TW202226912A - Method for manufacturing circuit board with embedded copper block structure - Google Patents

Abstract

A method for manufacturing a circuit board with an embedded copper block structure includes a preparation step, a blind hole forming step, a copper block inserting step, and a resin filling step. The preparation step includes providing an inner layer circuit board. The blind hole forming step includes performing a blind hole forming operation on the inner layer circuit board, so that the inner layer circuit board forms an accommodation structure. The copper block inserting step includes providing a heat dissipation copper block and inserting the heat dissipation copper block into the accommodating structure. A filling gap is formed between the heat dissipation copper block and the accommodating structure. The resin filling step includes filling ink resin into the filling gap and curing the ink resin to form the embedded copper block structure.

Description

Circuit board manufacturing method with buried copper block structure

The invention relates to a method for manufacturing a circuit board, in particular to a method for manufacturing a circuit board with an embedded copper block structure.

In the technical field of printed circuit boards, in order to improve the heat dissipation effect of the circuit board, a heat dissipation copper block can be inserted into the circuit board. Most of the existing copper block plugging process is the pressing method to plug the hole copper block. Copper block), followed by drilling, electroplating, outer layer, S/M, forming and other steps to complete the production of the circuit board. However, this process is complicated, and the size of the copper block is matched with the accuracy of the slot position of the board, and the uniformity of the board thickness, etc., which are prone to problems such as the influence of the alignment of the copper block and the reliability.

Therefore, how to provide a method for manufacturing a circuit board with an embedded copper block structure to overcome the above-mentioned defects has become one of the important issues to be solved by this business.

The technical problem to be solved by the present invention is to provide a circuit board manufacturing method with a buried copper block structure in view of the deficiencies of the prior art.

In order to solve the above-mentioned technical problems, one of the technical solutions adopted by the present invention is to provide a circuit board manufacturing method with a buried copper block structure, which includes: a preparation step, a blind scooping step, a copper block inserting step, and Resin filling step. The preparation step involves providing the inner layer circuit board. The blind scooping step includes performing a blind scooping operation on the inner-layer circuit board, so that the inner-layer circuit board forms a accommodating structure. The step of inserting the copper block includes providing the heat-dissipating copper block and inserting the heat-dissipating copper block into the accommodating structure. A filling gap is formed between the heat dissipation copper block and the accommodating structure. The resin filling step includes filling the ink resin into the filling gap, and curing the ink resin, thereby forming the buried copper block structure.

The beneficial effect of the present invention is that the buried copper block structure provided by the present invention can pass through "a blind scooping step, which includes: performing a blind scooping operation on the inner layer circuit board, so that the inner The layered circuit board is formed with an accommodating structure” and “a copper block inserting step, which includes: providing a heat dissipation copper block, and inserting the heat dissipation copper block into the accommodating structure; wherein, the heat dissipation copper block A filling gap is formed between the outer sidewall of the accommodating structure and the inner sidewall of the accommodating structure" and "a resin filling step, which includes: filling an ink resin into the filling gap, and curing the ink resin, Thus, the technical solution of the embedded copper block structure is formed, so as to improve the reliability between the heat dissipation copper block and the ink resin, and has the advantage of a relatively simple process flow.

For a further understanding of the features and technical content of the present invention, please refer to the following detailed descriptions and drawings of the present invention. However, the drawings provided are only for reference and description, and are not intended to limit the present invention.

The following are specific specific examples to illustrate the embodiments disclosed in the present invention, and those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further describe the related technical contents of the present invention in detail, but the disclosed contents are not intended to limit the protection scope of the present invention.

It should be understood that although terms such as "first", "second" and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are primarily used to distinguish one element from another element, or a signal from another signal. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.

[Manufacturing method of circuit board]

Please refer to FIG. 1 , which is a schematic flowchart of a method for manufacturing a circuit board with a buried copper block structure according to an embodiment of the present invention. The manufacturing method of the circuit board includes step S110, step S120, step S130, step S140, and step S150. It must be noted that, the sequence of each step and the actual operation mode described in this embodiment can be adjusted according to requirements, and are not limited to those described in this embodiment.

