CN102131348A - Method for manufacturing rigid-flexible printed circuit board - Google Patents
Method for manufacturing rigid-flexible printed circuit board Download PDFInfo
- Publication number
- CN102131348A CN102131348A CN2010100046651A CN201010004665A CN102131348A CN 102131348 A CN102131348 A CN 102131348A CN 2010100046651 A CN2010100046651 A CN 2010100046651A CN 201010004665 A CN201010004665 A CN 201010004665A CN 102131348 A CN102131348 A CN 102131348A
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- China
- Prior art keywords
- subregion
- flexible
- printed circuit
- circuit board
- pcb
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09127—PCB or component having an integral separable or breakable part
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Abstract
The invention relates to a method for manufacturing a rigid-flexible printed circuit board. The printed circuit board comprises at least one flexible subregion (I) and at least one rigid subregion (II) at least connected with at least one fringe region of the flexible subregion, and is characterized in that in order to remove an element (10) covering the flexible subregion, cutting parts (8) for layers covering the flexible subregion are arranged in the rigid subregion (II) and outside at least one peripheral seamed edge of the flexible subregion; the cutting parts extend to the positions have the same height with a cavity (5) positioned in the flexible subregion (I); and the elements covering the cavity and the flexible subregion is tripped off from the peripheral or connected rigid subregion (II) within the cutting part (8) region under the action of mechanical load, thus, rigid-flexible printed circuit boards can be manufactured simply and reliably on the premise of not damaging the flexible subregion.
Description
Technical field
The present invention relates to a kind of method that is used to make the printed circuit board (PCB) of rigid-flexible, this method comprises the steps:
At least one flexible subregion of the printed circuit board (PCB) that will make is provided;
At least one rigidity subregion of the printed circuit board (PCB) that will make is provided and is connected with at least one fringe region of flexible subregion or seamed edge zone at least;
At least one of the printed circuit board (PCB) that foundation will be made layer other, especially whole, this moment above the flexible subregion and/or below flexible subregion is capped under the situation of cavity keeping; And
After the foundation of finishing the rigidity subregion, under the situation of removing the element that constitutes by the layer that covers flexible subregion, expose flexible subregion.
Background technology
About the known multiple diverse ways of manufacturing of the printed circuit board (PCB) of flexibility-rigidity, wherein after foundation comprises the printed circuit board (PCB) of interconnective rigidity and flexible subregion, remove the layer on the flexible subregion that needs expose usually.In this contact for example with reference to JP-A 2004031682, JP-A 2003198133, US-PS 4931134 or US-A 2009/0026168.Especially in the end the method for open the above-mentioned type in the document of mentioning, wherein after interconnective at least one flexible subregion that the printed circuit board (PCB) that will make is provided and at least one rigidity subregion, the other layer of the printed circuit board (PCB) that layout will be made, and after finishing this structure, under employing is arranged at the situation of the cavity on the flexible subregion, expose flexible subregion.In pressing the known form of implementation of US-A 2009/0026168, cavity hides by the copper layer on the flexible subregion that afterwards needs to expose, then finishing printed circuit board (PCB) after, on the end regions of the flexible subregion that needs expose, for example produce otch until the copper layer of covering cavity by laser, under the situation of using the corrosion solvent, remove the copper layer then, described solvent is directly run into flexible subregion after cutting off the copper layer surface so that finally expose flexible subregion.For fear of damaging the flexible subregion that this needs expose, covering layer additionally is set on flexible subregion in by the known form of implementation of US-A 2009/0026168, and this covering layer is for example for the conducting in flexible region later on or for corresponding member is set and must removes bothersomely.But using the corrosion solvent so that exposing may directly damage under the situation of flexible subregion to be exposed to lip-deep structure of flexible subregion or member when abandoning covering layer, making the additional step that to abandon taking a lot of trouble according to this known systems: applying corresponding covering layer or protective layer and remove described covering layer or protective layer to small part later on.
Summary of the invention
The objective of the invention is to, improve the method for aforementioned type, therefore avoid the problems referred to above of prior art.The objective of the invention is in addition, the method of aforementioned type is provided, safety and can expose flexible subregion in simple and reliable mode reliably after manufacturing has the printed circuit board (PCB) of at least one flexible subregion and at least one rigidity subregion especially should avoid damaging the lip-deep structure that may be exposed to flexible subregion reliably whereby.
