EP3075006A1 - Circuit board structure - Google Patents
Circuit board structureInfo
- Publication number
- EP3075006A1 EP3075006A1 EP14805471.1A EP14805471A EP3075006A1 EP 3075006 A1 EP3075006 A1 EP 3075006A1 EP 14805471 A EP14805471 A EP 14805471A EP 3075006 A1 EP3075006 A1 EP 3075006A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- circuit board
- board structure
- printed circuit
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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Definitions
- the invention relates to a printed circuit board structure consisting of at least one insulating layer, at least one conductor layer and at least one embedded component having an outer barrier layer possessing contact pad, wherein at least two interconnects / layers are connected via vias with at least two terminals.
- the invention further relates to a method for contacting a component embedded in a printed circuit board structure with a printed conductor section by producing plated-through holes from a conductor layer to terminals of the component.
- the contact pads of the components have copper connection pads, which are constructed on a barrier layer, in particular of nickel.
- barrier layers are required to prevent diffusion of copper into adjacent layers, in the present case e.g. in an adhesion layer, which consists for example of titanium, titanium-tungsten or chromium.
- an adhesion layer which consists for example of titanium, titanium-tungsten or chromium.
- semiconductors e.g. a power MOSFET
- a contact made of, for example, aluminum for the drain or gate of a MOSFET.
- An object of the invention is to provide a printed circuit board structure or a method for their production, wherein the production costs can be reduced, the use of extremely thin components, for example, a thickness of the order of 20 m is possible and the use of copper connections to the components to be embedded can be omitted.
- This object is achieved with a printed circuit board structure of the aforementioned type, in which, according to the invention, each plated-through hole runs from a conductor track / layer directly to the barrier contact layer of the corresponding terminal of the component.
- the material of the barrier contact layer is selected from the group consisting of nickel, nickel vanadium, platinum, palladium and cobalt.
- the material of the barrier contact layer is nickel.
- Cost-effective and technologically easy to control are versions in which the plated through hole is made of copper.
- an adhesion layer is arranged below the barrier contact layer, wherein the adhesion layer is advantageously selected from the group consisting of titanium, titanium tungsten and chromium.
- the invention is particularly advantageous when the component is a power component, which may be an IGBT chip / MOSFET or a power diode.
- the invention advantageously leads to variants in which the printed circuit board structure is at least partially flexible.
- the object is also achieved with a method of the type mentioned above, in which according to the invention in the region of the terminals of the component in an outer conductor layer at least one opening is made, which extends to a barrier layer of a terminal, and then at least one via from the conductor / Layer is made directly to the barrier layer of the corresponding terminal of the component.
- electroless copper plating is performed on at least one side of the printed circuit board structure to form a copper layer on the surface and in the openings.
- the at least one opening is produced by laser cutting.
- the at least one opening is chemically cleaned before the vias are produced.
- the chemical cleaning step can usefully reduce the thickness of the barrier layer.
- a mask is applied to the at least one side of the printed circuit board structure, followed by a galvanic copper plating to produce at least one conductor layer and the completion of plated-through holes and removal of the mask.
- FIG. 2 shows in a section as a component, for example, a power MOSFET before embedding in a printed circuit board structure and before contacting
- Fig. 9 shows a variant of a printed circuit board structure according to the invention with a total of four embedded components
- FIG. 9a shows a section of FIG. 9 with a modified plated through hole in two components.
- FIGS. 1 a and 1 b which initially explain the principal difference between a contacting of a contact pad of an embedded component according to the prior art on the one hand and according to the invention on the other hand.
- a component 1a shows in a detailed view a component 1, for example a chip, which, for contacting on its surface, has a flat contact 2, e.g. made of aluminum.
- a flat contact 2 e.g. made of aluminum.
- An existing example of titanium, titanium-tungsten or chromium contact adhesion layer 3 is located and this is connected with the interposition of a barrier layer 4 with a contact pad 5, which is usually made of copper.
- a passivation layer 6 is applied, which consists mostly of silicon nitride.
- a through-connection is made 9, which, as also explained in more detail below, is prepared by galvanic means.
- the connection between the conductor track 7 and the terminal 8 of the component 1 thus takes place via a "two-stage" copper connection, namely the plated-through hole 9 and the copper contact pad 5.
- Fig. Lb shows, in which the same reference numerals as in Fig. 1 a are used for the same parts, that according to the invention, the feedthrough 9 of the conductor 7 extends directly to the barrier layer 4 of the contact pad of the terminal 8.
- FIG. 2 shows, as an example of a component 1, a power MOSFET which according to the invention is to be embedded in a printed circuit board structure and is contacted on both sides in planar technology.
- the silicon substrate 1s whose structure is not shown in detail, has on its underside for the drain terminal 8d a flat drain contact 2d made of aluminum, followed by a drain adhesion layer 3 d made of titanium and a drain barrier layer 4d made of nickel.
- a flat gate contact 2g made of aluminum, above a gate adhesion layer 3g and finally a gate barrier layer 4g are provided for the gate connection 8g.
- a passivation layer 6 of silicon nitride is also present on the upper side.
- top refers primarily to the drawings and serve to simplify the description, but not necessarily with any orientation refer to described parts or their orientation in the manufacturing process.
