CN105163527A - Manufacturing method of semi-flexible circuit board - Google Patents
Manufacturing method of semi-flexible circuit board Download PDFInfo
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- CN105163527A CN105163527A CN201510573317.9A CN201510573317A CN105163527A CN 105163527 A CN105163527 A CN 105163527A CN 201510573317 A CN201510573317 A CN 201510573317A CN 105163527 A CN105163527 A CN 105163527A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention aims at providing a manufacturing method of a semi-flexible circuit board. The manufacturing method is convenient to manufacture, simple in structure, free of a connector, low in cost and high in reliability. The method comprises the following steps: (1) core plate manufacturing, namely blanking, inner layer manufacturing, depth-controlled slotting of a core plate and browning; (2) PP manufacturing, namely blanking and PP notching; (3) circuit board manufacturing, core plate and PP combination, drilling, hole copper plating, outer patterning, solder mask, surface treatment, characters, molding, depth-controlled slotting (milling a Semi-Flex region), electrical testing, final inspection and packaging. The manufacturing method can be applied to the field of circuit board technologies.
Description
Technical field
The present invention relates to a kind of circuit board manufacturing process, particularly relate to a kind of manufacture method of half soft-circuit board.
Background technology
Half soft-circuit board is mainly used in automobile and electronics industry, therefore there is strict demand, when final assembling needs pcb board to carry out storehouse, this Semi-FlexPCB can provide low cost, reduce the winding of pad and connector, possess and can carry out attachment components and parts at same state, same plane, after assembling, flexible portion can meet the requirement being bent to net shape.Owing to possessing these advantages, adopt half soft-circuit board by omit PCB connector introducing, this will strengthen the reliability of pcb board electronic system widely.
Half soft-circuit board be produce on the basis of rigid printed board to bending number of times require less but can carry out local bending a kind of printed board, existingly can provide rigid printed board due supporting role, there is again the bendability of local, can meeting requirements on three-dimensional assembling requirement, the high density that half soft board has, high reliability and can locally bend feature and be used widely, compare high density interconnecting board and have more the advantage facilitating installation and maintenance.
Tradition realizes PCB bending connection all needs extra PCB connector to accept, or is realized by the technology mode that the soft or hard of high cost combines.This will cause the complexity of PCB electronic system, reduces its reliability, and PCB space availability ratio is low, cost height enterprise.
Summary of the invention
Technical problem to be solved by this invention overcomes the deficiencies in the prior art, provide a kind of easy to make, structure simple, without the need to the manufacture method of connector, cost is low, reliability is high half soft-circuit board.
The technical solution adopted in the present invention is, the inventive method comprises the following steps:
(1) central layer makes: blanking, and inner plating makes, and control dark groove milling to the core layer of flexibility bending, depth of milled groove is 0.3 ~ 0.5mm, then carries out brown process and stand-by;
(2) PP layer makes: PP layer is made in blanking, bend the corresponding groove in region bend the adjacent PP layer of central layer offers with flexibility with flexibility, and this well width bends the monolateral large 0.1 ~ 0.3mm of the width in region than flexibility;
(3) wiring board makes: undertaken adjacent superimposed by the central layer after step (1) and step (2) process and PP layer, wherein, need to carry out the central layer of flexible bending and the PP layer skin near wiring board, the direction that central layer is slotted is consistent with the flexible direction bent;
(4) to uncap process to the wiring board after pressing, on the central layer that the part of uncapping is positioned at unslotted and PP layer, the position of uncapping is consistent with the region that flexibility bends.
Further, the detailed process that central layer makes is:
A () makes central layer with common material blanking;
B () carries out internal layer making to central layer;
C () carries out flexure region making: utilize milling cutter to carry out groove milling to core layer, and groove milling thickness is 0.3 ~ 0.5mm;
The process of (d) brown.
Further, the manufacturing process of PP layer is as follows:
E () makes PP layer with common FR4 material blanking;
F () carries out slot treatment to PP layer, wherein groove width large 0.1 ~ 0.3mm more monolateral than flexure region width.
Further, the process that wiring board makes is:
G () central layer is adjacent with PP layer superimposed, wherein outermost layer is base layers of copper;
H () carries out digital control hole drilling according to pattern;
(i) carry out boring copper facing;
J () cuts out plate, press mold, outer exposure and development, and circuit is electroplated, zinc-plated process, striping, etching;
The process of (k) solder mask;
L () carries out surface treatment;
The process of (m) wiring board character;
N () is shaping.
