WO2011099820A3 - Pcb with cavity and fabricating method thereof - Google Patents

Pcb with cavity and fabricating method thereof Download PDF

Info

Publication number
WO2011099820A3
WO2011099820A3 PCT/KR2011/000953 KR2011000953W WO2011099820A3 WO 2011099820 A3 WO2011099820 A3 WO 2011099820A3 KR 2011000953 W KR2011000953 W KR 2011000953W WO 2011099820 A3 WO2011099820 A3 WO 2011099820A3
Authority
WO
WIPO (PCT)
Prior art keywords
cavity
pcb
circuit
forming
layer
Prior art date
Application number
PCT/KR2011/000953
Other languages
French (fr)
Other versions
WO2011099820A2 (en
Inventor
Hyung Jong Kim
Jae Hyoun Yoo
Jin Goo Chun
Jun Soo Park
Ki Yong Lee
Original Assignee
Lg Innotek Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020100013438A external-priority patent/KR20110093407A/en
Priority claimed from KR1020100050675A external-priority patent/KR101136396B1/en
Application filed by Lg Innotek Co., Ltd. filed Critical Lg Innotek Co., Ltd.
Priority to JP2012552813A priority Critical patent/JP5727521B2/en
Priority to CN201180018921.5A priority patent/CN102860144B/en
Publication of WO2011099820A2 publication Critical patent/WO2011099820A2/en
Publication of WO2011099820A3 publication Critical patent/WO2011099820A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A fabricating method of a printed circuit board (PCB) with a cavity and a structure of the PCB fabricated by the method are provided. The method includes a first step of forming a base circuit board provided with an internal circuit layer having cavity circuit patterns on a surface of a substrate, a second step of forming a laser stopper layer on upper portions of the cavity circuit patterns, a third step of forming at least one external circuit layer on the base circuit board, and a fourth step of forming a cavity region by removing the external circuit layer on an upper portion of the laser stopper layer. Accordingly, in a fabricating method of a multi-layered PCB with a cavity, a laser stopper layer is formed on upper surfaces of cavity circuit patterns, so that it is possible to rapidly and precisely form the cavity, to precisely control the depth of the cavity and to have no influence on a circuit previously formed in the interior of the cavity.
PCT/KR2011/000953 2010-02-12 2011-02-11 Pcb with cavity and fabricating method thereof WO2011099820A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012552813A JP5727521B2 (en) 2010-02-12 2011-02-11 Printed circuit board and manufacturing method thereof
CN201180018921.5A CN102860144B (en) 2010-02-12 2011-02-11 There is PCB and the manufacture method thereof in chamber

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2010-0013438 2010-02-12
KR1020100013438A KR20110093407A (en) 2010-02-12 2010-02-12 Pcb within cavity and fabricaring method of the same
KR10-2010-0050675 2010-05-28
KR1020100050675A KR101136396B1 (en) 2010-05-28 2010-05-28 PCB within cavity and Fabricaring method of the same

Publications (2)

Publication Number Publication Date
WO2011099820A2 WO2011099820A2 (en) 2011-08-18
WO2011099820A3 true WO2011099820A3 (en) 2012-01-12

Family

ID=44368335

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/000953 WO2011099820A2 (en) 2010-02-12 2011-02-11 Pcb with cavity and fabricating method thereof

Country Status (4)

Country Link
JP (1) JP5727521B2 (en)
CN (1) CN102860144B (en)
TW (1) TWI513385B (en)
WO (1) WO2011099820A2 (en)