- FIGS. 3 to 8 wherein the embedding and contacting of the component according to FIG. 2 is shown here with reference to a section of a printed circuit board component.
- the component 1 is embedded in a printed circuit board, which in the present case consists of an insulating layer 10 with an upper conductor layer 11 and a lower conductor layer 12.
- the insulating layer 10 may be a commercial prepreg based on an epoxy resin with glass fiber reinforcement, e.g. FR 4 or in other cases e.g. a polyimide with or without reinforcement, the conductor layers are usually copper foils.
- a window 13 is formed, which frees the underside of the component or the drain terminal 8d.
- two openings namely a gate opening 14 and a source opening 15 are provided at the top by etching away of copper of the upper conductor layer or laser cutting of the insulating layer 10, up to the gate barrier layer 4g or to the source barrier layer 4s of the gate terminal 8g or of the source terminal 8s.
- the openings 14, 15 are cleaned with well-known in the field of printed circuit Lochthesesvon, eg by chemical cleaning using potassium permanganate and the thickness of all the barrier layers 4d, 4g, 4s can be reduced by chemical dissolution of the barrier layers.
- the reduced thickness of the barrier layers 4d, 4g, 4s in FIG. 5 can be seen.
- the barrier layers 4d, 4g, 4s have a thickness of at least 100 nm or more before cleaning and are reduced by, for example, 50 nm in the cleaning step, for example by up to 500 nm in the case of thicker barrier layers.
- FIG. 1 An upper copper layer 16 and a lower copper layer 17 are formed, wherein the upper copper layer 16 covers not only the upper conductor layer 11 but also the walls of the openings 14 and 15 and the gate barrier layer 4g and the source barrier layer 4s, respectively. Similarly, the lower copper layer 17 covers the lower conductor layer 12 and the one drain barrier layer 4d.
- 9 shows by way of example a further embodiment of a printed circuit board structure 22, which is manufactured according to the method described above and contains a total of four components, namely a first MOSFET 23, eg a "high source FET", a second MOSFET 24, eg a "low Source FET ", a drive chip 25 and a capacitor 26, for example of the" Multilayer Cofired Ceramic "type.
- FIG. 9 also shows two plated-through holes 27, 28 between the upper and lower conductor layers 19, 20, wherein a plated-through hole 28 establishes a connection between source S of the first MOSFET 23 and drain D of the second MOSFET 24.
- the vias from the bottom conductor layer 20 to the drains of the MOSFETs are split into three and five vias 9, respectively.
- all plated-through holes of the conductor layers 19, 20 are provided with component reference numbers "9".
- the drive chip 25 is arranged to the right of the MOSFET 24, and to the right of this the capacitor 26.
- the structure of the electrode contacting in the MOSFETs 23 and 24 and the drive chip 25 is the same as shown in Fig. 16 and Fig. 2, it thus consists - from the inside to the outside - of a contact layer, a contact adhesion layer and a barrier layer.
- the two terminals of the capacitor 26 are each internally provided with a contact adhesion layer 26-3 on which a contact barrier layer 26-4 follows.
- the adhesion layers 26-3 are preferably made of chromium and the barrier layers 26-4 of nickel.
- the circuit board structure 22 shown in FIG. 9 may contain further components, not shown here, such as power diodes, resistors and inductors.
- the thickness of the circuit board structure can be kept very low, it is also easily possible to make them at least partially flexible, in which case, for example, offers as a material for the insulating layer polyimide.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
Description
Claims
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PCT/AT2014/050239 WO2015077808A1 (en) | 2013-11-27 | 2014-10-09 | Circuit board structure |
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EP (1) | EP3075006A1 (en) |
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Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015077808A1 (en) | 2013-11-27 | 2015-06-04 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Circuit board structure |
AT515101B1 (en) | 2013-12-12 | 2015-06-15 | Austria Tech & System Tech | Method for embedding a component in a printed circuit board |
US11523520B2 (en) | 2014-02-27 | 2022-12-06 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Method for making contact with a component embedded in a printed circuit board |
