CN105491819A - Rigid-flex board with different flexible appearances and preparation method of rigid-flex board - Google Patents

Rigid-flex board with different flexible appearances and preparation method of rigid-flex board Download PDF

Info

Publication number
CN105491819A
CN105491819A CN201510827292.0A CN201510827292A CN105491819A CN 105491819 A CN105491819 A CN 105491819A CN 201510827292 A CN201510827292 A CN 201510827292A CN 105491819 A CN105491819 A CN 105491819A
Authority
CN
China
Prior art keywords
flexible
profile
central layer
rigid
preparation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201510827292.0A
Other languages
Chinese (zh)
Other versions
CN105491819B (en
Inventor
徐波
莫欣满
陈蓓
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Fastprint Circuit Tech Co Ltd
Yixing Silicon Valley Electronic Technology Co Ltd
Original Assignee
Shenzhen Fastprint Circuit Tech Co Ltd
Yixing Silicon Valley Electronic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Fastprint Circuit Tech Co Ltd, Yixing Silicon Valley Electronic Technology Co Ltd filed Critical Shenzhen Fastprint Circuit Tech Co Ltd
Priority to CN201510827292.0A priority Critical patent/CN105491819B/en
Publication of CN105491819A publication Critical patent/CN105491819A/en
Priority to PCT/CN2016/096906 priority patent/WO2017088539A1/en
Application granted granted Critical
Publication of CN105491819B publication Critical patent/CN105491819B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination

Abstract

The invention relates to a rigid-flex board with different flexible appearances and a preparation method of the rigid-flex board. The preparation method comprises the following steps: fabricating flexible core boards, rigid core boards and prepregs; stacking all flexible core boards and rigid core boards in a set order; carrying out laminating, drilling, degumming, copper deposition, electroplating, outer line fabrication, screen-printing and resistance welding procedures; conventionally carrying out surface treatment; carrying out uncapping operation on a circuit board which is subjected to surface treatment and exposing a flexible region; and carrying out laser appearance operation on the uncapped circuit board, so as to obtain the rigid-flex board with different flexible appearances. According to the method, appearance treatment is carried out on a flexible substrate overlapping region before lamination, so that the randomness in a hierarchical structure design on the rigid-flex board can be improved; multi-branch interconnection requirements are met; multi-branch current wiring space can also be saved; the bending performance of branch circuits is met; and the space of the printed board is saved.