In order to achieve the above object, the feature of the method for aforementioned type mainly is: in order to remove the element that covers flexible subregion, realize to cover the cut-out portion of the layer of flexible subregion outside at least one periphery seamed edge of flexible subregion on the rigidity subregion, described cut-out portion is up to the height that is positioned at the cavity on the flexible subregion; And the element that hides cavity and flexible subregion is especially thrown off with rigidity subregion on every side or that be connected in the zone in cut-out portion under the effect of mechanical load or power later on.By the present invention for required the exposing of flexible subregion after finishing printed circuit board (PCB) in the cut-out that is positioned at the layer of realizing covering flexible subregion on zone on the rigidity subregion or the position, and described cut-out is until corresponding to the height that is positioned at the cavity on the flexible subregion, therefore guarantee, both made at the chemicals that uses corrosion so that make cut-out portion or, at the flexible subregion of covering not so that expose under the situation of flexible subregion with changing, with the element of the form of lid be connected (abgesetzt) connecting portion that has bar shaped or formation convex shoulder between the rigidity subregion on the flexible subregion.Therefore prevent reliably by method of the present invention, thereby the especially chemicals of corrosion that may adopt especially enters the surface that the cavity that is arranged on the flexible subregion also may damage flexible subregion when exposing flexible subregion.For finally remove after cutting off, hide flexible subregion, with the subregion of the form of covering linear element, by the present invention suggestion, thereby mechanical load or power are acted in the zone of cut-out portion above the rigidity subregion and act in the zone of connecting portion bar shaped or the formation convex shoulder.By this overlapping or size that covers of corresponding selection in the zone of connecting portion bar shaped or that constitute convex shoulder, can in wide scope, select or regulate in addition in order in the step of continuation, to remove the required power of lid linear element of the flexible subregion of covering.The removing of element that hides flexible subregion can be carried out after automatically constituting cut-out portion basically under the situation of less bending load; perhaps especially for following situation; promptly other operating procedure of printed circuit board (PCB) should be essential by especially applying lid linear element defencive function, that hide flexible subregion under the state that cuts off, and could remove the element that hides flexible subregion by applying stronger mechanical force or load after carrying out other such procedure of processing.
According to a kind of preferred form of implementation suggestion, flexible subregion constituted the surface of conduction to small part before hiding under the situation that keeps cavity.Therefore becoming possible is, in the printed circuit board (PCB) of making following rigid-flexible, adopt method of the present invention, wherein on the surface of the flexible subregion that needs afterwards under the situation that keeps cavity to expose, can directly be provided with or adopt the surf zone or the conductive structure of conduction, the feasible opposite corresponding and additional covering layer of can abandoning constituting with prior art.By method of the present invention, wherein after cutting off and finally removing and be provided with before the element that hides flexible subregion or zone bar shaped or that constitute convex shoulder is provided, so during cutting-off process or in order to expose the chemicals that the element that hides flexible subregion avoids damaging or to destroy the corrosion of conductive surface or conductive structure reliably, enter.
In the reliable and simple contact of the printed circuit board (PCB) of rigid-flexible, wherein flexible subregion should expose after finishing, suggestion in addition, described at least one layer that covers flexible subregion is made of the layer that is used to set up the rigidity subregion, and this point is corresponding to a kind of preferred form of implementation of method of the present invention.
Must guarantee reliably when after adopting laser manufacturing cut-out portion to be used for, removing the zone that hides flexible subregion or element that laser only enters into corresponding to the level of the cavity on the flexible subregion or highly always.Except corresponding adjusting laser power, when making cut-out portion, for example, corresponding layer correspondingly limits this entering by being set, the entering or cutting off under the situation of the plastic material that printed circuit board (PCB) adopted of especially considering to be used to make or constituting rigid-flexible under the situation of the power of selecting of corresponding layer with simple mode limit laser, make and in the zone of the later cut-out that is used to expose flexible subregion, on the height at cavity metal level is set, especially copper layer, this is corresponding to another preferred form of implementation of method of the present invention.This metal level can not cut off or only could cut off under the situation of corresponding higher power by laser (described laser is used for cutting off for the plastic material that adopts usually in making printed circuit board (PCB)), make and to realize entering the restriction of the degree of depth reliably, so that make one or more cut-out portion by this metal level is set.
