CN106102324A - The method of copper billet off normal is buried in a kind of prevention - Google Patents
The method of copper billet off normal is buried in a kind of prevention Download PDFInfo
- Publication number
- CN106102324A CN106102324A CN201610511475.6A CN201610511475A CN106102324A CN 106102324 A CN106102324 A CN 106102324A CN 201610511475 A CN201610511475 A CN 201610511475A CN 106102324 A CN106102324 A CN 106102324A
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- CN
- China
- Prior art keywords
- copper billet
- prevention
- normal
- bury
- buried
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Forging (AREA)
Abstract
The present invention relates to printed circuit board and manufacture field, particularly relate to a kind of method that copper billet off normal is buried in prevention, mainly comprise the steps that (1) respectively arranges a projection in four corners of copper billet；(2) first described projection is withstood and bury four angles of copper billet groove, then copper billet is embedded and bury in copper billet groove.The present invention can effectively prevent copper billet off normal, thus prevention buries that copper billet line of rabbet joint gap is excessive or the too small filler deficiency problem caused, and can scrap reduction by 70% by produce because filler is not enough, improve and bury copper billet product P CB product economy benefit 70%.
Description
Technical field
The present invention relates to printed circuit board and manufacture field, particularly relate to a kind of method that copper billet off normal is buried in prevention.
Background technology
For burying copper billet PCB product, burying copper billet groove bigger than copper billet, product allows certain gap space, copper billet ability
In embedded groove, fill up the pressing glue that overflows and could fix copper billet.But in burying copper bonding processes, due to the effect of stress, copper billet meeting
Inclined in one direction, as it is shown in figure 1, the excessive or too small problem that gaps, no matter gap is excessive or too small all causing fills out
Glue is not enough.
Summary of the invention
The deficiency existed for prior art, it is an object of the invention to provide a kind of method that copper billet off normal is buried in prevention,
Will not off normal in copper billet pressing manufacturing process, it is to avoid the situation that in gap, filler is not enough.
For achieving the above object, the present invention can be achieved by the following technical programs:
The method of copper billet off normal is buried in a kind of prevention, comprises the following steps:
(1) four corners at copper billet respectively arrange a projection；
(2) first described projection is withstood and bury four angles of copper billet groove, then copper billet is embedded and bury in copper billet groove.
Further, step (1) described projection mills out in milling or when rushing copper billet profile or goes out.
Further, step (1) described projection thickness is identical, diagonal angle two projection to angle point line distance equal to burying copper billet
Groove to angle point line distance.
Further, the thickness of described projection is 0.1-0.2mm.
Compared with prior art, the method have the advantages that
1, copper billet deviation problem in pressing can effectively be prevented；
2, copper billet is not affected into during process operation and the size burying copper billet groove；
3, embedding copper billet operation and copper billet pressing quality are not affected during process operation；
4, simple to operate, it is not necessary to increase cost.
Sum it up, the present invention can effectively prevent copper billet off normal, thus prevention to bury copper billet line of rabbet joint gap excessive or too small cause
Filler deficiency problem, reduction by 70% can be scrapped by produce because filler is not enough, improve and bury copper billet product P CB product economy
Benefit 70%.
Accompanying drawing explanation
Fig. 1 is the structural representation of prior art；
Fig. 2 is the structural representation of the present invention；
In figure: 1-copper billet, 2-bury copper billet groove, 3-gap, 4-projection.
Detailed description of the invention
Below in conjunction with accompanying drawing and detailed description of the invention, the present invention is further illustrated:
As in figure 2 it is shown, the method that copper billet off normal is buried in prevention of the present invention, comprise the following steps:
(1) four corners at copper billet 1 respectively arrange a projection 4；
(2) first described projection 4 is withstood and bury four angles of copper billet groove 2, then copper billet 1 is embedded and bury in copper billet groove 2.
The thickness of four projections 4 is identical, diagonal angle two projection 4 to angle point line distance equal to bury copper billet groove 2 to angle point
Line distance, four cornicults play the size of 4 just with to bury 2 four angles of copper billet groove etc. big, and when making embedding copper billet 1, four projections 4 can
Just to withstand on four corners burying copper billet groove 2.Copper billet 1 is during copper billet groove 2 is buried in embedding, and no matter pressing pressure is executed to which
Side, copper billet 1 all will not offset.Projection 4 mills out in milling or when rushing copper billet 1 profile or goes out.The thickness of projection 4 can be set to 0.1-
0.2mm。
For a person skilled in the art, can be made other various accordingly according to above technical scheme and design
Change and deformation, and within all these changes and deformation all should belong to the protection domain of the claims in the present invention.
