TW200623987A - Printed wiring board and method of manufacturing the same - Google Patents

Printed wiring board and method of manufacturing the same

Info

Publication number
TW200623987A
TW200623987A TW094129374A TW94129374A TW200623987A TW 200623987 A TW200623987 A TW 200623987A TW 094129374 A TW094129374 A TW 094129374A TW 94129374 A TW94129374 A TW 94129374A TW 200623987 A TW200623987 A TW 200623987A
Authority
TW
Taiwan
Prior art keywords
forming
via hole
blind via
round
wiring board
Prior art date
Application number
TW094129374A
Other languages
Chinese (zh)
Other versions
TWI367056B (en
Inventor
Eiji Hirata
Original Assignee
Nippon Cmk Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Cmk Kk filed Critical Nippon Cmk Kk
Publication of TW200623987A publication Critical patent/TW200623987A/en
Application granted granted Critical
Publication of TWI367056B publication Critical patent/TWI367056B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Abstract

The present invention provides a printed wiring board in which there is no positional deviation between a blind via hole and a round and which enables high-density wiring design to be easily achieved. Provided is a method of manufacturing a printed wiring board in which wiring pattern forming layers are connected by a blind via hole, which includes the steps of forming a wiring pattern by etching at least metal foil laminated on a surface of an insulating layer and forming a round having a window portion in a portion where a blind via hole is to be formed; irradiating the window portion with a laser beam having a diameter larger than the diameter of the window portion but smaller than the diameter of the round, thereby making a nonthrough hole for forming the blind via hole; and forming a blind via hole by forming a coating on the nonthrough hole and the round.
TW094129374A 2004-12-24 2005-08-26 Method of manufacturing a printed wiring board TWI367056B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004373935A JP2006179822A (en) 2004-12-24 2004-12-24 Printed wiring board and its manufacturing method

Publications (2)

Publication Number Publication Date
TW200623987A true TW200623987A (en) 2006-07-01
TWI367056B TWI367056B (en) 2012-06-21

Family

ID=36610079

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094129374A TWI367056B (en) 2004-12-24 2005-08-26 Method of manufacturing a printed wiring board

Country Status (5)

Country Link
US (1) US7243425B2 (en)
JP (1) JP2006179822A (en)
KR (1) KR20060073434A (en)
CN (1) CN1794900A (en)
TW (1) TWI367056B (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006179822A (en) 2004-12-24 2006-07-06 Cmk Corp Printed wiring board and its manufacturing method
JP5040346B2 (en) * 2007-02-15 2012-10-03 パナソニック株式会社 Method for manufacturing printed wiring board
JP5066427B2 (en) * 2007-11-02 2012-11-07 日本シイエムケイ株式会社 Method for manufacturing printed wiring board
CN101657072B (en) * 2008-08-19 2011-12-21 富葵精密组件(深圳)有限公司 Circuit board manufacturing method
US8610001B2 (en) * 2010-05-21 2013-12-17 Ibiden Co., Ltd. Printed wiring board and method for manufacturing printed wiring board
CN101958444A (en) * 2010-05-27 2011-01-26 世达普(苏州)通信设备有限公司 Packaging structure of microwave isolator
JP5335023B2 (en) * 2011-04-05 2013-11-06 住友電気工業株式会社 Method for manufacturing printed wiring board
CN104349609A (en) * 2013-08-08 2015-02-11 北大方正集团有限公司 Printed circuit board and manufacturing method thereof
KR20180095350A (en) * 2017-02-17 2018-08-27 삼성전기주식회사 Substrate and method for manufacturing the same
CN110933873A (en) * 2019-11-25 2020-03-27 江门市鼎峰照明电子科技有限公司 Manufacturing method of double-sided circuit board
JPWO2022039062A1 (en) * 2020-08-15 2022-02-24
US20220256716A1 (en) * 2021-02-05 2022-08-11 Shennan Circuits Co., Ltd. Method for manufacturing printed circuit board, and printed circuit board
CN114222445B (en) * 2021-11-09 2023-07-14 深圳市景旺电子股份有限公司 Circuit board manufacturing method and circuit board
CN114173478A (en) * 2021-11-09 2022-03-11 深圳市景旺电子股份有限公司 Circuit board manufacturing method and circuit board

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6373026B1 (en) * 1996-07-31 2002-04-16 Mitsubishi Denki Kabushiki Kaisha Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring board
JP3395621B2 (en) * 1997-02-03 2003-04-14 イビデン株式会社 Printed wiring board and manufacturing method thereof
JP3925192B2 (en) * 1997-02-03 2007-06-06 イビデン株式会社 Printed wiring board and manufacturing method thereof
JPH1174651A (en) * 1997-03-13 1999-03-16 Ibiden Co Ltd Printed wiring board and its manufacture
TW469228B (en) * 1998-01-14 2001-12-21 Mitsui Mining & Smelting Co Method for producing multi-layer printed wiring boards having blind vias
US20020083586A1 (en) * 1998-04-10 2002-07-04 Takahiro Iijima Process for producing multilayer circuit board
KR100336829B1 (en) * 1998-04-10 2002-05-16 모기 쥰이찌 Fabricating method of multilayered wiring substrate
JP2000031640A (en) * 1998-07-08 2000-01-28 Ibiden Co Ltd Printed wiring board and manufacture thereof
JP2002026515A (en) 2000-07-07 2002-01-25 Toshiba Corp Printed wiring board and its manufacturing method
JP4383219B2 (en) 2003-04-01 2009-12-16 日本シイエムケイ株式会社 Method for manufacturing printed wiring board
JP2006179822A (en) 2004-12-24 2006-07-06 Cmk Corp Printed wiring board and its manufacturing method

Also Published As

Publication number Publication date
TWI367056B (en) 2012-06-21
CN1794900A (en) 2006-06-28
US20060137906A1 (en) 2006-06-29
KR20060073434A (en) 2006-06-28
US7243425B2 (en) 2007-07-17
JP2006179822A (en) 2006-07-06

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