Description

There is rigid-flex board of different flexible profile and preparation method thereof
Technical field
The present invention relates to printed wiring board and manufacture field, particularly relate to and a kind of there is rigid-flex board of different flexible profile and preparation method thereof.
Background technology
Along with electronic product is constantly to the future development of multifunction, miniaturization and, high performance, also day by day improve the miniaturization of printed wiring board, the requirement of densification, its product is also developed to high-density build-up printed board by common PCB.For rigid-flex board, rigidity mainboard connects by flex region the direction that multiple branches rigid plate is also high-density development, as shown in Figure 1.
When prior art is by going to parallel by the flexible circuitry of each branch, arranged in parallel is on a flexible central layer; Or stacked arrangement is distributed on layer flexible central layer, these two kinds of ways have significant limitation:
(1), during individual layer wiring, the flexible region that each branch converges can account for area very much, wastes winding displacement space greatly.
(2) during multilayer wiring, branch's flexible portion only wherein a central layer have wiring, and in order to easy to make, the flexible central layer do not connected up also presses to rigid region together together with this branch, cause branched line flexible region blocked up, have a strong impact on bending performance.
(3) individual layer wiring and multilayer wiring converge region at branched line, and its profile is all consistent, all cannot meet the installation requirements to flexible region limited width.
Summary of the invention
Based on this, the object of this invention is to provide a kind of preparation method with the rigid-flex board of different flexible profile.
Concrete technical scheme is as follows:
There is a preparation method for the rigid-flex board of different flexible profile, comprise the steps:
(1) make at least two pieces of flexible central layers, make line pattern on the surface of the flexible central layer of every block according to a conventional method, then carry out laser profile operation;
(2) make at least two pieces of rigidity central layers, then grooving operations is carried out to the flexure region of rigidity central layer;
(3) make polylith prepreg, every block prepreg is offered the groove mated with described flexure region;
(4) order of all flexible central layers and rigidity central layer being pressed setting is stacked, is provided with prepreg between flexible central layer and rigidity central layer, between flexible central layer and flexible central layer and between rigidity central layer and rigidity central layer;
(5) flexible central layer, rigidity central layer and prepreg after stacked are carried out laminating operation;
(6) carry out routinely holing, except glue, heavy copper, plating, outer-layer circuit, silk-screen and welding resistance operation;
(7) surface treatment is carried out routinely;
(8) wiring board after surface treatment is carried out operation of uncapping, expose flexure region;
(9) wiring board after uncapping is carried out laser profile operation, there is described in obtaining the rigid-flex board of different flexible profile.
Wherein in some embodiments, in step (1), described flexible central layer is provided with profile coincidence district and profile region of variability, and the region of described laser profile operation is profile region of variability.
Wherein in some embodiments, in step (1), the object line of described laser profile operation extends to profile coincidence district 0.15-0.3mm.
Wherein in some embodiments, in step (2), described grooving operations comprises: the flexure region being positioned at the rigidity central layer of internal layer opens groove, and the flexure region being positioned at outer field rigidity central layer opens half groove.
Wherein in some embodiments, in step (7), described surface treatment comprises: one or more in turmeric, NiPdAu, heavy silver, heavy tin, OSP or spray tin.
Wherein in some embodiments, in step (9), described laser profile operation comprises the operation of laser flexible profile and the operation of numerical control rigidity profile.
Wherein in some embodiments, the region of described laser flexible profile operation is profile coincidence district.
Wherein in some embodiments, in step (5), the technological parameter of described lamination is: lamination tapping temperature controlled below 70 DEG C.
Another object of the present invention is to provide a kind of rigid-flex board with different flexible profile.
Concrete technical scheme is as follows:
The rigid-flex board of different flexible profile that what above-mentioned preparation method prepared have.
Principle of the present invention and beneficial effect as follows:
The present invention proposes a kind of preparation method with the rigid-flex board of different flexible profile, particularly arrange as follows in preparation method: (1) is in the manufacturing process of flexible central layer, first externally shape region of variability carries out laser profile operation, can ensure that flexible profile region of variability can not be destroyed, if one-time formed words, this region is very easily destroyed by laser or milling machine; And the object line of laser profile operation extends to profile coincidence district 0.15-0.30mm, can ensure that transitional region can not exist burr or remain like this; (2) in rigidity central layer grooving operations, half groove is opened to the flexure region being positioned at outer field rigidity central layer, this region can be protected like this in follow-up wet flow process can not to enter liquid medicine, corrosion flex region PI; (3) operation of uncapping of motherboard must be put after surface treatment, this is because this region can be protected in wet flow process can not to enter liquid medicine, and corrosion flex region PI.
Profile process has just been carried out in flexible parent metal overlay region by the method before lamination, randomness during rigid-flex board stratified energy mechanism can be improved, meet multiple branch circuit interconnected, multiple-limb electric current wiring space can also be saved, meet branch circuit bending performance, and save printed board space.Solve the branch circuit installation requirement of different flexible width, and the method technique is simple, easy to operate.
Accompanying drawing explanation
Fig. 1 is the rigid-flex board schematic diagram with different flexible profile;
Fig. 2 is preparation method's flow chart that the embodiment of the present invention has the rigid-flex board of different flexible profile;
Fig. 3 is the schematic diagram of flexible central layer laser profile operation in the embodiment of the present invention;
Fig. 4 is the schematic diagram of rigidity central layer grooving operations in the embodiment of the present invention.
Embodiment
By the following examples the application is further elaborated.
A kind of preparation method's (flow chart as shown in Figure 2) with the rigid-flex board of different flexible profile of the present embodiment, comprises the steps:
(1) make at least two pieces of flexible central layers, make line pattern on the surface of the flexible central layer of every block according to a conventional method, then carry out laser profile operation (as shown in Figure 3);
Described flexible central layer is provided with profile coincidence district and profile region of variability, and the region of described laser profile operation is profile region of variability; The object line of described laser profile operation extends to profile coincidence district more than 0.15mm;
Such operation can ensure that flexible profile region of variability can not be destroyed, if one-time formed words, this region is very easily destroyed by laser or milling machine; And the object line of laser profile operation extends to profile coincidence district 0.15-0.30mm, can ensure that transitional region can not exist burr or remain like this;
(2) make at least two pieces of rigidity central layers, then grooving operations (as shown in Figure 4) is carried out to the flexure region of rigidity central layer;
Described grooving operations comprises: the flexure region being positioned at the rigidity central layer of internal layer opens groove, and the flexure region being positioned at outer field rigidity central layer opens half groove.This region can be protected like this in follow-up wet flow process can not to enter liquid medicine, corrosion flex region PI;
(3) make polylith prepreg, every block prepreg is offered the groove mated with described flexure region;
(4) order of all flexible central layers and rigidity central layer being pressed setting is stacked, is provided with prepreg between flexible central layer and rigidity central layer, between flexible central layer and flexible central layer and between rigidity central layer and rigidity central layer;
(5) flexible central layer, rigidity central layer and prepreg after stacked are carried out laminating operation;
The technological parameter of described lamination is: lamination tapping temperature controlled below 70 DEG C.
(6) carry out routinely holing, except glue, heavy copper, plating, outer-layer circuit, silk-screen and welding resistance operation;
(7) surface treatment is carried out routinely;
Described surface treatment comprises: one or more in turmeric, NiPdAu, heavy silver, heavy tin, OSP or spray tin.
(8) wiring board after surface treatment is carried out operation of uncapping, expose flexure region; Operation of uncapping after the surface treatment, this is because this region can be protected in follow-up wet flow process can not to enter liquid medicine, must corrode flex region PI.
(9) wiring board after uncapping is carried out laser profile operation, described laser profile operation comprises the operation of laser flexible profile and numerical control rigidity profile operates; The region of described laser flexible profile operation is profile coincidence district; There is described in obtaining the rigid-flex board of different flexible profile.
Profile process has just been carried out in flexible parent metal overlay region by the preparation method of the present embodiment before lamination, randomness during rigid-flex board stratified energy mechanism can be improved, meet multiple branch circuit interconnected, multiple-limb electric current wiring space can also be saved, meet branch circuit bending performance, and save printed board space.Solve the branch circuit installation requirement of different flexible width, and the method technique is simple, easy to operate.
Each technical characteristic of the above embodiment can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics does not exist contradiction, be all considered to be the scope that this specification is recorded.
The above embodiment only have expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but can not therefore be construed as limiting the scope of the patent.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.

