CN107172810A - A kind of orthopedic FPC of thick copper foil with hollow out golden finger and its manufacture craft - Google Patents
A kind of orthopedic FPC of thick copper foil with hollow out golden finger and its manufacture craft Download PDFInfo
- Publication number
- CN107172810A CN107172810A CN201710447382.6A CN201710447382A CN107172810A CN 107172810 A CN107172810 A CN 107172810A CN 201710447382 A CN201710447382 A CN 201710447382A CN 107172810 A CN107172810 A CN 107172810A
- Authority
- CN
- China
- Prior art keywords
- golden finger
- fpc
- copper foil
- orthopedic
- hollow out
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 44
- 239000011889 copper foil Substances 0.000 title claims abstract description 37
- 230000000399 orthopedic effect Effects 0.000 title claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 43
- 229910052802 copper Inorganic materials 0.000 claims abstract description 7
- 239000010949 copper Substances 0.000 claims abstract description 7
- 238000004080 punching Methods 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 abstract description 5
- 230000008602 contraction Effects 0.000 abstract description 4
- 102100040160 Rabankyrin-5 Human genes 0.000 description 8
- 101710086049 Rabankyrin-5 Proteins 0.000 description 8
- 238000003466 welding Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 238000013475 authorization Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Orthopedics, Nursing, And Contraception (AREA)
Abstract
The invention discloses a kind of orthopedic FPC of thick copper foil with hollow out golden finger and its manufacture craft, the FPC includes base material, the copper foil circuit and golden finger being printed on base material, the golden finger is arranged at the both sides of base material, the golden finger has the inner being connected with circuit and the outer end for extending to material edge, the FPC is provided with the concave station rank being stamped and formed out in golden finger area, and the inner end portion of the golden finger is remained on the inner side base material of concave station rank.The concave station rank being stamped and formed out in the golden finger area of the PFC both sides of the present invention, thus release FPC stress is orthopedic to carry out, thick copper FPC is set to be difficult expansion or contraction distortion, avoiding during varying environment use product solder joint from pulling causes bad connection, product reliability is improved simultaneously, cost has been saved, client's credit worthiness is improved.
Description
Technical field
The present invention relates to circuit board technology field, more particularly to a kind of orthopedic FPC of thick copper foil with hollow out golden finger and
Its manufacture craft.
Background technology
FPC is using polyester film or polyimides as base material, by being etched in the one kind on copper foil forming circuit and being made
With height reliability, the printed circuit of excellent flexibility.A FPC key property just can be achieved on circuit connection, lead to
It is often that golden finger is set in FPC both sides, FPC is welded by golden finger and external devices, to reach the purpose of electric connection.
Authorization Notice No. discloses a kind of multilayer of golden finger position hollow out for CN204119655U Chinese invention patent
FPC, the FPC offers the connection window of hollow out in the position of golden finger, and FPC is outer in access
During portion's device, the connection window position of hollow out only need to be set in the access golden finger position of external devices, make FPC
Golden finger correspondence be covered on the access golden finger of external devices, then weld, this mode can greatly increase soft
Property wiring board and external devices between golden finger between solder attachment area, strengthen welding stability, make welding more firm
Gu, and it is convenient welding, simple, quick.
For the higher thick copper hollow out golden finger class FPC of hardness, during production process and follow-up SMT, easily
Expanded or shrink by ambient influnences such as air humidity and temperature changes.FPC expansion or contraction can influence its precision,
Occur such as solder joint pull can not connect or loose contact situation, and then cause product failure to be scrapped.
The content of the invention
To overcome the deficiencies in the prior art, it is an object of the invention to provide a kind of thick copper foil with hollow out golden finger is orthopedic
FPC and its manufacture craft, FPC is unlikely to deform by orthopedic technology.
