JP2010206124A - Method of manufacturing multilayer circuit board, and multilayer circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To perform processing for forming an internal-layer circuit board more effectively while easily and properly masking a terminal of the internal-layer circuit board in a flexible part. <P>SOLUTION: In a method of manufacturing a multilayer circuit board including the flexible part having flexibility, a first laminate 110 having at least an insulating base film is stacked through an interlayer adhesive layer 200 having a opening 22 at least at a surface of a side where the terminal 20a is exposed in the internal-layer circuit board 100 in which the terminal 20a is exposed. The first laminate 110 has two slits 24 formed facing each other to hold a part to be finally removed. After the first laminate is stacked, a cutting means penetrates all of the laminate 110 and the internal-layer circuit board 100 across the two slits 24 to form an unnecessary piece and to form the opening 21, thereby performing processing for forming a terminal 20 including the terminal 20a. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an improvement in a method for manufacturing a multilayer circuit board such as a rigid flex circuit board provided with a flexible portion having flexibility.

  In a rigid flex circuit board including a flexible part having flexibility and a rigid part for component mounting, a wiring pattern having a terminal part may be required on the inner circuit board of the flexible part. The terminal part of the inner layer circuit board must eventually be exposed on the surface of the circuit board. However, after laminating the outer layer circuit board, when the outer layer circuit board is patterned or etched, it has chemical resistance. It is necessary to mask the terminal portion of the inner layer circuit board with a tape or the like. However, this masking process requires time and effort, and in some cases, the tape is peeled off from the terminal portion of the inner layer circuit board during the pattern formation process of the outer layer circuit board.

  In order to solve this problem, a method of manufacturing a multilayer circuit board using an outer-layer copper-clad laminate itself as a masking material is provided (for example, see Patent Documents 1 and 2). In this manufacturing method, an opening is provided in the inner layer circuit board in advance and a wiring pattern is formed so as to expose the terminal portion in the opening, and then a copper-clad laminate is laminated on both surfaces of the inner circuit board. Two slits are formed in advance in the laminated laminate, and the copper-clad laminate is punched from the long hole-shaped punched portions provided at positions including both ends of the two slits to remove unnecessary removal pieces. Thus, the terminal portion of the inner layer circuit board is finally exposed.

  According to this method, the step of masking the terminal portion of the inner layer circuit board with tape can be omitted, but it is necessary to form the opening and shape the terminal portion in the inner layer circuit board in advance. There are problems that require time and labor for the work, because two different processes for forming the terminal portion and forming the removal piece are required. In this method, since the opening is formed in the inner layer circuit board in advance, in order to protect the terminal portion from the drug, it is necessary to laminate a copper clad laminate on both surfaces of the inner layer circuit board. There was a problem that slits were formed in these copper-clad laminates on both sides and a punching operation from both sides of the inner circuit board was required.

In addition, conventionally, in order to make a multilayer circuit board, after thermocompression bonding in advance for each inner layer circuit board to be laminated, in the stage of finally forming a multilayer shape, the whole was further thermocompression bonded, Similarly, the process requires time and effort, and due to repetitive thermal stress, alignment between layers becomes difficult due to variations and warpage caused by dimensional changes of each circuit board, and reliability of interlayer connection is lowered. .
JP 2001-36239 A Japanese Patent No. 3427011

  In view of the above circumstances, the problem to be solved by the present invention is that the inner layer circuit board can be shaped more efficiently while simply and appropriately masking the terminals of the inner layer circuit board of the flexible portion. It is an object of the present invention to provide a multilayer circuit board manufacturing method and a multilayer circuit board manufactured by such a method and having excellent interlayer connection reliability.

  The present invention provides, as a first means for solving the above-mentioned problem, a method for manufacturing a multilayer circuit board having a flexible part having flexibility and a rigid part, and an inner circuit board in which terminals are exposed. A slit is formed at least on the boundary between the rigid part and at least the part to be finally removed, which has at least an insulating base film, through an interlayer adhesive layer having an opening on at least the exposed side surface of the terminal. After the laminated plates are laminated, the shape processing of the terminal portion including the terminals is performed through cutting means so as to penetrate all the laminated plates and the inner layer circuit board across the slit. A method for manufacturing a multilayer circuit board.