Further, step of uncapping carries out in the circuit board controlling dark groove milling and mills out flexible bending region, then carries out the test of ion residual volume to wiring board, after examining eventually, and packed products.
The invention has the beneficial effects as follows: adopt the inventive method to carry out printed wiring board making, carry out fluting in the region of flexibility bending to arrange, the groove width of PP layer is wherein greater than the width in the region of flexible bending, this makes wiring board in bonding processes, carry out the control of PP gummosis amount, avoid opening the risk causing too greatly product starved, or open the too little PP of causing glue fill up the slotting position on central layer and cause the follow-up work of uncapping to carry out, ensure that the reliability of pcb board, and its structure is simple; Additionally by the design of the inventive method, the present invention can use common FR4 material can realize traditional PCB and bend demand, for traditional PCB, it is an innovation, decrease the application of PCB connector, be that printed circuit board can realize three-dimensional assembling function, take full advantage of the space of pcb board, also reduce cost.
Accompanying drawing explanation
Fig. 1 is that the wiring board product in embodiment folds structure schematic diagram;
Fig. 2 is the easy structure schematic diagram that L3, L4 layer in embodiment carries out controlling dark Xiyanping injection;
Fig. 3 is the easy structure schematic diagram in embodiment, central layer and PP layer being carried out to grooving operations;
Fig. 4 is the easy structure schematic diagram of half soft-circuit board after completing in embodiment.
Embodiment
The inventive method comprises the following steps:
(1) central layer makes: blanking, and inner plating makes, and control dark groove milling to the core layer of flexibility bending, depth of milled groove is 0.3 ~ 0.5mm, then carries out brown process and stand-by; The detailed process that central layer makes is:
A () makes central layer with common material blanking;
B () carries out internal layer making to central layer;
C () carries out flexure region making: utilize milling cutter to carry out groove milling to core layer, and groove milling thickness is 0.3 ~ 0.5mm;
The process of (d) brown.
(2) PP layer makes: PP layer is made in blanking, bend the corresponding groove in region bend the adjacent PP layer of central layer offers with flexibility with flexibility, and this well width bends the monolateral large 0.1 ~ 0.3mm of the width in region than flexibility; The manufacturing process of PP layer is as follows:
E () makes PP layer with common FR4 material blanking;
F () carries out slot treatment to PP layer, wherein groove width large 0.1 ~ 0.3mm more monolateral than flexure region width.
(3) wiring board makes: undertaken adjacent superimposed by the central layer after step (1) and step (2) process and PP layer, wherein, need to carry out the central layer of flexible bending and the PP layer skin near wiring board, the direction that central layer is slotted is consistent with the flexible direction bent; The detailed process that wiring board makes is:
G () central layer is adjacent with PP layer superimposed, wherein outermost layer is base layers of copper;
H () carries out digital control hole drilling according to pattern;
(i) carry out boring copper facing;
J () cuts out plate, press mold, outer exposure and development, and circuit is electroplated, zinc-plated process, striping, etching;
The process of (k) solder mask;
L () carries out surface treatment;
The process of (m) wiring board character;
N () is shaping.
(4) to uncap process to the wiring board after pressing, on the central layer that the part of uncapping is positioned at unslotted and PP layer, the position of uncapping is consistent with the region that flexibility bends; Step of uncapping carries out in the circuit board controlling dark groove milling and mills out flexible bending region, then carries out the test of ion residual volume to wiring board, after examining eventually, and packed products.
Below, with specific embodiment, the present invention is further illustrated.The present embodiment is described with 6 laminates.
1) in Fig. 1, L1-L2 layer and L5-L6 layer central layer normally make, and make consistent with common wiring board central layer; As shown in Figure 1, fold composition for " 6 " layer half soft-circuit board (hereinafter referred to as Semi-Flex) product in figure, wherein " 1 " is represented as central layer base copper, and " 2 " represent central layer thickness of dielectric layers, " 3 " are represented as the thickness of insulating layer between central layer and central layer, the PP layer namely described in flow process.
2) need extra increasing to control dark groove milling in Fig. 1 after L3-L4 layer central layer normal etches, need to carry out controlling dark Xiyanping injection toward L3 layer from L4 layer, controlling dark milling position is the region that L5-L6 layer needs bending, and concrete schematic diagram as shown in Figure 2.The substrate surface that in Fig. 2, the Regional Representative of " 1 " white is circuit surface after the etching of L4 layer; In Fig. 2, the round dot of " 2 " black needs the copper PAD retained after representing the etching of L4 sandwich circuit; In Fig. 2, the pane of " 3 " black represents the copper PAD that the corresponding L5 layer of L4 layer needs to bend region; The circuit that in Fig. 2, the long line of " 4 " black retains after representing the etching of L4 layer; In Fig. 2, the blockage of " 5 " black needs the copper PAD retained after representing the etching of L4 layer; In Fig. 2, being represented as of " 6 " grey adopts milling cutter to carry out the dark blind slot machining sketch chart of machinery control.
