TW202143804A - Copper plate structure, circuit board with embedded copper block and manufacturing method thereof - Google Patents

Abstract

A copper plate structure, a circuit board with embedded copper blocks and a manufacturing method thereof are provided. The copper plate structure includes a copper block disposed portion, a plurality of embedded portions, a body portion, and a plurality of disconnected portions. The copper block disposed portion has at least one edges. The plurality of embedding portions are respectively connected to the at least one edges of the copper block disposed portion and extend outward. The body portion is disposed around the copper block disposed portion and the embedded portions, and is separated from the copper block disposed portion and the embedded portions. The disconnecting part connects the body part and the plurality of embedded portions. The at least one edge of the copper block disposed portion has a first width. A first side of the embedded portion is connected to the copper block disposed portion and has a second width. The first width is greater than the second width.

Description

Copper plate structure, circuit board with embedded copper block and manufacturing method thereof

The invention relates to a copper plate structure, a circuit board and a manufacturing method thereof, and in particular to a copper plate structure for arranging copper blocks, a circuit board with embedded copper blocks and a manufacturing method thereof.

At present, in the packaging process of electronic components, most of the process of embedding the copper blocks is manually inserting the copper blocks in the opening of the substrate manually. Therefore, not only the man-hours are lengthy, but also due to manual production, the process variation is large, resulting in the product The yield rate is not high. Therefore, how to improve the process efficiency and product yield of embedding copper blocks in the substrate has become one of the topics that designers are concerned about in research and development.

The invention provides a copper plate structure, a circuit board with embedded copper blocks, and a manufacturing method thereof, which can realize an automated manufacturing process and greatly improve the efficiency and yield of the embedded copper block manufacturing process.

The copper plate structure of the present invention includes a copper block setting part, a plurality of embedded parts, a body part and a plurality of disconnected parts. The copper block setting part has at least one edge. A plurality of embedded parts are respectively connected to at least one edge of the copper block setting part and extend outward. The body part is arranged on the periphery of the copper block setting part and the embedding part, and is separated from the copper block setting part and the embedding part. The disconnection part connects the body part and the embedding part. At least one edge of the copper block setting portion has a first width. The first side of the embedding part is connected to the copper block setting part and has a second width. The first width is greater than the second width.

In an embodiment of the present invention, the second side of each embedding portion described above connects to each disconnected portion and has a second width. The third side of each disconnected portion connects to each embedded portion and has a third width. Half of the second width is greater than the third width.

In an embodiment of the present invention, the number of the above-mentioned multiple embedding parts is two or more. A plurality of embedded parts are arranged on at least one edge of the copper block installation part in a symmetrical or radially distributed manner with respect to the central point of the copper block installation part.

The circuit board with embedded copper block of the present invention includes a circuit board, a copper plate structure, a copper block and an insulating material layer. The circuit board has a first surface, a second surface opposite to the first surface, and an opening penetrating the circuit board. The copper plate structure is arranged in the opening of the circuit board. The copper plate structure includes a copper block setting part and a plurality of embedded parts. A plurality of embedded parts are respectively connected to at least one edge of the copper block setting part and extend outward to the side wall of the opening. At least one edge of the copper block setting portion has a first width. The first side of each embedding part is connected to the copper block setting part and has a second width. The first width is greater than the second width. The copper block is arranged in the opening of the circuit board and is located on the copper block setting part of the copper plate structure. The insulating material layer is filled in the opening and surrounds the copper block and the copper plate structure.

In an embodiment of the present invention, the above-mentioned copper plate structure further includes a plurality of disconnected parts having a third side connected to the second side of each embedded part. The second side of each embedding part has a second width. The third side of each broken portion has a third width. Half of the second width is greater than the third width.

In an embodiment of the present invention, the length of each embedding part mentioned above is L. The distance between the copper block and the side wall of the opening is D. L is greater than D.

In an embodiment of the present invention, the above-mentioned distance between the first surface and the second surface is H. L=1/2×(H+D).