A method of fabricating a circuit board may provide additional operations before, during, and after various steps, and some of the operations described may be replaced, eliminated, or relocated to implement additional embodiments of the method. The manufacturing method of the circuit board is described below with reference to FIGS. 2A to 2E .

As shown in FIG. 2A , FIG. 2A is a schematic diagram of step S110 of a method for manufacturing a circuit board according to an embodiment of the present invention. The step S110 is a preparation step, and the preparation step includes: providing an inner-layer circuit board 1 , wherein the inner-layer circuit board 1 has a first surface 101 and a first surface on the opposite side Two surfaces 102 .

In this embodiment, the inner-layer circuit board 1 includes a plurality of inner-layer substrates 11 , and each of the inner-layer substrates 11 has a board structure and an inner-layer circuit (not numbered in the figure) formed on the board structure.

Further, the inner-layer circuit board 1 is formed by stacking a plurality of inner-layer substrates 11 with each other and through an inner-layer lamination process. Wherein, a top surface of the plurality of inner layer substrates 11 is defined as the first surface 101 , and a bottom surface of the plurality of inner layer substrates 11 is defined as the second surface 102 . Wherein, the number of the plurality of inner layer substrates may be, for example, four, six, eight, ten, or more than ten, that is, the inner layer circuit board 1 is a multi-layer circuit board.

It should be noted that the “first” and “second” described herein for each element or structure, such as the first surface, the second surface, the first groove, and the second groove, are only for the convenience of description and It is convenient to distinguish different elements or structures, but is not intended to limit the arrangement order or upper-lower positional relationship of each element or structure. For example, although this embodiment is described by taking the first surface 101 as the upper surface of the inner-layer circuit board 1 and the second surface 102 as the lower surface of the inner-layer circuit board 1 as an example, in practical application, the The first surface 101 can also be the lower surface of the inner-layer circuit board 1 , and the second surface 102 can also be the upper surface of the inner-layer circuit board 1 , which is not limited in the present invention.

As shown in FIG. 2B , FIG. 2B is a schematic diagram of step S120 of the method for manufacturing a circuit board according to an embodiment of the present invention. The step S120 is a blind hole forming step, and the blind hole forming step includes: using a blind hole forming machine to perform a blind hole forming operation on the inner layer circuit board 1, so that the inner layer circuit board 1 is formed by a blind hole forming step. The circuit board 1 is formed with an accommodating structure 2 . Wherein, the accommodating structure 2 is used to provide a heat-dissipating copper block to be inserted therein.

It is worth mentioning that the shape and size of the inner layer circuit board 1 are substantially fixed after passing through the inner lamination operation. Therefore, in the subsequent blind fishing step, the blind fishing forming machine can cooperate with the subsequent plugging. The size of the heat-dissipating copper block to be inserted can well control the depth and precision of the blind scooping, so as to produce a accommodating structure of suitable size.

In this embodiment, the accommodating structure 2 is formed by penetrating through a plurality of inner-layer substrates 11 , and the accommodating structure 2 includes a first groove 21 and a concave recessed on the first surface 101 . A second groove 22 is formed on the second surface 102 . The first groove 21 is spatially communicated with the second groove 22 , and a first width W1 of the first groove 21 is greater than a second width W2 of the second groove 22 ( Please also refer to Figure 3).

Please continue to refer to FIG. 2B and also refer to FIG. 3 , in the accommodating structure 2 , the first width W1 of the first groove 21 is between the second width of the second groove 22 Between 120% and 140% of W2, and a first depth H1 of the first groove 21 is between 600% and 700% of a second depth H2 of the second groove 22, but The present invention is not limited to this.

In terms of the forming method, the first groove 21 is formed by blind casting towards the first surface 101 of the inner layer circuit board 1 by a blind casting forming machine, and the second groove 22 is formed by a blind casting forming machine. It is formed by blind scooping toward the second surface 102 of the inner layer circuit board 1 .

Referring to FIG. 4 , in another embodiment of the present invention, the accommodating structure 2 has a first groove 21 recessed in the first surface 101 , and the first groove 21 penetrates through a plurality of At least part of the inner layer substrate 11 of the inner layer substrate 11 . Wherein, the first groove 21 is a blind hole structure, and the first groove 21 is used for accommodating the following heat dissipation copper block 3 .

As shown in FIG. 2C , FIG. 2C is a schematic diagram of step S130 of the method for manufacturing a circuit board according to an embodiment of the present invention. The step S130 is a copper block inserting step. The step of inserting the copper block includes: providing a heat-dissipating copper block 3 and inserting the heat-dissipating copper block 3 into the accommodating structure 2 . Wherein, a filling gap G (filling gap) is formed between the outer side wall of the heat dissipation copper block 3 and the inner side wall of the accommodating structure 2 , and the filling gap G is used to provide ink resin to be filled therein.

In this embodiment, the heat-dissipating copper block 3 can be selected from red copper with thermal conductivity ranging from 350 W/mk to 400 W/mk and thermal conductivity ranging from 80% to 99%, which can provide better thermal conductivity. Effect.

In this embodiment, the filling gap G formed between the outer sidewall of the heat dissipation copper block 3 and the inner sidewall of the accommodating structure 2 has a width between 500 μm and 1000 μm. That is, the distance between the outer sidewall of the heat dissipation copper block 3 and the inner sidewall of the accommodating structure 2 is between 500 μm and 1000 μm, but the invention is not limited thereto. Thereby, after the ink resin is filled to the filling gap G and flattened, the ink resin and the heat dissipation copper block 3 can have good reliability.

Further, please continue to refer to FIG. 2C , the heat dissipation copper block 3 has a base 31 and an extension 32 extending from one end of the base 31 , and the width of the extension 32 is smaller than the width of the base 31 , So that the heat dissipation copper block 3 is in an inverted convex shape as a whole.

Furthermore, the heat-dissipating copper block 3 further has at least two protruding ribs 33 respectively protruding outward from opposite sides of the base portion 31 . In this embodiment, the number of the protruding ribs 33 is four, but the present invention is not limited thereto. Wherein, after the heat dissipation copper block 3 is inserted into the accommodating structure 2 , the outer sidewall of the base 31 and the inner sidewall of the accommodating structure 2 form the filling gap G, and the heat dissipation copper block 3 At least two protruding ribs 33 protrude toward the inner side wall of the accommodating structure 2 .

In this embodiment, the at least two protruding ribs 33 of the heat dissipation copper block 3 abut against the inner sidewall of the accommodating structure 2 , so that the heat dissipation copper block 3 can be fixed on the heat dissipation copper block 3 through the at least two protruding ribs 33 . accommodating structure 2.

In the accommodating structure 2, the first groove 21 and the second groove 22 together form a stepped structure, and a portion of the stepped structure parallel to the first surface 101 or the second surface 102 is defined. One to the top 23. The abutting portion 23 is located between the first groove 21 and the second groove 22 . When the accommodating structure 2 accommodates the heat-dissipating copper block 3 , the accommodating structure 2 abuts the heat-dissipating copper block 3 through the abutting portion 23 .

Furthermore, when the accommodating structure 2 accommodates the heat dissipation copper block 3, the first groove 21 can accommodate the base 31 and the rib 33 of the heat dissipation copper block 3, and the second groove 22 can accommodate the heat dissipation copper block 3. The extension portion 32 of the heat dissipation copper block 3 is placed. In this embodiment, the top surface of the base portion 31 and the first surface 101 of the inner layer circuit board 1 are flush with each other, and the bottom surface of the extension portion 32 and the second surface 102 of the inner layer circuit board 1 are flush with each other , but the present invention is not limited to this.

As shown in FIG. 2D , FIG. 2D is a schematic diagram of step S140 of the circuit board manufacturing method according to the embodiment of the present invention. The step S140 is a resin filling step. The resin filling step includes: filling an ink resin 4 into the filling gap G, and curing the ink resin 4 to form a submerged type Embedded copper block structure.

The main component of the ink resin 4 can be, for example, epoxy resin (expoxy resin), polyimide (polyimide), cyanate ester (cyanate ester), bismaleimide triazine (bismaleimide triazine), or the above The combination can also be a polymer composite material.

Further, in the resin filling step, the air in the filling gap G is removed by a vacuum plugging machine, and then the ink resin 4 is filled into the filling gap G through a vacuum plugging machine . More specifically, the ink resin 4 fills the filling gap G so that the filling gap G does not contain air substantially.

