JP2008235506A - Drawer part structure of flexible circuit substrate on mounting board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a drawer part structure of a flexible circuit substrate on a mounting board capable of preventing the drawer part of the flexible circuit substrate from being damaged by the side of the mounting board. <P>SOLUTION: A flexible circuit substrate 30 is laid on a mounting board 10 comprising a metal plate. A drawer part 33 projecting from the outer periphery of the flexible circuit substrate 30 is pulled outside the mounting board 10. An inclined part (a substrate damage prevention part) 13 formed by a crash processing is provided on the side 11a of the outer periphery 11 of the mounting board 10. The drawer part 33 is arranged on the inclined part 13. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a lead-out structure of a flexible circuit board on a mounting plate, in which a lead-out part of a flexible circuit board placed on a mounting plate made of a metal plate is pulled out to the outside of the side of the mounting plate.

  Conventionally, since a flexible circuit board has flexibility, it is used by being mounted on a mounting plate made of a metal plate, a synthetic resin plate, or the like (for example, the mounting plate 80 and the flexible substrate 60 of FIG. 1 of Patent Document 1). ). As shown in FIG. 1 of Patent Document 1, there is a case where the flexible circuit board is pulled out from the outer periphery of the flexible circuit board so as to protrude, for example, and a leading end of the lead-out part is connected to another circuit board. When the lead-out portion of the flexible circuit board is pulled out outside the outer periphery of the mounting plate, the lead-out portion passes over the outer periphery of the mounting plate.

However, when the mounting plate is a metal plate, the outer periphery of the mounting plate is generally an acute angle. Therefore, when the mounting plate on which the flexible circuit board is mounted is transported or incorporated in a case or the like, the drawer portion is It strongly abuts the sharp outer periphery of the mounting plate, the insulating layer covering the circuit pattern on the drawer part is peeled off, the circuit pattern is shorted to the mounting plate, the circuit pattern on the drawer part is disconnected, There was a possibility that the synthetic resin film constituting the lead-out portion might be damaged. In addition, when the metal mounting plate is manufactured by press cutting, a burr which is a so-called acute protrusion is generated in the outer periphery of the metal mounting plate. However, if the drawer portion is in strong contact with the burr, the above problem is further increased. It gets bigger.
JP 2005-317740 A

  The present invention has been made in view of the above points, and an object of the present invention is to provide a lead-out structure of a flexible circuit board on a mounting plate that can prevent the lead-out part of the flexible circuit board from being damaged by the side of the mounting plate. There is.

  According to the first aspect of the present invention, a flexible circuit board is placed on a mounting plate made of a metal plate, and a lead-out portion protruding from the outer periphery of the flexible circuit board is drawn out to the outside of the side of the mounting plate. In the lead-out structure of the flexible circuit board, the mounting plate is characterized in that a substrate damage prevention portion comprising an inclined portion by crushing is provided on the side of the mounting plate, and the lead-out portion is disposed on the substrate damage prevention portion. It is in the drawer part structure of the upper flexible circuit board. Here, the outside of the side of the mounting plate is a concept including the side of the outer periphery of the mounting plate and the side of the inner periphery of the opening provided in the mounting plate.

  According to the second aspect of the present invention, the flexible circuit board is placed on the mounting plate made of a metal plate, and the lead-out portion protruding from the outer periphery of the flexible circuit board is drawn out to the outside of the side of the mounting plate. In the flexible circuit board lead-out part structure, a board damage prevention part comprising a side that is rounded when press cutting to form the side of the mounting plate is provided, and the lead-out part is disposed on the board damage prevention part In the lead-out portion structure of the flexible circuit board on the mounting plate characterized by the above.

  In the invention according to claim 3 of the present application, the flexible circuit board is placed on the mounting plate made of a metal plate, and the lead-out portion protruding from the outer periphery of the flexible circuit board is drawn out to the outside of the side of the mounting plate. In the flexible circuit board lead-out part structure, a board damage preventing part formed by bending the side part of the mounting plate toward the side opposite to the surface on which the flexible circuit board is placed is provided on the side part of the mounting board. And a lead-out portion structure of a flexible circuit board on a mounting plate, wherein the lead-out portion is disposed on the substrate damage prevention portion.

  In the invention according to claim 4 of the present invention, the flexible circuit board is placed on the mounting plate made of a metal plate, and the lead-out portion protruding from the outer periphery of the flexible circuit board is drawn out to the outside of the side of the mounting plate. In the lead-out structure of the flexible circuit board, a flexible board is placed between the mounting plate and the flexible circuit board, and is further removed from the side of the mounting board at a portion facing the lead-out part of the flexible board. In the lead-out structure of the flexible circuit board on the mounting plate, a board damage prevention part protruding in the direction is provided, and the lead-out part is arranged on the board damage prevention part.

  According to the first aspect of the present invention, since the lead-out portion of the flexible circuit board passes over the board damage prevention portion formed of the inclined portion, the lead-out portion can be prevented from being damaged by the side of the mounting plate.

  According to the second aspect of the present invention, the lead-out portion of the flexible circuit board passes over the substrate damage prevention portion formed by the side on which the roundness occurs when the press cutting process is performed. It can be prevented from being damaged by the side.

  According to the third aspect of the present invention, since the lead-out portion of the flexible circuit board passes over the board damage prevention portion formed by bending the side portion of the mounting plate, the lead-out portion is damaged by the side of the mounting plate. Can be prevented.

  According to the fourth aspect of the present invention, since the lead-out portion of the flexible circuit board passes over the board damage prevention portion provided on the flexible substrate, the lead-out portion can be prevented from being damaged by the side of the mounting plate.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[First Embodiment]
FIG. 1 is a perspective view of a main part of a lead-out structure of a flexible circuit board 30 on a mounting plate 10 according to a first embodiment of the present invention, and FIG. 2 is an enlarged cross-sectional view taken along line AA of FIG. As shown in both figures, in this embodiment, the flexible circuit board 30 is placed on the mounting plate 10, the lead-out portion 33 protrudes from the outer periphery 31 of the flexible circuit board 30, and is drawn to the outside of the mounting plate 10. A substrate damage preventing portion (hereinafter referred to as “inclined portion”) 13 is provided on the outer periphery 11 of the plate 10, and the drawing portion 33 is disposed on the inclined portion 13. Each component will be described below.

  The mounting plate 10 is made of a metal plate, and an iron plate is used in this embodiment. The mounting plate 10 is manufactured by stamping the outer shape (outer periphery 11) of the metal plate by press cutting. In this embodiment, as described above, the inclined portion 13 is provided in the portion of the outer periphery 11 of the mounting plate 10 through which the extraction portion 33 passes. The inclined portion 13 is formed by crushing, and specifically, on the side (the side on the surface side of the mounting plate 10 on which the flexible circuit board 30 is placed) 11a on the side of the outer periphery 11 of the mounting plate 10 that becomes the inclined portion 13. The side 11a portion is crushed by strongly pressing a mold, a punch or the like, so that the side 11a portion descends from the upper surface of the mounting plate 10 (the surface on which the flexible circuit board 30 is placed) toward the outer peripheral side surface. It is formed on a surface inclined obliquely. The surface of the inclined portion 13 may be flat or curved. The material of the mounting plate 10 may be various metals other than iron.

  The flexible circuit board 30 is configured by forming various circuit patterns (not shown) on at least one of the upper surface and the lower surface of the synthetic resin film 35. In this embodiment, a thermoplastic polyethylene terephthalate (PET) film is used as the synthetic resin film 35. However, various other thermoplastic or thermosetting synthetic resin films such as polyphenylene sulfide (PPS) film, polyimide ( PI) film, polyethylene naphthalate (PEN) film, polyetherimide (PEI) film, polyether ether ketone (PEEK) film, polyether ketone (PEK) film, polycarbonate (PC) film, polybutylene naphthalate (PBN) A film, polybutylene terephthalate (PBT) film or the like may be used, and a UV curable film or the like may be further used. On the other hand, the circuit pattern may be formed, for example, by applying a conductive paste on the synthetic resin film 35 by printing or the like, or may be formed by etching a metal foil attached to the synthetic resin film 35, You may form by other means, such as vapor deposition. Examples of the conductive paste include silver paste (a urethane-based or phenol-based resin material dissolved in a solvent and silver powder kneaded in a solvent) or a carbon paste [a urethane-based resin dissolved in a solvent, a phenol-based resin material containing carbon powder. Kneaded product] or the like is used. Usually, an insulating layer is coated on the circuit pattern so as to cover it.