Claims (9)

1. there is a preparation method for the rigid-flex board of different flexible profile, it is characterized in that, comprise the steps:
(1) make at least two pieces of flexible central layers, make line pattern on the surface of the flexible central layer of every block according to a conventional method, then carry out laser profile operation;
(2) make at least two pieces of rigidity central layers, then grooving operations is carried out to the flexure region of rigidity central layer;
(3) make polylith prepreg, every block prepreg is offered the groove mated with described flexure region;
(4) order of all flexible central layers and rigidity central layer being pressed setting is stacked, is provided with prepreg between flexible central layer and rigidity central layer, between flexible central layer and flexible central layer and between rigidity central layer and rigidity central layer;
(5) flexible central layer, rigidity central layer and prepreg after stacked are carried out laminating operation;
(6) carry out routinely holing, except glue, heavy copper, plating, outer-layer circuit, silk-screen and welding resistance operation;
(7) surface treatment is carried out routinely;
(8) wiring board after surface treatment is carried out operation of uncapping, expose flexure region;
(9) wiring board after uncapping is carried out laser profile operation, there is described in obtaining the rigid-flex board of different flexible profile.
2. preparation method according to claim 1, is characterized in that, in step (1), described flexible central layer is provided with profile coincidence district and profile region of variability, and the region of described laser profile operation is profile region of variability.
3. preparation method according to claim 2, is characterized in that, in step (1), the object line of described laser profile operation extends to profile coincidence district 0.15-0.3mm.
4. preparation method according to claim 1, is characterized in that, in step (2), described grooving operations comprises: the flexure region being positioned at the rigidity central layer of internal layer opens groove, and the flexure region being positioned at outer field rigidity central layer opens half groove.
5. preparation method according to claim 1, is characterized in that, in step (7), described surface treatment comprises: a kind of one or more of turmeric, NiPdAu, heavy silver, heavy tin, OSP or spray tin.
6. preparation method according to claim 2, is characterized in that, in step (9), described laser profile operation comprises the operation of laser flexible profile and the operation of numerical control rigidity profile.
7. preparation method according to claim 6, is characterized in that, the region of described laser flexible profile operation is profile coincidence district.
8. the preparation method according to any one of claim 1-7, is characterized in that, in step (5), the technological parameter of described lamination is: lamination tapping temperature controlled below 70 DEG C.
9. the rigid-flex board of different flexible profile that what the preparation method described in any one of claim 1-8 prepared have.
CN201510827292.0A 2015-11-24 2015-11-24 Rigid-flex board and preparation method thereof with different flexible shapes Active CN105491819B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201510827292.0A CN105491819B (en) 2015-11-24 2015-11-24 Rigid-flex board and preparation method thereof with different flexible shapes
PCT/CN2016/096906 WO2017088539A1 (en) 2015-11-24 2016-08-26 Rigid-flexible board having different fixable shapes and manufacturing method therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510827292.0A CN105491819B (en) 2015-11-24 2015-11-24 Rigid-flex board and preparation method thereof with different flexible shapes

