JP2004146634A - Resin board fabricating process and resin multilayer board fabricating process - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin board capable of reducing connection resistance between an interconnection pattern and a via conductor, and to provide a resin multilayer board fabricating process. <P>SOLUTION: A resin sheet 201, and a supporting body 202 formed with the interconnection patterns 203 including a laser passing hole 204 on one main surface of the resin sheet, are prepared. Then the one main surface of the resin sheet 201 and that formed with the interconnection patterns 203 of the supporting body 202 are mated to attach the resin sheet 201 to the supporting body 202 by pressure. A through hole 208 for penetrating the resin sheet 201 by using laser via the laser passing hole 204 is formed to fill the through hole 208 with an electrical conductor 208. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing a resin substrate having wiring on both main surfaces or inside, and a method for manufacturing a resin multilayer substrate.
[0002]
[Prior art]
In recent years, with the miniaturization of electronic devices, a multilayer wiring board on which semiconductor elements such as LSIs can be mounted at a high density has been demanded. For this reason, in a multilayer wiring board, it is an important subject to form wiring at a high density with a fine wiring pitch.
[0003]
On the other hand, among multilayer wiring boards, resin multilayer boards have been receiving attention because of their light weight and low dielectric constant. As a method of realizing high-density wiring in this resin multilayer substrate, a method of transferring a wiring pattern formed on a support such as a metal plate onto a resin sheet is known.
[0004]
FIG. 19 is a cross-sectional view showing a step of transferring a wiring pattern in a conventional method for manufacturing a resin substrate. Conventionally, a wiring pattern has been transferred as follows. First, as shown in FIG. 19A, a resin sheet 501 previously filled with a conductor 509 as a via conductor and a support 502 on which a wiring pattern 503 is formed are prepared. Next, as shown in FIG. 19B, the support 502 is pressed on the main surface of the resin sheet 501. Next, as shown in FIG. 19C, the support 502 is removed from the resin sheet 501, and the wiring pattern 503 is transferred onto the main surface of the resin sheet 501. (For example, refer to Patent Document 1.)
[0005]
[Patent Document 1]
JP-A-10-84186 (paragraph number 0026, FIG. 1)
[0006]
[Problems to be solved by the invention]
However, in the transfer method described above, when the resin sheet 501 and the support 502 are pressed, the resin component of the resin sheet 501 may flow between the wiring pattern 503 and the conductor 509, Since the 509 may be deformed, there is a problem that the connection resistance between the wiring pattern 503 and the conductor 509 increases.
[0007]
An object of the present invention is to solve the above problems and to provide a method of manufacturing a resin substrate and a method of manufacturing a resin multilayer substrate, which can reduce the connection resistance between a wiring pattern and a via conductor.
[0008]
[Means for Solving the Problems]
A first method for manufacturing a resin substrate according to the present invention includes a step of preparing a resin sheet in a prepreg state and a support for transferring a wiring pattern, and forming a wiring pattern on one main surface of the support. Forming a laser passage hole penetrating through the wiring pattern, and one main surface of the resin sheet, and one main surface of the support on which the wiring pattern is formed, the resin sheet and Press-bonding the support, removing the support from the resin sheet, forming a through-hole through the resin sheet by laser through the laser-passing hole, And filling a conductor with a conductive material.
[0009]
A second method for manufacturing a resin substrate according to the present invention includes a step of preparing a resin sheet in a prepreg state and a support for transferring a wiring pattern, and forming a wiring pattern on one main surface of the support. Forming a laser passage hole penetrating through the wiring pattern, and one main surface of the resin sheet, and one main surface of the support on which the wiring pattern is formed, the resin sheet and A step of crimping the support, a step of forming a through-hole through the resin sheet and the support by a laser through the laser passage hole, and a step of filling the through-hole with a conductor. Removing the support from the resin sheet.
[0010]
In the first and second methods for manufacturing a resin substrate, it is preferable that the laser passage hole is formed so as to penetrate the support and the wiring pattern in a thickness direction.
[0011]
Preferably, the method of manufacturing the first and second resin substrates further includes a step of pressing the resin sheet in a thickness direction after the step of filling the through hole with a conductor.
[0012]
Further, the first method for manufacturing a resin substrate includes a step of pressing the resin sheet in a thickness direction after the step of filling the through hole with a conductor, and removing the support from the resin sheet. Preferably, a step of heat-treating the resin sheet is provided between the step and the step of pressing the resin sheet in the thickness direction.
[0013]
In the first and second methods for manufacturing a resin substrate, a circuit component is mounted on one main surface of the support so as to be electrically connected to the wiring pattern. In the step of pressure-bonding the support and the support, it is preferable that the circuit component is embedded in a resin sheet.
