TW200740335A - Manufacturing method of multilayer wiring board having cable section - Google Patents

Manufacturing method of multilayer wiring board having cable section

Info

Publication number
TW200740335A
TW200740335A TW095139214A TW95139214A TW200740335A TW 200740335 A TW200740335 A TW 200740335A TW 095139214 A TW095139214 A TW 095139214A TW 95139214 A TW95139214 A TW 95139214A TW 200740335 A TW200740335 A TW 200740335A
Authority
TW
Taiwan
Prior art keywords
forming
outer layer
manufacturing
conduction hole
wiring board
Prior art date
Application number
TW095139214A
Other languages
Chinese (zh)
Other versions
TWI365694B (en
Inventor
Fumihiko Matsuda
Original Assignee
Nippon Mektron Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron Kk filed Critical Nippon Mektron Kk
Publication of TW200740335A publication Critical patent/TW200740335A/en
Application granted granted Critical
Publication of TWI365694B publication Critical patent/TWI365694B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

To provide a method for inexpensively and stably manufacturing a multilayer wiring board having a cable section with a high integration degree capable of loading narrow pitch CSP. The manufacturing method of the multilayer flexible wiring board having the cable section on an outer layer includes (a) a process for manufacturing an inner layer core substrate; (b) a process for forming an opening of copper foil in a conduction hole forming part on an outer layer side in a double sided copper clad laminate having flexibility, and forming a circuit pattern comprising an opening of a conduction hole forming part on an inner layer side; (c) a process for forming a cover ray on the circuit pattern to make it to be an outer layer built-up layer, laminating the outer layer built-up layer by turning a side where the cover ray is formed to a side of the inner layer core substrate, and forming the lamination circuit substrate; (d) a process for performing laser processing on the conduction hole forming part of the outer layer side through the opening of copper foil, and forming a conduction hole in the lamination circuit substrate; and (e) a process for performing a conduction processing on the conduction hole, and forming a via hole with electrolytic plating.
TW095139214A 2005-11-01 2006-10-24 Manufacturing method of multilayer wiring board having cable section TW200740335A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005318532A JP4527045B2 (en) 2005-11-01 2005-11-01 Method for manufacturing multilayer wiring board having cable portion

Publications (2)

Publication Number Publication Date
TW200740335A true TW200740335A (en) 2007-10-16
TWI365694B TWI365694B (en) 2012-06-01

Family

ID=38113079

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095139214A TW200740335A (en) 2005-11-01 2006-10-24 Manufacturing method of multilayer wiring board having cable section

Country Status (4)

Country Link
JP (1) JP4527045B2 (en)
KR (1) KR101201940B1 (en)
CN (1) CN1972571B (en)
TW (1) TW200740335A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI804017B (en) * 2021-10-25 2023-06-01 健鼎科技股份有限公司 Method for manufacturing circuit board