The present invention is that the technical scheme for solving the use of its technical problem is：
A kind of orthopedic FPC of thick copper foil with hollow out golden finger, including base material, the copper foil circuit and gold that are printed on base material
Finger, the golden finger is arranged at the both sides of base material, and the golden finger has the inner being connected with circuit and extends to base material side
The outer end of edge, the FPC is provided with the concave station rank being stamped and formed out in golden finger area, and the inner end portion of the golden finger is remained in
On the inner side base material of concave station rank, the recessed stepped portions of the base material correspondence are provided with the hollow out for only retaining golden finger figure.
Further, it is provided with intermediate incline on the inside of the concave station rank.
Further, the hollow out extends to the outer end of golden finger.
Further, the copper foil circuit is formed by etching.
Further, the copper thickness is 4oz to 8oz.
The present invention also provides the above-mentioned orthopedic FPC of thick copper foil with hollow out golden finger manufacture craft, comprises the following steps：
A. FPC base materials are provided, the FPC substrate surfaces are provided with copper foil layer, and copper foil layer thickness is 4oz to 8oz；
B. circuit and golden finger are made according to design configuration in copper foil layer surface, the both sides of the FPC base materials are respectively provided with gold
Finger；
C. orthopedic to the progress punching press of FPC base materials by mold and lower mould, the mold and lower mould are correspondingly arranged
Have the groove and projection of mutual cooperation, it is orthopedic after FPC base materials both sides be formed with concave station rank, and concave station rank in golden finger area
Inner side be provided with intermediate incline；
D. the FPC base materials of the upper golden finger blank space of concave station rank are removed by being punched, is formed and only retain golden finger figure
Hollow out.
Further, in the step c, by mold and lower mould FPC base materials are carried out punching press it is orthopedic before, in addition to
Cover layer is set to be protected on orthopedic position.
Further, in the step c, the mold and lower mould are correspondingly arranged on positioning hole and locating dowel.
The beneficial effects of the invention are as follows：The concave station rank that the present invention is stamped and formed out in the golden finger area of FPC both sides, by
This release FPC stress is orthopedic to carry out, and thick copper FPC is difficult expansion or contraction distortion, it is to avoid to be used in varying environment
Product solder joint, which is pulled, in journey causes bad connection, while improving product reliability, has saved cost, has improved client's credit worthiness.
Brief description of the drawings
Fig. 1 is the top view of the present invention；
Fig. 2 is the front view of the present invention.
Embodiment
Below in conjunction with accompanying drawing and example, the present invention will be further described.
As depicted in figs. 1 and 2, a kind of orthopedic FPC of thick copper foil with the golden finger of hollow out 4 of the invention, including base material 1, print
Copper foil circuit 2 and golden finger 3 on base material 1 are made, the copper foil circuit 2 is formed by etching.The golden finger 3 is arranged at
The both sides of base material 1, the golden finger 3 has an outer end that is inner and extending to the edge of base material 1 being connected with circuit, the FPC in
The region of golden finger 3 is provided with the concave station rank 5 being stamped and formed out, to reach orthopedic effect.The present invention is discharged in FPC by concave station rank 5
Portion's stress, makes thick copper FPC be difficult expansion or contraction distortion, it is to avoid product solder joint is pulled and caused during varying environment use
Bad connection, while improving product reliability, has saved cost.
The inner side of the concave station rank 5 is provided with intermediate incline 6, it is to avoid the drop of concave station rank 5 is big and causes golden finger 3 to damage
Wound.
The inner end portion of the golden finger 3 is remained on the inner side base material 1 of concave station rank 5, it is ensured that the company of golden finger 3 and circuit
Connect reliable.
The corresponding position of concave station rank 5 of base material 1 is provided with the hollow out 4 for only retaining the figure of golden finger 3, by golden finger 3 in recessed
The blank space of step 5, which is punched, to be removed.The hollow out 4 extends to the outer end of golden finger 3, facilitates golden finger 3 to be welded with external devices
Connect.
The copper thickness is preferably 4oz to 8oz.
