TWI799062B - Manufacturing method of heat-dissipation circuit board structure - Google Patents

Abstract

The present invention provides a manufacturing method of a heat-dissipation circuit board structure and an embedding type circuit board. The manufacturing method includes: forming a cross-shaped thru-hole penetrating through a circuit board that has a board and a metal layer arranged in the board; forming two receiving slots by respectively recessing from two surfaces of the board until the metal layer; expanding a center of the cross-shaped thru-hole to form a deformable opening, so that a part of the metal layer has a plurality of flanges arranged around the deformable opening and spaced apart from each other; and inserting a heat-conductive block from a first one of the two receiving slots to a second one of the two receiving slots by passing through the deformable opening, so that the flanges are bent to be located between the heat-conductive block and an inner wall of the second one of the two receiving slots.

Description

Method for manufacturing heat-dissipating circuit board structure

The invention relates to a circuit board, in particular to a method for manufacturing a heat dissipation circuit board structure and an embedded circuit board.

In the existing circuit board, a slot hole whose size corresponds to the heat conduction block is dug out, and then the heat conduction block is embedded in the slot hole of the existing circuit board. However, the embedding method of the heat conduction block of the existing circuit board has been practiced for a long time, and the problems caused by it (such as: difficult heavy work, high processing precision requirements) have always existed and are difficult to be effectively improved.

Therefore, the inventor believes that the above-mentioned defects can be improved, Naite devoted himself to research and combined with the application of scientific principles, and finally proposed an invention with reasonable design and effective improvement of the above-mentioned defects.

Embodiments of the present invention provide a method for manufacturing a heat-dissipating circuit board structure and an embedded circuit board, which can effectively improve possible defects of existing circuit boards.

The embodiment of the present invention discloses a method for manufacturing a heat-dissipating circuit board structure, which includes: a patterning step: forming a penetrating cross-shaped through hole in a predetermined area of a circuit board; wherein the circuit board includes a a plate and a metal layer located inside the plate, and the cross pattern runs through the metal layer and the plate; a groove digging step: In the setting area, a receiving groove is recessed from the two board surfaces of the board until the metal layer is formed, so that the cross-shaped through-hole is only located in the metal layer and communicates with the two metal layers. Accommodating groove; a hole opening step: widen the center of the cross-shaped through hole of the metal layer to form a deformation opening, so that the metal layer located in the predetermined area is formed with a hole surrounding the a plurality of edge portions of the deformation opening and spaced apart from each other; and an embedding step: inserting a heat conduction block from one of the receiving grooves along the deformation opening toward the other of the receiving grooves, so that the multiple The edge portion is bent and located between the heat conduction block and the inner wall surface of another one of the receiving grooves.

The embodiment of the present invention also discloses a method for manufacturing a heat-dissipating circuit board structure, which includes: a step of digging a groove: providing a circuit board, which includes a plate and a metal layer inside the plate, and on the circuit board In the preset area, a receiving groove is recessed from the two board surfaces of the board until the metal layer is formed; a hole opening step: a deformation opening is formed in the metal layer, so that the The metal layer in the preset area forms an annular portion surrounding the deformation opening; a patterning step: patterning the annular portion to form a plurality of edge portions spaced apart from each other; and a Embedding step: Insert a heat conduction block from one of the receiving grooves along the deformation opening toward the other of the accommodation grooves, so that a plurality of the edges are bent and located between the heat conduction block and Between the inner walls of the other one of the storage tanks.

The embodiment of the present invention also discloses an embedded circuit board, which includes: a board with two board surfaces on opposite sides; and a metal layer located inside the board; wherein, the board is formed from each The surface of the board is recessed to form a storage groove up to the metal layer, and the metal layer is formed with a deformation opening connected to each of the storage grooves; wherein, the metal layer corresponds to any one of the storage grooves. The slot is formed with a plurality of edge portions surrounding the deformation opening and spaced apart from each other, and each of the edge portions can be bent towards the inner wall of any one of the receiving grooves to form an elastic arm shape.

