CN208300107U - A kind of multilayer circuit board - Google Patents
A kind of multilayer circuit board Download PDFInfo
- Publication number
- CN208300107U CN208300107U CN201820590976.2U CN201820590976U CN208300107U CN 208300107 U CN208300107 U CN 208300107U CN 201820590976 U CN201820590976 U CN 201820590976U CN 208300107 U CN208300107 U CN 208300107U
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- China
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- single layer
- wiring board
- layer wiring
- locating slot
- sides wall
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Abstract
The utility model discloses a kind of multilayer circuit board, including protective shell, the front and rear sides wall of protective shell cavity is provided with several the first positioning columns, the left and right sides wall of protective shell is provided with heat release hole, single layer route board group is provided in cavity, the front and rear sides wall of single layer route board group is provided with the first locating slot matched with the first positioning column, single layer route board group includes the first single layer wiring board, second single layer wiring board, and the radiator between the first single layer wiring board and the second single layer wiring board is set, radiator is radiating block, the both ends of radiating block are respectively equipped with link block and promote link block and radiating block Formation cross-section for the lower notches shape of " H " type, the left and right sides wall of lower notches is provided with several the second positioning columns, the bottom display of lower notches is provided with several arc convex.The utility model structure is simple, and contraposition is not in dislocation, and have good heat dissipation effect precisely.
Description
Technical field
The utility model relates to wiring board technology field more particularly to a kind of multilayer circuit boards.
Background technique
1961, the U.S. was the pioneer for first opening multi-layer board exploitation, and such mode and cash make multilayer using plated-through-hole legal system
The mode of plate is almost identical.After Japan in 1963 is across this field of foot, related multiple-plate various conception schemes, manufacturing method, then
It is gradually popularized in the whole world.Because with marching toward the integrated circuit epoch by transistor, computer using after increasingly popular, because of Gao Gong
The demand of rate, so that wiring capability is big, transmission characteristic is good becomes multiple-plate demand emphasis.Multi-layer board was originally with mesopore
Method, increasing Buddhist nun's method, the logical three kinds of manufacturing methods of method of plating are disclosed.Since clearance hole method is very time-consuming in manufacture, and densification by
Limit, thus it is not practical.Layer increasing method is because manufacturing method is considerably complicated, though in addition have the advantages of densification, because right at that time
Densification demand simultaneously is not so good as to come urgently now, unknown to the public always, you are close then because of the demand day Yin of high density circuit board, then
Degree becomes the emphasis of various manufacturers' research and development.Method is led in plating as processing procedure same as dual platen, is at present still multiple-plate mainstream system
The phenomenon that making method, and needing to position between lamina when carrying out and plating logical, be not so easy to appear dislocation, causes multilayer wire
Road plate is not available, and the heat dissipation effect of multiple plate is generally poor, be easy to cause internal wiring that can not carry out normally
Work, for this purpose, it is proposed that a kind of multilayer wire wiring board.
Summary of the invention
The purpose of the utility model is to overcome the deficiencies in the prior art, provide a kind of multilayer circuit board.
The technical solution of the utility model is as follows: a kind of multilayer circuit board, including protective shell, is provided in the protective shell
Cavity, the front and rear sides wall of the cavity are provided with several the first positioning columns, and the left and right sides wall of the protective shell is all provided with
It is equipped with heat release hole, single layer route board group is provided in the cavity, and the size of single layer route board group and the size of cavity match
It closes, the front and rear sides wall of the single layer route board group is provided with the first locating slot matched with the first positioning column, the list
Sandwich circuit board group includes that the first single layer wiring board, the second single layer wiring board and setting are single in the first single layer wiring board and second
Radiator between sandwich circuit board, the radiator are radiating block, and the front and rear sides of the radiating block, which are provided with, constitutes institute
The second locating slot of the first locating slot is stated, the both ends of the radiating block are respectively equipped with link block and promote link block and radiating block shape
It is the lower notches shape of " H " type at section, the link block is corresponding with the heat release hole of protective shell two sides, first single-layer wire
Road plate, the second single layer wiring board are respectively placed in lower notches, the size of the first single layer wiring board, the second single layer wiring board
It being matched with the size of groove, the left and right sides wall of the lower notches is provided with several the second positioning columns, and described first
Single layer wiring board, the second single layer wiring board left and right sides wall be provided with the third locating slot matched with the second positioning column,
The bottom display of the lower notches is provided with several arc convex, the first single layer wiring board, the second single layer wiring board
Bottom be provided with several arc grooves matched with arc convex, the first single layer wiring board, the second single-layer wire
The front and rear sides of road plate are provided with the 4th locating slot for constituting first locating slot, the 4th locating slot and the second locating slot
It is corresponding.
Further, first positioning column and the second positioning column are semicylinder, and first locating slot, third are fixed
Position slot is equipped with arcwall face corresponding with the semicylinder.
Further, second positioning column and arc convex are set on same straight line.