  In the present invention, as a second means for solving the above-described problem, two slits are formed facing each other so as to sandwich a portion to be finally removed, and straddle the two slits. A method for manufacturing a multilayer circuit board, comprising: cutting a terminal so as to penetrate all of the laminated board and the inner layer circuit board, and processing the shape of the terminal portion including the terminal.

  According to the present invention, as a third means for solving the above problems, in the first or second solving means, an unnecessary removal piece is simultaneously formed by the cutting means, and then the removal piece is removed. The present invention provides a method for manufacturing a multilayer circuit board, wherein a terminal portion is exposed on the surface.

  According to the present invention, as a fourth means for solving the above-described problems, in any one of the first to third solving means, an opening is formed around the terminal portion simultaneously with the shape processing of the terminal portion by the cutting means. The present invention provides a method for manufacturing a multilayer circuit board.

  As a fifth means for solving the above-mentioned problems, the present invention is characterized in that, in any of the first to fourth solving means, the slit is formed outside the opening of the interlayer adhesive layer. A method for manufacturing a multilayer circuit board is provided.

  As a sixth means for solving the above-mentioned problems, the present invention is characterized in that, in the fifth solving means, the distance between the slit and the opening of the interlayer adhesive layer is set to 0.5 mm to 2.0 mm. A method for manufacturing a multilayer circuit board is provided.

  According to the present invention, as a seventh means for solving the above-described problem, in any one of the first to sixth solving means, the opening of the interlayer adhesive layer is formed larger than the exposed portion of the terminal of the inner circuit board. The present invention provides a method for manufacturing a multilayer circuit board.

  As an eighth means for solving the above-mentioned problems, the present invention provides a single or even surface on the side opposite to the exposed side of the terminal of the inner circuit board in the first to seventh solving means. Provided is a multilayer circuit board manufacturing method characterized by laminating a plurality of backside laminates having at least an insulating base film, and forming openings in the backside laminate plate through which cutting means can pass. .

  The present invention provides, as a ninth means for solving the above-described problems, in the above-described first to eighth solving means, the laminated board and the inner circuit board or the back laminated board laminated on each other or It is another object of the present invention to provide a method for manufacturing a multilayer circuit board, wherein an outer circuit board is further laminated on one side.

  The present invention provides, as a tenth means for solving the above-mentioned problems, in any one of the above first to ninth solving means, in a state where all the layers are laminated without heating and pressurizing each layer. The present invention provides a method for producing a multilayer circuit board characterized by heating and pressurizing.

  The present invention provides, as an eleventh means for solving the above-mentioned problems, in the solution means described in the tenth aspect, in a state where all the layers are laminated and heated and pressed together, and further, a plurality of layers are formed. The present invention provides a method for manufacturing a multilayer circuit board, which includes a step of heating and pressurizing after laminating.

  The present invention provides, as a twelfth means for solving the above-mentioned problems, a multilayer circuit board manufactured by the manufacturing method which is any one of the first to eleventh solving means.

  According to the present invention, as described above, the cutting means such as the cutting blade is lowered so as to penetrate all the layers to form the terminal portion, and hence the opening portion. Since the shape of the terminal part can be processed simultaneously with the removal of unnecessary removal pieces in the work, the layer circuit board can be manufactured very efficiently, and the terminals formed on the inner layer circuit board by the laminated board Since the terminal can be protected by the insulating base film of the inner layer circuit board that is not cut out without providing the laminated board on the back side at the same time as masking from the side, the laminated board is laminated only on the surface side where the terminals are exposed at least. In this case, there is an advantage that the terminals of the inner circuit board can be protected appropriately and reliably.

  In addition, according to the present invention, as described above, the slit formed in the laminated plate is arranged outside with an appropriate distance from the opening of the interlayer adhesive layer. There is an actual benefit that can also suppress the influence of.

  Furthermore, according to the present invention, as described above, heating is applied collectively in a state where all the layers of the laminated board and the inner circuit board or the back laminated board are laminated without being heated and pressurized for each layer. Therefore, there is an actual advantage that the laminating operation can be performed more efficiently, and at the same time, the reliability of the interlayer connection can be improved.