  As described above, the lead-out portion 33 protrudes from the outer periphery 31 of the flexible circuit board 30, and the lead-out portion 33 is drawn outward from the outer periphery 11 (side 11 a) of the mounting plate 10. The lead-out portion 33 has a strip shape in this embodiment, but may have other various shapes. A circuit pattern (not shown) connected to the circuit pattern provided on the flexible circuit board 30 is formed on at least one of the upper surface and the lower surface of the lead-out portion 33. The circuit pattern forming method is the same as the circuit pattern forming method provided on the flexible circuit board 30 (usually formed simultaneously), and the upper surface thereof is covered with an insulating layer.

  And the said drawer | drawing-out part 33 passes on the edge | side 11a of the outer periphery 11 of the attachment board 10, but since the inclination part 13 is provided in this part, it will not be damaged when the drawer | drawing-out part 33 contacts the edge | side 11a. Absent.

  FIG. 3 is a schematic explanatory view of the manufacturing process of the mounting plate 10. As shown in the figure, the mounting plate 10 is manufactured by using a hoop material 100 in which a metal plate is formed in a strip shape, by using a plurality of processing stages (outer shape stage, drilling stage, bending stage, connecting part cutting stage, etc.) using a press machine. Accompanied by continuous processing. In the present embodiment, a crushing processing stage is further introduced as one of the processing stages in order to form the inclined portion 13. That is, as shown in FIG. 3, for example, the outer shape of the mounting plate 10 is punched by a press machine at the outer punching stage S <b> 1, then various additional press processing is performed on a drilling stage, a bending stage, etc. (not shown), and then crushed In the processing stage Sm, the inclined part 13 is formed by press working with a press machine, and then the part of the connecting part 101 connected to the hoop material 100 is cut in the connecting part cutting stage Sn, whereby the single mounting plate 10 is formed. Take out. Of course, the mounting plate 10 may be manufactured by various other methods.

  In the above embodiment, the example in which the drawer portion 33 is simply drawn from the side 11a of the outer periphery 11 of the mounting plate 10 is shown. However, for example, as shown in FIG. The same effect can be obtained when the lead-out portion 33 is folded back onto the flexible circuit board 30 and can be similarly applied.

  Further, as shown in FIG. 5, inclined portions 13 are respectively provided on the upper and lower sides 11 a and 11 b of the outer periphery 11 of the mounting plate 10, and the lead-out portion 33 drawn from the outer periphery 11 of the mounting plate 10 is folded back to the lower surface side of the mounting plate 10. In this case, the same effect can be applied. The leading end of the lead-out portion 33 is a lead-out portion 33a.

[Second Embodiment]
FIG. 6 is a perspective view of a principal part of the lead-out portion structure of the flexible circuit board 30 on the mounting plate 10-2 according to the second embodiment of the present invention, and FIG. 7 is an enlarged cross-sectional view taken along the line BB in FIG. In the embodiment shown in the figure, the same or corresponding parts as those in the embodiment shown in FIGS. Items other than those described below are the same as those in the first embodiment shown in FIGS. In this embodiment as well, as in the first embodiment, the flexible circuit board 30 is placed on the mounting plate 10-2, and the lead-out portion 33 protruding from the outer periphery 31 of the flexible circuit board 30 is placed outside the mounting plate 10-2. It is pulled out towards. And in this embodiment, the board | substrate damage prevention part (henceforth below) which consists of the edge | side where the roundness at the time of press-cutting the outer periphery 11-2 of this mounting plate 10-2 to the outer periphery 11-2 of the mounting plate 10-2 13-2) is provided, and the lead-out portion 33 of the flexible circuit board 30 is disposed on the round portion 13-2. That is, in this embodiment, the flexible circuit board 30 is provided on the surface opposite to the burr protruding side surface on which the burr that is a sharp protrusion when the outer periphery 11-2 of the mounting plate 10-2 is press-cut. Is placed.

  In this embodiment, when manufacturing the mounting plate 10-2 made of a metal plate, the outer shape is manufactured by press cutting (punching) using a press die. -2 has a burr S due to shearing on the side 11-2b on one side, and a rounded portion 13-2 on the side 11-2a on the other side. Therefore, in this embodiment, the rounded portion 13-2 is used as it is as the substrate damage preventing portion, and the lead-out portion 33 of the flexible circuit board 30 is disposed thereon, so that the lead-out portion 33 contacts the side 11-2a. However, the drawer part 33 is prevented from being damaged.

  Also in this embodiment, as shown in FIG. 4, the same applies to the case where the lead-out portion 33 of the flexible circuit board 30 drawn out from the outer periphery 11-2 of the mounting plate 10-2 is folded back onto the flexible circuit board 30. Applicable.

