KR100867954B1 - Printed circuit board having embedded electronic components and method for manufacturing the same - Google Patents

Abstract

An electro device built-in PCB(Printed Circuit Board) is provided to simplify its manufacturing process by skipping a punch process of a cavity or a process which uses an adhesive tape. Some part of electronic device is indented to a first insulation layer(S100), and a second insulation layer is stacked on the first insulation layer to indent the rest part of the electronic device to the second insulation layer(S200). A blind via-hole is punched on the first or second insulation layer(S300). A first blind via-hole is formed by plating the blind via-hole(S400), and a circuit pattern is formed at another planes of the first and second insulation layers(S500).

Description

Printed circuit board having embedded electronic components and method for manufacturing the same

The present invention relates to a printed circuit board embedded with an electronic device and a method of manufacturing the same.

The development of integrated circuits (ICs) has enabled miniaturization and high integration to enable multifunction and high performance. Interposers, packages, printed circuit boards, etc., which have such a high-density IC and are intended for electrical connection with another device, should be highly integrated accordingly.

Conventional multilayer boards have internal circuits and all parts are mounted on the upper layer. However, recently, a demand for developing printed circuit boards with electronic parts to achieve higher integration and miniaturization and high performance by embedding many or some components inside the multilayer board has been developed. It is getting stronger.

In addition to the advantages of multifunctionality and miniaturization, printed circuit boards with electronic devices are also considered in terms of improvement of high frequency characteristics, which can minimize wiring distance at high frequencies of 100 MHz or higher, and in some cases, flip chip assembly (FC). This is because it provides a solution to improve the reliability problem of the connection of components using wire bonding or solder balls used in a ball grid array (BGA).

1 to 4 are flowcharts illustrating a method of manufacturing a printed circuit board having an electronic device according to the prior art. Referring to FIGS. 1 to 4, a method of manufacturing an electronic device embedded printed circuit board according to the related art will be described. First, as shown in FIG. 1, a circuit board on which vias and circuit patterns are formed for electrical connection between layers is formed. A cavity 103 (cavity) is punctured at the position where the electronic element 106 is to be embedded in the 102, and the adhesive tape 104 is attached to the lower surface of the perforated cavity 103. Next, as shown in FIG. 2, the electronic device 106 is inserted and fixed onto the adhesive tape 104 through the cavity 103. Next, as shown in FIG. 3, the insulating layer 110 is stacked on the circuit board 102, the electronic device 106 is fixed, and the conductor layer 108 for the circuit pattern is stacked thereon. Next, as shown in FIG. 4, the adhesive tape 104 is removed and the insulating layer 114 and the conductor layer 112 are laminated again. Next, the conductor layers 108 and 112 formed on the outside of the circuit board 102 are selectively etched to form circuit patterns.

However, according to the prior art, when manufacturing a printed circuit board in which an electronic device is embedded, there is a concern that damage may occur to the electronic device due to cavity perforation, use of an adhesive tape, and the manufacturing process is very complicated.

In addition, the insulating layer of the circuit board on which the electronic device is mounted and the insulating layer laminated on the circuit board are made of a thermosetting resin, which is difficult to regenerate expensive electronic devices when a process defect occurs due to the thermal characteristics of the thermosetting resin. There is a problem.

The present invention provides an electronic device-embedded printed circuit board and a method of manufacturing the same, which simplifies the manufacturing process by eliminating the process of puncturing the cavity and using the adhesive tape by inserting and embedding the electronic device between two insulating layers. .

The present invention also provides an electronic device-embedded printed circuit board and a manufacturing method thereof, by which electronic devices are embedded between two insulating layers to recycle expensive electronic devices.

According to an aspect of the invention, the step of pressing a portion of the electronic device on one surface of the first insulating layer and the second insulating layer on the first insulating layer, such that the remaining portion of the electronic device on the one surface of the second insulating layer is pressed. Provided are a method for manufacturing a printed circuit board embedded with an electronic device, the method including stacking and pressing.

The pressing may include heating the first insulating layer to a softening temperature or higher, pressing the electronic device on the first insulating layer, and cooling the first insulating layer.

The pressing may include heating the second insulating layer to a softening temperature or higher and cooling the second insulating layer.

The first insulating layer may include a thermosetting resin, and the second insulating layer may include a thermoplastic resin.

A conductor layer may be formed on the other surface of the first insulating layer, and in this case, the method may further include forming a circuit pattern by selectively etching the conductor layer.

When the electronic device is provided with a connection terminal, drilling a blind via hole in the first insulating layer or the second insulating layer to expose the connection terminal, and plating the blind via hole to form a first blind via. It may further comprise forming a. The method may further include stacking a buildup layer on the first insulating layer or the second insulating layer on which the first blind via is formed, and forming a second blind via electrically connected to the first blind via by drilling the buildup layer. It may further include.

The buildup layer may be stacked in plurality, and the second blind via may be formed in each of the plurality of buildup layers.

A conductor layer may be formed on the other surface of the first insulating layer and the other surface of the second insulating layer, respectively, forming a through via for electrically connecting a pair of conductor layers and selectively etching the conductor layer to form a circuit pattern. It may further comprise the step of forming.

A connection terminal may be provided on one surface of the electronic device, and a heat dissipation layer may be stacked on the other surface of the first insulating layer. In this case, the other surface of the electronic device may be pressed in contact with the heat dissipation layer.

The method may further include forming a blind via hole by perforating the second insulating layer to expose the connection terminal, and forming the third blind via by plating the blind via hole.

The buildup layer may be stacked on the second insulating layer, and the buildup layer may be drilled to form a fourth blind via electrically connected to the third blind via.

The buildup layer may be stacked in plurality, and the fourth blind via may be formed in the plurality of buildup layers, respectively.

After forming the fourth blind via, the method may further include forming a conductive bump electrically connected to the fourth blind via on the surface of the build-up layer.

In addition, according to another aspect of the present invention, the first insulating layer, an electronic device, a part of which is pressed into one surface of the first insulating layer, the second part of the electronic device is pressed into, the second insulating layer laminated on the first insulating layer Provided is an electronic device embedded printed circuit board including a layer and a conductor layer laminated on the other surface of the first insulating layer.

The circuit pattern may further include a circuit pattern formed by selectively etching the conductor layer.

A connection terminal may be provided on one surface of the electronic device, the conductor layer may be a heat radiation layer, and the other surface of the electronic device may be in contact with the heat radiation layer.

The display device may further include a first blind via penetrating the second insulating layer and electrically connected to the connection terminal.

The display device may further include a build up layer stacked on the second insulating layer and a second blind via electrically connected to the blind via through the build up layer.

The buildup layer may be stacked in plural, and the second blind via may be formed in plural so as to be respectively processed in the plurality of buildup layers and electrically connected to each other.

It may further include a conductive bump formed on the surface of the buildup layer and electrically connected to the second blind via.

In the process of embedding the electronic device in the printed circuit board, the cavity drilling process and the process using the adhesive tape are omitted, thereby simplifying the manufacturing process, thereby reducing the defect rate and manufacturing cost of the product.

As the invention allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the written description. However, this is not intended to limit the present invention to specific embodiments, it should be understood to include all transformations, equivalents, and substitutes included in the spirit and scope of the present invention. In the following description of the present invention, if it is determined that the detailed description of the related known technology may obscure the gist of the present invention, the detailed description thereof will be omitted.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, components, or a combination thereof.

Hereinafter, an embodiment of an electronic device embedded printed circuit board and a method of manufacturing the same according to the present invention will be described in detail with reference to the accompanying drawings. In the following description with reference to the accompanying drawings, the same or corresponding components are the same reference numerals. And duplicate description thereof will be omitted.

5 is a flowchart illustrating a method for manufacturing an electronic device embedded printed circuit board according to the first embodiment of the present invention, and FIGS. 6 to 10 illustrate a method for manufacturing an electronic device embedded printed circuit board according to the first embodiment of the present invention. It is a flow chart. 6 to 10, the first insulating layer 12, the conductor layer 14, the electronic device 16, the connection terminal 18, the second insulating layer 20, the blind via hole 22, and through Via 23, first blind via 24, build up layer 25, circuit pattern 26, and second blind via 27 are shown.