AT515447B1 (en) | 2014-02-27 | 2019-10-15 | At & S Austria Tech & Systemtechnik Ag | Method for contacting a component embedded in a printed circuit board and printed circuit board |
US20170333700A1 (en) * | 2016-02-22 | 2017-11-23 | The Charles Stark Draper Laboratory, Inc. | Method of manufacturing an implantable neural electrode interface platform |
JP2018074088A (en) * | 2016-11-02 | 2018-05-10 | 富士電機株式会社 | Semiconductor device |
JP7202785B2 (en) * | 2018-04-27 | 2023-01-12 | 新光電気工業株式会社 | Wiring board and method for manufacturing wiring board |
EP3584833B1 (en) * | 2018-06-19 | 2021-09-01 | Mitsubishi Electric R&D Centre Europe B.V. | Power module with improved alignment |
DE102018115509A1 (en) * | 2018-06-27 | 2020-01-02 | Infineon Technologies Ag | Heat dissipation device, semiconductor packaging system and method of manufacturing the same |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1424731A2 (en) * | 2002-11-26 | 2004-06-02 | Shinko Electric Industries Co., Ltd. | Electronic parts packaging structure and method of manufacturing the same |
DE102008040906A1 (en) * | 2008-07-31 | 2010-02-04 | Robert Bosch Gmbh | Printed circuit board with electronic component |
US20120247819A1 (en) * | 2011-03-31 | 2012-10-04 | Tdk Corporation | Electronic component-embeded board and method for manufacturing the same |
US20130146991A1 (en) * | 2011-12-08 | 2013-06-13 | Infineon Technologies Ag | Device Including Two Power Semiconductor Chips and Manufacturing Thereof |
Family Cites Families (170)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH667359A5 (en) | 1985-03-27 | 1988-09-30 | Ppc Electronic Ag | METHOD FOR PRODUCING A RIGID AND FLEXIBLE PARTICULAR BOARD FOR PRINTED ELECTRICAL CIRCUITS. |
EP0275433B1 (en) | 1986-12-22 | 1992-04-01 | Siemens Aktiengesellschaft | Method for mounting electronic components on a substrate, foil to carry out the method and method to produce the foil |
US4931134A (en) | 1989-08-15 | 1990-06-05 | Parlex Corporation | Method of using laser routing to form a rigid/flex circuit board |
US5206188A (en) | 1990-01-31 | 1993-04-27 | Ibiden Co., Ltd. | Method of manufacturing a high lead count circuit board |
US5241456A (en) | 1990-07-02 | 1993-08-31 | General Electric Company | Compact high density interconnect structure |
BE1007714A3 (en) | 1993-11-09 | 1995-10-03 | Philips Electronics Nv | Method for manufacturing a plate of electrical insulation materials with a pattern of holes and / or cavities. |
US5561085A (en) | 1994-12-19 | 1996-10-01 | Martin Marietta Corporation | Structure for protecting air bridges on semiconductor chips from damage |
US5645673A (en) | 1995-06-02 | 1997-07-08 | International Business Machines Corporation | Lamination process for producing non-planar substrates |
CN1094717C (en) | 1995-11-16 | 2002-11-20 | 松下电器产业株式会社 | PC board and fixing body thereof |
JPH09266268A (en) | 1996-03-28 | 1997-10-07 | Mitsubishi Electric Corp | Semiconductor device manufacturing method and package of semiconductor device |
DE19642488A1 (en) | 1996-10-15 | 1998-04-16 | Bernd Klose | Thin-layer circuit board for e.g. chip card |
US5868950A (en) | 1996-11-08 | 1999-02-09 | W. L. Gore & Associates, Inc. | Method to correct astigmatism of fourth yag to enable formation of sub 25 micron micro-vias using masking techniques |
JPH11150368A (en) | 1997-11-19 | 1999-06-02 | Toshiba Chem Corp | Manufacture of flex rigid wiring board |
US6281446B1 (en) | 1998-02-16 | 2001-08-28 | Matsushita Electric Industrial Co., Ltd. | Multi-layered circuit board and method of manufacturing the same |
US6163049A (en) * | 1998-10-13 | 2000-12-19 | Advanced Micro Devices, Inc. | Method of forming a composite interpoly gate dielectric |
US6120693A (en) | 1998-11-06 | 2000-09-19 | Alliedsignal Inc. | Method of manufacturing an interlayer via and a laminate precursor useful for same |
JP3656484B2 (en) | 1999-03-03 | 2005-06-08 | 株式会社村田製作所 | Manufacturing method of ceramic multilayer substrate |
US6405429B1 (en) | 1999-08-26 | 2002-06-18 | Honeywell Inc. | Microbeam assembly and associated method for integrated circuit interconnection to substrates |
US6442033B1 (en) | 1999-09-24 | 2002-08-27 | Virginia Tech Intellectual Properties, Inc. | Low-cost 3D flip-chip packaging technology for integrated power electronics modules |
DE19954941C2 (en) | 1999-11-16 | 2003-11-06 | Fraunhofer Ges Forschung | Method for integrating a chip within a printed circuit board |
WO2001063991A1 (en) | 2000-02-25 | 2001-08-30 | Ibiden Co., Ltd. | Multilayer printed wiring board and method for producing multilayer printed wiring board |