Furthermore, as shown in FIG. 2D , the ink resin 4 partially overflows onto the first surface 101 and the second surface 102 of the inner-layer circuit board 1 , and the overflowed ink resin needs to be processed in subsequent steps. steps are removed.

It is worth mentioning that after the ink resin 4 is filled to the filling gap G, the ink resin 4 covers the base 31 , the extension 32 , and the at least two protruding ribs 33 of the heat dissipation copper block 3 . In addition, after the ink resin 4 is cured, the heat dissipation copper block 3 and the ink resin 4 become a structure in which they are fitted with each other, so that the heat dissipation copper block 3 is more fixed in the accommodating structure 2 .

As shown in FIG. 2E , FIG. 2E is a schematic diagram of step S150 of the method for manufacturing a circuit board according to an embodiment of the present invention. The step S150 is a planarization step. The planarizing step includes: grinding, polishing, or brushing the ink resin 4, so that the ink resin 4 located in the filling gap G and the first surface 101 or the second surface of the inner layer circuit board 1 102 are flush with each other, thereby forming a flat plane.

Wherein, in the planarization step, a grinder or a brush grinder is used to grind or brush the ink resin 4 to remove the overflow to the first surface 101 or the second surface of the inner layer circuit board 1 . Ink resin 4 on surface 102. In a preferred embodiment of the present invention, the planarization step is to use an eight-axis ceramic grinding and polishing machine to grind the ink resin 4 to remove the overflow to the first surface of the inner-layer circuit board 1 101 or ink resin 4 on the second surface 102.

In an unillustrated embodiment of the present invention, after the planarization step, the manufacturing method of the circuit board further includes sequentially performing a drilling step, an electroplating step, and an outer layer. An outer circuit forming step, a solder mask step, and a molding step are performed to complete the fabrication of the circuit board E. The above steps are all within the scope of the prior art, and will not be described here.

According to the above configuration, in the manufacturing method of the circuit board of the embodiment of the present invention, the heat dissipation copper block is filled with resin ink, and the PP prepreg replaced by it is filled; The accommodating groove matched with the size of the heat-dissipating copper block; and, with a vacuum plugging machine, the air is removed when plugging the hole, and the resin ink is inserted, and the eight-axis ceramic grinding and polishing machine is used to achieve flattening, which ensures the heat-dissipating copper block. It is reliable with ink resin and has the advantage of relatively simple process flow.

[Circuit board with buried copper block structure]

The above is the description of the circuit board manufacturing method of the present embodiment, and the following describes the specific structure of the circuit board of the present embodiment. It must be noted that although the circuit board of this embodiment is manufactured by the above-mentioned manufacturing method of the circuit board, the present invention is not limited thereto. That is, the circuit board of the present invention may be produced by other methods of manufacturing a circuit board.

The embodiment of the present invention further discloses a circuit board E having an embedded copper block structure. The circuit board E includes an inner-layer circuit board 1 , an accommodating structure 2 , a heat-dissipating copper block 3 , and an ink resin 4 . The specific structure of each element of the circuit board in this embodiment will be described below, and then the connection relationship between the various elements of the circuit board will be described in due course. It should be noted that, in order to facilitate understanding of this embodiment, the drawings only show a partial structure of the circuit board, so as to clearly show the structure and connection relationship of each element of the circuit board.

Please refer to FIG. 3 , the inner circuit board 1 is formed with an accommodating structure 2 . The heat dissipation copper block 3 is arranged in the accommodating structure 2 . A filling gap G is formed between the outer sidewall of the heat dissipation copper block 3 and the inner sidewall of the accommodating structure 2 . Furthermore, the ink resin 4 is filled into the filling gap G, and the ink resin 4 is cured, thereby forming the buried copper block structure.

The inner layer circuit board 1 includes a plurality of inner layer substrates 11 , and the inner layer circuit board 1 is formed by a plurality of the inner layer substrates 11 through an inner lamination operation. A top surface 11 is defined as a first surface 101 , and a bottom surface of the plurality of inner-layer substrates 11 is defined as a second surface 102 .

The accommodating structure 2 is formed by penetrating through a plurality of inner-layer substrates 11 , and the accommodating structure 2 has a first groove 21 recessed in the first surface 101 and a groove 21 recessed in the second surface 102 . A second groove 22 . The first groove 21 is spatially communicated with the second groove 22 , and a first width W1 of the first groove 21 is greater than a second width W2 of the second groove 22 .