In an embodiment of the present invention, the surface of the copper block away from the copper plate structure is aligned with the first surface of the circuit board, and the surface of the copper plate structure away from the copper block is aligned with the second surface of the circuit board.

In an embodiment of the present invention, the aforementioned circuit board includes a substrate, a first metal layer, and a second metal layer. The substrate has an upper surface and a lower surface opposite to the upper surface. The first metal layer is configured on the upper surface of the substrate. The second metal layer is configured on the lower surface of the substrate.

The manufacturing method of the circuit board with embedded copper block of the present invention includes the following steps. First, the copper plate structure as described above is formed. Next, the copper block is arranged on the copper block setting part of the copper plate structure. Then, provide the circuit board. The circuit board has a first surface, a second surface opposite to the first surface, and an opening penetrating the circuit board. Then, align the copper block with the opening of the circuit board. Next, pressure is applied to the copper block to break the broken part of the copper plate structure and separate the embedded part from the body part. Then, the embedding part, the copper block setting part and the copper block separated from the main body are pressed into the opening of the circuit board. Then, an insulating material layer is filled in the opening to surround the copper block and the copper plate structure.

Based on the foregoing, in the copper plate structure, the circuit board with embedded copper blocks and the manufacturing method thereof in the embodiments of the present invention, the first width of the edge of the copper block setting part is larger than the second width of the first side of the embedded part. The width, half of the second width of the first side of the embedded part is greater than the third width of the third side of the disconnected part, so when pressure is applied to the copper block, the disconnected part can be broken and the embedded part is connected to the The main body part is separated, and the embedding part, the copper block setting part and the copper block separated from the main body part are pressed into the opening of the circuit board. Therefore, compared with the conventional process of embedding copper blocks manually, the copper plate structure, the circuit board with embedded copper blocks and the manufacturing method thereof of this embodiment can realize an automated process and greatly improve the efficiency of the process of embedding copper blocks. And yield.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.

1A to 1C are schematic top views of a manufacturing method of a circuit board with embedded copper blocks according to an embodiment of the present invention. 2A to 2D are schematic cross-sectional views of a manufacturing method of a circuit board with embedded copper blocks according to an embodiment of the present invention. Fig. 2A is a schematic cross-sectional view of Fig. 1A along the section line A-A'. Fig. 2B is a schematic cross-sectional view taken along the section line B-B' of Fig. 1B. Fig. 2C is a schematic cross-sectional view of Fig. 1C along the section line C-C'.

Please refer to FIG. 1A and FIG. 2A at the same time. First, the copper plate structure 100 is formed first. In this embodiment, for example, a copper plate (not shown) is patterned by a photolithography process to form the copper plate structure 100, but it is not limited to this. In this embodiment, the copper plate structure 100 includes a copper block setting portion 110, a plurality of embedded portions 120, a body portion 130 and a plurality of disconnected portions 140. The copper block setting portion 110, the plurality of embedded portions 120, the body portion 130, and the plurality of disconnected portions 140 are integrally formed and seamlessly connected.

In detail, the copper block setting portion 110 has at least one edge 112 (FIG. 1A schematically shows four), and a plurality of embedded portions 120 (FIG. 1A schematically shows four) are respectively connected to the copper block setting portion 110 At least one edge 112 extends outward. Specifically, the surface 114 of the copper block setting portion 110 may have a center point P1, at least one edge 112 is a part of the outline of the copper block setting portion 110, and the plurality of embedded portions 120 are respectively connected to different parts of the outline. In addition, in this embodiment, the plurality of embedding parts 120 are arranged in a symmetrical distribution with respect to the center point P1, for example, but the present invention is not limited to this.

In the schematic top view of the copper plate structure 100 of this embodiment (as shown in FIG. 1A), when the outline of the copper block setting portion 110 is rectangular, at least one edge 112 of the copper block setting portion 110 may include a first edge 112a, A second edge 112b opposite to the first edge 112a, a third edge 112c connecting the first edge 112a and the second edge 112b, and a fourth edge 112d opposite to the third edge 112c. The plurality of embedded portions 120 are respectively connected to the first edge 112a, the second edge 112b, the third edge 112c, and the fourth edge 112d of the copper block setting portion 110. Wherein, the embedded portion 120 connected to the first edge 112a and the embedded portion 120 connected to the second edge 112b are symmetrically distributed with respect to the center point P1, and the embedded portion 120 connected to the third edge 112c and the embedded portion 120 connected to the fourth edge 112d are distributed symmetrically. It is symmetrically distributed with respect to the center point P1, but not limited to this.

In this embodiment, the edges 112a, 112b, 112c, and 112d of the copper block setting portion 110 have a first width W1. The first side 121 of the embedded portion 120 is connected to the copper block setting portion 110, and the first side 121 of the embedded portion 120 has a second width W2. Wherein, the first width W1 is, for example, greater than the second width W2. In this embodiment, the first width W1 of the edges 112a, 112b, 112c, and 112d of the copper block setting portion 110 is greater than the second width W2 of the first side 121 of the embedding portion 120, so that in the subsequent manufacturing process, When the copper block 200, the copper block setting portion 110, and the embedded portion 120 are pressed into the opening 308 of the circuit board 300, the embedded portion 120 can be easily bent relative to the copper block setting portion 110, so that the embedded portion 120 can be Press into the opening 308 of the circuit board 300, and then fix the copper block 200 and the copper block setting portion 110 in the opening 308 of the circuit board 300, as shown in FIG. 2C.

In the copper plate structure 100 of the present embodiment, the body portion 130 is disposed on the periphery of the copper block setting portion 110 and the embedded portion 120, and the body portion 130, the copper block setting portion 110 and the embedded portion 120 are separated from each other. In other words, the main body part 130 does not contact the copper block setting part 110, and the main body part 130 does not contact the embedded part 120. In addition, there are a plurality of hollow parts 150 between the main body part 130 and the copper block setting part 110, and the plurality of hollow parts 150 surround the copper block setting part 110 and the embedding part 120.

In this embodiment, a plurality of disconnecting parts 140 (four schematically shown in FIG. 1A) connect the main body part 130 and the plurality of embedding parts 120. The plurality of disconnected portions 140 are located between the main body portion 130 and the plurality of embedded portions 120. In other words, the embedding portion 120 and the copper block setting portion 110 are respectively located on opposite sides of the disconnection portion 140.

In this embodiment, the first side 121 and the second side 122 of the embedding portion 120 are opposite to each other. The second side 122 of the embedding portion 120 is connected to the disconnecting portion 140. The width of the second side 122 of the embedding portion 120 is, for example, the same as the width of the first side 121 and has a second width W2, but it is not limited thereto. In addition, the distance between the first side 121 and the second side 122 of the embedded portion 120a can be regarded as the length L of the embedded portion 120a.

In this embodiment, the third side 141 of the disconnecting portion 140 is connected to the embedding portion 120, and the third side 141 has a third width W3. Wherein, the third width W3 of the third side 141 of the disconnected portion 140 is smaller than the second width W2 of the second side 122 of the embedding portion 120. For example, half of the second width W2 of the second side 122 of the embedded portion 120 is greater than the third width W3 of the third side 141 of the disconnected portion 140, that is, 1/2×W2>W3, but not Limited by this. In this embodiment, since half of the second width W2 of the second side 122 of the embedding portion 120 is greater than the third width W3 of the third side 141 of the disconnection portion 140, in the subsequent manufacturing process, When the copper block 200, the copper block setting portion 110, and the embedded portion 120 are pressed into the opening 308 of the circuit board 300, the pressure can disconnect the disconnected portion 140 of the copper plate structure 100, so that the embedded portion 120 can be separated from the main body 130 , As shown in Figure 2B.

