TWM628126U - Heat dissipation circuit board structure - Google Patents

Abstract

The present invention discloses a heat-dissipating circuit board structure, which includes an embedded circuit board and a heat-conducting block. The embedded circuit board includes a plate and a metal layer. The plate has two plate surfaces on opposite sides, and a receiving groove is concavely formed from one of the plate surfaces. The metal layer is formed on the other surface of the plate and constitutes a groove bottom of the receiving groove. A deformation opening communicated with the receiving groove is formed on the metal layer, and a plurality of edge portions surrounding the deformation opening and spaced apart from each other are formed at a portion of the metal layer corresponding to the receiving groove. The heat-conducting block is inserted into the embedded circuit board from the deformation opening toward the receiving groove, and a plurality of the edge portions are bent and located between the heat-conducting block and the inner wall surface of the receiving groove .

Description

Heat-dissipating circuit board structure

The invention relates to a circuit board, in particular to a heat dissipation circuit board structure.

In the existing circuit board, a slot hole with a size corresponding to the heat conduction block is excavated, and then the heat conduction block is embedded in the slot hole of the existing circuit board. However, the heat-conducting block embedding method of the existing circuit board has been practiced for many years, and the problems caused by it (eg, difficulty in rework and high requirements on machining accuracy) have always existed and cannot be effectively improved.

Therefore, the creator of this article believes that the above-mentioned defects can be improved. Nate has devoted himself to the research and the application of scientific principles, and finally proposes a creation that is reasonable and can effectively improve the above-mentioned defects.

The present inventive embodiment provides a heat dissipation circuit board structure, which can effectively improve the possible defects of the existing circuit board.

An embodiment of the present invention discloses a heat dissipation circuit board structure, which includes: an embedded circuit board, including: a board with two board surfaces on opposite sides, and the board is recessed from one of the board surfaces A receiving groove is formed; and a metal layer is formed on the other surface of the plate and constitutes the groove bottom of the receiving groove; wherein, the metal layer is formed with a deformation connected to the receiving groove and a plurality of edge portions surrounding the deformation opening and spaced apart from each other are formed at the part of the metal layer corresponding to the receiving groove; and a heat conducting block, facing the deformation opening from the metal layer The receiving slot is inserted into the embedded circuit board, and a plurality of the edges The portion is bent and located between the heat conducting block and the inner wall surface of the receiving groove.

To sum up, in the heat dissipation circuit board structure disclosed in the embodiment of the present invention, the heat conduction block is matched with the structure design of a plurality of the edge portions that can be bent toward the receiving groove, so as to reduce the The machining accuracy of the receiving groove is required (or, the embedded circuit board can allow the heat-conducting block embedded therein to have a wide range of machining errors), and the heat-conducting block and the The embedded circuit board is used for heavy work.

In order to further understand the features and technical content of this creation, please refer to the following detailed descriptions and drawings about this creation, but these descriptions and drawings are only used to illustrate this creation, and do not make any claim to the scope of protection of this creation. limit.

1000: heat dissipation circuit board structure

100: Embedded circuit board

100a: Circuit Board

1: Plate

11a, 11b: Board surface

12: Containment slot

121: inner wall surface

2: Metal layer

21: Deformation mouth

22: Edge

3: Cross-shaped through hole

200: Thermal block

201: End

300: Filler layer

H: thickness direction

R: Preset area

G: Gap

α: Bending angle

T: Thickness

D ₁ : first distance

D ₂ : Second distance

L: length

S110: Patterning step

S130: Grooving step

S150: Opening step

S170: Embedding step

S190: Filling step

FIG. 1 is a schematic diagram of patterning steps of a method for manufacturing a heat dissipation circuit board structure according to an embodiment of the invention.

FIG. 2 is a schematic diagram of a trenching step of a method for manufacturing a heat-dissipating circuit board structure according to an embodiment of the present invention.

FIG. 3 is a schematic cross-sectional view of FIG. 2 along line III-III.

FIG. 4 is a schematic diagram of a hole-drilling step of a method for manufacturing a heat-dissipating circuit board structure according to an embodiment of the invention.

FIG. 5 is a schematic cross-sectional view along the line V-V of FIG. 4 .

FIG. 6 and FIG. 7 are schematic diagrams of embedding steps of the manufacturing method of the heat-dissipating circuit board structure according to the inventive embodiment.