According to another preferred form of implementation suggestion,, make and in wide boundary, can select or regulate for the required power of element of removing the flexible subregion of covering after the size by the overlapping region as mentioned above according to selecting in the width that is constituting the overlapping region that keeps after the cut-out portion of the rigidity subregion outside the periphery seamed edge of flexible subregion or size for removing the required mechanical load of operation.
Expose flexible subregion after cut-out is used for especially reliably, by another preferred form of implementation suggestion, cut-out portion makes by the combination of method for milling, cutting method especially laser cutting method, caustic solution or these methods.Such method is known in the contact of manufacturing or processing printed circuit board usually, make method of the present invention to carry out adopting under the situation of making common or known method in the printed circuit board (PCB), and especially in the scope of the method for making printed circuit board (PCB) essential the exposing for flexible subregion do not need new bothersome processing step.
In addition according to a kind of particularly preferred form of implementation suggestion, after making cut-out portion, keep, constitute by dielectric material and conductive film with rigidity subregion overlapping areas, so especially in the time must removing flexible subregion, obtain shirtsleeve operation.
Known in the contact of the printed circuit board (PCB) of making rigid-flexible, be arranged on the width of this flexible region between two rigid regions of printed circuit board (PCB) or size usually usually less than the rigidity subregion that connects thereon.This structure for flexible subregion, subproposal in addition, the subregion a plurality of flexibilities and/or rigidity of removing printed circuit board (PCB) by milling process and/or cutting technique before removing the element that hides flexible subregion, this is corresponding to another preferred form of implementation of method of the present invention.
In order to improve the especially patience of machinery of flexible subregion, advise preferably that in addition flexible subregion to small part is provided with to be strengthened or fastening element, or reinforcement or back-up coat, they constitute after removing the element that covers flexible subregion or are exposed.
Suggestion in addition in the contact of the printed circuit board (PCB) of making rigid-flexible of the present invention as far as possible simple and reliablely, flexible subregion is made of core, described core not only extends through the flexible subregion of the printed circuit board (PCB) that will make but also extends through the rigidity subregion that is connected on the flexible subregion to small part by known mode itself, and this is corresponding to another preferred form of implementation of the inventive method.
Description of drawings
The embodiment by the method for the printed circuit board (PCB) that is used to make rigid-flexible of the present invention that describes by means of signal in the accompanying drawings explains the present invention in detail below.Wherein:
Fig. 1 shows the cutaway view of signal of first form of implementation of the printed circuit board (PCB) of rigid-flexible, this printed circuit board (PCB) is by method manufacturing of the present invention, flexible subregion is connected with rigidity subregion in abutting connection with this flexibility subregion in the process of this manufacture method, and hides flexible subregion under the situation that constitutes cavity on the flexible subregion;
Fig. 2 shows the printed circuit board (PCB) that is described in the rigid-flexible among Fig. 1, wherein applies additional layer for the printed circuit board (PCB) that constitutes rigid-flexible;
Fig. 3 shows by the printed circuit board (PCB) of the rigid-flexible of Fig. 2 with the ratio of dwindling, and wherein additionally constitutes cut-out portion, exposes flexible subregion after being used for;
Fig. 3 a wherein is presented in detail and removes overlapping region element bar shaped before or that constitute convex shoulder that hides flexible subregion with the part of the ratio displayed map 3 of amplification;
Fig. 4 shows the perspective illustration of printed circuit board (PCB) before exposing the subregion of rigid-flexible by the rigid-flexible of Fig. 2;
Fig. 5 shows the view that be similar to Fig. 4 of rigid-flexible subregion after it exposes, and the width of visible flexible subregion is less than the width that connects rigidity subregion thereon in addition;
Fig. 6 shows the view that is similar to Fig. 3 by the modification form of implementation of the printed circuit board (PCB) of the rigid-flexible of method manufacturing of the present invention, the cut-out portion of after this represents again to be used for, exposing flexible subregion, and Fig. 6 is half of the view of displayed map 3 only basically;
Fig. 7 is presented at and removes the printed circuit board (PCB) that the element that hides flexible subregion is described in the rigid-flexible among Fig. 6 afterwards;
This shows with the view that is similar to Fig. 3 and another modification form of implementation of the printed circuit board (PCB) of the rigid-flexible of making by method of the present invention wherein is illustrated in the reinforcing or the reinforcing element that add in the flexible subregion Fig. 8 again;
Fig. 9 is presented at the printed circuit board (PCB) of removing after the lid linear element that hides flexible subregion by the rigid-flexible of Fig. 8 with the view that is similar to Fig. 7.
