TWI749954B - Method for manufacturing circuit board with embedded copper block structure - Google Patents

Abstract

A method for manufacturing a circuit board with an embedded copper block structure includes a preparation step, a blind hole forming step, a copper block inserting step, and a resin filling step. The preparation step includes providing an inner layer circuit board. The blind hole forming step includes performing a blind hole forming operation on the inner layer circuit board, so that the inner layer circuit board forms an accommodation structure. The copper block inserting step includes providing a heat dissipation copper block and inserting the heat dissipation copper block into the accommodating structure. A filling gap is formed between the heat dissipation copper block and the accommodating structure. The resin filling step includes filling ink resin into the filling gap and curing the ink resin to form the embedded copper block structure.

Description

Method for manufacturing circuit board with buried copper block structure

The invention relates to a manufacturing method of a circuit board, in particular to a manufacturing method of a circuit board with a buried copper block structure.

In the technical field of printed circuit boards, in order to improve the heat dissipation effect of the circuit board, a heat dissipation copper block can be inserted into the circuit board. Most of the existing plugging copper block process is the pressing method of plugging copper block. The process includes: inner layer, L00 layer pre-fusion, copper block and groove, Core/PP/PI/PFG recombination, PinLam (plug Copper block), follow-up drilling, electroplating, outer layer, S/M, forming and other steps to complete the production of the circuit board. However, this process is complicated, and the size of the copper block is matched with the accuracy of the slotting position of the board and the uniformity of the thickness of the board. Problems such as the impact of the alignment of the copper block and reliability are prone to occur.

Therefore, how to provide a method for manufacturing a circuit board with a buried copper block structure to overcome the above-mentioned defects has become one of the important issues to be solved by this business.

The technical problem to be solved by the present invention is to provide a method for manufacturing a circuit board with a buried copper block structure in view of the deficiencies of the prior art.

In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a circuit board manufacturing method with a buried copper block structure, which includes: a preparation step, a blind fishing step, a copper block insertion step, and Resin filling step. The preparation step includes providing the inner circuit board. The blind fishing step includes performing a blind fishing operation on the inner circuit board, so that the inner circuit board forms a housing structure. The step of plugging the copper block includes providing a heat-dissipating copper block and plugging the heat-dissipating copper block into the accommodating structure. A filling gap is formed between the heat dissipation copper block and the accommodating structure. The resin filling step includes filling the ink resin into the filling gap and curing the ink resin to form a buried copper block structure.

The beneficial effect of the present invention is that the embedded copper block structure provided by the present invention can pass "a blind fishing step, which includes: performing a blind fishing operation on the inner circuit board, so that the inner The layer circuit board is formed with a accommodating structure" and "a copper block inserting step, which includes: providing a heat dissipation copper block, and inserting the heat dissipation copper block into the accommodating structure; wherein, the heat dissipation copper block A filling gap is formed between the outer side wall of the accommodating structure and the inner side wall of the accommodating structure" and "a resin filling step, which includes: filling an ink resin into the filling gap, and curing the ink resin, Thus, the technical solution of the "buried copper block structure" is formed to improve the reliability between the heat dissipation copper block and the ink resin, and has the advantage of relatively simple process flow.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings about the present invention. However, the provided drawings are only for reference and description, and are not used to limit the present invention.

The following are specific specific examples to illustrate the disclosed embodiments of the present invention, and those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be based on different viewpoints and applications, and various modifications and changes can be made without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to actual size, and are stated in advance. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.

It should be understood that although terms such as “first”, “second”, and “third” may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are mainly used to distinguish one element from another, or one signal from another signal. In addition, the term "or" used in this document may include any one or a combination of more of the associated listed items depending on the actual situation.

[Method of manufacturing circuit board]

Please refer to FIG. 1. FIG. 1 is a schematic flowchart of a method for manufacturing a circuit board with a buried copper block structure according to an embodiment of the present invention. The manufacturing method of the circuit board includes step S110, step S120, step S130, step S140, and step S150. It must be noted that the sequence of the steps and the actual operation mode described in this embodiment can be adjusted according to requirements, and are not limited to those described in this embodiment.