In the method of manufacturing a printed circuit board with electronic devices according to the present exemplary embodiment, the method of press-injecting a part of the electronic device 16 into one surface of the first insulating layer 12 and the electronic device 16 on one surface of the second insulating layer 20 may be performed. Laminating and pressurizing the second insulating layer 20 to the first insulating layer 12 so as to press-fit the remaining portion thereof), and the cavity drilling process for embedding the electronic device 16 in the printed circuit board. And the use process of the adhesive tape can be omitted to simplify the manufacturing process, thereby reducing the defective rate and manufacturing cost of the product.

Referring to the method of manufacturing a printed circuit board with electronic devices according to the present embodiment, as shown in FIG. 6, a part of the electronic device 16 is press-fitted into one surface of the first insulating layer 12 (S100). . Unlike the conventional technique of drilling a cavity in a circuit board and blocking the adhesive sheet on one side of the cavity and fixing the electronic device to the adhesive sheet through the cavity, a part of the electronic device 16 is press-fitted into the first insulating layer 12. In the subsequent process, the second insulating layer 20 is laminated and pressed again to press the remaining portion of the electronic device 16 into the second insulating layer 20 to press the electronic device 16 to the first insulating layer 12. And by mounting on the opposing surface of the 2nd insulating layer 20, the process of perforating a cavity and the process of using an adhesive sheet can be skipped, and a manufacturing process can be shortened. In addition, it is possible to prevent breakage of the electronic device, which may occur when the adhesive sheet is removed, and to prevent adhesion failure between the insulating layer and the electronic device due to residual adhesive components of the adhesive sheet.

In the method of pressing the electronic device 16 on one surface of the first insulating layer 12, first, the first insulating layer 12 is heated to a softening temperature or higher to make the first insulating layer 12 softened. The electronic device 16 is placed on the first insulating layer 12 in a softened state and pressed to press a part of the electronic device 16. When the electronic device 16 is pressed into the first insulating layer 12, the electronic device 16 is fixed to the first insulating layer 12 through the cooling process of the first insulating layer 12.

Alternatively, the electronic device 16 may be seated on the first insulating layer 12, and the first device may contact the electronic device 16 by applying heat to the electronic device 16 above the softening temperature of the first insulating layer 12. It is also possible to transfer heat to the insulating layer 12 to make the first insulating layer 12 soft and press-fit the electronic device 16.

In order for a part of the electronic device 16 to be press-fitted, the thickness of the first insulating layer 12 is smaller than the thickness of the electronic device 16.

When the connection terminal 18 is provided on one surface of the electronic device 16, a method of press-fitting the electronic device 16 to the first insulating layer 12 may be performed by the electronic device 16 as illustrated in FIG. 6. A face up method in which the other surface faces one surface of the first insulating layer 12 so that the connection terminal 18 faces upward, and conversely, the electronic device 16 having the connection terminal 18 is provided. There is a face down method in which one side faces the one surface of the first insulating layer 12 so that the connection terminal 18 faces downward. In this embodiment, a method of press-fitting the electronic device 16 to the first insulating layer 12 by a face up method is provided.

On the other hand, as shown in Figure 6, it is also possible to use the first insulating layer 12 having the conductor layer 14 formed on the other surface. The strength is increased due to the conductor layer 14 to prevent deformation of the first insulating layer 12 to prevent breakage in the manufacturing process. In addition, the conductor layer 14 may be selectively etched to form the circuit pattern 26.

The electronic device 16 is a concept including an active device such as a semiconductor chip and a passive device such as a capacitor, an inductance, and a resistor. The printed circuit board of the present embodiment may include a passive device or an active device.

Next, as shown in FIG. 7, the second insulating layer 20 is laminated on the first insulating layer 12 such that the remaining part of the electronic device 16 is pressed into one surface of the second insulating layer 20. Pressurize (S200). In order to embed the electronic device 16 in the insulating layer, the second insulating layer 20 is laminated and pressed on one surface of the first insulating layer 12 into which a part of the electronic device 16 is press-fitted, thereby The remaining part is pressed into the second insulating layer 20.

In the method of pressing the remaining part of the electronic device 16 into one surface of the second insulating layer 20, first, one surface of the second insulating layer 20 and one surface of the first insulating layer 12 face each other. After laminating the second insulating layer 20 on the insulating layer 12 and heating the second insulating layer 20 to a softening temperature or more, the first insulating layer 12 and the second insulating layer ( 20 is pressed against each other so that the remaining part of the electronic device 16 is pressed into the second insulating layer 20. When the second insulating layer 20 is cooled, the electronic device 16 is embedded in the opposite surface of the first insulating layer 12 and the second insulating layer 20.

In another method, the second insulating layer 20 may be heated to a softening temperature or more to be softened, and then laminated on the first insulating layer 12 and pressed.

On the other hand, thermosetting resins have a higher softening temperature than thermoplastic resins. Therefore, when the first insulating layer 12 is made of a thermosetting resin, when the electronic device 16 is pressed into and fixed to the first insulating layer 12, the second insulation is made of a thermoplastic resin heated to a softening temperature. Even if the layers 20 are stacked, the first insulating layer 12 is not softened and the electronic device 16 is stably fixed to the first insulating layer 12 during the stacking process of the second insulating layer 20. However, if there is no problem in the manufacturing process, it is also possible to use the first insulating layer 12 and the second insulating layer 20 with the same material.

In addition, it is also possible to use the 2nd insulating layer 20 in which the conductor layer was formed in the other surface. Due to the conductor layer, strength may be increased to prevent breakage of the second insulating layer 20 in the manufacturing process. It is also possible to selectively etch such conductor layers to form circuit patterns.

Next, as shown in FIG. 8, the blind via hole 22 is drilled in the first insulating layer 12 or the second insulating layer 20 to expose the connection terminal 18 of the electronic device 16 ( S300). A blind via hole 22 is formed in the first insulating layer 12 or the second insulating layer 20 so that the connection terminal 18 of the electronic device 16 is exposed for electrical connection between the electronic device 16 and the printed circuit board. Form.

As described above, a method of pressing the electronic device 16 into the first insulating layer 12 by pressing the electronic device 16 includes a face up method and a face down method. 1 When press-fitted into the insulating layer 12, a blind via hole 22 is drilled into the second insulating layer 20 stacked on the first insulating layer 12 to connect the electronic terminal 16 to the connection terminal. In the case of exposing the electronic device 16 by pressing the face down method, the blind via hole 22 is drilled through the first insulating layer 12 to expose the connection terminal 18 of the electronic device 16. Let's do it.

In this embodiment, the case where the electronic element 16 is press-fitted by the face up method is shown. Therefore, the blind via hole 22 is drilled in the second insulating layer 20 to expose the connection terminal 18 of the electronic device 16.

Next, as shown in FIG. 9, the blind via hole 22 is plated to form a first blind via hole 22 (S400), and the other surface of the first insulating layer 12 and the second insulating layer 20 are formed. The circuit pattern 26 is formed on the other surface of the substrate (S500). In addition, the first insulating layer 12 and the second insulating layer 20 may be formed for electrical connection between the other surface of the first insulating layer 12 and the circuit pattern 26 formed on the other surface of the second insulating layer 20. Through-holes can be formed.

When the blind via hole 22 and the through hole are formed, a plating process is performed on the other surface of the first insulating layer 12 and the other surface of the second insulating layer 20 to form the first blind via 24 and the through via 23. Form. In addition, a metal conductive material is deposited on the other surface of the first insulating layer 12 and the other surface of the second insulating layer 20, and then selectively etched to form a circuit pattern 26 or the first insulating layer 12. The circuit pattern 26 may be formed by selectively depositing a metallic conductive material corresponding to the circuit pattern 26 to be formed on the other surface of the second surface and the second surface of the second insulating layer 20.

Meanwhile, as described above, when the second insulating layer 20 having the conductor layer 14 formed on the other surface is used, the blind via hole 22 is formed by drilling the conductor layer 14 and the second insulating layer 20. And the first blind via 24 may be formed by plating. On the other hand, when the conductor layer 14 is formed on the other surface of the first insulating layer 12 and the other surface of the second insulating layer 20, the conductive layer 14 is selectively etched to form the first insulating layer 12. The circuit pattern 26 may be formed on the other surface of the second surface and the other surface of the second insulating layer 20.

In this embodiment, as shown in FIG. 6, an insulating material having a conductor layer 14 formed on the other surface of the first insulating layer 12 is used to increase the strength. The conductor is formed on the other surface of the first insulating layer 12. The circuit pattern 26 is formed by selectively etching the layer 14, and a circuit pattern 26 is formed by selectively plating a metallic conductive material on the other surface of the second insulating layer 20. .

Next, as shown in FIG. 10, the build-up layer 25 is laminated on the second insulating layer 20, and the build-up layer 25 is drilled to be electrically connected to the first blind via 24. A second blind via 27 is formed (S600). The number of stacking of the buildup layer 25 and the processing of the second blind via 27 may vary depending on the design of the printed circuit board.

10 illustrates an example in which one buildup layer 25 is stacked. The buildup layer 25 may be made of an insulating material, and may be formed by applying a liquid PI and curing or stacking a PI film.

When the build-up layer 25 is stacked, the blind via holes 22 are processed to form second blind vias 27 electrically connected to the first blind vias 24. The process of forming the second blind via 27 is the same as the process of forming the first blind via 24 described above. That is, the blind blind hole 22 is drilled by drilling the build-up layer 25 so that a part of the first blind via 24 is exposed, and the inner surface of the blind via hole 22 is plated, thereby forming the first blind via 24 and the first blind via 24. The two blind vias 27 are electrically connected.

In the case of stacking the plurality of buildup layers 25, the above buildup process is repeated. As described above, the build-up process proceeds a plurality of times as necessary according to the design of the printed circuit board embedded with the electronic device. Accordingly, a plurality of build-up layers 25 are stacked and second blinds are formed on each build-up layer 25. The vias 27 are processed to implement electrical connection passages.

11 to 15 are flowcharts illustrating a method of manufacturing a printed circuit board having an electronic device according to a second embodiment of the present invention. 11 to 15, the first insulating layer 12, the electronic device 16, the connection terminal 18, the second insulating layer 20, the blind via hole 22, the circuit pattern 26, and heat dissipation. Layer 28, third blind via 30, fourth blind via 32, bump pad 33, conductive bump 34 are shown.

The present embodiment relates to a method of manufacturing a bumpless package as a printed circuit board in which an electronic device 16 such as a semiconductor chip is embedded. In the following description of the present embodiment, detailed descriptions of matters overlapping with those of the first embodiment will be omitted.

Referring to the method of manufacturing the printed circuit board with electronic devices according to the present embodiment, as shown in FIG. 11, a part of the electronic device 16 is pressed into one surface of the first insulating layer 12. The heat dissipation layer 28 is stacked on the other surface of the first insulating layer 12, and the connection terminal 18 is provided on one surface of the electronic device 16. In this step, the electronic device 16 is press-fitted in a face-up manner in which the connection terminal 18 of the electronic device 16 faces upward. In this case, the other surface of the electronic device 16 on which the connection terminal 18 is not formed is pressed into contact with the heat dissipation layer 28. As such, the electronic device 16 is in contact with the heat dissipation layer 28 so that heat generated from the electronic device 16 in use can be radiated to the outside through the heat dissipation layer 28.

Next, as shown in FIG. 12, the second insulating layer 20 is laminated on the first insulating layer 12 such that the remaining part of the electronic device 16 is pressed into one surface of the second insulating layer 20. And pressurized. As a result, the electronic device 16 is embedded between the first insulating layer 12 and the second insulating layer 20.

Next, as shown in FIG. 13, a blind via hole 22 is formed by drilling the second insulating layer 20 so that the connection terminal 18 of the electronic device 16 is exposed. Unlike the first embodiment described above, the heat dissipation layer 28 is formed on the other surface of the first insulating layer 12 so that the second insulating layer 20 is exposed to expose the connection terminal 18 of the electronic device 16. Perforate.

Next, as shown in FIG. 14, the blind via hole 22 is plated to form a third blind via 30. The third blind via 30 implements electrical connection between the electronic device 16 and the printed circuit board.

Next, as shown in FIG. 15, the build-up layer 25 is stacked on the second insulating layer 20, and the build-up layer 25 is drilled to be electrically connected to the third blind via 30. Fourth blind via 32 is formed. As described above, the number of stacking of the buildup layer 25 and the processing of the fourth blind via 32 may vary according to the design of the printed circuit board. 15 illustrates an example in which one buildup layer 25 is stacked. The build-up process proceeds a plurality of times as necessary according to the design of the printed circuit board embedded with the electronic device. Accordingly, a plurality of build-up layers 25 are stacked and fourth blind vias 32 are formed in each build-up layer 25. Process the to implement the electrical connection passage.