3) after the etching of L4 sandwich circuit, dark groove milling is controlled to the region that L5-L6 layer need bend, mainly in order to solve the PP gummosis problem between L4-L5 layer when pressing, first the PP between L4-L5 layer is slotted before this, fluting size bigger than normal 0.1 ~ 0.3mm more monolateral than bending region, as shown in Figure 3.As shown in Figure 3, this step only enclose for the institute of " 1 " in Fig. 3 the level shown and is carried out decomposition and illustrate, other levels process by normal wiring board making, do not repeat at this.In Fig. 3, " 2 " are designated as Semi-Flex area size; " 3 " are designated as the size that L4-L5 layer PP slots, PP fluting size large 0.1 ~ 0.3mmmm more monolateral than Semi-Flex region, gummosis amount when mainly considering PP pressing controls, if open the risk easily causing too greatly product starved, if that opens too littlely easily causes PP glue that the groove of L4 layer Semi-Flex position is filled up excessive glue out to be clung by the copper PAD of this position, final products can be caused to uncap cannot be realized; " 4 " and indicate for L4 layer control dark milling fluting the degree of depth, this degree of depth general control is between 0.3 ~ 0.5mm, excessive easily by too many for the inflow between L4-L5, cause product starved, easily cause PP glue that the groove of L4 layer Semi-Flex position is filled up excessive glue out to be clung by the copper PAD of this position as too shallow, final products can be caused to uncap cannot be realized.
4) by above-mentioned steps 3) after, product carries out the regular link plate Making programme after pressing, carries out Semi-Flex region and uncap process after final products are shaping, finally realizes the demand of L5-L6 layer bending.As shown in Figure 4, Fig. 4 is the schematic diagram belonging to finished product Semi-Flex region fluting, and final medium-soft region only remains L5-L6 layer dielectric layer and circuit.
The inventive method makes common FR4 design of material realize traditional PCB bending demand, realize the function that printed circuit board can realize three-dimensional assembling, reduce the processing cost of soft or hard combined process, also having filled up traditional PCB processes unsurpassable technical field simultaneously simultaneously.
The present invention can be applicable to circuit board technique field.
Claims (5)
1. a manufacture method for half soft-circuit board, is characterized in that, the method comprises the following steps:
(1) central layer makes: blanking, and inner plating makes, and control dark groove milling to the core layer of flexibility bending, depth of milled groove is 0.3 ~ 0.5mm, then carries out brown process and stand-by;
(2) PP layer makes: PP layer is made in blanking, bend the corresponding groove in region bend the adjacent PP layer of central layer offers with flexibility with flexibility, and this well width bends the monolateral large 0.1 ~ 0.3mm of the width in region than flexibility;
(3) wiring board makes: undertaken adjacent superimposed by the central layer after step (1) and step (2) process and PP layer, wherein, need to carry out the central layer of flexible bending and the PP layer skin near wiring board, the direction that central layer is slotted is consistent with the flexible direction bent;
(4) to uncap process to the wiring board after pressing, on the central layer that the part of uncapping is positioned at unslotted and PP layer, the position of uncapping is consistent with the region that flexibility bends.
2. the manufacture method of a kind of half soft-circuit board according to claim 1, is characterized in that, the detailed process that central layer makes is:
A () makes central layer with common material blanking;
B () carries out internal layer making to central layer;
C () carries out flexure region making: utilize milling cutter to carry out groove milling to core layer, and groove milling thickness is 0.3 ~ 0.5mm;
The process of (d) brown.
3. the manufacture method of a kind of half soft-circuit board according to claim 1, it is characterized in that, the manufacturing process of PP layer is as follows:
E () makes PP layer with common FR4 material blanking;
F () carries out slot treatment to PP layer, wherein groove width large 0.1 ~ 0.3mm more monolateral than flexure region width.
4. the manufacture method of a kind of half soft-circuit board according to claim 1, is characterized in that, the process that wiring board makes is:
G () central layer is adjacent with PP layer superimposed, wherein outermost layer is base layers of copper;
H () carries out digital control hole drilling according to pattern;
(i) carry out boring copper facing;
J () cuts out plate, press mold, outer exposure and development, and circuit is electroplated, zinc-plated process, striping, etching;
The process of (k) solder mask;
L () carries out surface treatment;
The process of (m) wiring board character;
N () is shaping.