The circuit board manufacturing method may provide additional operations before, during, and after each step, and some of the operations described may be substituted, eliminated, or relocated to implement additional implementations of the method. The manufacturing method of the circuit board is described below in conjunction with FIGS. 2A to 2E.

As shown in FIG. 2A, FIG. 2A is a schematic diagram of step S110 of a method for manufacturing a circuit board according to an embodiment of the present invention. The step S110 is a preparation step, and the preparation step includes: providing an inner layer circuit board 1, wherein the inner layer circuit board 1 has a first surface 101 and a first surface on the opposite side Two surface 102.

In this embodiment, the inner layer circuit board 1 includes a plurality of inner layer substrates 11, and each of the inner layer substrates 11 has a board structure and an inner layer circuit (not labeled) formed on the board structure.

Furthermore, the inner layer circuit board 1 is formed by stacking a plurality of inner layer substrates 11 on each other through an inner lamination process. Wherein, a top surface of the plurality of inner substrates 11 is defined as the first surface 101, and a bottom surface of the plurality of inner substrates 11 is defined as the second surface 102. Wherein, the number of the plurality of inner layer substrates may be, for example, four, six, eight, ten, or more than ten, that is, the inner layer circuit board 1 is a multilayer circuit board.

It should be noted that the "first" and "second" described in this article for each element or structure, such as the first surface, the second surface, the first groove, and the second groove, are just for the convenience of description and It is convenient to distinguish different elements or structures, but it is not intended to limit the arrangement sequence or the upper and lower positional relationship of the elements or structures. For example, although the present embodiment takes the first surface 101 as the upper surface of the inner layer circuit board 1 and the second surface 102 as the lower surface of the inner layer circuit board 1 as an example for description, in actual application, The first surface 101 may also be the lower surface of the inner layer circuit board 1, and the second surface 102 may also be the upper surface of the inner layer circuit board 1, which is not limited by the present invention.

As shown in FIG. 2B, FIG. 2B is a schematic diagram of step S120 of a method for manufacturing a circuit board according to an embodiment of the present invention. The step S120 is a blind hole forming step, and the blind hole forming step includes: using a blind hole forming machine to perform a blind hole forming operation on the inner layer circuit board 1 to make the inner layer The circuit board 1 is formed with a accommodating structure 2. Wherein, the accommodating structure 2 is used to provide a heat-dissipating copper block to be inserted into it.

It is worth mentioning that the shape and size of the inner layer circuit board 1 are roughly fixed after passing through the inner lamination cooperation. Therefore, in the subsequent blind fishing step, the blind fishing molding machine can cooperate with the subsequent plugs. The size of the imported heat-dissipating copper block can well control the depth and precision of blind fishing, so as to produce a suitable sized accommodating structure.

In this embodiment, the accommodating structure 2 is formed by penetrating a plurality of inner substrates 11, and the accommodating structure 2 includes a first groove 21 recessed on the first surface 101 and a recess. A second groove 22 provided on the second surface 102. Wherein, the first groove 21 is spatially connected to the second groove 22, and a first width W1 of the first groove 21 is greater than a second width W2 of the second groove 22 ( Please also refer to Figure 3).

Please continue to refer to FIG. 2B and also refer to FIG. 3. As shown in FIG. 3, in the accommodating structure 2, the first width W1 of the first groove 21 is between the second width of the second groove 22 Between 120% and 140% of W2, and a first depth H1 of the first groove 21 is between 600% and 700% of a second depth H2 of the second groove 22, but The present invention is not limited to this.

In terms of the forming method, the first groove 21 is formed by blind fishing towards the first surface 101 of the inner circuit board 1 by a blind fishing molding machine, and the second groove 22 is formed by a blind fishing molding machine. It is formed by blind fishing toward the second surface 102 of the inner circuit board 1.

Please refer to FIG. 4, in another embodiment of the present invention, the accommodating structure 2 has a first groove 21 recessed on the first surface 101, and the first groove 21 penetrates through a plurality of At least part of the inner substrate 11 is the inner substrate 11. Wherein, the first groove 21 is a blind hole structure, and the first groove 21 is used for accommodating the following heat dissipation copper block 3.

As shown in FIG. 2C, FIG. 2C is a schematic diagram of step S130 of the method for manufacturing a circuit board according to an embodiment of the present invention. The step S130 is a copper block inserting step (copper block inserting step). The step of inserting the copper block includes: providing a heat-dissipating copper block 3 and inserting the heat-dissipating copper block 3 into the accommodating structure 2. Wherein, a filling gap G (filling gap) is formed between the outer side wall of the heat dissipation copper block 3 and the inner side wall of the accommodating structure 2, and the filling gap G is used for filling the ink resin therein.

In this embodiment, the heat dissipating copper block 3 can be copper with a thermal conductivity of 350 W/mk to 400 W/mk and a thermal conductivity of 80% to 99%, which can provide better thermal conductivity. Effect.

In this embodiment, the filling gap G formed between the outer sidewall of the heat dissipation copper block 3 and the inner sidewall of the containing structure 2 has a width between 500 μm and 1000 μm. In other words, the distance between the outer side wall of the heat dissipation copper block 3 and the inner side wall of the accommodating structure 2 is between 500 μm and 1000 μm, but the present invention is not limited to this. Thereby, after the ink resin is filled into the filling gap G and planarized, the ink resin and the heat dissipation copper block 3 can have good reliability.

Furthermore, please continue to refer to FIG. 2C. The heat dissipating copper block 3 has a base 31 and an extension 32 extending from one end of the base 31, and the width of the extension 32 is smaller than the width of the base 31, In this way, the heat dissipation copper block 3 has an inverted convex shape as a whole.

Furthermore, the heat-dissipating copper block 3 further has at least two protruding ribs 33 respectively protruding outward from two opposite sides of the base portion 31. In this embodiment, the number of the ribs 33 is four, but the present invention is not limited to this. Wherein, after the heat dissipating copper block 3 is inserted into the accommodating structure 2, the outer side wall of the base 31 and the inner side wall of the accommodating structure 2 form the filling gap G, and the heat dissipating copper block 3 At least two ribs 33 protrude toward the inner side wall of the accommodating structure 2.

In this embodiment, the at least two convex ribs 33 of the heat dissipating copper block 3 abut against the inner side wall of the accommodating structure 2, so that the heat dissipating copper block 3 can be fixed to the at least two convex ribs 33 In the housing structure 2.

In the accommodating structure 2, the first groove 21 and the second groove 22 together form a stepped structure, and a portion of the stepped structure parallel to the first surface 101 or the second surface 102 defines One reaches the top 23. Wherein, the top portion 23 is located between the first groove 21 and the second groove 22. When the accommodating structure 2 accommodates the heat dissipating copper block 3, the accommodating structure 2 abuts the heat dissipating copper block 3 through the top portion 23.

Furthermore, when the accommodating structure 2 accommodates the heat dissipation copper block 3, the first groove 21 can accommodate the base 31 and the rib 33 of the heat dissipation copper block 3, and the second groove 22 can accommodate The extension 32 of the heat dissipating copper block 3 is located. In this embodiment, the top surface of the base portion 31 and the first surface 101 of the inner layer circuit board 1 are flush with each other, and the bottom surface of the extension portion 32 and the second surface 102 of the inner layer circuit board 1 are flush with each other. , But the present invention is not limited to this.

As shown in FIG. 2D, FIG. 2D is a schematic diagram of step S140 of the method for manufacturing a circuit board according to an embodiment of the present invention. The step S140 is a resin filling step, and the resin filling step includes: filling an ink resin 4 into the filling gap G, and curing the ink resin 4 to form a buried type Embedded copper block structure.

The main component of the ink resin 4 may be, for example, epoxy resin, polyimide, cyanate ester, bismaleimide triazine, or the above The combination can also be a polymer composite material.

Furthermore, in the resin filling step, the air in the filling gap G is removed by a vacuum plugging machine, and then the ink resin 4 is filled into the filling gap G by a vacuum plugging machine . More specifically, the ink resin 4 is filled in the filling gap G, so that there is substantially no air in the filling gap G.