Further, the radiating block, link block, the second positioning column, arc convex are structure as a whole.
Further, the inner wall of the cavity is provided with compound adhesive block film.
Further, first positioning column is thermal grease column.
Further, the heat release hole is that rectangular display shape is arranged on the left and right sides wall of protective shell, and heat release hole passes through
Wear the left and right sides wall of protective shell.
Further, the thickness size of the single layer route board group is identical as the depth size of cavity.
Compared with the existing technology, the utility model has the beneficial effects that: the utility model structure is simple, pass through protective shell
On cavity and cavity in the first positioning column to single layer route board group carry out positioning action, instead of previous in plate face,
And it is this open up the mode that single registration holes are aligned be easy to cause contraposition direction it is unclear, bit errors are larger, pass through sky
Chamber is matched with the size of single layer route board group, so that being not in dislocation when contraposition, which reduces bit errors, and
On the basis of original multilayer circuit board, the utility model increases radiator between single layer wiring board, and passes through knot
Structure design, increases the heat dissipation area of single layer wiring board, heat release hole, the first positioning column is also provided on the side wall of protective shell
Using thermal grease column, so that multilayer circuit board has good heat dissipation effect.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the structural schematic diagram of the utility model single layer route board group；
Fig. 3 is the structural schematic diagram of the utility model radiator；
Fig. 4 is the structural schematic diagram of the utility model single layer wiring board.
Specific embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in detail.
Please refer to Fig. 1 ~ 4, a kind of multilayer circuit board provided by the utility model, including protective shell 1, setting in protective shell 1
There is cavity 11, the front and rear sides wall of cavity 11 is provided with several the first positioning columns 12, and the left and right sides wall of protective shell 1 is all provided with
It is equipped with heat release hole 13, single layer route board group 2, and the size of the size of single layer route board group 2 and cavity 11 are provided in cavity 11
It matches, the front and rear sides wall of single layer route board group 2 is provided with the first locating slot 21 matched with the first positioning column 12, single
Sandwich circuit board group 2 include the first single layer wiring board 22, the second single layer wiring board 23 and setting the first single layer wiring board 22 with
Radiator between second single layer wiring board 23, radiator are radiating block 24, and the front and rear sides of radiating block 24 are provided with structure
At the second locating slot 241 of the first locating slot 21, the both ends of radiating block 24 are respectively equipped with link block 242 and promote link block 242
It is the lower notches shape of " H " type with 24 Formation cross-section of radiating block, link block 242 is corresponding with the heat release hole 13 of 1 two sides of protective shell,
First single layer wiring board 22, the second single layer wiring board 23 are respectively placed in lower notches, the first single layer wiring board 22, the second single layer
The size of wiring board 23 is matched with the size of groove, and the left and right sides wall of lower notches is provided with several the second positioning columns
243, the first single layer wiring board 22, the second single layer wiring board 23 left and right sides wall be provided with and the second positioning column 243 match
The third locating slot 244 of conjunction, the bottom display of lower notches are provided with several arc convex 245, the first single layer wiring board 22,
The bottom of second single layer wiring board 23 is provided with several arc grooves 246 matched with arc convex 245, the first single layer
Wiring board 22, the second single layer wiring board 23 front and rear sides be provided with the 4th locating slot 247 for constituting the first locating slot 21, institute the
Four locating slots 247 are corresponding with the second locating slot 241.
Wherein, first positioning column 12 and the second positioning column 243 are semicylinder, the first locating slot, third positioning
Slot 244 is equipped with arcwall face corresponding with semicylinder.Be conducive to addition contact, to increase heat dissipation area.
Wherein, second positioning column 243 is set on same straight line with arc convex 245.Radiating block 24, link block
242, the second positioning column 243, arc convex 245 are structure as a whole.
Wherein, the inner wall of the cavity 11 is provided with compound adhesive block film, by single circuit board group 2 and cavity when preventing from closing glue
11 are bonded together, and are not easy to later period assembling and maintenance.First positioning column 12 is thermal grease column.The heat release hole 13 is
Rectangular display shape is arranged on the left and right sides wall of protective shell 1, and heat release hole 13 runs through the left and right sides wall of protective shell 1.It is described
The thickness size of single layer route board group 2 is identical as the depth size of cavity 11.
Working principle: the first single layer wiring board 22, the second single layer wiring board 23 are mounted on to the lower notches of radiator
It is interior, and arc convex 245 on radiating block 24 is made to be directed at the arc groove 246 of single layer wiring board, the second positioning column 243 and the
Three locating slots 244 match, and arc convex 245 and the second positioning column 243 are not only the effect positioned, also have and increase single layer
The effect of the heat dissipation area of wiring board and radiator, the single layer route board group 2 for installing formation are mounted on the cavity 11 of protective shell 1
It is interior, it is positioned by the first locating slot 21 on the first positioning column 12 and single layer route board group 2 on 11 side wall of cavity, then lead to
Matching for the shapes and sizes of cavity 11 and single layer route board group 2 is crossed, so that entire multilayer circuit board will not be sent out in contraposition
It the phenomenon that raw dislocation, improves the accuracy of positioning, and first positioning column 12 is using thermal grease column, and is protecting
The outer wall of shell 1 offers the heat release hole 13 of perforation, the link block at the radiator both ends of the heat release hole 13 and single layer route board group 2
242 is corresponding, so that the heat of single layer wiring board passes through heat release hole 13 by radiator again is scattered to outside, heat dissipation effect is very
Significantly.
The above is only the preferred embodiments of the present utility model only, is not intended to limit the utility model, all practical at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the guarantor of the utility model within novel spirit and principle
Within the scope of shield.
Claims (8)
1. a kind of multilayer circuit board, including protective shell, it is characterised in that: cavity is provided in the protective shell, the cavity
Front and rear sides wall is provided with several the first positioning columns, and the left and right sides wall of the protective shell is provided with heat release hole, described
Single layer route board group is provided in cavity, and the size of single layer route board group is matched with the size of cavity, the single layer route
The front and rear sides wall of board group is provided with the first locating slot matched with the first positioning column, and the single layer route board group includes the
One single layer wiring board, the second single layer wiring board and be arranged between the first single layer wiring board and the second single layer wiring board dissipate
Thermal, the radiator are radiating block, and the front and rear sides of the radiating block, which are provided with, constitutes the of first locating slot
Two locating slots, the both ends of the radiating block are respectively equipped with link block and promote link block and radiating block Formation cross-section for " H " type
Lower notches shape, the link block is corresponding with the heat release hole of protective shell two sides, the first single layer wiring board, the second single-layer wire
Road plate is respectively placed in lower notches, the size and the size phase of groove of the first single layer wiring board, the second single layer wiring board
Cooperation, the left and right sides wall of the lower notches are provided with several the second positioning columns, the first single layer wiring board, second
The left and right sides wall of single layer wiring board is provided with the third locating slot matched with the second positioning column, the bottom of the lower notches
Portion's display is provided with several arc convex, the first single layer wiring board, the second single layer wiring board bottom be provided with
Several arc grooves that arc convex matches, the first single layer wiring board, the second single layer wiring board front and rear sides set
It is equipped with the 4th locating slot for constituting first locating slot, the 4th locating slot is corresponding with the second locating slot.
2. a kind of multilayer circuit board according to claim 1, it is characterised in that: first positioning column and the second positioning column
It is semicylinder, first locating slot, third locating slot are equipped with arcwall face corresponding with the semicylinder.
3. a kind of multilayer circuit board according to claim 1, it is characterised in that: second positioning column is set with arc convex
It is placed on same straight line.
4. a kind of multilayer circuit board according to claim 1, it is characterised in that: the radiating block, link block, the second positioning
Column, arc convex are structure as a whole.
5. a kind of multilayer circuit board according to claim 1, it is characterised in that: the inner wall of the cavity is provided with compound resistance
Glue film.
6. a kind of multilayer circuit board according to claim 1, it is characterised in that: first positioning column is thermal grease
Column.
7. a kind of multilayer circuit board according to claim 1, it is characterised in that: the heat release hole is the arrangement of rectangular display shape
On the left and right sides wall of protective shell, and heat release hole runs through the left and right sides wall of protective shell.
8. a kind of multilayer circuit board according to claim 1, it is characterised in that: the thickness size of the single layer route board group
It is identical as the depth size of cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820590976.2U CN208300107U (en) | 2018-04-24 | 2018-04-24 | A kind of multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820590976.2U CN208300107U (en) | 2018-04-24 | 2018-04-24 | A kind of multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208300107U true CN208300107U (en) | 2018-12-28 |
Family
ID=64725622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820590976.2U Active CN208300107U (en) | 2018-04-24 | 2018-04-24 | A kind of multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208300107U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111465168A (en) * | 2020-03-05 | 2020-07-28 | 珠海崇达电路技术有限公司 | Method for improving deviation of pressed buried copper block |
| CN111867236A (en) * | 2020-08-20 | 2020-10-30 | 景旺电子科技(龙川)有限公司 | Circuit board and manufacturing method thereof |
| CN112165820A (en) * | 2020-11-04 | 2021-01-01 | 江苏斯菲尔电气股份有限公司 | Multifunctional instrument |
-
2018
- 2018-04-24 CN CN201820590976.2U patent/CN208300107U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111465168A (en) * | 2020-03-05 | 2020-07-28 | 珠海崇达电路技术有限公司 | Method for improving deviation of pressed buried copper block |
| CN111867236A (en) * | 2020-08-20 | 2020-10-30 | 景旺电子科技(龙川)有限公司 | Circuit board and manufacturing method thereof |
| CN112165820A (en) * | 2020-11-04 | 2021-01-01 | 江苏斯菲尔电气股份有限公司 | Multifunctional instrument |
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