The present invention also provides the above-mentioned orthopedic FPC of thick copper foil with the golden finger 3 of hollow out 4 manufacture craft, comprises the following steps：
A. FPC base materials 1 are provided, the surface of FPC base materials 1 is provided with copper foil layer, and copper foil layer thickness is 4oz to 8oz；
B. circuit 2 and golden finger 3 are made according to design configuration in copper foil layer surface, the both sides of the FPC base materials 1 are respectively provided with
Golden finger 3；
C. orthopedic to the progress punching press of FPC base materials 1 by mold and lower mould, the mold and lower mould are correspondingly arranged
Have the groove and projection of mutual cooperation, it is orthopedic after the both sides of FPC base materials 1 be formed with concave station rank 5 in the region of golden finger 3, it is and recessed
The inner side of step 5 is provided with intermediate incline 6；
D. the FPC base materials 1 of the blank space of golden finger 3 on concave station rank 5 are removed by being punched, is formed and only retain the figure of golden finger 3
The hollow out 4 of shape.
In the step c, by mold and lower mould FPC base materials 1 are carried out punching press it is orthopedic before, be additionally included in orthopedic
Cover layer is set to be protected on position.
In the step c, the mold and lower mould are correspondingly arranged on positioning hole and locating dowel.By locating dowel and calmly
Position hole is positioned to upper and lower mould, to improve punching precision.
Certainly, described above is not limitation of the present invention, and the present invention is also not limited to the example above, this technology neck
The variations, modifications, additions or substitutions that the technical staff in domain is made in the essential scope of the present invention, should also belong to the present invention's
Protection domain.
Claims (10)
1. the copper foil circuit on a kind of orthopedic FPC of thick copper foil with hollow out golden finger, including base material (1), printing on a substrate (1)
(2) and golden finger (3), the golden finger (3) is arranged at the both sides of base material (1), and the golden finger (3) has and copper foil circuit
(2) connected the inner and the outer end for extending to base material (1) edge, it is characterised in that：The FPC is set in golden finger (3) region
There is the concave station rank (5) being stamped and formed out, the inner end portion of the golden finger (3) is remained on the inner side base material (1) of concave station rank (5),
Described base material (1) correspondence concave station rank (5) position is provided with the hollow out (4) for only retaining golden finger (3) figure.
2. a kind of orthopedic FPC of thick copper foil with hollow out golden finger according to claim 1, it is characterised in that：The concave station
Intermediate incline (6) is provided with the inside of rank (5).
3. a kind of orthopedic FPC of thick copper foil with hollow out golden finger according to claim 1, it is characterised in that：The hollow out
(4) outer end of golden finger (3) is extended to.
4. a kind of orthopedic FPC of thick copper foil with hollow out golden finger according to claim 1, it is characterised in that：The copper foil
Circuit (2) is formed by etching.
5. a kind of orthopedic FPC of thick copper foil with hollow out golden finger according to claim 1, it is characterised in that：The FPC's
Copper thickness is 4oz to 8oz.
6. a kind of manufacture craft of the orthopedic FPC of thick copper foil with hollow out golden finger, it is characterised in that comprise the following steps：
A. FPC base materials (1) are provided, FPC base materials (1) surface is provided with copper foil layer；
B. circuit (2) and golden finger (3) are made according to design configuration in copper foil layer surface, the both sides of the FPC base materials (1) have
There is golden finger (3)；
C. orthopedic to FPC base materials (1) progress punching press by mold and lower mould, the mold and lower mould are correspondingly arranged on
The groove and projection of mutual cooperation, it is orthopedic after FPC base materials (1) both sides be formed with concave station rank (5) in golden finger (3) region；
D. the FPC base materials (1) of golden finger (3) blank space on concave station rank (5) are removed by being punched, formation only retains golden finger
(3) hollow out (4) of figure.
7. a kind of orthopedic FPC of thick copper foil with hollow out golden finger according to claim 6 manufacture craft, its feature exists
In, in the step c, by mold and lower mould FPC base materials (1) are carried out punching press it is orthopedic before, be additionally included in orthopedic position
Setting cover layer is put to be protected.
8. a kind of orthopedic FPC of thick copper foil with hollow out golden finger according to claim 6 manufacture craft, its feature exists
In in the step c, the mold and lower mould are correspondingly arranged on positioning hole and locating dowel.
9. a kind of orthopedic FPC of thick copper foil with hollow out golden finger according to claim 6 manufacture craft, its feature exists
In being provided with intermediate incline (6) on the inside of the concave station rank (5).
10. a kind of orthopedic FPC of thick copper foil with hollow out golden finger according to claim 6 manufacture craft, its feature exists
In the copper foil layer thickness is 4oz to 8oz.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710447382.6A CN107172810B (en) | 2017-06-14 | 2017-06-14 | Thick copper foil orthopedic FPC with hollowed-out golden finger and manufacturing process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710447382.6A CN107172810B (en) | 2017-06-14 | 2017-06-14 | Thick copper foil orthopedic FPC with hollowed-out golden finger and manufacturing process thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107172810A true CN107172810A (en) | 2017-09-15 |
| CN107172810B CN107172810B (en) | 2024-03-29 |
Family
ID=59818659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710447382.6A Active CN107172810B (en) | 2017-06-14 | 2017-06-14 | Thick copper foil orthopedic FPC with hollowed-out golden finger and manufacturing process thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107172810B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108463058A (en) * | 2018-04-16 | 2018-08-28 | 惠州市纬德电路有限公司 | A kind of production technology of staged golden finger pcb board |
| CN110446331A (en) * | 2019-08-14 | 2019-11-12 | 天地融科技股份有限公司 | Figure flexible circuit board, electronic equipment and its processing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005217173A (en) * | 2004-01-29 | 2005-08-11 | Sharp Corp | Printed wiring board, connecting method thereof and manufacturing method thereof |
| CN101827496A (en) * | 2010-04-08 | 2010-09-08 | 深南电路有限公司 | Method for machining PCB with step groove |
| CN103096642A (en) * | 2011-10-27 | 2013-05-08 | 比亚迪股份有限公司 | Manufacture method of flexible circuit board |
| CN103230968A (en) * | 2013-04-11 | 2013-08-07 | 珠海双赢柔软电路有限公司 | Pneumatic buckling device of flexible printed circuit (FPC) |
| CN205828419U (en) * | 2015-12-02 | 2016-12-21 | 王定锋 | A kind of stereoscopic circuit board encapsulation module |
| CN207011084U (en) * | 2017-06-14 | 2018-02-13 | 鹤山市中富兴业电路有限公司 | A kind of orthopedic FPC of thick copper foil with hollow out golden finger |
-
2017
- 2017-06-14 CN CN201710447382.6A patent/CN107172810B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005217173A (en) * | 2004-01-29 | 2005-08-11 | Sharp Corp | Printed wiring board, connecting method thereof and manufacturing method thereof |
| CN101827496A (en) * | 2010-04-08 | 2010-09-08 | 深南电路有限公司 | Method for machining PCB with step groove |
| CN103096642A (en) * | 2011-10-27 | 2013-05-08 | 比亚迪股份有限公司 | Manufacture method of flexible circuit board |
| CN103230968A (en) * | 2013-04-11 | 2013-08-07 | 珠海双赢柔软电路有限公司 | Pneumatic buckling device of flexible printed circuit (FPC) |
| CN205828419U (en) * | 2015-12-02 | 2016-12-21 | 王定锋 | A kind of stereoscopic circuit board encapsulation module |
| CN207011084U (en) * | 2017-06-14 | 2018-02-13 | 鹤山市中富兴业电路有限公司 | A kind of orthopedic FPC of thick copper foil with hollow out golden finger |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108463058A (en) * | 2018-04-16 | 2018-08-28 | 惠州市纬德电路有限公司 | A kind of production technology of staged golden finger pcb board |
| CN108463058B (en) * | 2018-04-16 | 2022-03-29 | 惠州市纬德电路有限公司 | Production process of stepped gold finger PCB |
| CN110446331A (en) * | 2019-08-14 | 2019-11-12 | 天地融科技股份有限公司 | Figure flexible circuit board, electronic equipment and its processing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107172810B (en) | 2024-03-29 |
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