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5080234B2 (en) * 2007-12-19 2012-11-21 新光電気工業株式会社 Wiring board and manufacturing method thereof
JP5198105B2 (en) * 2008-03-25 2013-05-15 日本メクトロン株式会社 Manufacturing method of multilayer flexible printed wiring board
JP5259240B2 (en) * 2008-04-21 2013-08-07 日本メクトロン株式会社 Multilayer flexible printed wiring board and manufacturing method thereof
JP2010016339A (en) * 2008-06-03 2010-01-21 Nippon Mektron Ltd Module using multilayer flexible printed circuit board and method of manufacturing the same
JP2010278067A (en) * 2009-05-26 2010-12-09 Nippon Mektron Ltd Method of manufacturing multilayer flexible printed circuit board, and multilayer circuit base material
CN102083272B (en) * 2009-11-30 2012-07-04 富葵精密组件(深圳)有限公司 Circuit board with grounding structure
JP5710152B2 (en) * 2010-04-15 2015-04-30 日本メクトロン株式会社 Manufacturing method of multilayer flexible printed wiring board
JP5450272B2 (en) 2010-06-10 2014-03-26 日本メクトロン株式会社 LASER PROCESSING METHOD AND MULTILAYER FLEXIBLE PRINTED WIRING BOARD MANUFACTURING METHOD USING THE LASER PROCESSING METHOD
WO2012014339A1 (en) 2010-07-26 2012-02-02 日本メクトロン株式会社 Flexible printed circuit board and method of manufacturing thereof
JP5693339B2 (en) * 2011-04-06 2015-04-01 日本メクトロン株式会社 Multilayer printed wiring board and manufacturing method thereof
DE112012002829T5 (en) * 2011-07-06 2014-04-24 Kabushiki Kaisha Toyota Jidoshokki Multilayer printed circuit board and method for producing a multilayer printed circuit board
KR101977088B1 (en) 2013-01-08 2019-05-10 엘지전자 주식회사 Wireless power transmitter
CN106385761A (en) * 2016-11-29 2017-02-08 珠海杰赛科技有限公司 Manufacture method for multilayer flexible circuit board and multilayer flexible circuit board
CN106793585A (en) * 2016-12-06 2017-05-31 深圳市景旺电子股份有限公司 A kind of high density interconnection semi-flexible printed circuit board and preparation method thereof
KR102268389B1 (en) * 2019-09-11 2021-06-23 삼성전기주식회사 Printed circuit board and antenna module comprising the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0682924B2 (en) * 1987-11-09 1994-10-19 シャープ株式会社 Manufacturing method of composite substrate
JPH06334284A (en) * 1993-05-20 1994-12-02 Toshiba Corp Printed wiring board
JPH09172261A (en) * 1995-12-20 1997-06-30 Nippon Avionics Co Ltd Manufacture of multilayered printed wiring board
CN1494120A (en) * 2002-10-28 2004-05-05 华泰电子股份有限公司 Metal electroplating method of integrated circuit packaging substrate
JP2005166764A (en) * 2003-11-28 2005-06-23 Toshiba Corp Multilayer printed wring board and its manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI804017B (en) * 2021-10-25 2023-06-01 健鼎科技股份有限公司 Method for manufacturing circuit board

Also Published As

Publication number Publication date
TWI365694B (en) 2012-06-01
KR101201940B1 (en) 2012-11-16
KR20070047219A (en) 2007-05-04
JP4527045B2 (en) 2010-08-18
JP2007128970A (en) 2007-05-24
CN1972571A (en) 2007-05-30
CN1972571B (en) 2010-05-19

Similar Documents

Publication Publication Date Title
TW200740335A (en) Manufacturing method of multilayer wiring board having cable section
CN103068165B (en) Printed circuit board (PCB) outer edge plating layer manufacturing technology
TW200617065A (en) Resin composite metal foil, laminate and process for the production of printed wiring board using the laminate
JP2011134890A (en) Multilayer wiring board, method of manufacturing multilayer wiring board, and via fill method
US20140353025A1 (en) Printed circuit board
WO2008153185A1 (en) Embedding copper plating method for manufacture of printed wiring board, and printed wiring board obtained by using the embedding copper plating method
EP1708552A3 (en) Method of production of circuit board utilizing electroplating
JP2015185735A (en) Multilayer wiring board and manufacturing method therefor
US8058568B2 (en) Circuit board and method for fabricating the same
JP4857433B2 (en) Metal laminate, metal laminate manufacturing method and printed circuit board manufacturing method
JP2010016336A (en) Method for manufacturing printed circuit board
JP5485299B2 (en) Manufacturing method of multilayer printed wiring board
JP2009026912A (en) Method for manufacturing multilayer printed-wiring board
KR20140098675A (en) Wiring substrate and method for manufacturing the same
US7992296B2 (en) PCB and manufacturing method thereof
TW200742523A (en) Multilayer circuit board and its manufacturing method
JP4485975B2 (en) Manufacturing method of multilayer flexible circuit wiring board
JP2006287007A (en) Multilayer printed circuit board and its manufacturing method
KR20170064706A (en) Method for manufacturing pcb and pcb manufactured using the same
JP5275001B2 (en) Manufacturing method of multilayer flexible wiring board
KR20100109699A (en) Method of manufacturing a printed circuit board
JP2007288023A (en) Method for manufacturing rigid flex multilayer printed wiring board
JP2005222999A (en) Method for manufacturing double-sided circuit wiring board
JP2011243767A (en) Multilayer wiring board and manufacturing method of the same
JP5214671B2 (en) Method for manufacturing printed wiring board