FIG. 8 is a schematic diagram of filling steps of a method for manufacturing a heat-dissipating circuit board structure according to an embodiment of the present invention.

The following are specific embodiments to illustrate the implementation of the “heat dissipation circuit board structure” disclosed in the present creation, and those skilled in the art can understand the advantages and effects of the present creation from the content disclosed in this specification. This creation can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this creation. In addition, the drawings in this creation are only for simple schematic illustration, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further describe the related technical contents of the present creation in detail, but the disclosed contents are not intended to limit the protection scope of the present creation.

It should be understood that although terms such as "first", "second" and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are primarily used to distinguish one element from another element, or a signal from another signal. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.

Please refer to FIG. 1 to FIG. 8 , which are embodiments of the present invention. The present embodiment discloses a method for manufacturing a heat dissipation circuit board structure, which sequentially includes a patterning step S110 , a trenching step S130 , a hole opening step S150 , a burying step S170 , and a filling step S190 . Next, specific implementations of the above-mentioned steps will be described below.

However, it should be noted first that the execution sequence of the above steps can be adjusted according to the creative requirements (for example, the execution sequence of the patterning step S110, the trenching step S130, and the hole drilling step S150 can be reversed. ) or an implementation manner, or omitting the steps therein (eg, omitting the filling step S190 ), so the content of this embodiment is not limited.

The patterning step S110 : as shown in FIG. 1 , a cross-shaped through hole 3 is formed in a predetermined region R (along a thickness direction H) of a circuit board 100 a. In this embodiment, the cross-section of the predetermined region R (eg, a cross-section of the predetermined region R perpendicular to the thickness direction H) is: Polygon (eg, quadrilateral), and the cross-shaped through-holes 3 are formed by concave formation along a plurality of diagonal surfaces of the predetermined region R. Furthermore, the circuit board 100 a includes a plate 1 and a metal layer 2 formed on the plate 1 , and the cross-shaped through holes 3 penetrate through the metal layer 2 and the plate 1 .

The grooving step S130 : as shown in FIG. 2 and FIG. 3 , in the predetermined region R of the circuit board 100 a , from the board surface 11 a (along the direction of the board surface 11 a of the board 1 away from the metal layer 2 ) A receiving groove 12 is formed concavely in the thickness direction H) up to the metal layer 2 , so that the cross-shaped through holes 3 are only located in the metal layer 2 and communicate with the receiving groove 12 .

The hole opening step S150 : as shown in FIG. 4 and FIG. 5 , the center of the cross-shaped through hole 3 of the metal layer 2 is widened to form a deformation opening 21 so as to be located in the predetermined region R A plurality of edge portions 22 surrounding the deformation opening 21 and spaced apart from each other are formed at the portion 2 of the metal layer 21 , so that the circuit board 100 a forms an in-cell circuit board 100 .

Wherein, each side of the cross section of the predetermined region R is correspondingly provided with one of the edge portions 22 , and each of the edge portions 22 is substantially trapezoidal in this embodiment. Furthermore, each of the edge portions 22 of the embedded circuit board 100 can be bent toward the inner wall surface 121 of the receiving groove 12 to form an elastic arm shape.

The embedding step S170 : as shown in FIG. 6 and FIG. 7 , insert a thermally conductive block 200 from the deformation opening 21 (along the thickness direction H) toward the receiving groove 12 , so that a plurality of the edges The portion 22 is bent and located between the heat conducting block 200 and the inner wall surface 121 of the receiving groove 12 . Wherein, each of the edge portions 22 (after being bent) is in the shape of an elastic arm and elastically abuts against the heat-conducting block 200 , so that the heat-conducting block 200 is clamped by the plurality of edge portions 22 . position.

It should be noted that one end portion 201 of the thermally conductive block 200 is clamped and positioned at a plurality of the edge portions 22 , and the cross-section of the predetermined region R is larger than the end of the thermally conductive block 200 . The size of the deformation opening 21 is smaller than the cross-section of the end portion 201 of the thermally conductive block 200 .

That is to say, the specific shape and size of the predetermined region R and the deformation opening 21 may be defined or shaped according to the thermally conductive block 200 in this embodiment. Furthermore, the thermally conductive block 200 is illustrated in a block shape in this embodiment, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the thermally conductive block 200 may have the largest cross-section at the end portion 201 , and the cross-section of the remaining portions is smaller than the cross-section of the end portion 201 .