Next, embodiments of the present invention will be described in detail with reference to the drawings. In the embodiment of the present invention, a method of manufacturing a multilayer circuit board in which two slits are formed facing each other so as to sandwich a portion to be finally removed will be described as an example.
1 to 9 show a state in which a method for manufacturing a multilayer circuit board according to the present invention is implemented. The method for manufacturing the present invention is a method for manufacturing a multilayer circuit board 10 having a flexible portion 12 having flexibility. . Examples of such a multilayer circuit board 10 include a rigid flex circuit board including a flexible portion 12 and a rigid portion 14 for component mounting. The present invention is particularly suitable for forming the flexible portion 12. Has characteristics.

  In the illustrated embodiment, a multilayer circuit board 10 manufactured according to the present invention includes an inner layer circuit portion 16 and an inner layer circuit portion 16 in a flexible portion 12 having flexibility as shown in FIG. And an outer layer circuit unit 18 laminated on both sides of the outer layer. As shown in FIG. 7, the inner layer circuit section 16 includes an inner layer circuit board 100, a first laminated board 110 laminated on the exposed surface of the terminal 20a formed on the inner layer circuit board 100, and an inner layer circuit. The substrate 100 includes a second laminated plate 120 and a third laminated plate 130 which are laminated on the surface opposite to the terminal 20a.

  As shown in FIG. 2, the inner layer circuit board 100 is formed by laminating a surface protective layer 104 via an adhesive layer 103 on a conductive layer 102 laminated on one surface side of an insulating base film 101, and then the surface protective layer 104. Then, the adhesive layer 103 is processed into a predetermined pattern by etching or the like to expose the conductive layer 102 on the surface, thereby forming the terminal 20a.

  On the other hand, the first to third laminated plates 110, 120, and 130 are all laminated on the insulating base films 111, 121, and 131 as shown in FIGS. 4 to 8 in the illustrated embodiment. Surface protective layers 114, 124, and 134 are stacked on the conductive layers 112, 122, and 132 via adhesive layers 113, 123, and 133. However, in these first to third laminated plates 110, 120, and 130, the conductive layers 112, 122, and 132 need only be provided as necessary, and are not necessarily formed. In the illustrated embodiment, the second and third laminated plates 120 and 130 are provided on the surface of the inner layer circuit board 100 opposite to the terminals 20a. However, the number of laminated layers is not particularly limited. Instead, the number of layers can be set as required in addition to the two layers of the illustrated second and third laminated plates.

  In addition, in the present invention, in particular, as will be described later, if the laminated plate 110 is laminated at least on the exposed side of the terminal 20a of the inner layer circuit board 100, the inner layer circuit board 100 is opposite to the terminal 20a. The second and third laminated plates 120 and 130 laminated on the surface are not necessarily installed. That is, in the illustrated embodiment, the inner layer circuit unit 16 includes a first laminated board 110 (first layer), an inner layer circuit board 100 (second layer), a second laminated board 120 (third layer), 3 of the three laminated boards 130 (fourth layer). However, the terminal 20a can also have a two-layer structure of at least the first laminated board 110 (first layer) and the inner layer circuit board 100 (second layer). The terminal portion 20 provided with the terminal 20a shown in FIG.

  In this case, as the insulating base films 101, 111, 121, 131 used for each of these layers, for example, a resin film base material or the like can be used. Examples of the resin film substrate include polyimide resin films such as polyimide resin films, polyetherimide resin films, polyamideimide resin films, polyamide resin films such as polyamide resin films, and polyester resin films such as polyester resin films. Is mentioned. Among these, a polyimide resin film is mainly preferable. Thereby, especially an elasticity modulus and heat resistance can be improved. The thickness of these insulating base films 101, 111, 121, and 131 is not particularly limited, but is preferably 5 to 50 μm, and particularly preferably 12.5 to 25 μm because it is particularly excellent in flexibility.

  Further, as the conductive layers 102, 112, 122, and 132 used for each of these layers, metal stays can be used. Examples of the metal stay include metal stays such as iron, aluminum, stainless steel, and copper. Among these, it is particularly preferable to use a copper foil from the viewpoint of electrical characteristics. The thickness of the metal stay is not particularly limited, but is preferably 5 to 35 μm, and particularly preferably 8 to 18 μm.