[Third Embodiment]
FIG. 8 is a perspective view of a main part of the lead-out portion structure of the flexible circuit board 30 on the mounting plate 10-3 according to the third embodiment of the present invention, and FIG. 9 is an enlarged cross-sectional view taken along the line CC in FIG. In the embodiment shown in the figure, the same or corresponding parts as those in the embodiment shown in FIGS. Items other than those described below are the same as those in the first embodiment shown in FIGS. In this embodiment, similarly to the first embodiment, the flexible circuit board 30 is placed on the mounting plate 10-3, and the lead-out portion 33 protruding from the outer periphery 31 of the flexible circuit board 30 is placed outside the mounting plate 10-3. It is pulled out towards. In this embodiment, the flexible circuit board 30 is mounted on the side 11-3a of the outer periphery 11-3 of the mounting plate 10-3 on the side 11-3a of the outer periphery 11-3 of the mounting plate 10-3. A board damage prevention part (hereinafter referred to as “bending part”) 13-3 that is bent toward the side opposite to the placed surface is provided, and the lead-out part 33 of the flexible circuit board 30 is disposed on the bending part 13-3. ing.

  That is, in this embodiment, a protruding portion that protrudes in a rectangular shape is provided in a portion where the lead-out portion 33 of the flexible circuit board 30 of the outer periphery 11-3 of the mounting plate 10-3 passes, and the protruding portion is used as the flexible circuit board 30. A bent portion 13-3 is formed by bending in a substantially arc shape toward the opposite surface side of the mounted surface. The bent portion 13-3 is formed on a bending stage in the manufacturing process of a series of mounting plates 10-3 similar to that shown in FIG.

  And the said drawer | drawing-out part 33 is pulled out of the outer periphery 11-3 of the attachment board 10-3, Since the bending part 13-3 is provided in the part of this outer periphery 11-3, the attachment board 10-3 Side 11-3a does not abut against the drawer 33, and the drawer 33 is not damaged.

  Also in this embodiment, as shown in FIGS. 4 and 5, the lead-out portion 33 of the flexible circuit board 30 drawn from the outer periphery 11-3 of the mounting board 10-3 is folded back onto the flexible circuit board 30 or attached to the mounting board. The same applies to the case where the lead-out portion 33 of the flexible circuit board 30 drawn from the outer periphery 11-3 of 10-3 is folded back to the lower surface side of the mounting plate 10-3.

[Fourth Embodiment]
FIG. 10 is a perspective view of a main part of the lead-out portion structure of the flexible circuit board 30 on the mounting plate 10-4 according to the fourth embodiment of the present invention, and FIG. 11 is an enlarged sectional view taken along the line DD in FIG. In the embodiment shown in the figure, the same or corresponding parts as those in the embodiment shown in FIGS. Items other than those described below are the same as those in the first embodiment shown in FIGS. In this embodiment, similarly to the first embodiment, the flexible circuit board 30 is placed on the mounting plate 10-4, and the lead-out portion 33 protruding from the outer periphery 31 of the flexible circuit board 30 is placed outside the mounting plate 10-4. It is pulled out towards. In this embodiment, the flexible board 50 is placed between the mounting board 10-4 and the flexible circuit board 30, and the mounting board 10-4 is placed on the portion of the flexible board 50 facing the lead-out portion 33. The board damage prevention part 51 which protrudes further outward from the outer periphery 11-4 is provided.

  In this embodiment, the flexible substrate 50 is a flexible circuit substrate in which a desired circuit pattern is formed on the same synthetic resin film as the flexible circuit substrate 30. That is, the flexible circuit board 30 is laminated on the flexible board 50 by folding and overlapping one flexible circuit board.

  The lead-out portion 33 is pulled out of the outer periphery 11-4 of the mounting plate 10-4. Since the substrate damage preventing portion 51 is installed on the outer periphery 11-4, the lead-out portion 33 is There is no contact with the side 11-4a of the mounting plate 10-4, and the drawer 33 is not damaged.

  The substrate damage preventing portion 51 of this embodiment is formed so as to protrude in a tongue-like shape from a part of the outer periphery 53 of the flexible substrate 50, but the entire non-projecting side of the outer periphery 53 of the flexible substrate 50 is attached to the mounting plate. It is good also as the board | substrate damage prevention part 51 by making it protrude so that it may protrude outward from the outer periphery 11-4 of 10-4.