Publications (2)

Publication Number Publication Date
CN105491819A true CN105491819A (en) 2016-04-13
CN105491819B CN105491819B (en) 2019-03-19

Family

ID=55678419

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510827292.0A Active CN105491819B (en) 2015-11-24 2015-11-24 Rigid-flex board and preparation method thereof with different flexible shapes

Country Status (2)

Country Link
CN (1) CN105491819B (en)
WO (1) WO2017088539A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017088539A1 (en) * 2015-11-24 2017-06-01 广州兴森快捷电路科技有限公司 Rigid-flexible board having different fixable shapes and manufacturing method therefor
CN108012464A (en) * 2017-11-28 2018-05-08 广州兴森快捷电路科技有限公司 The production method of rigid-flex combined board
CN108419381A (en) * 2018-01-23 2018-08-17 广州兴森快捷电路科技有限公司 Rigid-flex combined board and preparation method thereof
WO2019071853A1 (en) * 2017-10-11 2019-04-18 广州兴森快捷电路科技有限公司 Manufacturing method for rigid-flex combined circuit board
CN110139505A (en) * 2019-04-10 2019-08-16 江门崇达电路技术有限公司 A kind of production method of the Rigid Flex with the layering of local soft board
CN110678011A (en) * 2019-11-12 2020-01-10 江门崇达电路技术有限公司 Manufacturing method of rigid-flex printed circuit board
CN113555747A (en) * 2021-09-22 2021-10-26 四川赛狄信息技术股份公司 Heterogeneous connector

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111010820A (en) * 2019-12-27 2020-04-14 上海嘉捷通电路科技股份有限公司 Method for manufacturing rigid-flex board with overlapped flexible board area

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103068185A (en) * 2012-12-21 2013-04-24 深圳市中兴新宇软电路有限公司 Manufacturing method of printed circuit board soft-hard combination substrate flexible area
CN103687346A (en) * 2013-11-18 2014-03-26 广州兴森快捷电路科技有限公司 Rigid-flexible combined printed circuit board preparation method
CN104394643A (en) * 2014-11-18 2015-03-04 广州兴森快捷电路科技有限公司 Non-laminated rigid-flexible printed circuit board and manufacturing method thereof
CN104582309A (en) * 2013-10-14 2015-04-29 北大方正集团有限公司 Rigid-flex circuit board and production method thereof
CN104735923A (en) * 2015-03-12 2015-06-24 广州杰赛科技股份有限公司 Method for manufacturing rigidity and flexibility combined plate
CN104853542A (en) * 2015-04-17 2015-08-19 广州杰赛科技股份有限公司 Manufacturing method of rigid-flex printed circuit board

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105491819B (en) * 2015-11-24 2019-03-19 广州兴森快捷电路科技有限公司 Rigid-flex board and preparation method thereof with different flexible shapes