[0014]
The method for manufacturing a resin multilayer board according to the present invention includes the steps of manufacturing a plurality of resin boards by the first and second methods for manufacturing a resin board, and an adhesive layer formed of a resin sheet having a conductor embedded therein. And preparing the main surface of the resin substrate and the main surface of the adhesive layer so that the main surface of the resin substrate is aligned with the main surface of the adhesive layer, and the adhesive layer is disposed between the two resin substrates. Pressure-bonding the adhesive layer and the adhesive layer.
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
(Embodiment 1)
Hereinafter, an embodiment of a first method for manufacturing a resin substrate according to the present invention will be described. 1 to 7 are process cross-sectional views in the present embodiment.
[0016]
First, as shown in FIG. 1, a resin sheet 101 in a prepreg state and a support 102 for transferring a wiring pattern are prepared. On one main surface of the support 102, a wiring pattern 103 is formed. In the wiring pattern 103, a laser passage hole 104 penetrating the wiring pattern 103 in the thickness direction is formed.
[0017]
The resin sheet 101 is made of a mixture of an inorganic filler and a thermosetting resin. As the inorganic filler, for example, Al ₂ O ₃ , SiO ₂ , TiO ₂ Etc. can be used. By using these inorganic fillers, the heat dissipation of the resin substrate can be improved, and the fluidity of the resin substrate can be adjusted. In addition, as the thermosetting resin, for example, an epoxy resin, a phenol resin, a cyanate resin, or the like can be used. Among them, epoxy resins are preferable because of their excellent heat resistance and moisture resistance.
[0018]
The prepreg state means a state where the thermosetting resin is not cured, that is, a state where the resin sheet 101 has a certain fluidity. The resin sheet 101 finally forms a part of a resin substrate or a resin multilayer substrate in a cured state. However, in the process of manufacturing the resin substrate or the resin multilayer substrate, in which step the resin sheet 101 is cured is arbitrarily determined according to the purpose. Therefore, in the specification of the present application, the “resin sheet” means a prepreg state in an initial preparation stage, but does not necessarily mean a prepreg state in subsequent steps.
[0019]
Since the support 102 is used to transfer the wiring pattern 103 onto one main surface of the resin sheet 101, it is preferable that the support 102 has a certain degree of releasability. As the support 102, for example, a PET (polyethylene terephthalate) film, a PEN (polyethylene naphthalate) film, a PPS (polyphenylene sulfide) film, a PEEK (polyether ether ketone) film, a PI (polyimide) film, or the like is used. it can.
[0020]
The wiring pattern 103 is made of a metal such as Cu, Ag, Au, Ag-Pt, and Ag-Pd. The wiring pattern 103 is formed, for example, as follows.
[0021]
First, as shown in FIG. 2A, a metal foil 103a for a wiring pattern 103 is bonded to a support 102 having an adhesive (not shown) applied on one main surface.
[0022]
Next, as shown in FIG. 2B, a photoresist material made of a novolak resin or the like is spin-coated on the metal foil 103a adhered to the support 102 to form a photoresist layer 105.
[0023]
Next, after pre-baking the photoresist layer 105, as shown in FIG. 2C, a photomask 106 having a predetermined shape is brought into contact with the photoresist layer 105 and exposed.
[0024]
Next, after developing using a developing solution such as a boric acid aqueous solution, post-baking is performed, and the photoresist layer 105 is patterned as shown in FIG. 2D.
[0025]
Next, as shown in FIG. 2E, a portion of the metal foil 103a that is not covered with the photoresist layer 105 is etched with an etchant such as an aqueous ferric chloride solution to form a wiring pattern 103.
[0026]
Next, as shown in FIG. 2F, the photoresist layer 105 remaining on the wiring pattern 103 is removed with a resist stripper such as an aqueous sodium hydroxide solution. Thus, the wiring pattern 103 is formed on the support 102 by photolithography and etching.
[0027]
In the above-described method for forming the laser passage hole 104, when the laser passage hole 104 is minute, etching may be difficult. In such a case, the laser passage hole may be formed as follows. First, as shown in FIG. 3A, a support 102 having a wiring pattern 103 formed on one main surface is prepared. Next, as shown in FIG. 3B, a through hole penetrating the support 102 and the wiring pattern 103 is formed by a mechanical puncher, thereby forming a laser passage hole 104a in the wiring pattern 103.