  In the above embodiment, the flexible circuit board 30 is the same flexible circuit board as the flexible circuit board 30, and the flexible circuit board is bent to the lower side of the flexible circuit board 30. The flexible circuit board may be used and laminated. The flexible substrate 50 may not have a circuit pattern formed on the surface thereof, and the material thereof is not limited to a synthetic resin film (similar to the various materials used for the synthetic resin film 35). It may be constituted by various materials such as a thin plate made of a molded resin having properties and a thin plate made of a rubber-like elastic body such as synthetic rubber.

  Also in this embodiment, as shown in FIGS. 4 and 5, the lead-out portion 33 of the flexible circuit board 30 drawn from the outer periphery 11-4 of the mounting board 10-4 is folded back onto the flexible circuit board 30 or attached to the mounting board. The same applies to the case where the lead-out portion 33 of the flexible circuit board 30 drawn from the outer periphery 11-4 of 10-4 is folded back to the lower surface side of the mounting plate 10-4.

[Fifth Embodiment]
FIG. 12 is a plan view of the principal part of the lead-out portion structure of the flexible circuit board 30-5 on the mounting plate 10-5 according to the fifth embodiment of the present invention, and FIG. 13 is a schematic cross-sectional view taken along line EE of FIG. As shown in both figures, in this embodiment, a flexible circuit board (hereinafter referred to as “upper flexible circuit board”) 30-5 is placed on the mounting plate 10-5, and the outer periphery 31− of the upper flexible circuit board 30-5 is placed. 5 inside the opening 15-5 provided inside the mounting plate 10-5 by projecting the lead-out portion 33-5 (this is the outside of the mounting plate 10-5 when viewed from the mounting plate 10-5) The substrate damage prevention portions (hereinafter referred to as “inclined portions”) 13-5 are respectively provided on two opposing sides 17-5a and 17-5b of the inner periphery 17-5 of the opening 15-5. It is configured by arranging the drawing portion 33-5 on -5. A flexible circuit board (hereinafter referred to as a “lower flexible circuit board”) 30′-5 is integrally connected to the leading end side of the drawing portion 33-5 drawn to the lower surface side of the mounting plate 10-5. The sides 17-5a and 17-5b are provided on the upper and lower surfaces of the mounting plate 10-5, respectively, and both are sides on the side where the drawer portion 33-5 is touched.

  The mounting plate 10-5 is made of a metal plate, and in this embodiment, an iron plate is used. The mounting plate 10-5 is manufactured by stamping the outer shape (including the opening 15-5) by press-cutting a metal plate. In this embodiment, as described above, the inclined portion 13-5 is provided in the portion of the inner periphery 17-5 of the opening 15-5 through which the lead-out portion 33-5 passes. The inclined portion 13-5 is formed by crushing in the same manner as in the first embodiment, and the side 17-5a (17-5b) is formed from the upper surface (lower surface) of the mounting plate 10-5 to the inner peripheral side surface. It is formed in the surface which inclines diagonally so that it may descend | lower (rise) toward. The surface of the inclined portion 13-5 may be flat or curved.

  The upper flexible circuit board 30-5 and the lower flexible circuit board 30'-5 are composed of a single synthetic resin film 35-5 including the lead-out portion 33-5, and at least one of the upper surface and the lower surface thereof. Various circuit patterns (not shown) are formed on the surface. The material of the synthetic resin film 35-5, the material and forming method of the circuit pattern, and the like are the same as in the first embodiment.

  As described above, the lead-out portion 33-5 protrudes from the outer periphery 31-5 of the upper flexible circuit board 30-5 (the outer periphery 31'-5 of the lower flexible circuit board 30'-5). 5 is drawn out of the side 17-5a of the mounting plate 10-5 (that is, inside the opening 15-5). In this embodiment, the lead-out portion 33-5 is formed in a strip shape so as to connect the two upper lower flexible circuit boards 30-5 and 30'-5, but may have other various shapes. A circuit pattern (not shown) connected to the circuit pattern provided on the upper lower flexible circuit boards 30-5 and 30'-5 is formed on at least one of the upper surface and the lower surface of the lead-out portion 33-5. Yes.