In this embodiment, although the outline of the copper block setting portion 110 of the copper plate structure 100 of this embodiment may be rectangular, and there are four embedded portions 120 respectively connected to the first edge 112a and the second edge of the copper block setting portion 110. 112b, the third edge 112c, and the fourth edge 112d, but the present invention does not limit the shape of the outline of the copper block setting part, the number of edges, the number of embedded parts, and the number of disconnected parts. That is to say, in other embodiments, when the outline of the copper block setting part is rectangular, the number of embedded parts can also be two or more, as long as the two or more embedded parts are symmetrical with respect to the center point P1 Or it can be arranged in a radially distributed manner, and the embedding part can be connected to two or more of the first edge, the second edge, the third edge, and the fourth edge. In addition, in some embodiments, the outline of the copper block setting portion may also be circular or other suitable shapes. For example, when the outline of the copper block setting part is circular, the number of embedded parts and the number of disconnected parts can be two or more, as long as the two or more embedded parts are relative to the center. The point P1 can be arranged in a symmetrical or radially distributed manner.

In short, the copper plate structure 100 of this embodiment includes a copper block setting portion 110, a plurality of embedded portions 120, a body portion 130, and a plurality of disconnected portions 140. The copper block setting portion 110 has at least one edge 112 (ie, a first edge 112a, a second edge 112b, a third edge 112c, and a fourth edge 112d). A plurality of embedded portions 120 are respectively connected to at least one edge 112 of the copper block setting portion 110 and extend outward. The body part 130 is disposed on the periphery of the copper block setting part 110 and the embedding part 120 and is separated from the copper block setting part 110 and the embedding part 120. The disconnect part 140 connects the body part 130 and the embedded part 120. The edge 112 of the copper block setting portion 110 has a first width W1. The first side 121 of the embedding portion 120 is connected to the copper block setting portion 110 and has a second width W2. The first width W1 is greater than the second width W2.

Next, referring to FIGS. 1A and 2A at the same time, after the copper plate structure 100 is formed, the copper block 200 is disposed on the copper block setting portion 110 of the copper plate structure 100. In this embodiment, for example, a resistance welding process is used to directly weld the copper block 200 to the surface 114 of the copper block setting portion 110 of the copper plate structure 100, but it is not limited to this. In some embodiments, the copper block 200 may also be formed on the surface 114 of the copper block setting portion 110 of the copper plate structure 100 by electroplating. In some embodiments, the copper plate structure 100 and the copper block 200 can also be formed in the following steps: First, a thick copper plate (not shown) is provided, and the thickness of the thick copper plate is about the thickness of the copper block 200 plus the copper plate structure The thickness of 100; Then, the area to be patterned is fished out with a milling cutter, and the size of the area to be patterned is about the size of the copper plate structure 100; Then, the area to be patterned is performed through a photolithography process Patterning to form the multiple embedded portions 120, multiple disconnected portions 140 and the body portion 130 of the copper plate structure 100; wherein the area not dredged out by the milling cutter is used as the copper block setting portion 110 of the copper plate structure 100 and is arranged at The copper block 200 on the copper block setting part 110. So far, the copper plate structure 100 and the copper block 200 shown in FIGS. 1A and 2A have been fabricated.

In this embodiment, when the copper block 200 is positioned on the copper block setting portion 110, the center point P2 of the surface 202 of the copper block 200 is aligned with the center point P1 of the copper block setting portion 110 to be set, so that the copper block The orthographic projection of 200 on the copper block installation portion 110 completely overlaps the copper block installation portion 110. In this embodiment, the orthographic projection area of the copper block 200 to the copper block setting portion 110 is, for example, the same as the area of the copper block setting portion 110, but it is not limited to this. In some embodiments, the orthographic projection area of the copper block to the copper block installation portion may also be smaller than the area of the copper block installation portion.

In this embodiment, the thickness of the copper plate structure 100 is, for example, less than the thickness of the copper block 200, and the thickness of the copper plate structure 100 is, for example, 1/5 to 1/10 of the thickness of the copper block 200, but it is not limited thereto. For example, when the thickness of the copper block 200 is 1.6 mm, the thickness of the copper plate structure 100 may be 160 μm to 320 μm. In some embodiments, when the thickness of the copper plate structure 100 is too thin, it will be difficult to process and form the copper plate structure 100; on the contrary, when the thickness of the copper plate structure 100 is too thick, the copper plate structure 100 will be in the subsequent manufacturing process. When pressure is applied to press the copper block 200 into the opening 308 of the circuit board 300, the edge 112 of the opening 308 of the circuit board 300 is damaged, and the yield rate decreases.