US6384473B1 (en) | 2000-05-16 | 2002-05-07 | Sandia Corporation | Microelectronic device package with an integral window |
US6309912B1 (en) | 2000-06-20 | 2001-10-30 | Motorola, Inc. | Method of interconnecting an embedded integrated circuit |
US6459593B1 (en) | 2000-08-10 | 2002-10-01 | Nortel Networks Limited | Electronic circuit board |
US6492726B1 (en) | 2000-09-22 | 2002-12-10 | Chartered Semiconductor Manufacturing Ltd. | Chip scale packaging with multi-layer flip chip arrangement and ball grid array interconnection |
KR100797422B1 (en) | 2000-09-25 | 2008-01-23 | 이비덴 가부시키가이샤 | Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
TW511415B (en) | 2001-01-19 | 2002-11-21 | Matsushita Electric Ind Co Ltd | Component built-in module and its manufacturing method |
FR2822338B1 (en) | 2001-03-14 | 2003-06-27 | Sagem | METHOD FOR ELECTRICALLY CONNECTING CONTACT PLOTS OF A MICROELECTRONIC COMPONENT DIRECTLY TO PRINTED CIRCUIT TRACKS, AND PRINTED CIRCUIT PLATE THUS MADE UP |
JP3963661B2 (en) * | 2001-05-10 | 2007-08-22 | 株式会社荏原製作所 | Electroless plating method and apparatus |
JP3736679B2 (en) | 2001-07-18 | 2006-01-18 | 日立エーアイシー株式会社 | Printed wiring board |
TW550997B (en) | 2001-10-18 | 2003-09-01 | Matsushita Electric Ind Co Ltd | Module with built-in components and the manufacturing method thereof |
JP3935353B2 (en) | 2001-12-26 | 2007-06-20 | シャープ株式会社 | Manufacturing method of flexible build-up wiring board |
TW557521B (en) | 2002-01-16 | 2003-10-11 | Via Tech Inc | Integrated circuit package and its manufacturing process |
US6506632B1 (en) | 2002-02-15 | 2003-01-14 | Unimicron Technology Corp. | Method of forming IC package having downward-facing chip cavity |
JP3941573B2 (en) | 2002-04-24 | 2007-07-04 | 宇部興産株式会社 | Method for manufacturing flexible double-sided substrate |
US6903458B1 (en) | 2002-06-20 | 2005-06-07 | Richard J. Nathan | Embedded carrier for an integrated circuit chip |
JP2004031682A (en) | 2002-06-26 | 2004-01-29 | Sony Corp | Method of manufacturing printed wiring board |
DE20221189U1 (en) | 2002-09-19 | 2005-05-19 | Ruwel Ag | Printed circuit board with at least one rigid area and at least one flexible area |
US6919508B2 (en) | 2002-11-08 | 2005-07-19 | Flipchip International, Llc | Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing |
JP2004200209A (en) | 2002-12-16 | 2004-07-15 | Fuji Xerox Co Ltd | Method of forming conductive pattern of electrode, etc., surface light emitting type semiconductor laser using the same, and its manufacturing method |
JP2004214249A (en) | 2002-12-27 | 2004-07-29 | Renesas Technology Corp | Semiconductor module |
US7894203B2 (en) | 2003-02-26 | 2011-02-22 | Ibiden Co., Ltd. | Multilayer printed wiring board |
FI115601B (en) | 2003-04-01 | 2005-05-31 | Imbera Electronics Oy | Method for manufacturing an electronic module and an electronic module |
JP4303610B2 (en) | 2003-05-19 | 2009-07-29 | 富士フイルム株式会社 | Multilayer wiring board, component mounting method, and imaging apparatus |
JP3709882B2 (en) | 2003-07-22 | 2005-10-26 | 松下電器産業株式会社 | Circuit module and manufacturing method thereof |
FI20031201A (en) | 2003-08-26 | 2005-02-27 | Imbera Electronics Oy | Procedure for manufacturing an electronics module and an electronics module |
TWI221330B (en) | 2003-08-28 | 2004-09-21 | Phoenix Prec Technology Corp | Method for fabricating thermally enhanced semiconductor device |
FI20031341A (en) | 2003-09-18 | 2005-03-19 | Imbera Electronics Oy | Method for manufacturing an electronic module |
US7280372B2 (en) | 2003-11-13 | 2007-10-09 | Silicon Pipe | Stair step printed circuit board structures for high speed signal transmissions |
US7652381B2 (en) | 2003-11-13 | 2010-01-26 | Interconnect Portfolio Llc | Interconnect system without through-holes |
ITUD20040034A1 (en) | 2004-02-27 | 2004-05-27 | Eurotech Spa | MULTILAYER EXPANSION BOARD FOR ELECTRONIC AND RELATED EQUIPMENT |
US20050233122A1 (en) | 2004-04-19 | 2005-10-20 | Mikio Nishimura | Manufacturing method of laminated substrate, and manufacturing apparatus of semiconductor device for module and laminated substrate for use therein |
JP4251144B2 (en) | 2004-04-19 | 2009-04-08 | パナソニック株式会社 | Manufacturing method of laminated substrate |
FI20041680A (en) | 2004-04-27 | 2005-10-28 | Imbera Electronics Oy | Electronics module and method for its manufacture |
US20060008970A1 (en) | 2004-07-08 | 2006-01-12 | International Business Machines Corporation | Optimized plating process for multilayer printed circuit boards having edge connectors |
