TW200501850A - Method for manufacturing resin substrate and method for manufacturing multilayer resin substrate - Google Patents

Method for manufacturing resin substrate and method for manufacturing multilayer resin substrate

Info

Publication number
TW200501850A
TW200501850A TW092123292A TW92123292A TW200501850A TW 200501850 A TW200501850 A TW 200501850A TW 092123292 A TW092123292 A TW 092123292A TW 92123292 A TW92123292 A TW 92123292A TW 200501850 A TW200501850 A TW 200501850A
Authority
TW
Taiwan
Prior art keywords
resin substrate
manufacturing
resin sheet
wiring pattern
major surface
Prior art date
Application number
TW092123292A
Other languages
Chinese (zh)
Inventor
Yuki Yamamoto
Jun Harada
Hiroshi Takagi
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Publication of TW200501850A publication Critical patent/TW200501850A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A resin sheet (201) and a supporting body (202) which is provided on a major surface with a wiring pattern (203) having a laser passage hole (204) are prepared. The resin sheet (201) and the supporting body (202) are pressure-bonded in such a manner that a major surface of the resin sheet (201) and the major surface of the supporting body (202) on which the wiring pattern (203) is provided meet each other. A through hole (208) pierces through the resin sheet (201) by a laser beam coming through the laser passage hole (204), and the through hole (208) is filled with a conductor (209). Consequently, the resistance at the connection between the wiring pattern and a via conductor can be reduced.
TW092123292A 2002-10-25 2003-08-25 Method for manufacturing resin substrate and method for manufacturing multilayer resin substrate TW200501850A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002310647A JP2004146634A (en) 2002-10-25 2002-10-25 Resin board fabricating process and resin multilayer board fabricating process

Publications (1)

Publication Number Publication Date
TW200501850A true TW200501850A (en) 2005-01-01

Family

ID=32171055

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092123292A TW200501850A (en) 2002-10-25 2003-08-25 Method for manufacturing resin substrate and method for manufacturing multilayer resin substrate

Country Status (4)

Country Link
JP (1) JP2004146634A (en)
AU (1) AU2003255017A1 (en)
TW (1) TW200501850A (en)
WO (1) WO2004039136A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI20031341A (en) 2003-09-18 2005-03-19 Imbera Electronics Oy Method for manufacturing an electronic module
FI117814B (en) 2004-06-15 2007-02-28 Imbera Electronics Oy A method for manufacturing an electronic module
FI117812B (en) 2004-08-05 2007-02-28 Imbera Electronics Oy Manufacture of a layer containing a component
US8487194B2 (en) 2004-08-05 2013-07-16 Imbera Electronics Oy Circuit board including an embedded component
FI119714B (en) 2005-06-16 2009-02-13 Imbera Electronics Oy Circuit board structure and method for manufacturing a circuit board structure
FI122128B (en) 2005-06-16 2011-08-31 Imbera Electronics Oy Process for manufacturing circuit board design
GB2441265B (en) 2005-06-16 2012-01-11 Imbera Electronics Oy Method for manufacturing a circuit board structure, and a circuit board structure
KR101113889B1 (en) 2007-12-04 2012-02-29 삼성테크윈 주식회사 Electronic chip embedded circuit board and method of manufacturing the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6182497A (en) * 1984-09-28 1986-04-26 日立化成工業株式会社 Manufacture of printed circuit board
JPH0284791A (en) * 1988-06-17 1990-03-26 Hitachi Chem Co Ltd Manufacture of wiring board
JPH06177277A (en) * 1992-12-08 1994-06-24 Toppan Printing Co Ltd Manufacture of semiconductor device
JP3241605B2 (en) * 1996-09-06 2001-12-25 松下電器産業株式会社 Wiring board manufacturing method and wiring board
JP2000114681A (en) * 1998-10-01 2000-04-21 Ibiden Co Ltd Printed wiring board and its manufacture
TW511405B (en) * 2000-12-27 2002-11-21 Matsushita Electric Ind Co Ltd Device built-in module and manufacturing method thereof

Also Published As

Publication number Publication date
WO2004039136A1 (en) 2004-05-06
JP2004146634A (en) 2004-05-20
AU2003255017A1 (en) 2004-05-13

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