Embodiment
The profile of the printed circuit board (PCB) 1 of rigid-flexible is described in signal in Fig. 1, and wherein flexible core is labeled as 2, and it has maybe can have a plurality of layers of not describing in detail.
In order to constitute the rigidity subregion of printed circuit board (PCB) 1, layer 3 is pressed known printing own or drawing method or laminating to be connected with this core 2, these layers 3 hide by the layer 4 that is made of metal material, especially copper in form of implementation shown in Figure 1, make and determine a cavity 5 respectively on the flexible subregion that needs to expose in the continuation step after the printed circuit board (PCB) 1 of finishing rigid-flexible, this flexibility subregion is labeled as I.
The rigidity subregion that is connected on the flexible subregion I is labeled as II.
In order to continue to constitute the printed circuit board (PCB) 1 of rigid-flexible, as shown in Figure 2, adopt other layer 6,7, as this point with the getting in touch of the structure of the printed circuit board (PCB) 1 of multilayer in itself be known, therefore do not discuss in detail at this.
By be illustrated in Figures 1 and 2, in the step that continues, need the structure exposed, be connected with the flexible subregion I of rigidity subregion II, it can be enough that unique layer 3 is used to keep cavity 5 by for example low fluidity prepreg of cheap material, and other layer the 6, the 7th, material common, that adopt when making the printed circuit board (PCB) 1 of multilayer, that be made of the raw material of corresponding cheapness.
For after the printed circuit board (PCB) 1 of finishing rigid-flexible, in the step that continues, requiring to expose flexible subregion I, as Fig. 3 and especially as seen as the partial enlarged drawing of Fig. 3 a, corresponding to flexible subregion I, it is corresponding to position cavity 5 qualifications thereon, thereby outside the flexible subregion I and constituting cut-out portion 8 respectively within rigidity subregion II, these cut-out portions extend to the height corresponding with cavity 5 always.
Especially as seen by Fig. 3 a, keep zone 9 bar shaped or that constitute convex shoulder, the lid linear element (being labeled as 10 generally) that hides flexible subregion I in this zone constitutes overlapping 11, makes at Fig. 3 and especially set adhering to or connecting of the element 10 of the lid shape of the flexible subregion I of covering with changing under the state shown in Fig. 3 a.
Size or intensity according to the connection in overlapping 11 zone, for covering linear element 10 and expose flexible subregion I later on by removing, each schemes as seen to be made of the layer that constitutes rigidity subregion II described element before thus, need in various degree mechanical load or power, so that expose the core 2 of flexible subregion I later on.
By in bar shaped or constitute in the zone of projection 9 of convex shoulder and be provided with overlapping 11, for example adopting the chemicals that corrodes at 4 o'clock, therefore can avoid the damage or the destruction on the surface of flexible subregion I in addition especially for the layer that cuts off metal prevented that this chemicals from entering in the cavity 5.
Schematically illustrate exposing of flexible subregion in Figure 4 and 5, the printed circuit board (PCB) 1 of the rigid-flexible of multilayer is in the state that is similar to Fig. 2 in Fig. 4.Set out by this state, remove the subregion or the element on the next door of the flexible subregion I that exposes at needs, the width of this flexibility subregion is usually less than the rigidity subregion II that connects thereon, and this needs are removed is labeled as 12 element and for example removes by milling process in Fig. 4.
Especially after removing element 12, shown in Fig. 3 a, the lid linear element 10 of the flexible subregion I of the covering that and then also will keep after making cut-out portion 8 is removed, as shown in Figure 5.
