CN112165820A - Multifunctional instrument - Google Patents
Multifunctional instrument Download PDFInfo
- Publication number
- CN112165820A CN112165820A CN202011213799.4A CN202011213799A CN112165820A CN 112165820 A CN112165820 A CN 112165820A CN 202011213799 A CN202011213799 A CN 202011213799A CN 112165820 A CN112165820 A CN 112165820A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- connector
- opposite
- heat dissipation
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
- H05K7/1418—Card guides, e.g. grooves
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
- H05K7/1447—External wirings; Wiring ducts; Laying cables
- H05K7/1451—External wirings; Wiring ducts; Laying cables with connections between circuit boards or units
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0067—Devices for protecting against damage from electrostatic discharge
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a multifunctional instrument which is characterized by comprising a first shell, a second shell, a first circuit board, a second circuit board, a third circuit board and a fourth circuit board, wherein first heat dissipation holes are formed in two opposite sides of the first shell, baffle walls are arranged in the positions, close to the two opposite sides, in the first shell, a cavity is formed between each baffle wall and the corresponding side, a guide groove structure for mounting the third circuit board is oppositely arranged on the inner side of the corresponding baffle wall, a first supporting structure for mounting the first circuit board is arranged on the other two opposite sides in the first shell and the opposite inner side of the corresponding baffle wall, a second supporting structure for mounting the second circuit board is arranged on the opposite inner side of the corresponding baffle wall, and a third supporting structure for mounting the fourth circuit board is oppositely arranged on the corresponding baffle wall.
Description
Technical Field
The invention relates to a multifunctional instrument, in particular to a multifunctional instrument which has a simple and efficient electrical connection mode between circuit boards, safe external wiring, orientable and effective heat dissipation and reliable electrostatic protection capability.
Background
The connection mode of the circuit board inside the instrument mostly uses an inserting needle seat or a flexible flat cable, when the inserting needle seat is used, two circuit boards need to be inserted in pairs, manual alignment is needed during installation, otherwise, the circuit boards are easy to be inserted; when the flexible flat cables are connected, the flexible flat cables are required to be respectively connected with circuit boards to be connected and then are installed into the instrument shell, so that the installation steps are complicated; the external connector is a detachable connector which can facilitate wiring, but most of the external connector is exposed outside, a screw fastening area is electrified and is easy to touch potential safety hazards, and the connector is easy to be pulled out manually before wiring to cause connector loss; part inside device of instrument during operation can generate heat, like power module district, reachs certain temperature and can damage or have the potential safety hazard, so need set up the louvre, but inside having the region of instrument to guarantee certain temperature and come maintenance work like the unable normal work of liquid crystal display district low temperature state, the improper local cooling that makes not change the cooling of louvre that sets up of louvre easily, and the louvre can shorten the inside distance of static entering instrument, weakens the static protective capacities of casing.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a multifunctional instrument which has a simple and efficient circuit board-to-board electrical connection mode, safe external wiring, orientable and effective heat dissipation and reliable electrostatic protection capability.
The invention solves the technical problems through the following technical scheme:
the invention provides a multifunctional instrument which is characterized by comprising a first shell, a second shell, a first circuit board, a second circuit board, a third circuit board and a fourth circuit board, wherein first heat dissipation holes are formed in two opposite sides of the first shell, baffle walls are arranged in the positions, close to the two opposite sides, in the first shell, a cavity is formed between each baffle wall and the corresponding side, a guide groove structure for mounting the third circuit board is oppositely arranged on the inner side of the corresponding baffle wall, first supporting structures for mounting the first circuit board are arranged on the other two opposite sides in the first shell and the opposite inner side of the corresponding baffle wall, second supporting structures for mounting the second circuit board are arranged on the opposite inner sides of the corresponding baffle walls, and a third supporting structure for mounting the fourth circuit board is oppositely arranged on the corresponding baffle wall;
the second casing is provided with a high space structure at the position of the easily heating element, the high space structure is provided with a third heat dissipation hole, the two opposite sides of the second casing and the opposite blocking walls form a cavity, and the inner side of the third heat dissipation hole is provided with an electrostatic protection wall;
first circuit board is packed into in the first casing and is fixed through first bearing structure, the rear end of first circuit board has a connector to be used for with third circuit board electrical connection, the second circuit board is packed into in the first casing and fixed through second bearing structure, the rear end of second circuit board has a connector to be used for with third circuit board electrical connection, the third circuit board is packed into in the guide slot structure, the connector of third circuit board is connected with the connector of first circuit board and the connector of second circuit board respectively, the fourth circuit board is packed into in the first casing and is fixed through third bearing structure, the front end of fourth circuit board has a connector to be connected with the connector on the third circuit board, the rear end of fourth circuit board is equipped with heating element.