In summary, the manufacturing method of the heat dissipation circuit board structure disclosed in the embodiment of the present invention method and an embedded circuit board, which match the heat conduction block through a plurality of bendable structural designs of the edge parts, so as to reduce the processing accuracy requirements of the receiving groove (or, according to making the inner The embedded circuit board can allow the heat conduction block embedded therein to have a relatively large processing error), and can also facilitate heavy work between the heat conduction block and the embedded circuit board.

In order to further understand the characteristics and technical content of the present invention, please refer to the following detailed description and drawings related to the present invention, but these descriptions and drawings are only used to illustrate the present invention, rather than to make any statement on the scope of protection of the present invention. limit.

1000: heat dissipation circuit board structure

100: Embedded circuit board

100a: circuit board

1: plate

11a, 11b: board surface

12a, 12b: storage tank

121a, 121b: inner wall surface

2: metal layer

21: Deformation port

22: Edge

23: Annulus

3: Cross hole

200: heat conduction block

201: central section

300: filling layer

H: Thickness direction

R: preset area

G: Gap

α: Bending angle

T: Thickness

D ₁ : first distance

D ₂ : second distance

L: Length

S110: patterning step

S130: Grooving step

S150: Hole opening step

S170: Embedding step

S190: Filling step

S210: Grooving step

S230: Opening step

S250: patterning step

FIG. 1 is a schematic diagram of the patterning steps of the manufacturing method of the heat dissipation circuit board structure according to the first embodiment of the present invention.

FIG. 2 is a schematic diagram of the groove-digging steps of the manufacturing method of the heat-dissipating circuit board structure according to Embodiment 1 of the present invention.

FIG. 3 is a schematic cross-sectional view along line III-III in FIG. 2 .

FIG. 4 is a schematic diagram of the opening steps of the manufacturing method of the heat dissipation circuit board structure according to the first embodiment of the present invention.

FIG. 5 is a schematic cross-sectional view of FIG. 4 along the section line V-V.

6 and 7 are schematic diagrams of embedding steps of the manufacturing method of the heat dissipation circuit board structure according to Embodiment 1 of the present invention.

FIG. 8 is a schematic diagram of the filling steps of the manufacturing method of the heat dissipation circuit board structure according to the first embodiment of the present invention.

FIG. 9 is a schematic diagram of the groove-digging steps of the manufacturing method of the heat-dissipating circuit board structure according to the second embodiment of the present invention.

FIG. 10 is a schematic cross-sectional view along the section line X-X in FIG. 9 .

FIG. 11 is a schematic diagram of the opening steps of the manufacturing method of the heat dissipation circuit board structure according to the second embodiment of the present invention.

12 is a schematic diagram of the patterning steps of the manufacturing method of the heat dissipation circuit board structure according to the second embodiment of the present invention.

The following is a description of the implementation of the "manufacturing method of a heat dissipation circuit board structure and an embedded circuit board" disclosed in the present invention through specific specific examples. Those skilled in the art can understand the principles of the present invention from the content disclosed in this specification. Advantages and effects. The present invention can be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple illustration, and are not drawn according to the actual size, which is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.

It should be understood that although terms such as "first", "second", and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are mainly used to distinguish one element from another element, or one signal from another signal. In addition, the term "or" used herein may include any one or a combination of more of the associated listed items depending on the actual situation.

[Example 1]

Please refer to FIG. 1 to FIG. 8 , which are the first embodiment of the present invention. This embodiment discloses a method for manufacturing a heat dissipation circuit board structure, which sequentially includes a patterning step S110 , a digging step S130 , a hole opening step S150 , an embedding step S170 , and a filling step S190 . The specific implementation of the above steps will be described below. However, it should be noted that the above steps can be It is possible to adjust the implementation sequence or implementation manner according to the design requirements, or omit the steps therein (for example: omit the filling step S190 ), so the content of this embodiment is not limited thereto.