Furthermore, as shown in FIG. 2D, the ink resin 4 partially overflows onto the first surface 101 and the second surface 102 of the inner layer circuit board 1, and the overflowing ink resin needs to be in the subsequent Removed during the step.

It is worth mentioning that after the ink resin 4 is filled to the filling gap G, the ink resin 4 covers the base 31, the extension 32, and at least two ribs 33 of the heat dissipation copper block 3. Moreover, after the ink resin 4 is cured, the heat-dissipating copper block 3 and the ink resin 4 have a structure that fits each other, so that the heat-dissipating copper block 3 is more fixed in the accommodating structure 2.

As shown in FIG. 2E, FIG. 2E is a schematic diagram of step S150 of a method for manufacturing a circuit board according to an embodiment of the present invention. The step S150 is a planarization step. The planarization step includes: grinding, polishing, or brushing the ink resin 4, so that the ink resin 4 located in the filling gap G and the first surface 101 or the second surface of the inner layer circuit board 1 102 are flush with each other, thus forming a flat plane.

Wherein, the planarization step is to use a grinder or a brush grinder to grind or brush the ink resin 4 to remove overflow to the first surface 101 or the second surface of the inner layer circuit board 1. Ink resin 4 on surface 102. In a preferred embodiment of the present invention, the flattening step is to use an eight-axis ceramic grinding and polishing machine to grind the ink resin 4 to remove overflow to the first surface of the inner layer circuit board 1. 101 or ink resin 4 on the second surface 102.

In an unillustrated embodiment of the present invention, after the planarization step, the manufacturing method of the circuit board further includes sequentially performing a drilling step, an electroplating step, and an outer layer A circuit forming step (outer circuit forming step), a solder mask step (solder mask step), and a molding step (molding step) are completed, thereby completing the manufacture of the circuit board E. The above-mentioned steps are all within the scope of the prior art and will not be described here.

According to the above configuration, the manufacturing method of the circuit board of the embodiment of the present invention is filled with resin ink around the heat dissipation copper block, and filled with PP prepreg instead; and the blind fishing machine is used to well control the blind fishing depth and accuracy to achieve fishing The accommodating groove is matched with the size of the heat dissipation copper block; and the vacuum plugging machine is used to remove air when plugging the hole, and the resin ink is inserted. The eight-axis ceramic grinding and polishing machine realizes the flattening, which ensures the heat dissipation of the copper block. Reliability with ink resin, and has the advantage of relatively simple process flow.

[Circuit board with buried copper block structure]

The above is the description of the circuit board manufacturing method of this embodiment, and the following describes the specific structure of the circuit board of this embodiment. It must be noted that although the circuit board of this embodiment is manufactured by the above-mentioned manufacturing method of the circuit board, the present invention is not limited to this. In other words, the circuit board of the present invention can also be manufactured by other circuit board manufacturing methods.

The embodiment of the present invention also discloses a circuit board E with a buried copper block structure. The circuit board E includes an inner layer circuit board 1, a accommodating structure 2, a heat dissipation copper block 3, and an ink resin 4. The specific structure of each component of the circuit board of this embodiment will be described below, and then the connection relationship between the various components of the circuit board will be described in a timely manner. It should be noted that, in order to facilitate the understanding of this embodiment, the drawings only present the partial structure of the circuit board, so as to clearly show the structure and connection relationship of the various components of the circuit board.

Please refer to FIG. 3, the inner circuit board 1 is formed with a accommodating structure 2. The heat-dissipating copper block 3 is arranged in the accommodating structure 2. A filling gap G is formed between the outer side wall of the heat dissipation copper block 3 and the inner side wall of the accommodating structure 2. Furthermore, the ink resin 4 is filled into the filling gap G, and the ink resin 4 is cured, thereby forming the buried copper block structure.

The inner layer circuit board 1 includes a plurality of inner layer substrates 11, the inner layer circuit board 1 is formed by a plurality of the inner layer substrates 11 through an inner lamination operation, and a plurality of the inner layer substrates A top surface of 11 is defined as a first surface 101, and a bottom surface of the plurality of inner substrates 11 is defined as a second surface 102.