[0028]
Next, as shown in FIG. 4A, one main surface of the resin sheet 101 and one main surface of the support 102 on which the wiring pattern 103 is formed are aligned with each other so that the resin sheet 101 and the support And 102. In this embodiment, the support 102 is press-bonded to both main surfaces of the resin sheet 101.
[0029]
When pressure bonding the resin sheet 101 and the support 102, thermocompression bonding is basically performed. For example, using a heating press or the like, the resin sheet 101 and the support 102 are heated and pressed at a predetermined temperature and pressure for a certain period of time. By this heating, the thermosetting resin contained in the resin sheet 101 is cured.
[0030]
When performing thermocompression bonding, it is necessary to consider temperature restrictions. For example, when applying an adhesive on one main surface of the support 102, if the adhesive is denatured by the temperature of thermocompression bonding, when the support 102 is removed from the resin sheet 101 in a later step, the wiring pattern 103 The adhesive may remain on the top. Therefore, it is important to set appropriate heating conditions in accordance with the type of the thermosetting resin or the adhesive contained in the resin sheet 101.
[0031]
Next, the support 102 is removed from the resin sheet 101 as shown in FIG. As a result, the wiring pattern 103 is transferred onto both main surfaces of the resin sheet 103.
[0032]
Next, as shown in FIG. 5A, a mask member 107 is arranged on one main surface of the resin sheet 101. Next, as shown in FIG. 5B, through-holes 108 penetrating the resin sheet 101 and the mask member 107 are formed by laser through the laser passage holes 104. At this time, since the laser passes through the laser passage hole 104, it is possible to prevent the laser from being reflected on the wiring pattern 103.
[0033]
The mask member 107 prevents the conductor from adhering to the main surface of the resin sheet 101 when the through hole 108 is filled with the conductor in a later step. As the mask member 107, for example, a PET (polyethylene terephthalate) film, a PEN (polyethylene naphthalate) film, or the like can be used.
[0034]
The through hole 108 is formed by a laser using a laser puncher. By using a laser in this manner, a plurality of through holes 108 can be formed in a short time, so that mass productivity of the resin substrate is improved. As a laser, CO 2 ₂ A laser, a YAG laser, an excimer laser, etc. can be used. ₂ Preferably, a laser is used. Also, CO ₂ Since the laser is particularly easily reflected on the wiring pattern 103 made of metal, ₂ When a laser is used, the effects of the present invention are remarkably exhibited.
[0035]
Next, as shown in FIG. 6A, the conductor 109 is filled in the through hole 108 via the mask member 107. The conductor 109 functions as a via conductor that three-dimensionally connects a wiring formed on or inside the resin substrate. As the conductor 109, for example, a conductive paste in which metal particles and a thermosetting resin are mixed can be used. Au, Ag, Cu, Ni or the like can be used as the metal particles. As the thermosetting resin, an epoxy resin, a phenol resin, a cyanate resin, or the like can be used. The conductor 109 is not limited to the conductive paste, and may be a metal such as a solder ball or a gold ball.
[0036]
As a method of filling the through hole 108 with the conductor 109, for example, there is a method of pouring a conductive paste into the surface of the mask member 107 and sliding a squeegee on the surface of the mask member 107. Note that it is also possible to directly fill the through hole 108 with the conductor 109 without using the mask member 107. In the present embodiment, the through-hole 108 is formed after the mask member 107 is arranged. However, after the through-hole 108 is formed in the resin sheet 101, a hole is formed at a position corresponding to the through-hole 108. The mask member 107 may be provided.
[0037]
Next, the mask member 107 is removed from the resin sheet 101, and the conductor 109 is dried at a predetermined temperature for a predetermined time.
[0038]
As a result, as shown in FIG. 6B, the resin sheet 101 includes a resin sheet 101 cured to an arbitrary degree and a conductor 109 having a columnar projecting portion 109 a on one main surface of the resin sheet 101. The resin substrate 110 is obtained.
[0039]
After that, it is preferable to press the resin sheet 101 in the thickness direction. As a result, as shown in FIG. 7, the protruding portion of the conductor 109 is pushed out to form a nail-shaped head 109b. Further, at this time, in order to protect the wiring pattern 103 and the conductor 109, it is preferable that a protective member (not shown) is disposed on both main surfaces of the resin sheet 101 and then pressure is applied. As means for pressing the resin sheet 101, for example, a vacuum press can be used. As the protective member, for example, a PET (polyethylene terephthalate) film, a PEN (polyethylene naphthalate) film, or the like can be used.