FI117812B (en) | 2004-08-05 | 2007-02-28 | Imbera Electronics Oy | Manufacture of a layer containing a component |
TWI241007B (en) | 2004-09-09 | 2005-10-01 | Phoenix Prec Technology Corp | Semiconductor device embedded structure and method for fabricating the same |
US7326857B2 (en) | 2004-11-18 | 2008-02-05 | International Business Machines Corporation | Method and structure for creating printed circuit boards with stepped thickness |
JP4800606B2 (en) | 2004-11-19 | 2011-10-26 | Okiセミコンダクタ株式会社 | Method for manufacturing element-embedded substrate |
FI20041525A (en) | 2004-11-26 | 2006-03-17 | Imbera Electronics Oy | Electronics module and manufacturing process |
JP2006165175A (en) | 2004-12-06 | 2006-06-22 | Alps Electric Co Ltd | Circuit component module, electronic circuit device, and circuit component module manufacturing method |
KR100688769B1 (en) | 2004-12-30 | 2007-03-02 | 삼성전기주식회사 | Embedded chip print circuit board and method for fabricating the same by means of plating |
JP2006245057A (en) | 2005-02-28 | 2006-09-14 | Sony Corp | Hybrid module, its manufacturing method, and hybrid circuit apparatus |
WO2006090199A1 (en) | 2005-02-28 | 2006-08-31 | Infineon Technologies Ag | Semiconductor package, a panel and methods of assembling the same |
JP2006237517A (en) | 2005-02-28 | 2006-09-07 | Sanyo Electric Co Ltd | Circuit arrangement and manufacturing method therefor |
WO2006095852A1 (en) | 2005-03-10 | 2006-09-14 | Kyocera Corporation | Electronic component module and method for manufacturing same |
KR20060106891A (en) | 2005-04-04 | 2006-10-12 | 마츠시타 덴끼 산교 가부시키가이샤 | Optical device cavity structure, optical device, and method for manufacturing an optical device cavity structure |
KR100618892B1 (en) | 2005-04-13 | 2006-09-01 | 삼성전자주식회사 | Semiconductor package accomplishing a fan-out structure through wire bonding |
TWI275149B (en) | 2005-05-09 | 2007-03-01 | Phoenix Prec Technology Corp | Surface roughing method for embedded semiconductor chip structure |
FI122128B (en) | 2005-06-16 | 2011-08-31 | Imbera Electronics Oy | Process for manufacturing circuit board design |
FI119714B (en) | 2005-06-16 | 2009-02-13 | Imbera Electronics Oy | Circuit board structure and method for manufacturing a circuit board structure |
TWI283462B (en) | 2005-09-27 | 2007-07-01 | Via Tech Inc | Bumpless chip package and fabricating process thereof |
KR100726240B1 (en) | 2005-10-04 | 2007-06-11 | 삼성전기주식회사 | Electronic components embedded PCB and the method for manufacturing thereof |
US8101868B2 (en) | 2005-10-14 | 2012-01-24 | Ibiden Co., Ltd. | Multilayered printed circuit board and method for manufacturing the same |
JP5188816B2 (en) | 2005-12-16 | 2013-04-24 | イビデン株式会社 | Multilayer printed wiring board and manufacturing method thereof |
JP4771135B2 (en) | 2006-01-12 | 2011-09-14 | 日立化成工業株式会社 | Printed wiring board, LED device using the same, and printed wiring board manufacturing method |
AT503191B1 (en) | 2006-02-02 | 2008-07-15 | Austria Tech & System Tech | PCB LAYER ELEMENT WITH AT LEAST ONE EMBEDDED COMPONENT AND METHOD FOR BEDDING AT LEAST ONE COMPONENT IN A LADDER PLATE ELEMENT |
DE102006009723A1 (en) | 2006-03-02 | 2007-09-06 | Siemens Ag | Method of making and planar contacting an electronic device and device made accordingly |
US7977579B2 (en) | 2006-03-30 | 2011-07-12 | Stats Chippac Ltd. | Multiple flip-chip integrated circuit package system |
JP4954765B2 (en) | 2006-04-25 | 2012-06-20 | 日本特殊陶業株式会社 | Wiring board manufacturing method |
TWI308382B (en) | 2006-07-25 | 2009-04-01 | Phoenix Prec Technology Corp | Package structure having a chip embedded therein and method fabricating the same |
JP5082321B2 (en) | 2006-07-28 | 2012-11-28 | 大日本印刷株式会社 | Multilayer printed wiring board and manufacturing method thereof |
GB2485087B (en) | 2006-08-30 | 2012-06-13 | Denso Corp | Power electronic package having two substrates with multiple semiconductor chips and electronic components |
TWI318792B (en) | 2006-09-19 | 2009-12-21 | Phoenix Prec Technology Corp | Circuit board structure having embedded semiconductor chip and fabrication method thereof |
US7505282B2 (en) * | 2006-10-31 | 2009-03-17 | Mutual-Tek Industries Co., Ltd. | Laminated bond of multilayer circuit board having embedded chips |
TWI335643B (en) | 2006-11-21 | 2011-01-01 | Unimicron Technology Crop | Circuit board structure having embedded semiconductor chip and fabrication method thereof |
JP2008166736A (en) | 2006-12-06 | 2008-07-17 | Hitachi Via Mechanics Ltd | Method for manufacturing printed-circuit board, and printed-circuit board finishing machine |