Next, as shown in FIG. 15, a conductive bump 34 is formed on the surface of the buildup layer 25 that is electrically connected to the fourth blind via 32. The conductive bumps 34 are for electrical connection between the electronic circuit board and the external device, and the conductive bumps 34 such as solder balls may be connected to the bump pads 33 electrically connected to the fourth blind vias 32. It can be formed by adhering.

16 is a cross-sectional view illustrating a printed circuit board having an electronic device according to a third embodiment of the present invention. Referring to FIG. 16, the first insulating layer 12, the electronic device 16, the connection terminal 18, the second insulating layer 20, the circuit pattern 26, the heat radiation layer 28, and the first blind via 24, second blind via 27, and conductive bump 34 are shown.

The present embodiment is a printed circuit board in which the electronic device 16 is embedded, and includes a first insulating layer 12, an electronic device 16 through which a part of the first insulating layer 12 is pressed, and an electronic device ( The remaining part of 16 is press-fitted, and the second insulating layer 20 laminated on the first insulating layer 12 and the conductor layer laminated on the other surface of the first insulating layer 12 are constituted by an electronic device ( 16 is embedded between the two insulating layers to recycle the expensive electronic device 16. In addition, since the electronic device 16 is bonded to the conductor layer, it is possible to effectively dissipate heat emitted from the electronic device 16 in use.

Thermosetting resins have a higher softening temperature than thermoplastic resins. Therefore, when the first insulating layer 12 is made of a thermosetting resin, the second insulating layer 20 made of a thermoplastic resin heated to a softening temperature when the electronic device 16 is pressed into and fixed to the first insulating layer 12. Even if the stack is stacked, the first insulating layer 12 is not softened and the electronic device 16 is stably fixed to the first insulating layer 12. Therefore, there is no movement of the electronic device 16 in the manufacturing process, it is possible to manufacture a printed circuit board with electronic devices more precisely.

However, if there is no problem in the manufacturing process, it is also possible to use the first insulating layer 12 and the second insulating layer 20 with the same material.

The electronic device 16 is a concept including an active device such as a semiconductor chip and a passive device such as a capacitor, an inductance, and a resistor. The printed circuit board of the present embodiment may include a passive device and an active device.

This embodiment proposes a bumpless package as a printed circuit board in which an electronic device 16 such as a semiconductor chip is embedded.

The conductor layer is made of a metallic conductive material, and serves as a support to prevent deformation by increasing the strength of the first insulating layer 12 in the manufacturing process. Meanwhile, the circuit layer 26 may be formed by selectively etching the conductor layer.

On the other hand, the heat radiation layer 28 can be used as a conductor layer. When the connection terminal 18 is provided on one surface of the electronic device 16, the other surface of the electronic device 16 on which the connection terminal 18 is not formed is in contact with the heat dissipation layer 28. The heat generated can be effectively radiated.

The blind via hole 22 may be formed by drilling the second insulating layer 20, and the first blind via 24 may be formed by plating the blind via hole 22. The first blind via 24 implements an electrical connection between the electronic device 16 and the printed circuit board.

The buildup layer 25 may be stacked on the second insulating layer 20, and the second blind via 27 electrically connected to the first blind via 24 may be formed through the buildup layer 25. have. According to the design of the printed circuit board, the build-up layer 25 may be stacked in plural, and the second blind vias 27 may be formed in plural to be processed in the plurality of build-up layers 25 and electrically connected to each other. Can be. The number of stacking of the buildup layer 25 and the processing of the second blind beam 27 may vary according to the design of the printed circuit board. 16 illustrates an example in which one buildup layer 25 is stacked. The buildup layer 25 may be made of an insulating material, and may be formed by applying a liquid PI and curing or stacking a PI film.

Conductive bumps 34 are formed on the surface of buildup layer 25 and are electrically connected to second blind vias 27. The conductive bumps 34 are for electrical connection between the electronic circuit board and the external device, and the conductive bumps 34 such as solder balls may be connected to the bump pads 33 electrically connected to the second blind vias 27. It can be formed by adhering.

Although the above has been described with reference to a preferred embodiment of the present invention, those skilled in the art to which the present invention pertains without departing from the spirit and scope of the present invention as set forth in the claims below It will be appreciated that modifications and variations can be made.

1 to 4 are flowcharts illustrating a method of manufacturing a printed circuit board having an electronic device according to the prior art.

5 is a flowchart illustrating a method of manufacturing a printed circuit board having an electronic device according to a first embodiment of the present invention.

6 to 10 are flowcharts illustrating a method for manufacturing a printed circuit board having an electronic device according to a first embodiment of the present invention.

11 to 15 are flowcharts illustrating a method of manufacturing a printed circuit board having electronic devices according to a second embodiment of the present invention.

16 is a cross-sectional view illustrating a printed circuit board having an electronic device according to a third embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

12, 20: insulation layer

16: electronic device

18: connection terminal

24, 27, 30, 32: blind via

26: circuit pattern

28: heat dissipation layer

34: conductive bump

Claims (21)

Injecting a portion of an electronic device into one surface of the first insulating layer; And And stacking and pressing the second insulating layer on the first insulating layer to press-fit the remaining part of the electronic device to one surface of the second insulating layer. The method of claim 1, The indentation step, Heating the first insulating layer to a softening temperature or higher; Pressing the electronic device on the first insulating layer; And And cooling the first insulating layer. The method of claim 1, The pressing step, Heating the second insulating layer to a softening temperature or higher; And And cooling the second insulating layer. The method of claim 1, The first insulating layer is made of a thermosetting resin, the second insulating layer is a manufacturing method of a printed circuit board with an electronic device, characterized in that comprises a thermoplastic resin. The method of claim 1, A conductor layer is formed on the other surface of the first insulating layer, And selectively etching the conductor layer to form a circuit pattern. The method of claim 1, The electronic device is provided with a connection terminal Drilling a blind via hole in the first insulating layer or the second insulating layer to expose the connection terminal; And And plating the blind via hole to form a first blind via. The method of claim 6, Stacking a buildup layer on the first insulating layer or the second insulating layer on which the first blind via is formed, and forming the second blind via electrically connected to the first blind via by drilling the buildup layer. Electronic device embedded printed circuit board manufacturing method further comprising the step of. The method of claim 7, wherein The build-up layer is stacked in plurality, the second blind via is a printed circuit board manufacturing method, characterized in that formed in the plurality of the build-up layer, respectively. The method of claim 1, A conductor layer is formed on the other surface of the first insulating layer and the other surface of the second insulating layer, respectively. Forming through vias electrically connecting the pair of conductor layers; And And selectively etching the conductor layer to form a circuit pattern. The method of claim 1, A connection terminal is provided on one surface of the electronic device, and a heat dissipation layer is stacked on the other surface of the first insulating layer. The indentation step, And the other surface of the electronic device is pressed in contact with the heat dissipation layer. The method of claim 10, Forming a blind via hole by drilling the second insulating layer to expose the connection terminal; And The method of claim 1, further comprising forming a third blind via by plating the blind via hole. The method of claim 11, Stacking a build-up layer on the second insulating layer and perforating the build-up layer to form a fourth blind via electrically connected to the third blind via. . The method of claim 12, The build-up layer is stacked in plurality, wherein the fourth blind via is a printed circuit board manufacturing method, characterized in that formed on the plurality of build-up layers, respectively. The method of claim 12, After forming the fourth blind via, And forming a conductive bump electrically connected to the fourth blind via on the surface of the build-up layer. A first insulating layer; An electronic device, a part of which is pressed into one surface of the first insulating layer; A second insulating layer in which the remaining part of the electronic device is press-fitted and stacked on the first insulating layer; And Printed circuit board with an electronic device comprising a conductor layer laminated on the other surface of the first insulating layer. The method of claim 15, And a circuit pattern formed by selectively etching the conductor layer. The method of claim 15, One side of the electronic device is provided with a connection terminal, the conductor layer is a heat radiation layer Printed circuit board, characterized in that the other surface of the electronic device is in contact with the heat dissipation layer. The method of claim 17, And a first blind via electrically connected to the connection terminal through the second insulating layer. The method of claim 18, A buildup layer stacked on the second insulating layer; And And a second blind via penetrating the build-up layer and electrically connected to the first blind via. The method of claim 19, The build-up layer is stacked in plurality, the second blind via is a plurality of build-up printed circuit board, characterized in that the plurality of build-up layers are respectively processed to be electrically connected to each other. The method of claim 19, And a conductive bump formed on a surface of the build-up layer and electrically connected to the second blind via.

Images