[0040]
By forming the nail-shaped head 109b at one end of the conductor 109 in this manner, the main surface of the wiring pattern 103 and the lower main surface of the nail-shaped head 109b formed at one end of the conductor 109 are formed. , Are electrically connected by surface contact. Therefore, the connection area between the wiring pattern 103 and the conductor 109 increases, and the connection resistance between the wiring pattern 103 and the conductor 109 decreases. Further, since the surface of the resin substrate 110 is flattened, the resin substrate 110 can be easily multilayered.
[0041]
In the step of pressing the resin sheet 101 in the thickness direction, it is preferable that the resin sheet 101 has a certain degree of hardness, and it is particularly preferable that the resin sheet 101 is completely cured. When the resin sheet 101 is fluid, the resin sheet 101 is deformed by pressurization, the conductor 109 is enlarged in the lateral direction, and the volume resistance of the conductor 109 may increase. Therefore, if the resin sheet 101 is heat-treated and cured to some extent before this pressing step, an increase in the volume resistance of the conductor 109 can be suppressed.
[0042]
The timing of heat-treating the resin sheet 101 may be any time before the step of pressing the resin sheet 101 in the thickness direction. As described above, as shown in FIG. 3A, performing the thermocompression bonding when pressing the resin sheet 101 and the support 102 together is also included in the heat treatment.
[0043]
Further, as described above, when thermocompression bonding the resin sheet 101 and the support 102, it is necessary to sufficiently consider the heating conditions. However, when selecting the resin sheet 101 and the adhesive applied on the support 102, the resin sheet 101 may not be sufficiently cured at a temperature at which the adhesive is not denatured. In such a case, it is preferable to heat-treat the resin sheet 101 after removing the support 102 as shown in FIG. In addition, since some of the mask members 107 are weak to heat and easily denatured, it is particularly preferable to perform heat treatment on the resin sheet 101 alone.
[0044]
The resin substrate 110 manufactured as described above can be used as it is as a substrate for mounting circuit components. In this case, a completely cured resin sheet is used. As will be described later, the resin substrate 110 may be used as one resin layer, and the resin substrate may be formed into a multilayer to manufacture a resin multilayer substrate. In this case, the resin sheet 101 may be a completely cured one or a partially cured one.
[0045]
As described above, according to the first method for manufacturing a resin substrate according to the present invention, after the wiring pattern 103 is transferred to the resin sheet 101, the through hole 108 is formed in the resin sheet 101, and the conductor is formed in the through hole 108. 109 is filled to form a via conductor. Therefore, the resin component of the resin sheet 101 does not flow between the wiring pattern 103 and the conductor 109, and the connection resistance between the wiring pattern and the via conductor can be reduced.
[0046]
(Embodiment 2)
Next, an embodiment of a second method for manufacturing a resin substrate according to the present invention will be described. FIG. 8 is a process sectional view in the present embodiment.
[0047]
First, as shown in FIG. 8A, a resin sheet 201 in a prepreg state and a support 202 for transferring a pneumonia pattern are prepared. A wiring pattern 203 is formed on one main surface of the support 202. In the wiring pattern 203, a laser through hole 204 penetrating the wiring pattern 203 in the thickness direction is formed.
[0048]
Next, as shown in FIG. 8B, the support 202 is pressed on both main surfaces of the resin sheet 201. Next, as shown in FIG. 8C, a through hole 208 penetrating the resin sheet 201 and the support 202 is formed. Next, as shown in FIG. 8D, the conductor 209 is filled in the through hole 208 via the support 202. In the present embodiment, the support 202 functions as a mask member.
[0049]
Next, the support 202 is removed from the resin sheet 201, and the wiring pattern 203 is transferred onto both main surfaces of the resin sheet 201. Next, the conductor 209 is dried at a predetermined temperature for a predetermined time.
[0050]
As a result, as shown in FIG. 8E, the resin sheet 201 includes the resin sheet 201 cured to an arbitrary degree, and the conductor 209 having the column-shaped protrusions 209 a on both main surfaces of the resin sheet 201. The resin substrate 210 is obtained.
[0051]
After that, it is preferable to press the resin sheet 201 in the thickness direction. As a result, as shown in FIG. 8F, the protruding portion of the conductor 208 is pushed out, and a nail-shaped head 208b is formed. Further, similarly to the first embodiment, it is preferable to include a step of heat-treating the resin sheet 201 before the step of pressing the resin sheet 201 in the thickness direction.
[0052]
The other steps and components are the same as those of the first embodiment, and the description will not be repeated.
[0053]
As described above, according to the second method for manufacturing a resin substrate of the present invention, after the wiring pattern 203 is transferred to the resin sheet 201, the through hole 208 is formed in the resin sheet 201, and the conductor is formed in the through hole 208. 209 is filled to form a via conductor. Therefore, the resin component of the resin sheet 201 does not flow between the wiring pattern 203 and the conductor 209, and the connection resistance between the wiring pattern and the via conductor can be reduced.
[0054]
Further, in the second method for manufacturing a resin substrate according to the present invention, since the conductor 209 is filled in the through hole 208 via the support 202, a mask member is not required as compared with the first method for manufacturing a resin substrate. There is an advantage that it becomes.
[0055]
(Embodiment 3)
Next, a modified example of the second method for manufacturing a resin substrate according to the present invention will be described. FIG. 9 is a process sectional view in this embodiment.
[0056]
The method for manufacturing a resin substrate according to the present embodiment is substantially the same as that of the fourth embodiment. In the fourth embodiment, a laser passage hole 204a penetrating through the support 202 and the wiring pattern 203 is formed in advance. The laser passage hole 204a can be formed, for example, by the method shown in FIG. 3 of the first embodiment.
[0057]
The other steps and components are the same as in the fourth embodiment, and a description thereof will not be repeated.
[0058]
(Embodiment 4)
Next, application examples of the first and second resin substrate manufacturing methods according to the present invention will be described. 10 to 15 are process cross-sectional views in the present embodiment. This embodiment is based on the first embodiment, but can be applied to other embodiments.
[0059]
First, as shown in FIG. 10A, a support 302a having a wiring pattern 303 formed on one main surface is prepared. In the wiring pattern 303, a laser passage hole 304 penetrating the wiring pattern 303 in the thickness direction is formed.
[0060]
Next, as shown in FIG. 10B, a chip-type circuit component 311 is mounted on one main surface of the support 302a so as to be electrically connected to the wiring pattern 303. As the circuit component 311, an active element such as a transistor, an IC, or an LSI, or a passive element such as a chip capacitor, a chip resistor, a chip thermistor, or a chip inductor can be used. Examples of a method for mounting the circuit component 311 include a method using soldering and a conductive adhesive. The terminal electrodes of the circuit component 311 are not shown.
[0061]
Next, as shown in FIG. 11, a resin sheet 301 in a prepreg state, a support 302a on which circuit components 311 are mounted, and a support 302b on which a wiring pattern 303 having a laser passage hole 304 is formed are prepared. I do.
[0062]
Next, as shown in FIG. 12A, the supports 302a and 302b are pressed on both main surfaces of the resin sheet 301. At this time, the circuit component 311 is buried in the resin sheet 301. Next, as shown in FIG. 12B, the supports 302a and 302b are removed from the resin sheet 301, and the wiring pattern 303 is transferred onto both main surfaces of the resin sheet 301.
[0063]
In this embodiment, since the circuit component 311 is embedded in the resin sheet 301, the resin sheet 301 is particularly easily deformed. Therefore, at this point, it is preferable that the resin sheet 301 be heat-treated and completely cured. In addition, as described above, if heat treatment is performed with the support members 302a and 302b remaining, a problem may occur. Therefore, it is preferable to perform heat treatment after removing the support members 302a and 302b. It is particularly preferable to heat-treat the resin prepreg sheet 301 alone.
[0064]
Next, as shown in FIG. 13, after a mask member 307 is arranged on one main surface of the resin sheet 301, a through-hole penetrating the resin sheet 301 and the mask member 307 by a laser through a laser passage hole 304. 308 is formed.
[0065]
Next, as shown in FIG. 14A, the conductor 309 is filled in the through-hole 308 via the mask member 307. Next, the mask member 307 is removed from the resin sheet 301, and the conductor 309 is dried at a predetermined temperature for a predetermined time. As a result, as shown in FIG. 14B, the resin sheet 301 includes a resin sheet 301 cured to an arbitrary degree and a conductor 309 having a columnar projecting portion 309a on one main surface of the resin sheet 301. Resin substrate 310 is obtained.
[0066]
After that, it is preferable to press the resin sheet 301 in the thickness direction. As a result, as shown in FIG. 15, the protruding portion of the conductor 309 is extended to form a nail-shaped head 309b.
[0067]
The other steps and components are the same as those of the first embodiment, and the description will not be repeated.
[0068]
(Embodiment 5)
Next, application examples of the first and second resin substrate manufacturing methods according to the present invention will be described. 16 to 18 are process sectional views in the present embodiment. The present embodiment is based on the fourth embodiment, but can be applied to other embodiments.
[0069]
First, as shown in FIG. 15, a resin sheet 301, a wiring pattern 303 formed on both main surfaces of the resin sheet 301, and a resin sheet 301 penetrating the resin sheet 301 in the thickness direction by the method for manufacturing a resin substrate of the fourth embodiment. A resin substrate 310 including a conductor 309 to be formed and a circuit component 311 embedded in the resin sheet 301 is prepared. Note that nail-like heads 309b are formed at both ends of the conductor 309.
[0070]
Next, as shown in FIG. 16, an adhesive layer 412 made of a resin sheet 401 in which a conductor 409 is embedded is prepared. The adhesive layer 412 is produced, for example, as follows. First, as shown in FIG. 17A, mask members 407 are attached to both main surfaces of the resin sheet 401 in a prepreg state. Next, as shown in FIG. 17B, through holes 408 penetrating the resin sheet 401 and the mask member 407 are formed by laser. Next, as shown in FIG. 17C, the conductor 409 is filled in the through hole 408, and dried at a predetermined temperature for a predetermined time. Next, as shown in FIG. 17D, the mask member 407 is removed from the resin sheet 401 to form an adhesive layer 412.
[0071]
Next, as shown in FIG. 18, a resin multilayer substrate 413 is manufactured by alternately laminating the resin substrates 310 and the adhesive layers 412 and pressing them. In the resin multilayer substrate 413, the conductor 409 embedded in the adhesive layer 412 is electrically connected to the wiring pattern 303 of the resin substrate 310 or the conductor 309.
[0072]
When the resin substrate 310 and the adhesive layer 412 are pressure-bonded, all of the resin substrate 310 and the adhesive layer 412 may be laminated and then pressure-bonded at once, or the resin substrate 310 and the adhesive layer 412 may be sequentially laminated. This may be repeated by crimping.
[0073]
When the resin substrate 310 and the adhesive layer 412 are pressed, thermocompression bonding is basically performed. At this time, as described above, it is preferable that the resin sheet 301 constituting the resin substrate 310 is completely cured. On the other hand, since the adhesive layer 412 plays a role of bonding the resin substrates 310 to each other, the resin sheet 301 constituting the adhesive layer 412 may not be hardened so much and may have a certain fluidity until thermocompression bonding is performed. preferable. When the resin substrate 310 and the adhesive layer 412 are thermocompression bonded, the resin substrate 310 and the adhesive layer 412 are completely thermally cured.
[0074]
The other steps and components are the same as in the fourth embodiment, and a description thereof will not be repeated.
[0075]
【Example】
(Example 1)
Based on the content described in Embodiment 1, a resin substrate was manufactured as follows.
First, a PET film having a thickness of 80 μm was prepared as a support, and an acrylic resin-based pressure-sensitive adhesive having a thickness of 20 μm was applied on one main surface of the PET film to produce a PET film with a pressure-sensitive adhesive having a thickness of 100 μm.
[0076]
Next, on the main surface of the PET film to which the adhesive was applied, a copper foil having a thickness of 18 μm, both surfaces of which were roughened, was bonded. Next, the copper foil was patterned by photolithography and etching to form a predetermined wiring pattern and a laser passage hole having a diameter of 200 μm.
[0077]
Next, a 400-μm-thick sheet-like epoxy prepreg prepared by mixing silica and a liquid epoxy resin was prepared as a resin sheet. Next, the PET film on which the wiring pattern was formed was pressed on both main surfaces of the resin sheet by a vacuum press machine. Pressing conditions were 120 ° C., 1.0 MPa, and 5 minutes.
[0078]
Next, the PET film was removed from the resin sheet. Next, the resin sheet was heat-treated at 170 ° C. for 10 minutes to cure the epoxy prepreg constituting the resin sheet.
[0079]
Next, a PET film having a thickness of 20 μm was attached as a mask member on one main surface of the resin sheet, and CO 2 was passed through a laser passage hole. ₂ Through holes were formed in the resin sheet by laser.
[0080]
Next, a conductor was filled in the through-hole with a squeegee via a PET film to form a via conductor. A conductive paste (AE1244 manufactured by Tatsuta Electric Wire Co., Ltd.) was used as the conductor.
[0081]
Next, the PET film was removed from the resin sheet, the resin sheet was heat-treated at 100 ° C. for 30 minutes, and the conductive paste was dried.
[0082]
Next, a PET film having a thickness of 20 μm was attached as a protective member on both main surfaces of the resin sheet, and the resin sheet was pressed in the thickness direction by a vacuum press. Pressing conditions were 170 ° C., 1.0 MPa, and 5 minutes. Next, a resin substrate was obtained by removing the PET film.
[0083]
(Example 2)
Based on the contents described in the fourth embodiment, a resin substrate with a built-in circuit component was manufactured as follows.