KR20080076241A (en) | 2007-02-15 | 2008-08-20 | 삼성전기주식회사 | Printed circuit board having electronic component and method for manufacturing thereof |
AT11664U1 (en) | 2007-02-16 | 2011-02-15 | Austria Tech & System Tech | METHOD FOR REMOVING A PARTIAL AREA OF A SURFACE MATERIAL LAYER AND MULTILAYER STRUCTURE AND USE HIEFÜR |
AT11663U1 (en) | 2007-02-16 | 2011-02-15 | Austria Tech & System Tech | ABSORPTION MATERIAL, METHOD FOR REMOVING A PARTIAL AREA OF A SURFACE MATERIAL LAYER, AND MULTILAYER STRUCTURE AND USE OF THE HORTOR |
DE102007010731A1 (en) | 2007-02-26 | 2008-08-28 | Würth Elektronik GmbH & Co. KG | Method for arranging electronic chip in circuit board, involves forming of cavity in circuit board and base of cavity is structured for forming connection point |
KR100885899B1 (en) | 2007-04-27 | 2009-02-26 | 삼성전기주식회사 | PCB and manufacturing method thereof |
JP5013973B2 (en) | 2007-05-31 | 2012-08-29 | 株式会社メイコー | Printed wiring board and method for manufacturing the same, electronic component housing board using the printed wiring board, and method for manufacturing the same |
US8237259B2 (en) | 2007-06-13 | 2012-08-07 | Infineon Technologies Ag | Embedded chip package |
JP2009021426A (en) | 2007-07-12 | 2009-01-29 | Sharp Corp | Chip component type led and method of manufacturing the same |
TWI345432B (en) | 2007-07-26 | 2011-07-11 | Nan Ya Printed Circuit Board Corp | Method for manufacturing a rigid-flex circuit board |
KR100930642B1 (en) | 2008-02-04 | 2009-12-09 | 삼성전기주식회사 | Printed Circuit Board and Manufacturing Method Thereof |
US7935893B2 (en) | 2008-02-14 | 2011-05-03 | Ibiden Co., Ltd. | Method of manufacturing printed wiring board with built-in electronic component |
JP5224845B2 (en) | 2008-02-18 | 2013-07-03 | 新光電気工業株式会社 | Semiconductor device manufacturing method and semiconductor device |
JP5284155B2 (en) | 2008-03-24 | 2013-09-11 | 日本特殊陶業株式会社 | Component built-in wiring board |
CN101547574B (en) | 2008-03-28 | 2011-03-30 | 富葵精密组件(深圳)有限公司 | Base plate of a circuit board and a preparing method of a circuit board with a misalignment structure |
KR20090117237A (en) | 2008-05-09 | 2009-11-12 | 삼성전기주식회사 | Electronic components embedded pcb and the method for manufacturing thereof |
AT10247U8 (en) | 2008-05-30 | 2008-12-15 | Austria Tech & System Tech | METHOD FOR INTEGRATING AT LEAST ONE ELECTRONIC COMPONENT INTO A PCB AND LADDER PLATE |
JPWO2009147936A1 (en) | 2008-06-02 | 2011-10-27 | イビデン株式会社 | Manufacturing method of multilayer printed wiring board |
TWI363411B (en) | 2008-07-22 | 2012-05-01 | Advanced Semiconductor Eng | Embedded chip substrate and fabrication method thereof |
KR101486420B1 (en) | 2008-07-25 | 2015-01-26 | 삼성전자주식회사 | Chip package and stacked package using the same and method of fabricating them |
JP2010114434A (en) | 2008-10-08 | 2010-05-20 | Ngk Spark Plug Co Ltd | Component built-in wiring board and method of manufacturing the same |
AT12316U1 (en) | 2008-10-30 | 2012-03-15 | Austria Tech & System Tech | Method for integrating an electronic component into a printed circuit board |
JP5833926B2 (en) | 2008-10-30 | 2015-12-16 | アーテー・ウント・エス・オーストリア・テヒノロギー・ウント・ジュステームテッヒニク・アクチェンゲゼルシャフトAt & S Austria Technologie & Systemtechnik Aktiengesellschaft | Method for incorporating electronic components into a printed circuit board |
EP2357877B1 (en) | 2008-10-31 | 2018-06-27 | Taiyo Yuden Co., Ltd. | Method for manufacturing a printed wiring board |
DE112009003811B4 (en) | 2008-12-25 | 2017-04-06 | Mitsubishi Electric Corporation | Method for producing a printed circuit board |
FI122216B (en) | 2009-01-05 | 2011-10-14 | Imbera Electronics Oy | Rigid-flex module |
AT12322U1 (en) | 2009-01-27 | 2012-03-15 | Dcc Dev Circuits & Components Gmbh | METHOD FOR THE PRODUCTION OF A MULTILAYER CONDUCTOR PLATE, ANTI-TEMPERATURE MATERIAL AND MULTILAYER CONDUCTOR PLATE AND USE OF SUCH A PROCESS |
JP2010206124A (en) | 2009-03-06 | 2010-09-16 | Sumitomo Bakelite Co Ltd | Method of manufacturing multilayer circuit board, and multilayer circuit board |
US8049114B2 (en) | 2009-03-22 | 2011-11-01 | Unimicron Technology Corp. | Package substrate with a cavity, semiconductor package and fabrication method thereof |
TWI392404B (en) | 2009-04-02 | 2013-04-01 | Unimicron Technology Corp | Circuit board and manufacturing method thereof |
US8186042B2 (en) | 2009-05-06 | 2012-05-29 | Bae Systems Information And Electronic Systems Integration Inc. | Manufacturing method of a printed board assembly |
US7863735B1 (en) | 2009-08-07 | 2011-01-04 | Stats Chippac Ltd. | Integrated circuit packaging system with a tiered substrate package and method of manufacture thereof |