5. the manufacture method of a kind of half soft-circuit board according to claim 1, is characterized in that, step of uncapping carries out in the circuit board controlling dark groove milling and mills out flexible bending region, then carries out the test of ion residual volume to wiring board, after examining eventually, and packed products.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510573317.9A CN105163527B (en) | 2015-09-10 | 2015-09-10 | A kind of production method of half soft-circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510573317.9A CN105163527B (en) | 2015-09-10 | 2015-09-10 | A kind of production method of half soft-circuit board |
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| CN105163527A true CN105163527A (en) | 2015-12-16 |
| CN105163527B CN105163527B (en) | 2018-08-31 |
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| CN201510573317.9A Expired - Fee Related CN105163527B (en) | 2015-09-10 | 2015-09-10 | A kind of production method of half soft-circuit board |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110519928A (en) * | 2019-08-12 | 2019-11-29 | 珠海杰赛科技有限公司 | A kind of manufacture craft of blind slot flex plate |
| CN110996514A (en) * | 2019-11-06 | 2020-04-10 | 昆山沪利微电有限公司 | Method for manufacturing cavity structure |
| CN111163597A (en) * | 2019-12-31 | 2020-05-15 | 昆山沪利微电有限公司 | Manufacturing process of PCB cavity structure |
| US11324126B2 (en) | 2018-08-09 | 2022-05-03 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Mechanically robust component carrier with rigid and flexible portions |
| CN117095618A (en) * | 2023-10-16 | 2023-11-21 | 长春希达电子技术有限公司 | Flexible display panel preparation method and display device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101998769A (en) * | 2010-11-25 | 2011-03-30 | 深南电路有限公司 | Rigid-flex board and step board and processing method of rigid-flex board and step board |
| CN102291940A (en) * | 2011-08-01 | 2011-12-21 | 东莞生益电子有限公司 | Method for making printed circuit board (PCB) with step groove |
| CN104394658A (en) * | 2014-11-18 | 2015-03-04 | 广州兴森快捷电路科技有限公司 | Rigid-flexible combined circuit board and manufacturing method thereof |
| CN104519682A (en) * | 2014-12-11 | 2015-04-15 | 广州兴森快捷电路科技有限公司 | Semi-flexible circuit board and preparation method thereof |
-
2015
- 2015-09-10 CN CN201510573317.9A patent/CN105163527B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101998769A (en) * | 2010-11-25 | 2011-03-30 | 深南电路有限公司 | Rigid-flex board and step board and processing method of rigid-flex board and step board |
| CN102291940A (en) * | 2011-08-01 | 2011-12-21 | 东莞生益电子有限公司 | Method for making printed circuit board (PCB) with step groove |
| CN104394658A (en) * | 2014-11-18 | 2015-03-04 | 广州兴森快捷电路科技有限公司 | Rigid-flexible combined circuit board and manufacturing method thereof |
| CN104519682A (en) * | 2014-12-11 | 2015-04-15 | 广州兴森快捷电路科技有限公司 | Semi-flexible circuit board and preparation method thereof |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11324126B2 (en) | 2018-08-09 | 2022-05-03 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Mechanically robust component carrier with rigid and flexible portions |
| CN110519928A (en) * | 2019-08-12 | 2019-11-29 | 珠海杰赛科技有限公司 | A kind of manufacture craft of blind slot flex plate |
| CN110519928B (en) * | 2019-08-12 | 2020-07-28 | 珠海杰赛科技有限公司 | Manufacturing process of blind groove flexible plate |
| CN110996514A (en) * | 2019-11-06 | 2020-04-10 | 昆山沪利微电有限公司 | Method for manufacturing cavity structure |
| CN110996514B (en) * | 2019-11-06 | 2023-01-06 | 昆山沪利微电有限公司 | Method for manufacturing cavity structure |
| CN111163597A (en) * | 2019-12-31 | 2020-05-15 | 昆山沪利微电有限公司 | Manufacturing process of PCB cavity structure |
| CN117095618A (en) * | 2023-10-16 | 2023-11-21 | 长春希达电子技术有限公司 | Flexible display panel preparation method and display device |
| CN117095618B (en) * | 2023-10-16 | 2024-03-15 | 长春希达电子技术有限公司 | Flexible display panel preparation method and display device |
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| CN105163527B (en) | 2018-08-31 |
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