The accommodating structure 2 is formed by penetrating a plurality of inner substrates 11, and the accommodating structure 2 has a first groove 21 recessed on the first surface 101 and recessed on the second surface 102. A second groove 22. Wherein, the first groove 21 is spatially connected to the second groove 22, and a first width W1 of the first groove 21 is greater than a second width W2 of the second groove 22.

The heat dissipation copper block 3 has a base 31 and an extension 32 extending from one end of the base 31, and the width of the extension 32 is smaller than the width of the base 31. The first groove 21 is used to accommodate the base 31 of the heat dissipation copper block 3, and the second groove 22 is used to accommodate the extension portion 32 of the heat dissipation copper block 3.

The heat dissipation copper block 3 further has at least two protruding ribs 33 (four in this embodiment) protruding from the base 31. The filling gap G is formed between the outer side wall of the base 31 and the inner side wall of the accommodating structure 2, and at least two of the ribs 33 of the heat dissipation copper block 3 are facing the inner side wall of the accommodating structure 2 The direction is convex.

The at least two protruding ribs 33 of the heat dissipation copper block 3 are configured to abut against the inner side wall of the accommodating structure 2, so that the heat dissipation copper block 3 can be fixed to the accommodating structure through the at least two protruding ribs 33 Structure 2.

Furthermore, the ink resin 4 located in the filling gap G and the first surface 101 or the second surface 102 of the inner layer circuit board 1 are flush with each other, thereby forming a flat plane.

In another embodiment of the present invention, please refer to FIG. 4, the accommodating structure 2 of the circuit board E'has a first groove 21 recessed on the first surface 101, and the first groove 21 At least part of the inner substrate 11 penetrates through the plurality of inner substrates 11. Wherein, the first groove 21 is a blind hole structure, and the first groove 21 is configured to accommodate the heat dissipation copper block 3.

Please refer to FIG. 5, after the first groove 21 is inserted by the heat dissipating copper block 3, the outer side wall of the heat dissipating copper block 3 and the inner side wall of the first groove 21 form a filling gap G to provide The ink resin 4 is filled therein. Furthermore, the bottom of the heat dissipation copper block 3 is in contact with the bottom wall of the first groove 21, that is, there is no ink between the bottom of the heat dissipation copper block 3 and the bottom wall of the first groove 21 Resin, but the present invention is not limited to this. It is worth mentioning that, in an embodiment of the present invention, the bottom wall of the first groove 21 is a metalized surface, such as a copper surface. Thereby, the bottom of the heat dissipating copper block 3 is in contact with the bottom wall of the first groove 21, which can provide heat dissipation effect, but the present invention is not limited to this.

[Beneficial effects of the embodiment]

The beneficial effect of the present invention is that the embedded copper block structure provided by the present invention can pass "a blind fishing step, which includes: performing a blind fishing operation on the inner circuit board, so that the inner The layer circuit board is formed with a accommodating structure" and "a copper block inserting step, which includes: providing a heat dissipation copper block, and inserting the heat dissipation copper block into the accommodating structure; wherein, the heat dissipation copper block A filling gap is formed between the outer side wall of the accommodating structure and the inner side wall of the accommodating structure" and "a resin filling step, which includes: filling an ink resin into the filling gap, and curing the ink resin, Thus, the technical solution of the "buried copper block structure" is formed to improve the reliability between the heat dissipation copper block and the ink resin, and has the advantage of relatively simple process flow.

The content disclosed above is only the preferred and feasible embodiments of the present invention, and does not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the description and schematic content of the present invention are included in the application of the present invention. Within the scope of the patent.

E, E’: Circuit board 1: inner circuit board 101: first surface 102: second surface 11: Inner substrate 2: Housing structure 21: The first groove W1: first width H1: first depth 22: second groove W2: second width H2: second depth 23: reach the top 3: Heat dissipation copper block 31: Base 32: Extension 33: convex rib 4: Ink resin G: Fill the gap

FIG. 1 is a schematic flowchart of a method for manufacturing a circuit board according to an embodiment of the present invention.

2A is a schematic diagram of step S110 of a method for manufacturing a circuit board according to an embodiment of the present invention.