The printed circuit board (PCB) 13 that shows a kind of rigid-flexible in pressing the modification form of implementation of Fig. 6 and 7 covers by cavity 15 again at the core 14 of this multilayer.The layer that is used to constitute the rigidity subregion II on the flexible subregion that is connected in and is labeled as I and only part description is labeled as 16 and 17.
As in the view of Fig. 3, constitute cut-out portion 8 again for exposing flexible subregion I later on, in being described in the form of implementation of Fig. 6, this cut-out portion 8 is for example by the laser manufacturing, and the degree of depth of cut-out portion 8 limits by being labeled as 18 metal level again.
For the cut-out of this metal level, according to arrow 19, use the chemicals of corrosion again, avoid this chemicals to enter in the cavity 15 by the overlapping region 20 that is provided with again corresponding to delivery section 19.
Represent that in the view of Fig. 6 the subregion of the core 14 of flexible subregion hides by covering layer 21, but a subregion especially is set, and constitutes the surface or the structure of conduction at this in zone line.
By overlapping portion is set in the zone of projection 20, when adopting the chemicals 19 of corrosion, avoid it to enter in the cavity 15, therefore can protect in the lip-deep structure 22 that constitutes by electric conducting material of flexible subregion I and avoid damaging.
The printed circuit board (PCB) of the rigid-flexible of displayed map 6 has been removed the lid linear element 35 that hides flexible subregion I in Fig. 7.
In Fig. 8 and 9, describe another modification form of implementation of the printed circuit board (PCB) 23 of rigid-flexible, be similar to last embodiment, set out, under the situation of using other layer 25,26, realize the structure of the printed circuit board (PCB) 23 of multilayer again by core 24.
Represent cut-out portion 8 again for exposing flexible subregion I later on, use the chemicals of corrosion again by arrow 19 expressions.
With the same in last form of implementation, in flexible subregion, represent the zone that does not hide of conductive surface or conductive structure 28 again by covering layer 27.
In the form of implementation shown in Fig. 8 and 9, set in addition, in flexible subregion I, be provided with and strengthen or fastening element 29,30, as especially as seen from Figure 9, described reinforcing element 29,30 or constitute or correspondingly exposed by the material of the rigid material of the flexible subregion I of original covering.
In the form of implementation shown in Fig. 8 and 9, in projection or constitute the overlapping portion that also constitutes the lid linear element 34 that hides flexible subregion I in the zone of subregion 31 of convex shoulder, make that the same chemicals that can avoid especially corroding with aforementioned each form of implementation enters in the cavity 32 according to arrow 19.
Claims (10)
1. be used to make the method for the printed circuit board (PCB) of rigid-flexible, this method comprises the steps:
At least one flexible subregion (I) of the printed circuit board (PCB) (1,13,23) that will make is provided;
At least one rigidity subregion (II) of the printed circuit board (PCB) (1,13,23) that will make is provided and is connected with at least one fringe region of flexible subregion (I) or seamed edge zone at least;
At least one of the printed circuit board (PCB) that foundation will be made (1,13,23) layer other, especially whole (6,7,16,17,25,26) is keeping under the situation of cavity (5,15,32) covering flexible subregion (I) this moment in flexible subregion (I) top and/or below; And
After the foundation of finishing rigidity subregion (II), under the situation of removing the element (10,35,34) that constitutes by the layer that covers flexible subregion (I), expose flexible subregion (I);
It is characterized in that: in order to remove the element (10,35,34) that covers flexible subregion (I), go up to realize cover the cut-out portion (8) of the layer of flexible subregion (I) outside at least one periphery seamed edge of flexible subregion (I) at rigidity subregion (II), described cut-out portion is up to the height that is positioned at the cavity (5,15,32) on the flexible subregion (I); And the element that hides cavity (5,15,32) and flexible subregion (I) is especially being thrown off with rigidity subregion on every side or that be connected (II) in the zone in cut-out portion (8) under the effect of mechanical load or power later on.
2. method according to claim 1 is characterized in that: flexible subregion (I) constituted the surface (22,28) of conduction to small part before hiding under the situation that keeps cavity (15,32).
