JP5539150B2 - Wiring board manufacturing method - Google Patents

Description

  The present invention relates to a method of manufacturing a wiring board on which various electric / electronic components are mounted.

  Conventionally, as a wiring board on which various electric / electronic components are mounted, a metal core board having a multilayer structure in which an insulating layer is provided on the front and back surfaces of a metal plate and a conductor layer is formed on the insulating layer is known. According to this metal core substrate, the heat of the electric / electronic component is favorably radiated by the metal plate (see, for example, Patent Documents 1 and 2).

  As a method for producing such a wiring board, a laminate molding method is known in which an insulating sheet having a copper foil is laminated on the front and back surfaces of a metal plate and laminated (see, for example, Patent Documents 3 to 5).

JP 2003-46022 A Japanese Patent Laid-Open No. 2002-353584 JP 2001-189536 A JP 2009-218305 A JP-A-62-179200

  By the way, in order to connect a wire harness or the like, as shown in FIG. 16, a connector 2 is mounted on the wiring board 1 and attached later. To mount the connector 2, the connector 2 is provided. A large number of connection pins 3 are inserted into through holes formed on the mounting surface 1a of the wiring board 1 and soldered to the conductor pattern, and the manufacturing cost of the wiring board 1 increases. In addition, the unit price of the connector 2 having such a large number of connection pins 3 is increasing, and therefore, the cost of the wiring board 1 on which the connector 2 is mounted is further increased.

  The present invention has been made in view of the above-described circumstances, and an object of the present invention is to provide a wiring board that can be easily connected to a wire harness or the like and that can be easily manufactured at low cost. It is to provide a manufacturing method.

In order to achieve the above-described object, a method for manufacturing a wiring board according to the present invention is characterized by any one of (1) to (6) below.
(1) A conductor made of the conductive layer, in which an insulating layer having a conductive layer is laminated on at least one of the front and back surfaces of the plate-shaped metal core with the conductive layer disposed on the side opposite to the metal core side. The metal core in which a surface having a pattern is a mounting surface for various components, one end is a fixing portion fixed to the substrate, and the other end is a terminal portion extending from a side edge portion of the substrate A method of manufacturing a wiring board comprising a connection terminal comprising a part of
A fixing part forming step of forming the fixing part of the connection terminal on the metal plate to be the metal core;
A masking step of covering a terminal part forming region including a formation part of the terminal part of the connection terminal with a masking material on the surface of the metal plate on which the insulating layer is laminated;
An insulating layer laminating step in which the insulating layer having the conductive layer is stacked on the metal plate, and the insulating layer is integrated with the metal plate by laminating;
An insulating layer removing step of removing the insulating layer and the conductive layer in the terminal portion forming region to expose the metal plate;
A terminal portion forming step of processing the exposed metal plate to form the terminal portion of the connection terminal;
Including.
(2) In the method for manufacturing a wiring board according to (1), in the insulating layer laminating step, the laminated metal plate and the insulating layer are heated and pressurized after the laminating process to flatten the surface of the insulating layer. Including a flattening process.
(3) In the method for manufacturing a wiring board according to (1) or (2), a roughening step of roughening a surface on which the insulating layer of the metal plate is laminated is included after the masking step.
(4) In the method of manufacturing a wiring board according to any one of (1) to (3), in the masking step, a masking tape is attached to the metal plate as the masking material, and in the insulating layer removing step, the terminal A groove is formed by sitting the insulating layer along the inner periphery of the portion forming region, and then the masking tape is peeled off to remove the insulating layer and the conductive layer in the terminal portion forming region.
(5) In the method for manufacturing a wiring board according to (4), in the insulating layer removing step, a non-penetrating groove portion is formed by sitting on a portion of the insulating layer serving as an end surface from which the terminal portion of the terminal portion forming region projects. And forming through-grooves from both ends of the non-through-grooves toward the side of the wiring board.
(6) In the method for manufacturing a wiring board according to (5), a part of the through groove is formed with the masking tape or an insulating layer laminated on the masking tape left.