  Similarly, as the surface protective layers 104, 114, 124, and 134 used for these layers, for example, resin films can be used. As this resin film, as with the insulating base films 101, 111, 121, 131, for example, polyimide resin films such as polyimide resin films, polyetherimide resin films, polyamideimide resin films, and polyamides such as polyamide resin films. Polyester resin films such as resin films and polyester resin films can be used. Among these, a polyimide resin film is mainly desirable because it can particularly improve the elastic modulus and heat resistance. Note that these surface protective layers 104, 114, 124, and 134 are preferably laminated so as to cover the entire surface of the conductive layers 102, 112, 122, and 132.

  In this case, these surface protective layers 104, 114, 124, 134 are applied to the conductive layers 102, 112, 122, 132 by applying an adhesive as adhesive layers 103, 113, 123, 133 to the surfaces thereof. Can be laminated. Further, the surface protective layers 104, 114, 124, and 134 can be formed by a method of printing ink directly on a substrate. Examples of the adhesive include a resin composition including a thermosetting resin such as an epoxy resin, a polyester resin, a polyimide resin, a polyamide resin, a polyamideimide resin, a polyurethane resin, and an epoxy resin. Preferably it is. Among these, epoxy resins are particularly preferable because they can improve adhesion and heat resistance.

  The first laminated board 110 (first layer), the inner circuit board 100 (second layer), the second laminated board 120 (third layer), and the third laminated board 130 ( As shown in FIGS. 4 to 8, the fourth layer) is laminated on each other via the interlayer adhesive layers 200, 210, and 220. Examples of the interlayer adhesive layers 200, 210, and 220 include thermosetting resins such as epoxy resins, polyimide resins, polyamideimide resins, acrylic resins, polyurethane resins, and polyester resins. . Among these, an epoxy resin is preferable in terms of improving adhesion and heat resistance. In addition, as the interlayer adhesive layers 200, 210, and 220, a prepreg or the like in which a glass fiber base material is impregnated with the thermosetting resin can also be used. The thickness of the interlayer adhesive layers 200, 210 and 220 is preferably 10 to 200 μm, particularly preferably 20 to 120 μm when using a prepreg, and preferably 10 to 100 μm when using a bonding sheet.

  In this case, as shown in FIGS. 4 and 5, the first laminated plate 110 is a surface on the exposed side of the terminal 20a of the inner layer circuit board 100 with the surface protective layer 114 facing upward and the terminal 20a exposed. Are laminated through an interlayer adhesive layer 200 having an opening 22. That is, as shown in FIG. 1, the first laminated plate 110 is temporarily bonded to the interlayer adhesive layer 200 and then bonded to the inner circuit board 100, and the interlayer adhesive layer 200 has a structure as shown in FIG. Opening 22 is formed. As shown in FIGS. 1 and 4 to 8, the opening 22 is formed larger than the exposed portion of the terminal 20 a of the inner layer circuit board 100. More specifically, the size and shape are set such that the terminal portions 20 that are finally formed and processed are all exposed. In the illustrated embodiment, as shown in FIG. 9, since the terminal portion 20 protrudes in a square shape from the opening portion 21, the interlayer adhesive layer 200 is also formed in a rectangular shape in accordance with this, and the opening 22 is formed. Each side is set longer than each side of the terminal portion 20. The shape of the opening 22 is not necessarily limited to the illustrated rectangular shape, and can be set according to the shape of the terminal portion 20 to be finally formed.

  On the other hand, as shown in FIG. 1, two slits 24 are formed in the first laminated plate 110 so as to face each other so as to sandwich a portion to be finally removed. As will be described later, the slits 24 are finally formed on the side continuously extending from the rigid portion 14 and on the side opposite thereto, in order to punch out the respective layers so as to straddle the slit 24.

  These two slits 24 are formed outside the opening 22 of the interlayer adhesive layer 200 as shown in FIGS. 1 and 4 to 8. More specifically, the distance between the two slits 24 and the opening 22 of the interlayer adhesive layer 200 is set to 0.5 mm to 2.0 mm to form the two slits. As a result, since the interlayer adhesive layer 200 is present on the terminal 20a side of the slit 24, the interlayer adhesive layer 200 also suppresses the influence on the terminal 20a due to the intrusion of chemicals for the etching process or the like from the slit 24. Can do.

  The slit 24 is easier to work before it is temporarily bonded to the interlayer adhesive layer 200, but it is not excluded to form the slit 24 after temporary bonding. Similarly, the opening 22 of the interlayer adhesive layer 200 is preferably formed before temporary bonding to the first laminated plate 110, but can also be formed by cutting or the like after temporary bonding.

  In the illustrated embodiment, as shown in FIGS. 4 to 8, the first laminated board 110 shown in FIG. 1 and the inner circuit board 100 with the terminals 20a shown in FIG. Further, the second and third laminated plates 120 and 130 shown in FIG. 3 are laminated on the surface of the inner layer circuit board 100 opposite to the terminals 20a. In this case, the second and third laminated plates 120 and 130 are different from the first laminated plate 110 as shown in FIGS. 3 to 8 in that the surface protective layer 124 is formed with the inner circuit board 100 as a boundary. The second laminated plate 120 is laminated on the inner circuit board 100 through the interlayer adhesive layer 220 with the surface protective layers 124 and 134 facing downward. The third laminated plate 130 is laminated on the second laminated plate 120 via the interlayer adhesive layer 230.

  As for these second and third laminated plates 120 and 130, as shown in FIG. 3, an opening 28 is previously formed in an unnecessary portion by an appropriate method such as punching or cutting. As shown in FIG. 9, the opening 28 communicates with the opening 21 finally formed around the terminal portion 20, and is at least larger than the opening 21 around the terminal portion 20. At the same time, it is formed in a size and shape that can be passed by a cutting means described later. The openings 26 formed in the second and third laminated plates 120 and 130 are also preferably formed before lamination with other layers, but this does not exclude the formation after the lamination.

  The first laminated board 110 (first layer), the inner layer circuit board 100 (second layer), the second laminated board 120 (third layer), and the third laminated board constituting the inner layer circuit section 16 described above. As long as 130 (fourth layer) is prepared in the stacking step, the order of forming each layer is not particularly limited, and any layer may be formed first or later. Similarly, as long as the positional relationship is maintained, the order of stacking the layers is not particularly limited, and the layers can be stacked sequentially from the first stacked plate 110, or sequentially from the third stacked plate 130. They can be stacked on top of each other, in any other order, or all can be stacked simultaneously.

  After laminating the inner layer circuit portion 16 in this manner, as shown in FIG. 6, outer layer circuit boards 300 and 310 made of conductive layers are further laminated on both surfaces via interlayer adhesive layers 240 and 250. The outer layer circuit portion 18 is formed. The outer circuit boards 300 and 310 are exposed so that the inner circuit section 16 is exposed in the flexible section 12, so that at least a portion corresponding to the terminal section 20 is opened in the flexible section 12 as shown in FIG. , Processed into a shape corresponding to it. Further, the outer layer circuit board can be laminated only on one side of the inner layer circuit section 16, unlike the illustrated embodiment.

  In this case, the layers stacked on each other are not stacked after being heated and pressurized for each layer, but instead of the first stacked plate 110 (first layer) and the inner circuit board 100 (first layer) shown in FIG. 2 layers), the second laminated plate 120 (third layer), the third laminated plate 130 (fourth layer), and all the layers of the outer circuit boards 300 and 310 are heated together. It is desirable to press. Thereby, it is not necessary to go through the step of heating and pressurizing each layer, and the laminating operation can be performed more efficiently, and at the same time, the reliability of interlayer connection can be improved.

  In this case, the conditions for thermocompression bonding are preferably integrally molded by a hot press molding apparatus having a temperature of 110 to 220 ° C. and a pressure of 0.2 to 10 MPa. However, including these conditions, the present invention is not limited to the above-described embodiment, and each layer can be heated and pressurized by other methods.

  In the present invention, after laminating as the multilayer circuit board 10 in this way, the outer layer circuit portion 18 including the rigid portion 14 is patterned with a chemical agent or the like, and then the above two slits as shown in FIG. 24, a terminal 20a is provided through a cutting means (not shown) so as to penetrate all the layers constituting the inner layer circuit section 16, that is, all the laminated plates 110, 120, and 130 and the inner layer circuit board 100. The shape processing of the terminal portion 20 is performed.

  In this case, the portion sandwiched between the two slits 24 formed in the first laminated plate 110 passes through the two slits 24 and the cutting means (not shown) is cut off from the other portions. In addition to the shape processing of the terminal portion 20, an unnecessary removal piece G (see FIG. 8) to be removed at the same time is also formed. That is, the shape processing of the terminal portion 20 and the formation of the removal piece G can be performed by a single operation, and the multilayer circuit board 10 can be manufactured very efficiently. Thereafter, as shown in FIG. 8, by removing unnecessary removal pieces G, the terminal portions 20 of the inner circuit board 100 can be exposed to obtain a desired multilayer circuit board 10.