Preferably, external connector protection structures are arranged on two opposite sides of the second shell, and each external connector protection structure consists of a wiring area, a protection beam and a fastening area.
Preferably, the first circuit board, the second circuit board and the fourth circuit board are mounted in parallel.
Preferably, the third circuit board is arranged perpendicular to the first circuit board, the second circuit board and the fourth circuit board.
Preferably, the height of the blocking wall is higher than the height of the side edge of the second shell.
Preferably, the opposite sides of the second housing and the corresponding portions of the opposite blocking walls form a cavity to combine with the cavity of the first housing to form an upper air duct and a lower air duct, the first heat dissipation hole of the first housing and the second heat dissipation hole of the second housing are both communicated with the air duct, and the upper air duct and the lower air duct are communicated through the space at the rear end inside the assembled instrument to form a heat dissipation channel.
On the basis of the common knowledge in the field, the above preferred conditions can be combined randomly to obtain the preferred embodiments of the invention.
The positive progress effects of the invention are as follows:
the fixed mounting structure of the first shell of the multifunctional instrument is matched with the guide groove structure to realize the blind-mate socket for mounting the circuit board, manual alignment connectors are not needed, the first circuit board, the second circuit board and the fourth circuit board are respectively electrically connected with the third circuit board, the electrical connection between every two circuit boards can be realized by routing the third circuit board, and additional connectors are reduced; the external connector is a detachable connector, the connector is arranged in the external connector protection structure of the second shell, the separation of the fastening area and the wiring area is realized, the wiring is safer, the connector needs to be detached by using a tool and is not easy to be pulled out manually, the fastening area has a certain safety depth, and the potential safety hazard caused by the fact that a fastening screw is touched is prevented; the heat dissipation channel can be oriented to enable the easily-heated element to dissipate heat and can meet the distance requirement of electrostatic protection; a high space is arranged at the position, located at the easy-heating element, of the rear end of the second shell, and heat dissipation holes are formed to be communicated with the heat dissipation channel, so that the heat dissipation effect is enhanced.
Drawings
FIG. 1 is a schematic view of a multifunctional instrument according to the present invention;
FIG. 2 is a schematic view of a first housing structure;
FIG. 3 is a schematic view of a second housing structure;
FIGS. 4(a) - (e) are schematic views of the assembly process of the present invention;
FIG. 5 is a schematic view of an external connector installation;
FIG. 6 is a schematic diagram of external connector protection;
FIG. 7 is a schematic diagram of the electrical connection between circuit boards of the present invention in the cross-sectional view of FIG. 6A-A;
FIG. 8 is a schematic view of heat dissipation channel formation;
FIG. 9 is a schematic view of the airflow direction of the heat dissipation channel;
fig. 10 is a schematic view of a heat dissipation channel satisfying electrostatic protection.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
As shown in fig. 1, the present embodiment provides a multifunctional meter, which includes a first case 1, a second case 2, a first wiring board 3, a second wiring board 4, a third wiring board 5, and a fourth wiring board 6.
As shown in fig. 2, heat dissipation holes 1a are formed in two opposite sides of the first casing 1, blocking walls 1b are disposed at positions close to the two opposite sides in the first casing 1, a cavity 1c is formed between the blocking wall 1b and the corresponding side, guide groove structures 1d for mounting a third circuit board are disposed on the inner sides of the blocking walls 1b, supporting structures 1e for mounting the first circuit board 3 are disposed on the other two opposite sides in the first casing 1 and the inner sides of the blocking walls 1b, supporting structures 1f for mounting the second circuit board 4 are disposed on the inner sides of the blocking walls 1b, and supporting structures 1g for mounting the fourth circuit board 6 are disposed on the blocking walls 1 b.
As shown in fig. 3, heat dissipation holes 2a are formed in two opposite sides of the second housing 2, a high space structure 2b is disposed at a position where a heat is easily generated on the second housing 2, heat dissipation holes 2c are formed in the high space structure 2b, cavities are formed between two opposite sides of the second housing 2 and the opposite blocking walls 1b, and electrostatic protection walls 2e are disposed inside the heat dissipation holes 2c to meet the requirement of electrostatic protection distance; the opposite sides of the second housing 2 are provided with external connector protection structures consisting of a wiring area 2f, a guard beam 2g and a fastening area 2 h.