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CN103270819B (en) * 2010-10-20 2016-12-07 Lg伊诺特有限公司 Printed circuit board and manufacturing methods
CN103208475A (en) * 2012-01-12 2013-07-17 欣兴电子股份有限公司 Package substrate and production method thereof
US9257310B2 (en) 2012-10-19 2016-02-09 Haesung Ds Co., Ltd. Method of manufacturing circuit board and chip package and circuit board manufactured by using the method
KR101814113B1 (en) * 2012-11-02 2018-01-02 삼성전기주식회사 Method for manufacturing of printed circuit board
US20140158414A1 (en) * 2012-12-11 2014-06-12 Chris Baldwin Recessed discrete component mounting on organic substrate
CN203072246U (en) 2012-12-31 2013-07-17 奥特斯(中国)有限公司 Semi-finished product for production of printed circuit board
JP5377792B1 (en) * 2013-07-08 2013-12-25 株式会社イースタン Circuit board manufacturing method
CN104427790B (en) * 2013-08-29 2017-06-09 北大方正集团有限公司 A kind of local dent printed circuit board (PCB) and preparation method thereof
EP3075006A1 (en) 2013-11-27 2016-10-05 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Circuit board structure
AT515101B1 (en) 2013-12-12 2015-06-15 Austria Tech & System Tech Method for embedding a component in a printed circuit board
AT515447B1 (en) 2014-02-27 2019-10-15 At & S Austria Tech & Systemtechnik Ag Method for contacting a component embedded in a printed circuit board and printed circuit board
US11523520B2 (en) 2014-02-27 2022-12-06 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Method for making contact with a component embedded in a printed circuit board
DE102015113322B3 (en) * 2015-08-12 2016-11-17 Schweizer Electronic Ag Radio-frequency antenna, radio-frequency substrate with radio-frequency antenna and method of production
DE102015113324A1 (en) * 2015-08-12 2017-02-16 Schweizer Electronic Ag Ladder structure element with laminated inner layer substrate and method for its production
KR101720264B1 (en) 2015-09-04 2017-04-03 대덕전자 주식회사 Method of manufacturing printed circuit board
KR102466204B1 (en) * 2015-12-16 2022-11-11 삼성전기주식회사 Printed circuit board and method of manufacturing the same
JP2018073890A (en) 2016-10-25 2018-05-10 イビデン株式会社 Printed wiring board and manufacturing method for printed wiring board
CN108207080B (en) * 2017-12-29 2019-07-26 广东生益科技股份有限公司 A kind of hole-punching method of coil plate
JP7066603B2 (en) * 2018-12-20 2022-05-13 京セラ株式会社 Wiring board and mounting structure
CN110719695B (en) * 2019-10-21 2021-02-05 北大方正集团有限公司 Circuit board manufacturing method and circuit board
CN110996514B (en) * 2019-11-06 2023-01-06 昆山沪利微电有限公司 Method for manufacturing cavity structure
CN111163597A (en) * 2019-12-31 2020-05-15 昆山沪利微电有限公司 Manufacturing process of PCB cavity structure
JP7124128B2 (en) * 2019-12-31 2022-08-23 深南電路股▲ふん▼有限公司 Printed circuit board manufacturing method and printed circuit board
CN111417263A (en) * 2020-04-30 2020-07-14 上海创功通讯技术有限公司 Circuit board structure manufacturing method, circuit board structure and electronic equipment
US11963296B2 (en) 2021-10-07 2024-04-16 Google Llc Cavity printed circuit board for three-dimensional IC package

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JP2006108483A (en) * 2004-10-07 2006-04-20 Hitachi Metals Ltd Multilayered ceramic board having cavity and its manufacturing method
KR100677184B1 (en) * 2006-02-10 2007-02-02 삼성전기주식회사 Method for manufacturing a substrate with cavity
KR100890217B1 (en) * 2007-12-20 2009-03-25 삼성전기주식회사 Method for manufacturing pcb

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AT11663U1 (en) * 2007-02-16 2011-02-15 Austria Tech & System Tech ABSORPTION MATERIAL, METHOD FOR REMOVING A PARTIAL AREA OF A SURFACE MATERIAL LAYER, AND MULTILAYER STRUCTURE AND USE OF THE HORTOR
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JP4940124B2 (en) * 2007-12-27 2012-05-30 京セラＳｌｃテクノロジー株式会社 Wiring board manufacturing method
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Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
KR20030050400A (en) * 2001-12-18 2003-06-25 엘지전자 주식회사 Manufacturing method of multi-layer pcb, pad fabricating method of multi-layer pcb, semiconductor pkg manufacturing method using multi-layer pcb
JP2006108483A (en) * 2004-10-07 2006-04-20 Hitachi Metals Ltd Multilayered ceramic board having cavity and its manufacturing method
KR100677184B1 (en) * 2006-02-10 2007-02-02 삼성전기주식회사 Method for manufacturing a substrate with cavity
KR100890217B1 (en) * 2007-12-20 2009-03-25 삼성전기주식회사 Method for manufacturing pcb

Also Published As

Publication number Publication date
TW201206275A (en) 2012-02-01
WO2011099820A2 (en) 2011-08-18
CN102860144A (en) 2013-01-02
JP5727521B2 (en) 2015-06-03
JP2013520007A (en) 2013-05-30
CN102860144B (en) 2016-03-02
TWI513385B (en) 2015-12-11

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