  In this case, a cutting means (not shown) finally cuts each layer in accordance with the shape of the terminal portion 20 to be formed. That is, as shown in FIG. 9, when the opening 21 is formed around the terminal portion 20, the opening 21 including the two slits 24 is cut so as to form the opening 21. For this reason, it is most desirable that the cutting means is formed by punching or cutting out each layer in a shape that matches the opening 21, thereby forming the terminal portion 20 and thus forming the opening 21 around the terminal portion 20. Work can be done.

  In that sense, the cutting by the cutting means is not necessarily limited to the slit-shaped cutting, and can be set according to the shape to be punched. In addition, for example, the shape processing of the terminal portion 20 and the formation of the opening 21 can be performed by moving the cutting means linearly along the edge of the opening 21, or along the outer edge of the opening 21. After cutting, the periphery of the terminal portion 20 (inner edge of the opening portion 21) can be cut for shape processing. Note that the opening 21 does not necessarily have to be a single one formed in a substantially U shape, as shown in FIG. The bridge portion may be left and divided by this bridge portion.

  In general, as a cutting means, each layer can be cut by, for example, using a cutting blade of a cutting tool (not shown) and moving the cutting blade down and moving. It is not limited to a typical cutting means, and a physical cutting means such as a laser can also be used.

  In addition, since the terminal portion 20a of the inner layer circuit board is used for connection (fitting) with a connector, wear and connection reliability are required, and in general, electrolytic gold plating is often performed. On the other hand, the surface treatment of the component mounting portion on the surface of the rigid portion 14 has a high wiring density and component mounting density, so it is difficult to provide a region for installing conductive wiring for electrolytic plating. In order to ensure the mounting reliability of components at the portion where surface treatment is performed by electrolytic plating or component mounting by soldering, organic rust prevention treatment generally called heat-resistant preflux is often performed rather than gold plating. In this case, since a plurality of types of surface treatments are required for the terminal portion and the surface of the inner circuit board 100, it is necessary to add a mask process in which only necessary portions are exposed in order to selectively provide the surface treatment. is there. By using the inner layer circuit board protection method according to the present embodiment, the surface portion of the rigid portion is subjected to surface treatment before exposing the terminal portion, the terminal portion is then exposed, and then the terminal portion is provided with an appropriate mask on the rigid portion. By performing the surface treatment on the surface, the masking step of the surface treatment can be omitted.

  The present invention can be widely applied to the production of multilayer circuit boards in which terminal portions such as flexible rigid circuit boards and multilayer flexible circuit boards are exposed.

FIG. 1 shows a first laminate having an opening used in the present invention. FIG. 1A is a sectional view of the first laminate, and FIG. 1B is a slit in the first laminate. The figure which shows the state to form, the figure (C) is a figure which shows the state which forms an opening in the interlayer contact bonding layer which adhere | attaches a 1st laminated body on an inner-layer circuit board, The figure (D) is a 1st laminated | stacked layer. It is a figure which shows the state which adheres an interlayer contact bonding layer to a body. It is a figure which shows the state which exposes a terminal in the inner layer circuit board used for this invention. FIG. 3 shows the second and third laminates used in the present invention. FIG. 3A is a sectional view of the second and third laminates, and FIG. 3B is the second and third laminates. It is a figure which shows the state which forms opening in the laminated board. 4A and 4B show a state in which the laminated body and the inner layer circuit board used in the present invention are laminated together. FIG. 4A is a perspective view thereof, and FIG. 4B is a sectional view thereof. 5A and 5B show a state in which the laminated body and the inner layer circuit board used in the present invention are laminated together, FIG. 5A is a perspective view thereof, and FIG. 5B is a sectional view thereof. In this invention, it is sectional drawing of the multilayer circuit board in the state before cut | disconnecting the inner layer circuit part in which the outer layer circuit board was laminated | stacked on both surfaces. In this invention, it is a schematic perspective view which shows the state which cut | disconnects an inner layer circuit board by a cutting | disconnection means. FIGS. 8A and 8B show a state in which unnecessary removal pieces are removed in the present invention. FIG. 8A is a perspective view thereof and FIG. 8B is a cross-sectional view thereof. It is a perspective view of the inner layer circuit board which has the terminal part shape-processed by this invention.

DESCRIPTION OF SYMBOLS 10 Multilayer circuit board 12 Flexible part 14 Rigid part 16 Inner layer circuit part 18 Outer layer circuit part 20 Terminal part 20a Terminal 21 Opening part 22 Opening of 1st laminated board 24 Slit 26 Opening of 2nd, 3rd laminated board 100 Inner layer circuit Substrate 101 Insulating base film 102 Conductive layer 103 Adhesive layer 104 Surface protective layer 110 First laminated plate 111 Insulating base film 112 Conductive layer 113 Adhesive layer 114 Surface protective layer 120 Second laminated plate 121 Insulating base film 122 Conductive layer 123 Adhesive Layer 124 Surface protective layer 130 Third laminate 131 Insulating base film 132 Conductive layer 133 Adhesive layer 134 Surface protective layer 200 Interlayer adhesive layer 210 Interlayer adhesive layer 220 Interlayer adhesive layer 240 Interlayer adhesive layer 250 Interlayer adhesive layer 300 Outer circuit board 310 Outer circuit board G Sahen

Claims (12)

A method for manufacturing a multilayer circuit board comprising a flexible part having a flexibility and a rigid part, wherein an interlayer adhesive layer having an opening is formed on at least the exposed surface of the terminal of the inner circuit board from which the terminal is exposed. And laminating a laminated plate in which a slit is formed at the boundary between at least the flexible part and the rigid part of at least the part having an insulating base film and finally to be removed, and then, the laminated layered over the slit. A method of manufacturing a multilayer circuit board, comprising: shaping a terminal portion having the terminal through cutting means so as to penetrate all of the board and the inner layer circuit board. Two slits are formed facing each other so as to sandwich the part to be finally removed, and cut so as to penetrate all of the laminated board and inner layer circuit board across the two slits. A method of manufacturing a multilayer circuit board, wherein the shape processing of the terminal portion including the terminal is performed through the means. 3. The method of manufacturing a multilayer circuit board according to claim 1, wherein after the unnecessary removal pieces are simultaneously formed by the cutting means, the removal pieces are removed to expose the terminal portions on the surface. A method for manufacturing a multilayer circuit board. 4. The multilayer circuit board manufacturing method according to claim 1, wherein an opening is formed around the terminal portion simultaneously with the shape processing of the terminal portion by the cutting means. A method of manufacturing a circuit board. 5. The method for manufacturing a multilayer circuit board according to claim 1, wherein the slit is formed outside an opening of the interlayer adhesive layer. 6. 6. The method of manufacturing a multilayer circuit board according to claim 5, wherein a distance between the slit and the opening of the interlayer adhesive layer is set to 0.5 mm to 2.0 mm. 7. The method for manufacturing a multilayer circuit board according to claim 1, wherein an opening of the interlayer adhesive layer is formed larger than an exposed portion of the terminal of the inner circuit board. A method of manufacturing a circuit board. 8. The method of manufacturing a multilayer circuit board according to claim 1, further comprising at least one or more insulating base films on a surface of the inner circuit board opposite to the exposed side of the terminals. A method for producing a multilayer circuit board, comprising: laminating a back laminate, and forming an opening through which the cutting means can pass in the back laminate. 9. The method for manufacturing a multilayer circuit board according to claim 1, further comprising an outer layer circuit board on both sides or one side of the laminated board and the inner layer circuit board or the back side laminated board laminated on each other. A method for producing a multilayer circuit board, comprising stacking layers. The method for manufacturing a multilayer circuit board according to any one of claims 1 to 9, wherein the layers are heated and pressed together in a state where all the layers are laminated without being heated and pressed for each of the layers. A method for manufacturing a multilayer circuit board. The method for manufacturing a multilayer circuit board according to claim 10, further comprising a step of heat-pressing all the layers in a stacked state, and further heat-pressing in a lump after stacking a plurality of layers. A method for producing a multilayer circuit board. A multilayer circuit board manufactured by the method for manufacturing a multilayer circuit board according to any one of claims 1 to 11.

Images