The patterning step S110 : as shown in FIG. 1 , a cross-shaped through hole 3 is formed in a predetermined region R (along a thickness direction H) of a circuit board 100a. In this embodiment, the cross-section of the predetermined region R (such as: a cross-section of the predetermined region R perpendicular to the thickness direction H) is polygonal (such as: quadrilateral), and the cross-shaped through-hole 3 is formed by recessing a plurality of diagonal surfaces along the preset region R. Furthermore, the circuit board 100 a includes a plate 1 and a metal layer 2 inside the plate 1 , and the cross-shaped through hole 3 penetrates the metal layer 2 and the plate 1 .

The groove digging step S130: as shown in Figure 2 and Figure 3, in the preset region R of the circuit board 100a, the two board surfaces 11a, 11b of the board 1 (along the thickness direction H) Each receiving groove 12a, 12b is concavely formed until the metal layer 2, so that the cross-shaped through hole 3 is only located on the metal layer 2 and communicates with the two receiving grooves 12a, 12b. It should be additionally noted that the two receiving grooves 12a, 12b are described with approximately the same size in this embodiment, but in other embodiments of the present invention not shown, the two receiving grooves 12a, 12b The dimensions can also be adjusted according to design requirements and are different from each other.

The opening step S150: as shown in FIG. 4 and FIG. 5 , widen the center of the cross-shaped through-hole 3 of the metal layer 2 to form a deformed opening 21 so that it is located in the predetermined region R The metal layer 2 is formed with a plurality of edge portions 22 surrounding the deformation opening 21 and spaced apart from each other, so that the circuit board 100a forms an embedded circuit board 100 .

Wherein, each side of the cross-section of the predetermined region R is correspondingly provided with one edge portion 22 , and each edge portion 22 is roughly trapezoidal in this embodiment. Furthermore, each of the edge portions 22 of the embedded circuit board 100 can be bent towards the inner wall surface 121a, 121b of any one of the receiving grooves 12a, 12b to form an elastic arm shape.

The embedding step S170: as shown in Fig. 6 and Fig. 7, insert a heat conducting block 200 from it One of the receiving grooves 12b is inserted toward the other of the receiving grooves 12a through the deformation opening 21 (along the thickness direction H), so that a plurality of the edge portions 22 are bent and positioned on the heat conducting block 200 and the inner wall surface 121a of the other receiving groove 12a. Wherein, each of the edge portions 22 (after being bent) is in the shape of an elastic arm and elastically resists the heat conduction block 200 so that the heat conduction block 200 is clamped by a plurality of the edge portions 22 position.

It should be noted that a central section 201 of the heat conduction block 200 is clamped and positioned on a plurality of the edge portions 22 , and the cross section of the preset region R is larger than the cross section of the heat conduction block 200 . The cross section of the central section 201 , and the size of the deformation opening 21 is smaller than the cross section of the central section 201 of the heat conduction block 200 .

That is to say, the specific shape and size of the preset region R and the deformation opening 21 can be defined or shaped according to the heat conduction block 200 in this embodiment. Furthermore, the heat conduction block 200 is described as a block in this embodiment, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the heat conduction block 200 may have the largest cross-section in the central section 201 , and the cross-sections of other parts are smaller than the cross-section of the central section 201 .

In more detail, for the thickness T of any one of the edge portions 22, the two edge portions 22 facing each other are separated by a first distance D ₁ at the end edges adjacent to each other, and the two edge portions 22 are separated at the end edges far away from each other. There is a second distance D ₂ apart; any one of the sides of the cross-section of the central section 201 has a length L, and the length L of any one of the sides meets the following relationship: (D ₂ -2T )>L>D ₁ .