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103068185A (en) * 2012-12-21 2013-04-24 深圳市中兴新宇软电路有限公司 Manufacturing method of printed circuit board soft-hard combination substrate flexible area
CN104582309A (en) * 2013-10-14 2015-04-29 北大方正集团有限公司 Rigid-flex circuit board and production method thereof
CN103687346A (en) * 2013-11-18 2014-03-26 广州兴森快捷电路科技有限公司 Rigid-flexible combined printed circuit board preparation method
CN104394643A (en) * 2014-11-18 2015-03-04 广州兴森快捷电路科技有限公司 Non-laminated rigid-flexible printed circuit board and manufacturing method thereof
CN104735923A (en) * 2015-03-12 2015-06-24 广州杰赛科技股份有限公司 Method for manufacturing rigidity and flexibility combined plate
CN104853542A (en) * 2015-04-17 2015-08-19 广州杰赛科技股份有限公司 Manufacturing method of rigid-flex printed circuit board

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017088539A1 (en) * 2015-11-24 2017-06-01 广州兴森快捷电路科技有限公司 Rigid-flexible board having different fixable shapes and manufacturing method therefor
WO2019071853A1 (en) * 2017-10-11 2019-04-18 广州兴森快捷电路科技有限公司 Manufacturing method for rigid-flex combined circuit board
CN108012464A (en) * 2017-11-28 2018-05-08 广州兴森快捷电路科技有限公司 The production method of rigid-flex combined board
CN108419381A (en) * 2018-01-23 2018-08-17 广州兴森快捷电路科技有限公司 Rigid-flex combined board and preparation method thereof
CN110139505A (en) * 2019-04-10 2019-08-16 江门崇达电路技术有限公司 A kind of production method of the Rigid Flex with the layering of local soft board
CN110139505B (en) * 2019-04-10 2021-06-25 江门崇达电路技术有限公司 Manufacturing method of rigid-flex board with local flexible board layering
CN110678011A (en) * 2019-11-12 2020-01-10 江门崇达电路技术有限公司 Manufacturing method of rigid-flex printed circuit board
CN113555747A (en) * 2021-09-22 2021-10-26 四川赛狄信息技术股份公司 Heterogeneous connector

Also Published As

Publication number Publication date
WO2017088539A1 (en) 2017-06-01
CN105491819B (en) 2019-03-19

Similar Documents

Publication Publication Date Title
CN105491819A (en) Rigid-flex board with different flexible appearances and preparation method of rigid-flex board
CN108882566B (en) Manufacturing method of PCB
CN101299911B (en) Method for making a multilayered circuitized substrate
KR20140033177A (en) Method for manufacturing rigid-flexible printed circuit board and the rigid-flexible printed circuit board
CN103456643A (en) Ic carrier plate and manufacturing method thereof
CN103037640B (en) Art utilizing common equipment and material to manufacture High Density Interconnect (HDI) laminated plate
CN102740612A (en) Method for manufacturing rigid-flexible printed circuit board
CN101534609B (en) Circuit structure of circuit board and method for manufacture same
CN102364997A (en) Production method of Rogers board
WO2012065376A1 (en) Substrate of printed circuit board and manufacturing method thereof
CN102196668B (en) Method for manufacturing circuit board
CN101409980B (en) Soft and hard composite circuit board
CN104981096A (en) Processing method of suspended gold finger, and circuit board
CN110798993A (en) Method for manufacturing double-sided compression joint blind hole on PCB
CN104902684A (en) Stepped groove circuit board and processing method for the same
CN104363717A (en) Method for manufacturing rigid-flexible printed circuit board
CN112638064A (en) Printed circuit board with second-order blind hole and processing method
US20200015365A1 (en) Dummy core restrict resin process and structure
CN104981108A (en) Processing method of suspension-structure gold finger, and circuit board
CN101861057A (en) Method for manufacturing printed circuit board
CN104981115A (en) Circuit board gold finger processing method and gold finger circuit board
CN104902694A (en) Internal-layer thick-copper circuit board processing method and internal-layer thick-copper circuit board
CN104981114A (en) Processing method for dangling gold fingers and circuit board
CN103747623B (en) Printed wiring board containing Small Distance pad and preparation method thereof
CN113905512B (en) Circuit board with boss and manufacturing method thereof

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant