AU2003255017A1 - Method for manufacturing resin substrate and method for manufacturing multilayer resin substrate - Google Patents
Method for manufacturing resin substrate and method for manufacturing multilayer resin substrateInfo
- Publication number
- AU2003255017A1 AU2003255017A1 AU2003255017A AU2003255017A AU2003255017A1 AU 2003255017 A1 AU2003255017 A1 AU 2003255017A1 AU 2003255017 A AU2003255017 A AU 2003255017A AU 2003255017 A AU2003255017 A AU 2003255017A AU 2003255017 A1 AU2003255017 A1 AU 2003255017A1
- Authority
- AU
- Australia
- Prior art keywords
- resin substrate
- manufacturing
- multilayer resin
- manufacturing multilayer
- multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002-310647 | 2002-10-25 | ||
JP2002310647A JP2004146634A (en) | 2002-10-25 | 2002-10-25 | Resin board fabricating process and resin multilayer board fabricating process |
PCT/JP2003/010281 WO2004039136A1 (en) | 2002-10-25 | 2003-08-13 | Method for manufacturing resin substrate and method for manufacturing multilayer resin substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2003255017A1 true AU2003255017A1 (en) | 2004-05-13 |
Family
ID=32171055
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003255017A Abandoned AU2003255017A1 (en) | 2002-10-25 | 2003-08-13 | Method for manufacturing resin substrate and method for manufacturing multilayer resin substrate |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2004146634A (en) |
AU (1) | AU2003255017A1 (en) |
TW (1) | TW200501850A (en) |
WO (1) | WO2004039136A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FI20031341A (en) | 2003-09-18 | 2005-03-19 | Imbera Electronics Oy | Method for manufacturing an electronic module |
FI117814B (en) | 2004-06-15 | 2007-02-28 | Imbera Electronics Oy | A method for manufacturing an electronic module |
FI117812B (en) | 2004-08-05 | 2007-02-28 | Imbera Electronics Oy | Manufacture of a layer containing a component |
US8487194B2 (en) | 2004-08-05 | 2013-07-16 | Imbera Electronics Oy | Circuit board including an embedded component |
FI119714B (en) | 2005-06-16 | 2009-02-13 | Imbera Electronics Oy | Circuit board structure and method for manufacturing a circuit board structure |
FI122128B (en) * | 2005-06-16 | 2011-08-31 | Imbera Electronics Oy | Process for manufacturing circuit board design |
JP2008544512A (en) | 2005-06-16 | 2008-12-04 | イムベラ エレクトロニクス オサケユキチュア | Circuit board structure and manufacturing method thereof |
KR101113889B1 (en) | 2007-12-04 | 2012-02-29 | 삼성테크윈 주식회사 | Electronic chip embedded circuit board and method of manufacturing the same |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6182497A (en) * | 1984-09-28 | 1986-04-26 | 日立化成工業株式会社 | Manufacture of printed circuit board |
JPH0284791A (en) * | 1988-06-17 | 1990-03-26 | Hitachi Chem Co Ltd | Manufacture of wiring board |
JPH06177277A (en) * | 1992-12-08 | 1994-06-24 | Toppan Printing Co Ltd | Manufacture of semiconductor device |
JP3241605B2 (en) * | 1996-09-06 | 2001-12-25 | 松下電器産業株式会社 | Wiring board manufacturing method and wiring board |
JP2000114681A (en) * | 1998-10-01 | 2000-04-21 | Ibiden Co Ltd | Printed wiring board and its manufacture |
TW511405B (en) * | 2000-12-27 | 2002-11-21 | Matsushita Electric Ind Co Ltd | Device built-in module and manufacturing method thereof |
-
2002
- 2002-10-25 JP JP2002310647A patent/JP2004146634A/en active Pending
-
2003
- 2003-08-13 AU AU2003255017A patent/AU2003255017A1/en not_active Abandoned
- 2003-08-13 WO PCT/JP2003/010281 patent/WO2004039136A1/en active Application Filing
- 2003-08-25 TW TW092123292A patent/TW200501850A/en unknown
Also Published As
Publication number | Publication date |
---|---|
TW200501850A (en) | 2005-01-01 |
JP2004146634A (en) | 2004-05-20 |
WO2004039136A1 (en) | 2004-05-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |