, refer to shown in Fig. 3 and Fig. 7, it includes provides one polyimide film 20 (Polyimidefilm) (S1), in the present embodiment, monomer whose composition and the method for preparing do not limit especially, usual technology by the art is carried out, and its thickness can be 7-50 micron (μm).

Shown in Fig. 7, step S1: provide a polyimide film 10, step S2: shown in Fig. 4, leading prebored hole operation on polyimide film (Polyimidefilm) 10, makes polyimide film 20 surface form multiple perforation 22.

Step S3: the polyimide film 20 completing prebored hole is carried out a glutinous layer operation, carry out a surface cleaning process again, to remove the impurity/dirt on polyimide film 20, wherein, step S4: this surface cleaning process comprises advanced row one dry process, step S5: carry out a wet processed again, this dry process can be corona (corona), or physical property high-energy processing mode such as electricity slurry (plasma) or UV-irradiation (UVirradiation) etc., this not only can clean face, also can have and show upgrading in various degree, to increase the adhesive force of face, and corona mode more can activate the hydrophily of face, be conducive to subsequent wet process.This wet processed is chemical liquid cleaning, and it also includes and one surpasses because of ripple concussion, can promote that chemical liquid is to the treatment effeciency of fouling boundary layer.

Step S6: will complete the polyimide film 20 of clean with electroless plating method processing procedure, make its surface and perforation 22 wall form a first metal layer 24, in the present embodiment, the first metal layer 24 is nickel metal, and its thickness can be 0.05-0.2 micron.

Step S7: the polyimide film 20 completing the first metal layer 24 is carried out a heat treatment, by this heat treatment, can improve existing metal level and the intermembranous adhesion problem of polyimides (namely the high temperature reliability of peel strength is between the two not enough).Via this heat treatment, while the peel strength maintaining metal level and polyimide film, the yield of layers of copper plating can be improved, and improves the operability of layers of copper plating.

Step S8: refer to shown in Fig. 5, carries out plating second metal level 26 processing procedure by completing the polyimide film after heat treatment 20, makes to form one second metal level 26 above the first metal layer 24.

Moreover, the utility model by polyimide film 20 leading prebored hole before metallization, then after clean, forms metal level with wet type plating, the process complexity of existing flexible electric circuit board shown in Fig. 1 can be improved, and fine rule, micropore and highdensity product demand can be reached.

The display of following form, can the quality of lifting nickel operation through corona treatment.

Do not implement face cleaning and directly change plating, and having the situation of plating leakage to occur.

Do not implement face cleaning and directly change plating, and drilled edge there is the situation of plating leakage to occur.

After implementing face cleaning, carrying out is plated, and its outward appearance is normal, does not have the situation of plating leakage.

The above; be only the embodiment in the utility model; but protection range of the present utility model is not limited thereto; any people being familiar with this technology is in the technical scope disclosed by the utility model; the conversion or replacement expected can be understood, all should be encompassed in of the present utility model comprising within scope.

Claims

1. a wet type plated metal substrate for prebored hole, is characterized in that including:

One polyimide film;

This polyimide film forms multiple perforation;

One the first metal layer is formed on polyimide film surface and perforation wall, and one second metal level is formed on this first metal layer.

2. the wet type plated metal substrate of prebored hole as claimed in claim 1, is characterized in that, this first metal layer be with electroless nickel deposition one nickel dam on this polyimide film surface and perforation wall.

3. the wet type plated metal substrate of prebored hole as claimed in claim 2, is characterized in that, this second metal level deposits a layers of copper on this nickel dam with electrocoppering, makes the surface of this polyimide film and perforation wall form a nickel dam and a layers of copper.

4. the wet type plated metal substrate of prebored hole as claimed in claim 1, is characterized in that, this first metal layer thickness is 0.05-0.2 micron.

5. the wet type plated metal substrate of prebored hole as claimed in claim 1, is characterized in that, this second metal layer thickness is 0.2-12 micron.