  The lead-out portion 33-5 passes over the two sides 17-5a and 17-5b of the inner periphery 17-5 of the opening 15-5, and these portions are each provided with an inclined portion 13-5. Therefore, the lead-out portion 33-5 is not damaged by coming into contact with the sides 17-5a and 17-5b. Various structures according to the second to fourth embodiments may be applied to the sides 17-5a and 17-5b instead of the inclined portion 13-5.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the technical idea described in the claims and the specification and drawings. Is possible. It should be noted that any shape, structure, and material not directly described in the specification and drawings are within the scope of the technical idea of the present invention as long as the effects and advantages of the present invention are exhibited. For example, the shape, structure, and material of the mounting plates 10 to 10-5, the flexible circuit boards 30, 30-5, and the flexible board 50 can be variously modified. The crushing process for forming the inclined parts 13 and 13-5 and the bending process for forming the bent part 13-3 may be performed after being separated from the hoop material.

3 is a perspective view of a main part of a lead-out portion structure of a flexible circuit board 30 on the mounting plate 10. FIG. It is an AA cross-sectional enlarged view of FIG. 4 is a schematic explanatory diagram of a manufacturing process of the mounting plate 10. FIG. It is a cross-sectional enlarged view which shows the other example of the drawer structure of the drawer part 33. FIG. It is a cross-sectional enlarged view which shows the other example of the drawer structure of the drawer part 33. FIG. It is a principal part perspective view of the drawer | drawing-out part structure of the flexible circuit board 30 on the attachment board 10-2. It is a BB cross-sectional enlarged view of FIG. It is a principal part perspective view of the drawer | drawing-out part structure of the flexible circuit board 30 on the attachment board 10-3. It is CC sectional enlarged view of FIG. It is a principal part perspective view of the drawer | drawing-out part structure of the flexible circuit board 30 on the attachment board 10-4. It is DD sectional enlarged view of FIG. It is a principal part top view of the drawer | drawing-out part structure of the flexible circuit board 30-5 on the attachment board 10-5. It is EE schematic sectional drawing of FIG.

Explanation of symbols

10 mounting plate 11 outer periphery 11a side 13 inclined part (substrate damage prevention part)
30 Flexible circuit board 31 Outer periphery 33 Drawer part 10-2 Mounting plate 13-2 Round part (board damage prevention part)
10-3 Mounting plate 13-3 Bending part (substrate damage prevention part)
10-4 Mounting plate 50 Flexible substrate 51 Substrate damage prevention part 10-5 Mounting plate 13-5 Inclined part (Substrate damage prevention part)
15-5 Opening 17-5 Inner circumference 17-5a, 17-5b Side 30-5 Flexible circuit board (upper flexible circuit board)
30'-5 Flexible circuit board (lower flexible circuit board)
31-5 outer periphery 31'-5 outer periphery 33-5 drawer | drawing-out part

Claims (4)

In the lead-out structure of the flexible circuit board on the mounting plate, the flexible circuit board is placed on the mounting plate made of a metal plate, and the lead-out portion protruding from the outer periphery of the flexible circuit board is drawn out to the outside of the side of the mounting plate.
A lead-out structure of a flexible circuit board on a mounting plate, wherein a board damage prevention portion comprising an inclined portion by crushing is provided on a side of the mounting plate, and the lead-out portion is disposed on the board damage prevention portion. In the lead-out structure of the flexible circuit board on the mounting plate, the flexible circuit board is placed on the mounting plate made of a metal plate, and the lead-out portion protruding from the outer periphery of the flexible circuit board is drawn out to the outside of the side of the mounting plate.
On the mounting plate, characterized in that a substrate damage prevention portion comprising a side that is rounded when press cutting to form the side of the mounting plate is provided, and the drawer portion is disposed on the substrate damage prevention portion. Leader structure of flexible circuit board. In the lead-out structure of the flexible circuit board on the mounting plate, the flexible circuit board is placed on the mounting plate made of a metal plate, and the lead-out portion protruding from the outer periphery of the flexible circuit board is drawn out to the outside of the side of the mounting plate.
Provided on the side of the mounting plate is a board damage prevention portion formed by bending the side of the mounting plate toward the surface opposite to the surface on which the flexible circuit board is placed. A lead-out part structure of a flexible circuit board on a mounting plate, wherein a lead-out part is arranged. In the lead-out structure of the flexible circuit board on the mounting plate, the flexible circuit board is placed on the mounting plate made of a metal plate, and the lead-out portion protruding from the outer periphery of the flexible circuit board is drawn out to the outside of the side of the mounting plate.
A flexible substrate is placed between the mounting plate and the flexible circuit board, and a substrate damage prevention portion that protrudes further outward from the side of the mounting plate is provided at a portion of the flexible substrate facing the lead-out portion. A lead-out part structure of a flexible circuit board on a mounting plate, wherein the lead-out part is arranged on the board damage prevention part.

Images