Next, referring to FIG. 1B and FIG. 2B at the same time, a circuit board 300 is provided. In this embodiment, the circuit board 300 has a first surface 302, a second surface 304 opposite to the first surface 302, and an opening 308 penetrating the circuit board 300. Wherein, the opening 308 connects the first surface 302 and the second surface 304 of the circuit board 300. There is a distance H between the first surface 302 and the second surface 304.

In detail, the circuit board 300 includes a substrate 310, a first metal layer 320 and a second metal layer 330. The substrate 310 has an upper surface 312 and a lower surface 314 opposite to the upper surface 312. The first metal layer 320 is disposed on the upper surface 312 of the substrate 310. The second metal layer 330 is disposed on the lower surface 314 of the substrate 310. In this embodiment, the first surface 302 of the circuit board 300 can be regarded as the surface of the first metal layer 320 away from the substrate 310. The second surface 304 of the circuit board 300 can be regarded as the surface of the second metal layer 330 away from the substrate 310.

Then, referring to FIGS. 1B, 1C, 2B, and 2C at the same time, align the copper block 200 with the opening 308 of the circuit board 300, and align the body portion 130 of the copper plate structure 100 with the circuit board 300 outside the opening 308 . Next, pressure is applied to the copper block 200 to disconnect the disconnected portion 140 of the copper plate structure 100 and separate the embedded portion 120 from the main body 130. At the same time, the embedded portion 120 and the copper block setting portion separated from the main body 130 can be separated. 110 and the copper block 200 are pressed into the opening 308 of the circuit board 300.

Please continue to refer to FIGS. 1C and 2C. In this embodiment, the copper plate structure 100a separated from the main body 130 and the copper block 200 are disposed in the opening 308 of the circuit board 300. In detail, the copper plate structure 100a includes a copper block setting portion 110 and a bent embedded portion 120a. The copper block arrangement portion 110 and the copper block 200 are disposed in the center of the opening 308 of the circuit board 300, and there is a distance D between the copper block 200 and the side wall 308a of the opening 308. The bent embedded portions 120a are respectively connected to the first edge 112a, the second edge 112b, the third edge 112c, and the fourth edge 112d of the copper block setting portion 110 and extend outward to the side wall 308a of the opening 308. In this embodiment, the embedding portion 120a extends from the copper block setting portion 110 to the sidewall 308a of the opening 308 in a direction facing the side wall 308a of the opening 308 and a direction of the first surface 302 of the circuit board 300.

In this embodiment, the distance between the first side 121 and the second side 122 of the embedding portion 120a can be regarded as the length L of the embedding portion 120a. In this embodiment, the length L of the embedded portion 120a is, for example, greater than the distance D between the copper block 200 and the side wall 308a of the opening 308, that is, L>D, but it is not limited to this. For example, the length L of the embedded portion 120a is, for example, less than the sum of the distance H between the first surface 302 and the second surface 304 plus twice the distance D between the copper block 200 and the side wall 308a of the opening 308, that is, L>H+2D, but not limited to this. In this way, it can be ensured that the embedded portion 120a can resist the side wall 308a, and the copper block 200 and the copper block setting portion 110 are fixed in the opening 308 of the circuit board 300. That is, in this embodiment, since the length L of the embedding portion 120a is greater than the distance D between the copper block 200 and the side wall 308a of the opening 308, it can be ensured that the embedding portion 120a in the opening 308 can abut the side wall 308a. As a result, the fixing degree of the copper block 200 embedded in the circuit board 300 is better, and the yield rate of the circuit board 300 can be improved. In addition, in some embodiments, after the embedding portion 120a abuts against the side wall 308a of the opening 308, it may be bent again to form a bend 143, thereby enabling the embedding at the bend 143 to be bent again. The portion 120a continues to extend toward the first surface 302 of the circuit board 300, but is not limited to this.

Please continue to refer to Figure 1C and Figure 2C. In this embodiment, the copper plate structure 100a may further include a disconnection portion 140a. The disconnection portion 140 a is a part of the disconnection portion 140. The disconnected portion 140a is connected to the second side 122 of the embedded portion 120a and extends and contacts the side wall 308a of the opening 308 at the same time as the embedded portion 120a. In this embodiment, the disconnection portion 140b is the remaining part of the disconnection portion 140. The disconnect portion 140b is connected to the body portion 130 and is not embedded in the circuit board 300. That is, in this embodiment, the disconnection position of the disconnection portion 140 is, for example, between the disconnection portion 140a and the disconnection portion 140b.

In this embodiment, although the copper plate structure 100a buried in the opening 308 of the circuit board 300 may further include the disconnection portion 140a, it is not limited to this. That is, in some embodiments, when the disconnected position of the disconnected portion 140 is at the connection between the disconnected portion 140 and the embedded portion 120, the copper plate structure 100a embedded in the opening 308 of the circuit board 300 is There will be no disconnection 140a.

2C again, in this embodiment, the surface 202 of the copper block 200 away from the copper plate structure 100a is aligned with the first surface 302 of the circuit board 300, and the surface 104 of the copper plate structure 100a away from the copper block 200 and the circuit board 300 are aligned. The second surface 304 is evenly cut. In other words, the thickness of the copper plate structure 100 a plus the thickness of the copper block 200 is, for example, equal to the distance H between the first surface 302 and the second surface 304 of the circuit board 300. In this embodiment, the thickness of the copper plate structure 100 a and the thickness of the copper block 200 are measured along the normal direction of the circuit board 300.

Then, referring to FIG. 2D, the insulating material layer 400 is filled in the opening 308 of the circuit board 300 so that the insulating material layer 400 can surround the copper block 200 and the copper plate structure 100a. In this embodiment, the upper surface 402 and the lower surface 404 of the insulating material layer 400 are respectively connected to the first surface 302 (that is, the surface of the first metal layer 320 away from the substrate 310) and the second surface 304 (that is, the second metal layer) of the circuit board 300. The surface of the layer 330 away from the substrate 310) is flush. In this embodiment, the insulating material layer 400 does not cover the first surface 302 and the second surface 304 of the circuit board 300, and the insulating material layer 400 exposes the surface 202 of the copper block 200 and the surface 104 of the copper plate structure 100a. In this embodiment, the insulating material layer 400 may be a plugging agent, and the material of the insulating material layer 400 may be, for example, a resin (such as epoxy), but it is not limited thereto. So far, the circuit board 10 with embedded copper blocks of this embodiment has been manufactured.

In short, the circuit board 10 with embedded copper blocks of this embodiment includes a circuit board 300, a copper plate structure 100a, a copper block 200, and an insulating material layer 400. The circuit board 300 has a first surface 302, a second surface 304 opposite to the first surface 302, and an opening 308 penetrating the circuit board 300. The copper plate structure 100 a is disposed in the opening 308 of the circuit board 300. The copper plate structure 100a includes a copper block setting portion 110 and a plurality of embedded portions 120a. The embedded portion 120a is respectively connected to the edges 112a, 112b, 112c, and 112d of the copper block setting portion 110 and extends outward to the side wall 308a of the opening 308. The edges 112a, 112b, 112c, and 112d of the copper block setting portion 110 have a first width W1. The first side 121 of the embedding portion 120a is connected to the copper block setting portion 110 and has a second width W2. The first width W1 is greater than the second width W2. The copper block 200 is disposed in the opening 308 of the circuit board 300 and is located on the copper block setting portion 110 of the copper plate structure 100a. The insulating material layer 400 fills the opening 308 and surrounds the copper block 200 and the copper plate structure 100a.

It is specifically explained here that although the above description is based on a copper plate structure 100, a copper block 200 and an opening 308 of the circuit board 300, in actual operation, it will be a copper plate (or a thick copper plate). ) A plurality of copper plate structures 100 and a plurality of copper blocks 200 are formed. Then, after the plurality of copper blocks 200 are aligned with the plurality of openings 308 of the circuit board 300, for example, the plurality of The copper block 200 is pressed into the plurality of openings 308 of the circuit board 300. In this way, an automated process can be realized, and the efficiency and yield of the process of embedding copper blocks can be greatly improved.

Other embodiments will be listed below for description. It must be noted here that the following embodiments use the element numbers and part of the content of the foregoing embodiments, wherein the same numbers are used to represent the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiment, and the description of the following embodiments will not be repeated.

3 is a schematic cross-sectional view of a package structure according to an embodiment of the invention. Please refer to FIGS. 2D and 3 at the same time. The package structure 1 of this embodiment is similar to the circuit board 10 with embedded copper blocks in FIG. 2D, but the main difference between the two is: the package structure 1 of this embodiment also It includes a first circuit layer 340, a second circuit layer 350, a wire 360, a heating element 20, and a heat sink 30.

Specifically, the package structure 1 of FIG. 3 is an application embodiment of the circuit board 10 with embedded copper blocks of FIG. 2. 2D and FIG. 3 at the same time, the first circuit layer 340 is disposed on the first surface 302 of the circuit board 300, and the first circuit layer 340 covers the copper block 200 and the insulating material layer 400. The second circuit layer 350 is disposed on the second surface 304 of the circuit board 300, and the second circuit layer 350 covers the copper plate structure 100 a and the insulating material layer 400. In some embodiments, the first circuit layer 340 can contact the circuit board 300, the copper block 200 and the insulating material layer 400, and the second circuit layer 350 can contact the circuit board 300, the copper plate structure 100 a and the insulating material layer 400.

In this embodiment, the heating element 20 is disposed on the first circuit layer 340, and the heat sink 30 is disposed on the second circuit layer 350. The heating element 20 can be electrically connected to the first circuit layer 340 through the wire 360. The heat sink 30 can be additionally connected to an external heat sink (not shown). The heat generated by the heating element 20 can be directly transferred to the outside through the first circuit layer 340, the copper block 200, the copper block setting portion 110, the second circuit layer 350, and the heat sink 30 in sequence.

In summary, in the copper plate structure, the circuit board with embedded copper blocks, and the manufacturing method thereof in the embodiments of the present invention, since the first width of the edge of the copper block setting portion is greater than that of the first side of the embedded portion The second width, half of the second width of the first side of the embedding part is greater than the third width of the third side of the breaking part, so when pressure is applied to the copper block, the breaking part can be broken and the embedding The part is separated from the body part, and the embedded part, the copper block setting part and the copper block separated from the body part are pressed into the opening of the circuit board. Therefore, compared with the conventional process of embedding copper blocks manually, the copper plate structure, the circuit board with embedded copper blocks and the manufacturing method thereof of this embodiment can realize an automated process and greatly improve the efficiency of the process of embedding copper blocks. And yield.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be subject to those defined by the attached patent scope.

1: Package structure 10: Circuit board with embedded copper block 20: Heating element 30: heat sink 100, 100a: Copper plate structure 104, 114, 202: surface 110: Copper block setting department 112: Edge 112a: first edge 112b: second edge 112c: third edge 112d: fourth edge 120, 120a: Embedded part 121: first side 122: second side 130: body part 140, 140a, 140b: disconnect 141: third side 143: bend 150: empty part 200: copper block 300: circuit board 302: First Surface 304: second surface 308: open 308a: side wall 312, 402: upper surface 314, 404: lower surface 310: substrate 320: the first metal layer 330: second metal layer 340: first circuit layer 350: second circuit layer 360: Wire 400: insulating material layer W1: first width W2: second width W3: third width H, D: distance L: length P1, P2: center point

1A to 1C are schematic top views of a manufacturing method of a circuit board with embedded copper blocks according to an embodiment of the present invention. 2A to 2D are schematic cross-sectional views of a manufacturing method of a circuit board with embedded copper blocks according to an embodiment of the present invention. 3 is a schematic cross-sectional view of a package structure according to an embodiment of the invention.