US20110089531A1 (en) | 2009-10-16 | 2011-04-21 | Teledyne Scientific & Imaging, Llc | Interposer Based Monolithic Microwave Integrate Circuit (iMMIC) |
KR101095130B1 (en) | 2009-12-01 | 2011-12-16 | 삼성전기주식회사 | A printed circuit board comprising embeded electronic component within and a method for manufacturing the same |
US8664043B2 (en) * | 2009-12-01 | 2014-03-04 | Infineon Technologies Ag | Method of manufacturing a laminate electronic device including separating a carrier into a plurality of parts |
JP5490525B2 (en) | 2009-12-28 | 2014-05-14 | 日本シイエムケイ株式会社 | Component built-in type multilayer printed wiring board and method for manufacturing the same |
US8901724B2 (en) | 2009-12-29 | 2014-12-02 | Intel Corporation | Semiconductor package with embedded die and its methods of fabrication |
CN102131348A (en) | 2010-01-20 | 2011-07-20 | 奥特斯(中国)有限公司 | Method for manufacturing rigid-flexible printed circuit board |
JP2011148930A (en) | 2010-01-22 | 2011-08-04 | Nitto Denko Corp | Adhesive sheet |
US8354743B2 (en) | 2010-01-27 | 2013-01-15 | Honeywell International Inc. | Multi-tiered integrated circuit package |
WO2011099820A2 (en) | 2010-02-12 | 2011-08-18 | Lg Innotek Co., Ltd. | Pcb with cavity and fabricating method thereof |
US8227344B2 (en) * | 2010-02-26 | 2012-07-24 | Tokyo Electron Limited | Hybrid in-situ dry cleaning of oxidized surface layers |
KR101067109B1 (en) | 2010-04-26 | 2011-09-26 | 삼성전기주식회사 | A printed circuit board comprising embeded electronic component within and a method for manufacturing |
US8519270B2 (en) | 2010-05-19 | 2013-08-27 | Unimicron Technology Corp. | Circuit board and manufacturing method thereof |
KR101085733B1 (en) | 2010-05-28 | 2011-11-21 | 삼성전기주식회사 | Printed circuit board having electronic component and method for manufacturing thereof |
US8289727B2 (en) | 2010-06-11 | 2012-10-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package substrate |
KR101710178B1 (en) | 2010-06-29 | 2017-02-24 | 삼성전자 주식회사 | An embedded chip on chip package and package on package including the same |
EP2416633A1 (en) | 2010-08-04 | 2012-02-08 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Method for fixing and/or embedding an electronic component and adhesive for use in such a method |
JP2012044102A (en) | 2010-08-23 | 2012-03-01 | Hitachi Cable Ltd | Light-emitting device and method of manufacturing the same and wiring board |
US9420694B2 (en) | 2010-08-31 | 2016-08-16 | Ge Embedded Electronics Oy | Method for controlling warpage within electronic products and an electronic product |
DE102010042567B3 (en) | 2010-10-18 | 2012-03-29 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method for manufacturing a chip package and chip package |
AT13430U1 (en) | 2010-11-19 | 2013-12-15 | Austria Tech & System Tech | METHOD FOR DETERMINING A COMPONENT IN BZW. ON A PCB AND LADDER PLATE |
US9406658B2 (en) | 2010-12-17 | 2016-08-02 | Advanced Semiconductor Engineering, Inc. | Embedded component device and manufacturing methods thereof |
US8736065B2 (en) | 2010-12-22 | 2014-05-27 | Intel Corporation | Multi-chip package having a substrate with a plurality of vertically embedded die and a process of forming the same |
US8735739B2 (en) | 2011-01-13 | 2014-05-27 | Ibiden Co., Ltd. | Wiring board and method for manufacturing the same |
JP2013038374A (en) | 2011-01-20 | 2013-02-21 | Ibiden Co Ltd | Wiring board and manufacturing method of the same |
JP2012164952A (en) | 2011-01-20 | 2012-08-30 | Ibiden Co Ltd | Wiring board with built-in electronic component and method of manufacturing the same |
JP5830864B2 (en) | 2011-01-20 | 2015-12-09 | 大日本印刷株式会社 | Capacitor built-in wiring board and method for manufacturing capacitor built-in wiring board |
AT13055U1 (en) | 2011-01-26 | 2013-05-15 | Austria Tech & System Tech | METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A CONDUCTOR PLATE OR A PCB INTERMEDIATE PRODUCT AND PCB OR INTERMEDIATE CIRCUIT PRODUCT |
AT13436U1 (en) | 2011-08-31 | 2013-12-15 | Austria Tech & System Tech | METHOD FOR INTEGRATING A COMPONENT INTO A PCB OR A PCB INTERMEDIATE PRODUCT, AND A PCB OR INTERMEDIATE CIRCUIT PRODUCT |
AT13432U1 (en) | 2011-08-31 | 2013-12-15 | Austria Tech & System Tech | METHOD FOR INTEGRATING A COMPONENT INTO A PCB OR A PCB INTERMEDIATE PRODUCT, AND A PCB OR INTERMEDIATE CIRCUIT PRODUCT |
KR101253514B1 (en) | 2011-10-27 | 2013-04-11 | 아페리오(주) | Method of resolving substrate warpage problem due to differences in thermal coefficients and electronic component embedded printed circuit board manufactured thereof |