The heat dissipation copper block 3 has a base portion 31 and an extension portion 32 extending from one end of the base portion 31 , and the width of the extension portion 32 is smaller than the width of the base portion 31 . The first groove 21 is used to accommodate the base portion 31 of the heat dissipation copper block 3 , and the second groove 22 is used to accommodate the extension portion 32 of the heat dissipation copper block 3 .

The heat dissipation copper block 3 further has at least two protruding ribs 33 (four in this embodiment) protruding outward from the base portion 31 . The filling gap G is formed between the outer sidewall of the base 31 and the inner sidewall of the accommodating structure 2 , and at least two of the protruding ribs 33 of the heat dissipation copper block 3 face the inner sidewall of the accommodating structure 2 . direction protruding.

At least two protruding ribs 33 of the heat-dissipating copper block 3 are configured to abut against the inner sidewall of the accommodating structure 2 , so that the heat-dissipating copper block 3 can be fixed to the accommodating body through the at least two protruding ribs 33 in structure 2.

Furthermore, the ink resin 4 located in the filling gap G and the first surface 101 or the second surface 102 of the inner layer circuit board 1 are flush with each other, thereby forming a flat plane.

In another embodiment of the present invention, please refer to FIG. 4 , the accommodating structure 2 of the circuit board E′ has a first groove 21 recessed in the first surface 101 , and the first groove 21 At least part of the inner layer substrates 11 of the plurality of inner layer substrates 11 is penetrated. The first groove 21 is a blind hole structure, and the first groove 21 is configured to accommodate the heat dissipation copper block 3 .

Please refer to FIG. 5 , after the first groove 21 is inserted by the heat-dissipating copper block 3 , the outer sidewall of the heat-dissipating copper block 3 and the inner sidewall of the first groove 21 form a filling gap G for providing The ink resin 4 is filled therein. Furthermore, the bottom of the heat-dissipating copper block 3 is in contact with the bottom wall of the first groove 21 , that is, no ink is contained between the bottom of the heat-dissipating copper block 3 and the bottom wall of the first groove 21 . resin, but the present invention is not limited to this. It is worth mentioning that, in an embodiment of the present invention, the bottom wall of the first groove 21 is a metallized surface, such as a copper surface. Thereby, the bottom of the heat dissipation copper block 3 is in contact with the bottom wall of the first groove 21 to provide heat dissipation effect, but the present invention is not limited to this.

[Advantageous effects of the embodiment]

The beneficial effect of the present invention is that the buried copper block structure provided by the present invention can pass through "a blind scooping step, which includes: performing a blind scooping operation on the inner layer circuit board, so that the inner The layered circuit board is formed with an accommodating structure” and “a copper block inserting step, which includes: providing a heat dissipation copper block, and inserting the heat dissipation copper block into the accommodating structure; wherein, the heat dissipation copper block A filling gap is formed between the outer sidewall of the accommodating structure and the inner sidewall of the accommodating structure" and "a resin filling step, which includes: filling an ink resin into the filling gap, and curing the ink resin, Thus, the technical solution of the embedded copper block structure is formed, so as to improve the reliability between the heat dissipation copper block and the ink resin, and has the advantage of a relatively simple process flow.

The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the scope of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

E, E': circuit board 1: inner circuit board 101: First Surface 102: Second Surface 11: Inner substrate 2: accommodating structure 21: First groove W1: first width H1: first depth 22: Second groove W2: Second width H2: Second depth 23: to the top 3: heat dissipation copper block 31: Base 32: Extensions 33: Ribs 4: ink resin G: Fill the gap

FIG. 1 is a schematic flowchart of a method for manufacturing a circuit board according to an embodiment of the present invention.

FIG. 2A is a schematic diagram of step S110 of a method for manufacturing a circuit board according to an embodiment of the present invention.

FIG. 2B is a schematic diagram of step S120 of the circuit board manufacturing method according to the embodiment of the present invention.

FIG. 2C is a schematic diagram of step S130 of the circuit board manufacturing method according to the embodiment of the present invention.

FIG. 2D is a schematic diagram of step S140 of the circuit board manufacturing method according to the embodiment of the present invention.