In more detail, the thickness T of any one of the edge parts 22, the two edge parts 22 facing each other are separated by a first distance D ₁ at the end edges adjacent to each other, and at the end edges far away from each other are separated by a second distance D ₂ ; any one of the sides has a length L, and the length L of any one of the sides satisfies the following relation: (D ₂ -2T)>L>D ₁ .

In addition, a gap G is formed between the thermally conductive block 200 and the inner wall surface 121 of the receiving groove 12 , and the size of the gap G depends on the bending angles of the edge portions 22 . α , and the bending angle α of each of the edge portions 22 is preferably between 60 degrees and 90 degrees in this embodiment, but the present invention is not limited thereto. That is to say, according to the size difference between the thermally conductive block 200 and the receiving groove 12 , each of the edge portions 22 can be correspondingly bent at different bending angles α , so that the There may be a large tolerance range of error between the heat conducting block 200 and the receiving groove 12 .

The filling step S190 : as shown in FIG. 8 , a filling layer 300 filling the gap G is formed. Wherein, the material of the filling layer 300 can be adjusted and changed according to the creation requirements. For example, electroplating is performed in the gap G to form the filling layer 300 (eg, a conductive filling layer) filling the gap G; or, the gap G is filled with an insulating material to form The filling layer 300 (eg, an insulating filling layer) of the gap G is filled.

In this embodiment, the manufacturing method of the heat-dissipating circuit board structure can produce a heat-dissipating circuit board structure 1000 as shown in FIG. The thermally conductive block 200 embedded in the embedded circuit board 100 and the The filling layer 300 in the in-cell circuit board 100, but the present invention is not limited to this. For example, in other embodiments not shown in the present invention, the heat dissipation circuit board structure 1000 can be formed by performing other steps or the filling layer 300 (eg, FIG. 7 ) can be omitted; The embedded circuit board 100 can be used alone (eg, sold) or used in combination with other components.

The specific structure of the heat-dissipating circuit board structure 1000 in this embodiment is briefly described below, and please refer to the description in the manufacturing method of the heat-dissipating circuit board structure (that is, the above-mentioned heat-dissipating circuit board structure) in due course. The technical features in the manufacturing method of the structure are not repeated here).

As shown in FIG. 8 , the embedded circuit board 100 includes a board 1 and a metal layer 2 formed on the board 1 . The plate 1 has two plate surfaces 11a and 11b on opposite sides, and a receiving groove 12 is formed concavely from one of the plate surfaces 11a of the plate 1 . The metal layer 2 is formed on the other surface 11 b of the plate 1 and constitutes the bottom of the receiving groove 12 . Wherein, the metal layer 2 is formed with a deformation opening 21 that communicates with the receiving groove 12 , and the metal layer 2 corresponding to the receiving groove 12 is formed around the deformation opening 21 and spaced apart from each other. the plurality of edge portions 22. Furthermore, the thermally conductive block 200 is inserted into the embedded circuit board 100 from the deformation opening 21 of the metal layer 2 toward the receiving groove 12 , and a plurality of the edge portions 22 are bent and located in the embedded circuit board 100 . between the heat conducting block 200 and the inner wall surface 121 of the receiving groove 12 .

In more detail, one end portion 201 of the thermally conductive block 200 is clamped and positioned at a plurality of the edge portions 22 , and the size of the deformation opening 21 is smaller than the cross-section of the end portion 201 of the thermally conductive block 200 . Wherein, the cross-section of the end portion 201 is a polygon (eg, quadrilateral), and the positions of the plurality of edge portions 22 correspond to the plurality of sides (eg, four sides) of the cross-section respectively, but This creation is not limited to this. For example, in other embodiments not shown in the present invention, the number of the edge portions 22 may also be smaller than the number of the sides of the cross section.

The filling layer 300 may fill the gap G by electroplating the gap G a conductive filling layer. And the material of the metal layer 2 , the thermally conductive block 200 , and the filling layer 300 (eg, the conductive filling layer) are all the same, so that the plurality of the edge portions 22 and the thermally conductive block 200 pass through the same material. The filling layer 300 (eg, the conductive filling layer) forms an integrally connected structure. Alternatively, the filling layer 300 may also be an insulating filling layer that fills the gap G by filling the gap G with an insulating material.