Fig. 4(a) - (e) are schematic diagrams illustrating an assembly process of the present invention, and as shown in fig. 4(a), the first circuit board 3 is first installed in the first housing 1, the supporting structure 1e is used for fixing, and the rear end of the first circuit board 3 has a connector 3a for electrically connecting with the third circuit board 5; as shown in fig. 4b, the second circuit board 4 is installed into the first housing 1, the supporting structure 1f is used for fixing, and the rear end of the second circuit board 4 has a connector 4a for electrically connecting with the third circuit board 5; as shown in fig. 4c, next, the third wiring board 5 is fitted into the guide groove structure 1d of the first casing 1, and the connectors 5a and 5b of the third wiring board 5 are connected with the connector 3a of the first wiring board 3 and the connector 4a of the second wiring board 4, respectively; as shown in fig. 4d, the fourth circuit board 6 is then assembled into the first housing 1, the supporting structure 1g is used for fixing, and the front end of the fourth circuit board 6 has a connector 6a connected with the connector 5c on the third circuit board 5; the fixed mounting structure is matched with the guide groove structure to realize blind plugging operation of circuit board mounting without manually aligning the connector; the rear end of the fourth circuit board 6 is provided with a heating element 6b, and finally the second housing 2 and the first housing 1 are assembled and fixed according to the direction shown in fig. 4 e.
The first circuit board 3, the second circuit board 4 and the fourth circuit board 6 parallel mount, the third circuit board 5 is perpendicular to the first circuit board 3, the second circuit board 4 and the setting of fourth circuit board 5, the side height that highly is higher than the second casing 2 of fender wall 1 b.
As shown in fig. 5, the external connector 7 is fitted into the terminal area 2e of the second housing 2.
As shown in fig. 6, external connector 7 is installed in second casing external connector protection architecture, realizes that fastening area 2h and wiring area 2f are kept apart by protection roof beam 2g physics, and the wiring is safer, needs the use tool to dismantle, and difficult artificial random extraction, fastening area 2h have certain safe degree of depth, prevents to touch fastening screw and produces the potential safety hazard.
As shown in fig. 7, the third circuit board 5 is electrically connected to the first circuit board 3, the second circuit board 4 and the fourth circuit board 6 through connectors, and the first circuit board 3, the second circuit board 4 and the fourth circuit board 6 can be electrically connected to each other through printed circuit traces of the third circuit board 5.
As shown in fig. 8, after the second housing 2 and the first housing are mounted, a cavity is formed at the corresponding portion of the upper side edge and the lower side edge 2d of the second housing and the first housing blocking wall 1b to combine with the cavity 1c of the first housing to form an upper air duct 103 and a lower air duct 103, the heat dissipation holes of the first housing and the heat dissipation holes of the second housing are communicated with the air duct 103, and the upper air duct and the lower air duct are communicated through an assembled instrument internal rear end space 104 to form a heat dissipation channel.
As shown in fig. 9, the heating element 6b generates heat to generate hot air, the airflow of the heat dissipation hole circulates as the path a in the figure to achieve the heat dissipation effect, and the first circuit board 3 can maintain the normal working temperature due to the obstruction of the second circuit board and the fourth circuit board.
As shown in fig. 10, the static electricity b entering from the heat dissipation hole can reach the component c only through the path of the heat dissipation channel, so as to satisfy the requirement of static protection.
While specific embodiments of the invention have been described above, it will be appreciated by those skilled in the art that these are by way of example only, and that the scope of the invention is defined by the appended claims. Various changes and modifications to these embodiments may be made by those skilled in the art without departing from the spirit and scope of the invention, and these changes and modifications are within the scope of the invention.
Claims (6)
1. A multifunctional instrument is characterized by comprising a first shell, a second shell, a first circuit board, a second circuit board, a third circuit board and a fourth circuit board, wherein first heat dissipation holes are formed in two opposite sides of the first shell, baffle walls are arranged in the first shell and close to the two opposite sides, a cavity is formed between each baffle wall and the corresponding side, a guide groove structure for mounting the third circuit board is oppositely arranged on the inner side of each opposite baffle wall, a first supporting structure for mounting the first circuit board is arranged on the other two opposite sides in the first shell and the opposite inner side of each opposite baffle wall, a second supporting structure for mounting the second circuit board is arranged on the opposite inner side of each opposite baffle wall, and a third supporting structure for mounting the fourth circuit board is oppositely arranged on each opposite baffle wall;
the second casing is provided with a high space structure at the position of the easily heating element, the high space structure is provided with a third heat dissipation hole, the two opposite sides of the second casing and the opposite blocking walls form a cavity, and the inner side of the third heat dissipation hole is provided with an electrostatic protection wall;
first circuit board is packed into in the first casing and is fixed through first bearing structure, the rear end of first circuit board has a connector to be used for with third circuit board electrical connection, the second circuit board is packed into in the first casing and fixed through second bearing structure, the rear end of second circuit board has a connector to be used for with third circuit board electrical connection, the third circuit board is packed into in the guide slot structure, the connector of third circuit board is connected with the connector of first circuit board and the connector of second circuit board respectively, the fourth circuit board is packed into in the first casing and is fixed through third bearing structure, the front end of fourth circuit board has a connector to be connected with the connector on the third circuit board, the rear end of fourth circuit board is equipped with heating element.
2. The multifunction meter of claim 1, wherein said second housing is provided with external connector protection structures on opposite sides thereof, said external connector protection structures consisting of a wire connection region, a protective beam and a fastening region.
3. The multifunction meter of claim 1, wherein said first, second and fourth circuit boards are mounted in parallel.
4. The multifunction meter of claim 1, wherein said third wiring board is disposed perpendicular to said first wiring board, said second wiring board and said fourth wiring board.
5. The multifunction meter of claim 1, wherein said retaining wall has a height greater than a lateral height of said second housing.
6. The multifunctional instrument according to claim 1, wherein a cavity is formed at opposite sides of the second housing and corresponding portions of the opposite blocking walls to combine with the cavity of the first housing to form an upper and lower air duct, the first heat dissipation hole of the first housing and the second heat dissipation hole of the second housing are both communicated with the air duct, and the upper and lower air ducts are communicated through a rear end space inside the instrument after assembly to form a heat dissipation channel.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011213799.4A CN112165820A (en) | 2020-11-04 | 2020-11-04 | Multifunctional instrument |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011213799.4A CN112165820A (en) | 2020-11-04 | 2020-11-04 | Multifunctional instrument |
Publications (1)
Publication Number | Publication Date |
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CN112165820A true CN112165820A (en) | 2021-01-01 |
Family
ID=73865618
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202011213799.4A Withdrawn CN112165820A (en) | 2020-11-04 | 2020-11-04 | Multifunctional instrument |
Country Status (1)
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CN (1) | CN112165820A (en) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103928789A (en) * | 2014-05-04 | 2014-07-16 | 南京深科博业电气股份有限公司 | Instrument of novel circuit board module structure |
CN104582453A (en) * | 2015-02-14 | 2015-04-29 | 青岛美奂电子科技有限公司 | Electronic device radiating shell |
CN105357904A (en) * | 2015-10-20 | 2016-02-24 | 江苏斯菲尔电气股份有限公司 | Intelligent instrument shell structure |
WO2016074450A1 (en) * | 2014-11-14 | 2016-05-19 | 广东太阳库新能源科技有限公司 | Mobile solar power supply having high heat-dissipation performance |
CN208300107U (en) * | 2018-04-24 | 2018-12-28 | 深圳市丰达兴线路板制造有限公司 | A kind of multilayer circuit board |
CN209767995U (en) * | 2018-12-27 | 2019-12-10 | 中宁县峰之源农业发展有限公司 | Instrument casing with novel structure |
CN210168394U (en) * | 2019-05-27 | 2020-03-20 | 东莞市世欣五金制品有限公司 | Refrigerator case |
CN210899829U (en) * | 2019-07-04 | 2020-06-30 | 浙江大华技术股份有限公司 | Support connection structure, circuit board assembly and case thereof |
-
2020
- 2020-11-04 CN CN202011213799.4A patent/CN112165820A/en not_active Withdrawn
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103928789A (en) * | 2014-05-04 | 2014-07-16 | 南京深科博业电气股份有限公司 | Instrument of novel circuit board module structure |
WO2016074450A1 (en) * | 2014-11-14 | 2016-05-19 | 广东太阳库新能源科技有限公司 | Mobile solar power supply having high heat-dissipation performance |
CN104582453A (en) * | 2015-02-14 | 2015-04-29 | 青岛美奂电子科技有限公司 | Electronic device radiating shell |
CN105357904A (en) * | 2015-10-20 | 2016-02-24 | 江苏斯菲尔电气股份有限公司 | Intelligent instrument shell structure |
CN208300107U (en) * | 2018-04-24 | 2018-12-28 | 深圳市丰达兴线路板制造有限公司 | A kind of multilayer circuit board |
CN209767995U (en) * | 2018-12-27 | 2019-12-10 | 中宁县峰之源农业发展有限公司 | Instrument casing with novel structure |
CN210168394U (en) * | 2019-05-27 | 2020-03-20 | 东莞市世欣五金制品有限公司 | Refrigerator case |
CN210899829U (en) * | 2019-07-04 | 2020-06-30 | 浙江大华技术股份有限公司 | Support connection structure, circuit board assembly and case thereof |
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WW01 | Invention patent application withdrawn after publication |
Application publication date: 20210101 |
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WW01 | Invention patent application withdrawn after publication |