In addition, the heat conduction block 200 is spaced apart from the inner wall surfaces 121a, 121b of each of the receiving grooves 12a, 12b, and a gap G is formed in each, and the size of the gap G depends on a plurality of the The bending angle α of the edge portion 22, and the bending angle α of each edge portion 22 is preferably between 60 degrees and 90 degrees in this embodiment, but the present invention is not limited thereto . That is to say, according to the size difference between the heat conduction block 200 and each of the receiving grooves 12a, 12b, each of the edge portions 22 can be correspondingly bent with different bending angles α , according to In this way, there may be a larger error tolerance range between the heat conduction block 200 and each of the receiving grooves 12a, 12b.

The filling step S190 : as shown in FIG. 8 , a filling layer 300 filling each of the gaps G is formed. Wherein, the material of the filling layer 300 can be adjusted and changed according to design requirements. For example, electroplating is performed in each of the gaps G to form the filling layer 300 (such as: a conductive filling layer) filling each of the gaps G; or, performing electroplating in each of the gaps G The insulating material is filled to form the filling layer 300 (eg, insulating filling layer) filling each of the gaps G.

The manufacturing method of the heat-dissipating circuit board structure in this embodiment can produce a heat-dissipating circuit board structure 1000 as shown in FIG. 8 by implementing the above steps, which includes the embedded circuit board 100, The heat conduction block 200 embedded in the embedded circuit board 100 and the filling layer 300 filled in the embedded circuit board 100 , but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the heat dissipation circuit board structure 1000 can be manufactured by implementing other steps or the filling layer 300 can be omitted (such as: FIG. 7 ); or, the The above-mentioned embedded circuit board 100 can be used alone (for example: sold) or used together with other components.

The specific structure of the heat-dissipating circuit board structure 1000 in this embodiment will be briefly described below, and please refer to the description in the above-mentioned manufacturing method of the heat-dissipating circuit board structure (that is, it has been described in the above-mentioned heat-dissipating circuit board structure) The technical features in the manufacturing method of the structure will not be repeated here).

As shown in FIG. 8 , the embedded circuit board 100 includes a board 1 and a metal layer 2 formed on the board 1 . The board 1 has two board surfaces 11a, 11b on opposite sides, and the board 1 is recessed from each of the board surfaces 11a, 11b to form a receiving groove 12a, 12b. The metal layer 2 is located inside the board 1 and forms the bottom of the two receiving grooves 12a, 12b. Wherein, the metal layer 2 is formed with a deformation opening 21 communicating with each of the receiving grooves 12a, 12b, and the position of the metal layer 2 corresponding to any one of the receiving grooves 12a, 12b is formed to surround each of the receiving grooves 12a, 12b. A plurality of edge portions 22 that are spaced apart from the deformation opening 21 are described. Moreover, the heat conduction block 200 comes from one of the receiving grooves 12b Inserted into the embedded circuit board 100 along the deformation opening 21 toward the other receiving groove 12a, and a plurality of the edge portions 22 are bent and located between the heat conducting block 200 and the other one. Between the inner wall surfaces 121a of the receiving groove 12a.

More specifically, a central section 201 of the heat conduction block 200 is clamped and positioned on a plurality of the edge portions 22 , and the size of the deformation opening 21 is smaller than the cross section of the central section 201 of the heat conduction block 200 . Wherein, the cross-section of the central section 201 is polygonal (such as: quadrilateral), and the positions of the plurality of edge portions 22 respectively correspond to the multiple sides of the cross-section (such as: four sides), but The present invention is not limited thereto. For example, in other unillustrated embodiments of the present invention, the number of the plurality of edge portions 22 may also be smaller than the number of the plurality of sides of the cross section.