10: Circuit board with embedded copper block

100a: Copper plate structure

104, 202: Surface

110: Copper block setting department

122: second side

120a: Embedded part

140a: Disconnect

200: copper block

300: circuit board

302: First Surface

304: second surface

310: substrate

320: the first metal layer

330: second metal layer

400: insulating material layer

402: upper surface

404: lower surface

H: distance

Claims (10)

A copper plate structure, including: A copper block setting part with at least one edge; A plurality of embedding parts respectively connected to the at least one edge of the copper block setting part and extending outward; A body part arranged on the periphery of the copper block setting part and the embedding parts, and separated from the copper block setting part and the embedding parts; and A plurality of disconnected parts connecting the body part and the embedded parts, wherein the at least one edge of the copper block setting part has a first width, and a first side of each of the embedded parts is connected to the copper block setting part And has a second width, and the first width is greater than the second width. The copper plate structure according to claim 1, wherein a second side of each of the embedded parts is connected to each of the disconnected parts and has the second width, and a third side of each of the disconnected parts is connected to each The embedding parts have a third width, and half of the second width is greater than the third width. The copper plate structure according to claim 1, wherein the number of the embedded parts is two or more, and the embedded parts are arranged on the copper block in a symmetrical or radially distributed manner with respect to the center point of the copper block setting part The at least one edge of the setting part. A circuit board with embedded copper blocks, including: A circuit board having a first surface, a second surface opposite to the first surface, and an opening penetrating the circuit board; A copper plate structure, which is arranged in the opening of the circuit board, includes: A copper block setting part; and A plurality of embedded portions are respectively connected to at least one edge of the copper block setting portion and extend outward to the side wall of the opening, wherein the at least one edge of the copper block setting portion has a first width, and one of each of the embedded portions The first side is connected to the copper block setting portion and has a second width, and the first width is greater than the second width; A copper block arranged in the opening of the circuit board and located on the copper block setting portion of the copper plate structure; and An insulating material layer is filled in the opening and surrounds the copper block and the copper plate structure. The circuit board with embedded copper blocks according to claim 4, wherein the copper plate structure further includes a plurality of disconnected portions, and has a third side connected to a second side of each of the embedded portions, Wherein, the second side of each of the embedding parts has the second width, the third side of each of the disconnected parts has a third width, and half of the second width is greater than the third width. The circuit board with embedded copper blocks according to claim 4, wherein the length of each of the embedded parts is L, the distance between the copper block and the side wall of the opening is D, and L is greater than D. The circuit board with embedded copper blocks according to claim 6, wherein the distance between the first surface and the second surface of the circuit board is H, and L>H+2D. The circuit board with an embedded copper block according to claim 4, wherein the surface of the copper block away from the copper plate structure is aligned with the first surface of the circuit board, and the surface of the copper plate structure away from the copper block is aligned with The second surface of the circuit board is evenly cut. The circuit board with embedded copper blocks according to claim 4, wherein the circuit board includes a substrate, a first metal layer, and a second metal layer, and the substrate has an upper surface and an upper surface opposite to the upper surface. On the lower surface, the first metal layer is disposed on the upper surface of the substrate, and the second metal layer is disposed on the lower surface of the substrate. A method for manufacturing a circuit board with embedded copper blocks, including: Form the copper plate structure as described in claim 1; Disposing a copper block on the copper block setting part of the copper plate structure; Providing a circuit board, wherein the circuit board has a first surface, a second surface opposite to the first surface, and an opening penetrating the circuit board; Align the copper block with the opening of the circuit board; Applying a pressure to the copper block to disconnect the disconnected parts of the copper plate structure and separate the embedded parts from the body part; Pressing the embedding parts, the copper block setting part and the copper block separated from the main body part into the opening of the circuit board; and An insulating material layer is filled in the opening to surround the copper block and the copper plate structure.

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