3. method according to claim 1 and 2 is characterized in that: described at least one layer (6,7,17,26) that covers flexible subregion (I) is made of the layer that is used to set up rigidity subregion (II).
4. according to claim 1,2 or 3 described methods, it is characterized in that: in the zone of the later cut-out portion (8) that is used to expose flexible subregion (I), metal level (4) is set, especially the copper layer on the height of cavity.
5. according to each described method of claim 1 to 4, it is characterized in that: the rigidity subregion (II) outside the periphery seamed edge of flexible subregion (I) in the width that constitutes the overlapping areas (11,20,31) that cut-out portion (8) keeps afterwards or size according to operating required mechanical load and select for removing.
6. according to each described method of claim 1 to 5, it is characterized in that: cut-out portion (8) makes by the combination of method for milling, cutting method especially laser cutting method, caustic solution or these methods.
7. according to each described method of claim 1 to 6, it is characterized in that: make that cut-out portion (8) keeps afterwards, and rigidity subregion (II) overlapping areas (11,20,31) constitute by dielectric material and conductive film.
8. according to each described method of claim 1 to 7, it is characterized in that: in the element (10) of removing the flexible subregion of covering (I) is removed printed circuit board (PCB) before by milling process or cutting technique subregion a plurality of flexibilities and/or rigidity (12).
9. according to each described method of claim 1 to 8, it is characterized in that: flexible subregion (I) to small part is provided with to be strengthened or fastening element, perhaps strengthen or back-up coat (29,30), they constitute afterwards or are exposed removing the element (34) that covers flexible subregion (I).
10. according to each described method of claim 1 to 9, it is characterized in that: flexible subregion (I) is made of core (2,14,24), and described core not only extends through the flexible subregion (I) of the printed circuit board (PCB) (1,13,23) that will make by known mode itself but also extends through the rigidity subregion (II) on the flexible subregion of being connected in of the printed circuit board (PCB) that will make to small part.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010100046651A CN102131348A (en) | 2010-01-20 | 2010-01-20 | Method for manufacturing rigid-flexible printed circuit board |
| PCT/AT2011/000029 WO2011088489A1 (en) | 2010-01-20 | 2011-01-18 | Method for producing a rigid-flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010100046651A CN102131348A (en) | 2010-01-20 | 2010-01-20 | Method for manufacturing rigid-flexible printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102131348A true CN102131348A (en) | 2011-07-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010100046651A Pending CN102131348A (en) | 2010-01-20 | 2010-01-20 | Method for manufacturing rigid-flexible printed circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102131348A (en) |
| WO (1) | WO2011088489A1 (en) |
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| CN110034389A (en) * | 2019-04-19 | 2019-07-19 | 歌尔科技有限公司 | A kind of electronic equipment and its antenna |
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| WO2015077808A1 (en) | 2013-11-27 | 2015-06-04 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Circuit board structure |
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| AT515447B1 (en) | 2014-02-27 | 2019-10-15 | At & S Austria Tech & Systemtechnik Ag | Method for contacting a component embedded in a printed circuit board and printed circuit board |
| US11523520B2 (en) | 2014-02-27 | 2022-12-06 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Method for making contact with a component embedded in a printed circuit board |
| CN105208801B (en) * | 2015-08-11 | 2018-07-31 | 深圳崇达多层线路板有限公司 | A kind of rigid-flex combined board cover film applying method |
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| EP4093165A1 (en) * | 2021-05-20 | 2022-11-23 | Würth Elektronik GmbH & Co. KG | Printed insulating protective coating |
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- 2010-01-20 CN CN2010100046651A patent/CN102131348A/en active Pending
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2011
- 2011-01-18 WO PCT/AT2011/000029 patent/WO2011088489A1/en active Application Filing
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109760122A (en) * | 2018-12-24 | 2019-05-17 | 江苏弘信华印电路科技有限公司 | A kind of half cutting method of mold for taking off lid for rigid-flex combined board |
| CN110034389A (en) * | 2019-04-19 | 2019-07-19 | 歌尔科技有限公司 | A kind of electronic equipment and its antenna |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011088489A1 (en) | 2011-07-28 |
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Application publication date: 20110720 |