The filling layer 300 may be a conductive filling layer that fills each of the gaps G by electroplating in each of the gaps G. Referring to FIG. And the materials of the metal layer 2, the heat conduction block 200, and the filling layer 300 (such as: the conductive filling layer) are all the same, so that a plurality of the edge portions 22 and the heat conduction block 200 pass through the The filling layer 300 (such as: the conductive filling layer) forms a structure integrally connected with each other. Alternatively, the filling layer 300 may also be an insulating filling layer that fills each of the gaps G with an insulating material.

According to the above, the manufacturing method of the heat dissipation circuit board structure and the embedded circuit board 100 disclosed in the embodiment of the present invention (or, the heat dissipation circuit board structure 1000 disclosed in the embodiment of the present invention), which pass The bendable structures of the plurality of edge portions 22 are designed to match the heat conduction block 200, so as to reduce the processing accuracy requirements of the receiving grooves 12a, 12b (or, so that the embedded circuit board 100 The heat conduction block 200 embedded therein can be allowed to have a relatively large processing error).

In addition, the manufacturing method of the heat dissipation circuit board structure disclosed in the embodiment of the present invention and the embedded circuit board 100 (or, the heat dissipation circuit board structure 1000 disclosed in the embodiment of the present invention) can also benefit the described The heat conduction block 200 and the embedded circuit board 100 perform heavy work (such as: the heat conduction block 200 can be pressed by force and move away from the metal layer 2 and be connected to the Embedded circuit board 100 is separated).

[Example 2]

Please refer to FIG. 9 to FIG. 12 , which are the second embodiment of the present invention. Since this embodiment is similar to the above-mentioned first embodiment, the similarities between the two embodiments will not be repeated (such as: the embedding step S170 and the filling step S190), and this embodiment is compared with the above-mentioned embodiment The main difference lies in: the manufacturing method of the heat-dissipating circuit board structure in this embodiment first implements a trenching step S210, and then sequentially implements a hole opening step S230 and a patterning step S250, the order of implementation Different from Example 1. The following describes the trenching step S210, the hole opening step S230, and the patterning step S250 in this embodiment:

The trenching step S210: as shown in FIG. 9 and FIG. 10, a circuit board 100a is provided, which includes a plate 1 and a metal layer 2 formed on the plate 1, and the circuit board 100a is prepared In the region R, the two board surfaces 11 a , 11 b of the board 1 are respectively concavely formed with a receiving groove 12 a , 12 b reaching the metal layer 2 .

The opening step S230: as shown in FIG. 11 , a deformation opening 21 is formed in the metal layer 2, so that the metal layer 2 located in the predetermined region R forms a hole surrounding the deformation opening 21. An annular portion 23 .

The patterning step S250 : as shown in FIG. 11 and FIG. 12 , pattern the annular portion 23 to form a plurality of edge portions 22 spaced apart from each other.

[Technical effects of the embodiments of the present invention]

To sum up, the manufacturing method of the heat dissipation circuit board structure and the embedded circuit board (or the heat dissipation circuit board structure disclosed in the embodiment of the present invention) disclosed in the embodiments of the present invention, it uses multiple The bendable structure of the edge portion is designed to match the heat conduction block, so as to reduce the processing accuracy requirements of the receiving groove (or, so that the embedded circuit board can allow all the embedded circuit boards to be embedded. The heat conduction block has a large range of processing errors), and it can also facilitate the connection between the heat conduction block and the Embedded circuit boards for heavy duty work.

The content disclosed above is only a preferred feasible embodiment of the present invention, and does not limit the patent scope of the present invention, so all equivalent technical changes made by using the description and drawings of the present invention are included in the patent scope of the present invention Inside.