US9040837B2 (en) | 2011-12-14 | 2015-05-26 | Ibiden Co., Ltd. | Wiring board and method for manufacturing the same |
AT13434U1 (en) | 2012-02-21 | 2013-12-15 | Austria Tech & System Tech | Method for producing a printed circuit board and use of such a method |
JP2013211519A (en) | 2012-02-29 | 2013-10-10 | Ngk Spark Plug Co Ltd | Method for manufacturing multilayer wiring board |
US20130256884A1 (en) | 2012-03-27 | 2013-10-03 | Intel Mobile Communications GmbH | Grid fan-out wafer level package and methods of manufacturing a grid fan-out wafer level package |
AT513047B1 (en) | 2012-07-02 | 2014-01-15 | Austria Tech & System Tech | Method for embedding at least one component in a printed circuit board |
KR20140053563A (en) | 2012-10-26 | 2014-05-08 | 삼성전기주식회사 | Laminated base meterial, substrate manufacturing method using the same, substrate |
CN203072250U (en) | 2012-12-20 | 2013-07-17 | 奥特斯(中国)有限公司 | Semi-finished product for production of printed circuit board and printed circuit board |
KR20140081193A (en) | 2012-12-21 | 2014-07-01 | 삼성전기주식회사 | Hybrid substrate with high density and low density substrate area and manufacturing method thereof |
CN203015273U (en) | 2012-12-24 | 2013-06-19 | 奥特斯(中国)有限公司 | Printed circuit board |
CN203072246U (en) | 2012-12-31 | 2013-07-17 | 奥特斯(中国)有限公司 | Semi-finished product for production of printed circuit board |
US9735128B2 (en) | 2013-02-11 | 2017-08-15 | The Charles Stark Draper Laboratory, Inc. | Method for incorporating stress sensitive chip scale components into reconstructed wafer based modules |
CN203206586U (en) | 2013-02-27 | 2013-09-18 | 奥特斯(中国)有限公司 | A semi-finished product used for producing a printed circuit board |
KR20140110553A (en) | 2013-03-08 | 2014-09-17 | 삼성디스플레이 주식회사 | Anisotropic conductive film, display device, and manufacturing method of display device |
AT514085B1 (en) | 2013-06-11 | 2014-10-15 | Austria Tech & System Tech | power module |
WO2015077808A1 (en) | 2013-11-27 | 2015-06-04 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Circuit board structure |
US9949376B2 (en) * | 2013-12-06 | 2018-04-17 | Second Sight Medical Products, Inc. | Cortical implant system for brain stimulation and recording |
AT515101B1 (en) | 2013-12-12 | 2015-06-15 | Austria Tech & System Tech | Method for embedding a component in a printed circuit board |
AT515372B1 (en) | 2014-01-29 | 2019-10-15 | At & S Austria Tech & Systemtechnik Ag | Method for producing a printed circuit board |
US11523520B2 (en) | 2014-02-27 | 2022-12-06 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Method for making contact with a component embedded in a printed circuit board |
AT515447B1 (en) | 2014-02-27 | 2019-10-15 | At & S Austria Tech & Systemtechnik Ag | Method for contacting a component embedded in a printed circuit board and printed circuit board |
JP2015220281A (en) | 2014-05-15 | 2015-12-07 | イビデン株式会社 | Printed wiring board |
US9913385B2 (en) | 2015-07-28 | 2018-03-06 | Bridge Semiconductor Corporation | Methods of making stackable wiring board having electronic component in dielectric recess |
-
2014
- 2014-10-09 WO PCT/AT2014/050239 patent/WO2015077808A1/en active Application Filing
- 2014-10-09 EP EP14805471.1A patent/EP3075006A1/en active Pending
- 2014-10-09 US US15/039,372 patent/US10219384B2/en active Active
- 2014-10-09 CN CN201480074135.0A patent/CN105934823A/en active Pending
-
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- 2018-12-19 US US16/225,567 patent/US11172576B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1424731A2 (en) * | 2002-11-26 | 2004-06-02 | Shinko Electric Industries Co., Ltd. | Electronic parts packaging structure and method of manufacturing the same |
DE102008040906A1 (en) * | 2008-07-31 | 2010-02-04 | Robert Bosch Gmbh | Printed circuit board with electronic component |
US20120247819A1 (en) * | 2011-03-31 | 2012-10-04 | Tdk Corporation | Electronic component-embeded board and method for manufacturing the same |
US20130146991A1 (en) * | 2011-12-08 | 2013-06-13 | Infineon Technologies Ag | Device Including Two Power Semiconductor Chips and Manufacturing Thereof |
Non-Patent Citations (1)
Title |
---|
See also references of WO2015077808A1 * |
Also Published As
Publication number | Publication date |
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US20170164481A1 (en) | 2017-06-08 |
US10219384B2 (en) | 2019-02-26 |
CN105934823A (en) | 2016-09-07 |
US11172576B2 (en) | 2021-11-09 |
WO2015077808A1 (en) | 2015-06-04 |
US20190150288A1 (en) | 2019-05-16 |
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