2B is a schematic diagram of step S120 of the method for manufacturing a circuit board according to an embodiment of the present invention.

2C is a schematic diagram of step S130 of the method for manufacturing a circuit board according to an embodiment of the present invention.

2D is a schematic diagram of step S140 of the method for manufacturing a circuit board according to an embodiment of the present invention.

2E is a schematic diagram of step S150 of the method for manufacturing a circuit board according to an embodiment of the present invention.

Fig. 3 is a schematic diagram of a circuit board according to an embodiment of the present invention.

4 is a schematic diagram of another implementation aspect of the accommodating structure according to the embodiment of the present invention.

FIG. 5 is a schematic diagram of another implementation aspect of the circuit board according to the embodiment of the present invention.

Claims (8)

A method for manufacturing a circuit board with an embedded copper block structure includes: a preparation step, including: providing an inner layer circuit board with a first surface and a second surface on opposite sides; a blind fishing The step includes: performing a blind fishing operation on the inner layer circuit board, so that the inner layer circuit board is formed with a containing structure; wherein, the containing structure includes a concave portion provided on the first surface A first groove and a second groove recessed on the second surface, the first groove is spatially connected to the second groove, and a first width of the first groove is between Between 120% and 140% of a second width of the second groove, and a first depth of the first groove is between 600% of a second depth of the second groove To 700%; a copper block inserting step, which includes: providing a heat dissipation copper block, and inserting the heat dissipation copper block into the accommodating structure; wherein, the outer side wall of the heat dissipation copper block and the A filling gap is formed between the inner side walls of the accommodating structure; wherein the heat dissipation copper block has a base and an extension extending from one end of the base, and the width of the extension is smaller than the width of the base, so The heat dissipating copper block further has at least two convex ribs respectively protruding outward from opposite sides of the base, the outer side wall of the base and the inner side wall of the accommodating structure form the filling gap, and the heat dissipating At least two of the convex ribs of the copper block protrude toward the inner side wall of the accommodating structure and abut against the inner side wall of the accommodating structure; the first groove accommodates the The base portion and the two ribs of the heat dissipation copper block, and the second groove accommodates the extension portion of the heat dissipation copper block; and a resin filling step, which includes: filling an ink resin to The gap is filled and the ink resin is cured to form the buried copper block structure. The method for manufacturing a circuit board with a buried copper block structure according to claim 1, wherein the outer side wall of the heat dissipation copper block and the inner side wall of the accommodating structure are formed between The filling gap is between 500 microns and 1000 microns. The method for manufacturing a circuit board with a buried copper block structure according to claim 1, wherein the inner layer circuit board includes a plurality of inner layer substrates, and the inner layer circuit board is composed of a plurality of inner layer substrates. The substrate is formed by an internal lamination process, a top surface of a plurality of the inner substrates is defined as the first surface, and a bottom surface of a plurality of the inner substrates is defined as the second surface. The method for manufacturing a circuit board with a buried copper block structure according to claim 3, wherein the containing structure is formed by penetrating a plurality of the inner substrates. The method for manufacturing a circuit board with a buried copper block structure according to claim 1, wherein, in the resin filling step, the air in the filling gap is removed by a vacuum plugging machine, and the The ink resin is filled into the filling gap by the vacuum plugging machine. The method for manufacturing a circuit board with a buried copper block structure according to claim 1, wherein, after the resin filling step, the circuit board manufacturing method further includes: a planarization step, which includes: The ink resin is ground, polished, or brushed so that the ink resin located in the filling gap and the first surface or the second surface of the inner layer circuit board are flush with each other, thereby forming a Flat surface. The method for manufacturing a circuit board having a buried copper block structure according to claim 6, wherein, in the resin filling step, the ink resin fills the filling gap and partially overflows to the On the first surface or the second surface of the inner layer circuit board; wherein, the flattening step is to use a grinder or a brush grinder to grind or brush the ink resin to remove In addition to overflowing to the ink on the first surface or the second surface of the inner layer circuit board Resin. The method for manufacturing a circuit board with a buried copper block structure according to claim 1, wherein the heat dissipation copper block can be fixed in the accommodating structure through at least two protruding ribs.

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