First, in the same manner as in Example 1, an 18 μm-thick copper foil having both surfaces roughened was adhered onto the main surface of a 100 μm-thick PET film with an adhesive, and a predetermined wiring pattern and a 200 μm-diameter A laser passage hole was formed.
[0084]
Next, a conductive adhesive (NH041A-2 manufactured by Nihon Handa Co., Ltd.) is applied to a part of the wiring pattern, and a chip capacitor of dimensions 0.3 mm × 0.3 mm × 0.6 mm is mounted thereon as a circuit component. did.
[0085]
Next, a sheet-like epoxy prepreg having the same thickness as that of Example 1 and having a thickness of 400 μm was prepared as a resin sheet. Next, a PET film on which a wiring pattern was formed and a chip capacitor was mounted was pressed on both main surfaces of the resin sheet by a vacuum press machine. Pressing conditions were 120 ° C., 1.0 MPa, and 5 minutes.
[0086]
Next, the PET film was removed from the resin sheet. Next, the resin sheet was heat-treated at 170 ° C. for 10 minutes to cure the epoxy prepreg constituting the resin sheet.
[0087]
Next, a PET film having a thickness of 20 μm was attached as a mask member on one main surface of the resin sheet, and CO 2 was passed through a laser passage hole. ₂ Through holes were formed in the resin sheet by laser.
[0088]
Next, a conductor was filled in the through-hole with a squeegee via a PET film to form a via conductor. A conductive paste (AE1244 manufactured by Tatsuta Electric Wire Co., Ltd.) was used as the conductor.
[0089]
Next, the PET film was removed from the resin sheet, the resin sheet was heat-treated at 100 ° C. for 30 minutes, and the conductive paste was dried.
[0090]
Next, a PET film having a thickness of 20 μm was attached as a protective member on both main surfaces of the resin sheet, and the resin sheet was pressed in the thickness direction by a vacuum press. Pressing conditions were 170 ° C., 1.0 MPa, and 5 minutes. Next, by removing the PET film, a resin substrate having a built-in chip capacitor was obtained.
[0091]
(Example 3)
Based on the contents described in the fifth embodiment, a resin multilayer substrate was manufactured as follows.
First, as a resin sheet, a sheet-like epoxy prepreg having a thickness of 100 μm and prepared by mixing silica and a liquid epoxy resin was prepared.
[0092]
Next, a PET film having a thickness of 20 μm was attached to both main surfaces of the resin sheet as a mask member. Next, CO ₂ A through hole having a diameter of 300 μm penetrating the resin sheet and the PET film was formed by laser.
[0093]
Next, a conductive paste (AE1244 manufactured by Tatsuta Electric Wire Co., Ltd.) was filled in the through hole, and the resin sheet was heat-treated at 60 ° C. for 30 minutes to dry the conductive paste. Next, the PET film was removed from the resin sheet to form an adhesive layer.
[0094]
Next, a resin substrate was manufactured in the same manner as in Example 2. Next, three resin substrates and two adhesive layers were alternately laminated and pressure-bonded such that the resin substrates were the uppermost layer and the lowermost layer. The pressing conditions were as follows: first, thermocompression bonding was performed at 80 ° C. and 1.0 MPa for 5 minutes, and after the adhesive layer was cured to some extent, thermocompression bonding was performed at 170 ° C. and 2.0 MPa for 60 minutes. Thus, a resin multilayer substrate in which the resin substrate and the adhesive layer were laminated was obtained.
[0095]
【The invention's effect】
According to the method of manufacturing a resin substrate according to the present invention, after the support is pressed onto the resin sheet, a through hole is formed in the resin sheet, the through hole is filled with a conductor, and a via conductor is formed. Therefore, the resin component of the resin sheet does not flow between the wiring pattern and the conductor, and the connection resistance between the wiring pattern and the via conductor can be reduced.
[0096]
At the same time, by forming a laser passage hole penetrating the wiring pattern in advance, it is possible to prevent laser reflection on the wiring pattern. Therefore, a plurality of through holes can be formed in a short time by using a laser, so that mass productivity of the resin substrate is improved.
[0097]
In addition, after filling the through hole with the conductor, the resin sheet is pressed in the thickness direction, so that the protrusion of the conductor can be flattened. Therefore, the electrical contact between the wiring pattern and the via conductor can be improved, and the resin substrate can be easily multilayered. Furthermore, before performing the pressing step, the resin sheet is heat-treated and cured to some extent, thereby preventing deformation of the resin sheet due to pressing and suppressing an increase in volume resistance of the via conductor.
[Brief description of the drawings]
FIG. 1 is a process cross-sectional view illustrating a method for manufacturing a resin substrate in Embodiment 1 of the present invention.
FIG. 2 is a process sectional view illustrating the method for manufacturing the resin substrate according to the first embodiment of the present invention.
FIG. 3 is a process sectional view illustrating the method for manufacturing the resin substrate in the first embodiment of the present invention.
FIG. 4 is a process sectional view illustrating the method for manufacturing the resin substrate in the first embodiment of the present invention.
FIG. 5 is a process sectional view illustrating the method for manufacturing the resin substrate in the first embodiment of the present invention.
FIG. 6 is a process sectional view illustrating the method for manufacturing the resin substrate in the first embodiment of the present invention.
FIG. 7 is a process sectional view illustrating the method for manufacturing the resin substrate in the first embodiment of the present invention.
FIG. 8 is a process sectional view illustrating the method for manufacturing the resin substrate in the second embodiment of the present invention.
FIG. 9 is a process sectional view illustrating the method for manufacturing the resin substrate in Embodiment 3 of the present invention.
FIG. 10 is a process sectional view illustrating the method for manufacturing the resin substrate in Embodiment 4 of the present invention.
FIG. 11 is a process sectional view illustrating the method for manufacturing the resin substrate in Embodiment 4 of the present invention.
FIG. 12 is a process sectional view illustrating the method for manufacturing the resin substrate in Embodiment 4 of the present invention.
FIG. 13 is a process sectional view illustrating the method for manufacturing the resin substrate in Embodiment 4 of the present invention.
FIG. 14 is a process sectional view illustrating the method for manufacturing the resin substrate in Embodiment 4 of the present invention.
FIG. 15 is a process sectional view illustrating the method for manufacturing the resin substrate in Embodiment 4 of the present invention.
FIG. 16 is a process sectional view illustrating the method for manufacturing the resin multilayer substrate in the fifth embodiment of the present invention.
FIG. 17 is a process sectional view illustrating the method for manufacturing the resin multilayer substrate in the fifth embodiment of the present invention.
FIG. 18 is a process sectional view illustrating the method for manufacturing the resin multilayer substrate in the fifth embodiment of the present invention.
FIG. 19 is a process cross-sectional view showing a conventional method for manufacturing a resin substrate.
[Explanation of symbols]
101 resin sheet
102 Support
103 Wiring pattern
104 Laser passage hole
107 Mask member
108 Through hole
109 conductor
110 resin substrate
311 Circuit parts
412 adhesive layer
413 resin multilayer board

Claims (6)

A step of preparing a resin sheet in a prepreg state and a support for transferring a wiring pattern,
Forming a wiring pattern on one main surface of the support, forming a laser passage hole penetrating the wiring pattern,
One main surface of the resin sheet and one main surface on which the wiring pattern of the support is formed, and pressing the resin sheet and the support together,
Removing the support from the resin sheet;
Through the laser passage hole, a step of forming a through hole through the resin sheet by laser,
Filling the through-hole with a conductor,
A method for manufacturing a resin substrate, comprising: A step of preparing a resin sheet in a prepreg state and a support for transferring a wiring pattern,
Forming a wiring pattern on one main surface of the support, forming a laser passage hole penetrating the wiring pattern,
One main surface of the resin sheet and one main surface on which the wiring pattern of the support is formed, and pressing the resin sheet and the support together,
Through the laser passage hole, a step of forming a through hole through the resin sheet and the support by laser,
Filling the through-hole with a conductor,
Removing the support from the resin sheet;
A method for manufacturing a resin substrate, comprising: The method for manufacturing a resin substrate according to claim 1, further comprising a step of pressing the resin sheet in a thickness direction after the step of filling the through hole with a conductor. After the step of filling the through hole with a conductor, the method includes a step of pressing the resin sheet in a thickness direction,
The resin according to claim 1, further comprising a step of heat-treating the resin sheet between the step of removing the support from the resin sheet and the step of pressing the resin sheet in a thickness direction. Substrate manufacturing method. Circuit components are mounted on one main surface of the support so as to be electrically connected to the wiring pattern,
3. The method according to claim 1, wherein, in the step of pressing the resin sheet and the support, the circuit component is buried in the resin sheet. 4. Producing a plurality of resin substrates by the method for producing a resin substrate according to claim 1 or 2;
A step of preparing an adhesive layer made of a resin sheet having a conductor embedded therein,
The resin substrate and the adhesive layer are pressure-bonded so that the main surface of the resin substrate and the main surface of the adhesive layer match, and the adhesive layer is disposed between the two resin substrates. The process of
A method for manufacturing a resin multilayer substrate, comprising:

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