100: Embedded circuit board

1: plate

11a, 11b: board surface

12a, 12b: storage tank

121a, 121b: inner wall surface

2: metal layer

21: Deformation port

22: Edge

200: heat conduction block

201: central section

H: Thickness direction

R: preset area

T: Thickness

D ₁ : first distance

D ₂ : second distance

L: Length

S170: Embedding step

Claims (9)

A method for manufacturing a heat-dissipating circuit board structure, which includes: a patterning step: forming a through-shaped cross-shaped through hole in a predetermined area of a circuit board; wherein, the circuit board includes a plate and is located on the a metal layer inside the board, and the cross pattern runs through the metal layer and the board; a groove digging step: in the predetermined area of the circuit board, from two board surfaces of the board Each recess is formed with a receiving groove up to the metal layer, so that the cross-shaped through hole is only located in the metal layer and communicates with two of the receiving grooves; a hole opening step: in the metal layer The center of the cross-shaped through hole is widened to form a deformation opening, so that the metal layer located in the predetermined area is formed with a plurality of edge portions surrounding the deformation opening and spaced apart from each other; and a Embedding step: Insert a heat conduction block from one of the receiving grooves along the deformation opening toward the other of the accommodation grooves, so that a plurality of the edges are bent and located between the heat conduction block and Between the inner walls of the other one of the storage tanks. The method for manufacturing a heat-dissipating circuit board structure according to Claim 1, wherein, in the embedding step, the heat-conducting block is spaced apart from the inner wall surface of each of the receiving grooves and each formed There is a gap, each of the edge portions is in the shape of an elastic arm and elastically resists the heat conduction block, so that the heat conduction block is clamped and positioned by a plurality of the edge portions. The method for manufacturing a heat dissipation circuit board structure according to claim 2, wherein, after the step of embedding, the method for manufacturing a heat dissipation circuit board structure further The step includes a filling step: performing electroplating in each of the gaps to form a conductive filling layer filling each of the gaps. The method for manufacturing a heat-dissipating circuit board structure according to Claim 2, wherein, after the embedding step, the method for manufacturing a heat-dissipating circuit board structure further includes a filling step: performing a filling step in each of the gaps The insulating material is filled to form an insulating filling layer filling each of the gaps. The method for manufacturing a heat dissipation circuit board structure according to claim 2, wherein a central section of the heat conduction block is clamped and positioned on a plurality of the edge portions, and the cross-section of the predetermined area is larger than the The cross section of the central section of the heat conduction block, and the size of the deformation opening is smaller than the cross section of the central section of the heat conduction block. The method for manufacturing a heat-dissipating circuit board structure according to Claim 1, wherein a central section of the heat conduction block is clamped and positioned on a plurality of the edge portions; in the embedding step, any one of the edge portions The thickness of the portion is defined as T, and the two edge portions facing each other are separated by a first distance at the ends adjacent to each other and defined as D ₁ , and are separated by a second distance at the ends far away from each other. Defined as D ₂ , any side of the cross-section of the central section has a length and it is defined as L, and the length of any one of the sides meets the following relationship: (D ₂ -2T)>L>D ₁ . The method for manufacturing a heat-dissipating circuit board structure according to claim 1, wherein the cross-section of the preset area is polygonal, and each side of the cross-section of the preset area is correspondingly provided with one of the Edge. The manufacturing method of the heat-dissipating circuit board structure as described in Claim 7, wherein, in In the patterning step, the cross-shaped through holes are formed by recessing along a plurality of diagonal surfaces of the predetermined area. A method for manufacturing a heat-dissipating circuit board structure, which includes: a step of digging a groove: providing a circuit board, which includes a plate and a metal layer located inside the plate, and is in a predetermined area of the circuit board , each of the two plate surfaces of the plate is recessed to form a receiving groove until the metal layer; a hole opening step: forming a deformation opening in the metal layer, so that all the holes located in the predetermined area The metal layer part forms an annular portion surrounding the deformation opening; a patterning step: patterning the annular portion to form a plurality of edge portions spaced apart from each other; and an embedding step: embedding a The heat conducting block is inserted from one of the receiving grooves along the deformed opening toward the other of the receiving grooves, so that a plurality of the edge portions are bent and positioned between the heat conducting block and the other of the receiving grooves. between the inner walls of the groove.

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