According to the above, the manufacturing method of the heat-dissipating circuit board structure and the in-cell circuit board 100 (or, the heat-dissipating circuit board structure 1000 disclosed in the present embodiment) disclosed in the present invention are achieved by The structure design of the plurality of edge portions 22 that can be bent toward the receiving groove 12 is matched with the thermally conductive block 200 , so as to reduce the processing accuracy requirement of the receiving groove 12 (or, according to the internal The embedded circuit board 100 can allow the thermally conductive block 200 embedded therein to have a wide range of processing errors).

In addition, the manufacturing method of the heat-dissipating circuit board structure and the embedded circuit board 100 (or, the heat-dissipating circuit board structure 1000 disclosed in the present embodiment) disclosed in the present invention can also facilitate the The thermally conductive block 200 is reworked with the embedded circuit board 100 (eg, the thermally conductive block 200 can be pressed to move away from the metal layer 2 and separated from the embedded circuit board 100 ) .

[Technical effects of this creative embodiment]

To sum up, the heat-dissipating circuit board structure disclosed in the embodiment of the present invention (or the manufacturing method of the heat-dissipating circuit board structure disclosed in the embodiment of the present invention) can be bent toward the receiving groove by bending The structure design of a plurality of the edge portions is matched with the thermally conductive block, so as to reduce the processing accuracy requirements of the receiving groove (or, accordingly, the embedded circuit board can allow all the embedded The heat-conducting block has a wide range of processing errors), and it can also facilitate the rework of the heat-conducting block and the embedded circuit board.

The contents disclosed above are only preferred and feasible embodiments of the present creation, and are not The scope of the patent of this creation is limited, so all equivalent technical changes made by using the contents of the description and drawings of this creation are included in the patent scope of this creation.

1000: heat dissipation circuit board structure

100: Embedded circuit board

1: Plate

11a, 11b: Board surface

12: Containment slot

121: inner wall surface

2: Metal layer

21: Deformation mouth

22: Edge

200: Thermal block

201: End

H: thickness direction

R: Preset area

G: Gap

α: Bending angle

S170: Embedding step

Claims (10)

A heat-dissipating circuit board structure, comprising: an embedded circuit board, comprising: a board with two board surfaces on opposite sides, and the board is recessed from one of the board surfaces to form a receiving groove; and a metal layer, which is formed on the other surface of the plate and constitutes the groove bottom of the receiving groove; wherein, the metal layer is formed with a deformation port communicating with the receiving groove, and the The part of the metal layer corresponding to the accommodating groove is formed with a plurality of edge parts that surround the deformation opening and are spaced apart from each other; Inside the embedded circuit board, a plurality of the edge portions are bent and located between the heat conducting block and the inner wall surface of the receiving groove. The heat-dissipating circuit board structure according to claim 1, wherein a gap is formed between the heat-conducting block and the inner wall surface of the receiving groove, and each edge portion is in the shape of an elastic arm and The thermally conductive block is elastically pressed against the thermally conductive block, so that the thermally conductive block is clamped and positioned by the plurality of edge portions. The heat-dissipating circuit board structure of claim 2, wherein the heat-dissipating circuit board structure includes a conductive filling layer, which fills the gap by plating the gap. The heat-dissipating circuit board structure according to claim 3, wherein the materials of the metal layer, the heat-conducting block, and the conductive filling layer are all the same, so that a plurality of the edge portions and the heat-conducting block pass through The conductive filling layers constitute a structure integrally connected to each other. The heat-dissipating circuit board structure of claim 2, wherein the heat-dissipating circuit board structure includes an insulating filling layer, which fills the gap by filling the gap with an insulating material. The heat-dissipating circuit board structure according to claim 2, wherein one end portion of the heat-conducting block is clamped and positioned at the plurality of edge portions, and the size of the deformation opening is smaller than that of the end portion of the heat-conducting block Cross-section. The heat-dissipating circuit board structure according to claim 6, wherein the cross-section of the end portion is a polygon, and the positions of a plurality of the edge portions correspond to a plurality of sides of the cross-section, respectively. The heat dissipation circuit board structure according to claim 6, wherein the cross section of the end portion is further defined as a quadrilateral, and the positions of the plurality of edge portions correspond to the four sides of the cross section respectively . The heat-dissipating circuit board structure of claim 2, wherein the heat-conducting block can be pressed by a force to move away from the metal layer and separate from the embedded circuit board. The heat dissipation circuit board structure according to claim 1, wherein the bending angle of each edge portion is between 60 degrees and 90 degrees.

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