Claims (4)
1. the method that copper billet off normal is buried in a prevention, it is characterised in that comprise the following steps:
(1) four corners at copper billet respectively arrange a projection；
(2) first described projection is withstood and bury four angles of copper billet groove, then copper billet is embedded and bury in copper billet groove.
The method of copper billet off normal is buried in prevention the most according to claim 1, it is characterised in that: step (1) described projection is in milling
Or mill out when rushing copper billet profile or go out.
The method of copper billet off normal is buried in prevention the most according to claim 1, it is characterised in that: step (1) described projection thickness
Identical, diagonal angle two projection to angle point line distance equal to bury copper billet groove to angle point line distance.
The method of copper billet off normal is buried in prevention the most according to claim 3, it is characterised in that: the thickness of described projection is 0.1-
0.2mm。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610511475.6A CN106102324B (en) | 2016-06-30 | 2016-06-30 | A method of copper billet deviation is buried in prevention |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610511475.6A CN106102324B (en) | 2016-06-30 | 2016-06-30 | A method of copper billet deviation is buried in prevention |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106102324A true CN106102324A (en) | 2016-11-09 |
| CN106102324B CN106102324B (en) | 2018-12-25 |
Family
ID=57212907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610511475.6A Active CN106102324B (en) | 2016-06-30 | 2016-06-30 | A method of copper billet deviation is buried in prevention |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106102324B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110996528A (en) * | 2019-12-30 | 2020-04-10 | 深圳市博敏电子有限公司 | Positioning method of semi-embedded copper sheet circuit board |
| CN111465168A (en) * | 2020-03-05 | 2020-07-28 | 珠海崇达电路技术有限公司 | Method for improving deviation of pressed buried copper block |
| US10736215B1 (en) | 2019-04-22 | 2020-08-04 | Unimicron Technology Corp. | Multilayer circuit board structure and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100867954B1 (en) * | 2007-10-31 | 2008-11-11 | 삼성전기주식회사 | Printed circuit board having embedded electronic components and method for manufacturing the same |
| CN101784160A (en) * | 2010-01-22 | 2010-07-21 | 东莞生益电子有限公司 | Method for manufacturing press in type printed circuit board with high thermal conductivity |
| CN103096638A (en) * | 2011-10-27 | 2013-05-08 | 北大方正集团有限公司 | Press-in type high thermal conductive printed circuit board (PCB) and manufacture method thereof |
| CN105472869A (en) * | 2015-12-14 | 2016-04-06 | 深圳崇达多层线路板有限公司 | Printed circuit board with semi-embedded type embedded heat conductive block |
-
2016
- 2016-06-30 CN CN201610511475.6A patent/CN106102324B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100867954B1 (en) * | 2007-10-31 | 2008-11-11 | 삼성전기주식회사 | Printed circuit board having embedded electronic components and method for manufacturing the same |
| CN101784160A (en) * | 2010-01-22 | 2010-07-21 | 东莞生益电子有限公司 | Method for manufacturing press in type printed circuit board with high thermal conductivity |
| CN103096638A (en) * | 2011-10-27 | 2013-05-08 | 北大方正集团有限公司 | Press-in type high thermal conductive printed circuit board (PCB) and manufacture method thereof |
| CN105472869A (en) * | 2015-12-14 | 2016-04-06 | 深圳崇达多层线路板有限公司 | Printed circuit board with semi-embedded type embedded heat conductive block |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10736215B1 (en) | 2019-04-22 | 2020-08-04 | Unimicron Technology Corp. | Multilayer circuit board structure and manufacturing method thereof |
| CN110996528A (en) * | 2019-12-30 | 2020-04-10 | 深圳市博敏电子有限公司 | Positioning method of semi-embedded copper sheet circuit board |
| CN110996528B (en) * | 2019-12-30 | 2023-02-03 | 深圳市博敏电子有限公司 | Positioning method of semi-embedded copper sheet circuit board |
| CN111465168A (en) * | 2020-03-05 | 2020-07-28 | 珠海崇达电路技术有限公司 | Method for improving deviation of pressed buried copper block |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106102324B (en) | 2018-12-25 |
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