FIG. 2E is a schematic diagram of step S150 of the method for manufacturing a circuit board according to an embodiment of the present invention.

FIG. 3 is a schematic diagram of a circuit board according to an embodiment of the present invention.

FIG. 4 is a schematic diagram of another implementation aspect of the accommodating structure according to the embodiment of the present invention.

FIG. 5 is a schematic diagram of another implementation aspect of the circuit board according to the embodiment of the present invention.

Claims (10)

A method for manufacturing a circuit board with an embedded copper block structure, comprising: A preparation step, which includes: providing an inner layer circuit board; a blind scooping step, which includes: performing a blind scooping operation on the inner-layer circuit board, so that the inner-layer circuit board forms an accommodating structure; A copper block inserting step includes: providing a heat dissipation copper block, and inserting the heat dissipation copper block into the accommodating structure; wherein, the outer sidewall of the heat dissipation copper block and the inner side of the accommodating structure A filling gap is formed between the sidewalls; and A resin filling step includes: filling an ink resin into the filling gap, and curing the ink resin to form the buried copper block structure. The method for manufacturing a circuit board with a buried copper block structure according to claim 1, wherein the space formed between the outer sidewall of the heat dissipating copper block and the inner sidewall of the accommodating structure The filling gap is between 500 microns and 1000 microns. The method for manufacturing a circuit board with a buried copper block structure as claimed in claim 1, wherein the inner-layer circuit board has a first surface and a second surface on opposite sides, and the inner-layer circuit board comprises There are a plurality of inner layer substrates, the inner layer circuit board is formed by a plurality of the inner layer substrates through an inner lamination operation, and a top surface of the plurality of the inner layer substrates is defined as the first surface , and a bottom surface of a plurality of the inner layer substrates is defined as the second surface. The method for manufacturing a circuit board with an embedded copper block structure as claimed in claim 3, wherein the accommodating structure is formed by penetrating through a plurality of the inner layer substrates, and the accommodating structure has a recessed structure in the A first groove on the first surface and a second groove recessed on the second surface; wherein, the first groove is spatially communicated with the second groove, and the first groove is A first width of a groove is greater than a second width of the second groove. The method for manufacturing a circuit board with a buried copper block structure according to claim 3, wherein the accommodating structure includes a first groove recessed on the first surface, the first groove Through at least a part of the inner layer substrates of the plurality of inner layer substrates, the first groove is a blind via structure, and the first groove is configured to accommodate the heat dissipation copper block. The method for manufacturing a circuit board having an embedded copper block structure according to claim 1, wherein, in the resin filling step, the air in the filling gap is removed by a vacuum plugging machine, and the The ink resin is filled into the filling gap by the vacuum plugging machine. The method for manufacturing a circuit board with an embedded copper block structure according to claim 1, wherein, after the resin filling step, the method for manufacturing a circuit board further comprises: a planarizing step, which includes: applying the resin to the circuit board. The ink resin is ground, polished, or brushed so that the ink resin located in the filling gap and the first surface or the second surface of the inner layer circuit board are flush with each other, thereby forming a flat surface. The method for manufacturing a circuit board with an embedded copper block structure according to claim 7, wherein, in the resin filling step, the ink resin fills the filling gap and partially overflows to the filling gap. On the first surface or the second surface of the inner layer circuit board; wherein, the planarization step is to use a grinder or a brush grinder to grind or brush the ink resin to remove the ink resin. Ink resin overflowing onto the first surface or the second surface of the inner layer circuit board is removed. The method for manufacturing a circuit board with a buried copper block structure according to claim 1, wherein the heat dissipation copper block has a base and at least two protruding ribs protruding from the base; wherein the base The filling gap is formed between the outer sidewall of the accommodating structure and the inner sidewall of the accommodating structure, and at least two of the protruding ribs of the heat dissipation copper block are protruding toward the direction of the inner sidewall of the accommodating structure . The method for manufacturing a circuit board with a buried copper block structure according to claim 9, wherein at least two of the protruding ribs of the heat dissipation copper block are configured to abut against the inner sidewall of the accommodating structure , so that the heat dissipation copper block can be fixed in the accommodating structure through at least two of the protruding ribs.

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