In the method for manufacturing a wiring board having the configuration (1), it is possible to easily manufacture a wiring board on which connection terminals that can be connected to a wire harness or the like are formed without using a separate expensive connector. In addition, since the insulating layer is integrated and laminated on the metal plate by the laminating process, continuous processing is possible without having an in-process inventory compared to the laminating press method, and the prepreg constituting the insulating layer is also possible. The resin can be well integrated and laminated while preventing voids of the resin, and the prepreg can be reduced. Moreover, since the insulating layer is laminated in a state in which the portion to be the terminal portion of the connection terminal is masked and protected, the surface of the formed terminal portion can be kept smooth. Therefore, it can connect with the other party's connecting terminal smoothly and reliably.
In other words, a wiring board with a multilayer structure that ensures good heat dissipation can be easily manufactured at low cost because it can be connected well to a wire harness and the like, and a part of the metal plate serving as a metal core is used as a connection terminal. can do.
In the method of manufacturing the wiring board having the configuration (2), the surface of the insulating layer serving as the mounting surface of the electric / electronic component is flattened by the flattening process, so that the electric / electronic component can be mounted satisfactorily. A quality wiring board can be manufactured.
In the manufacturing method of the wiring board having the configuration (3), the surface on which the insulating layer of the metal plate is laminated is roughened, so that the adhesion between the metal plate and the insulating layer can be greatly improved.
In the manufacturing method of the wiring board having the configuration (4), the insulating layer and the conductive layer in the terminal portion forming region can be easily removed by forming the groove portion while sitting around the insulating layer.
In the method for manufacturing a wiring board having the above configuration (5), since the through groove is provided, the insulating layer and the conductive layer on the terminal portion formation region can be more easily removed.
In the method for manufacturing a wiring board having the above configuration (6), since the insulating layer laminated on the masking tape or the masking tape is left in the through groove portion, the insulating layer on the terminal portion formation region is triggered by the portion. The conductive layer can be peeled and removed very easily.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the wiring board which can manufacture the wiring board excellent in the heat dissipation which can be connected with a wire harness etc. easily at low cost can be provided.

  The present invention has been briefly described above. Further, details of the present invention will be further clarified by reading through the modes for carrying out the invention described below with reference to the accompanying drawings.

It is a perspective view of the wiring board manufactured by the manufacturing method of the wiring board concerning an embodiment. It is AA arrow sectional drawing of FIG. It is a figure explaining the manufacturing method of the wiring board which concerns on embodiment, Comprising: (a) is a top view of a workpiece | work, (b) is an enlarged plan view of a workpiece | work. It is a figure explaining the manufacturing method of the wiring board which concerns on embodiment, Comprising: (a) is a top view of a workpiece | work, (b) is an enlarged plan view of a workpiece | work. It is a figure explaining the manufacturing method of the wiring board which concerns on embodiment, Comprising: (a) is a top view of a workpiece | work, (b) is an enlarged plan view of a workpiece | work. It is a top view of the wiring board in the middle of manufacture explaining the manufacturing method of the wiring board concerning an embodiment. It is a top view of the wiring board in the middle of manufacture explaining the manufacturing method of the wiring board concerning an embodiment. It is a top view of the wiring board in the middle of manufacture explaining the manufacturing method of the wiring board concerning an embodiment. It is a top view of the wiring board in the middle of manufacture explaining the manufacturing method of the wiring board concerning an embodiment. It is a figure explaining the manufacturing method of the wiring board which concerns on embodiment, Comprising: (a)-(c) is sectional drawing of a part of workpiece | work. It is a figure explaining the manufacturing method of the wiring board which concerns on embodiment, Comprising: (a) to (c) is sectional drawing of a part of wiring board. It is a schematic side view of the laminate molding apparatus which performs laminate molding. It is a figure explaining the manufacturing method of the wiring board which concerns on another embodiment, Comprising: (a) is a top view of a workpiece | work, (b) is an enlarged plan view of a workpiece | work. FIG. 6 is a diagram for explaining a method of manufacturing a wiring board according to another embodiment, wherein (a) and (b) are cross-sectional views of a part of a work as viewed from the longitudinal direction of the wiring board. It is a partial top view of the wiring board in the middle of manufacture which shows another embodiment of the manufacturing method of the wiring board provided with the connection terminal. It is a perspective view of the wiring board which shows the example of mounting of a wiring board.

Hereinafter, examples of embodiments according to the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view of a wiring board manufactured by the method for manufacturing a wiring board according to the embodiment, and FIG. 2 is a cross-sectional view taken along line AA in FIG.

  As shown in FIGS. 1 and 2, the wiring board 11 manufactured by the method for manufacturing a wiring board according to the present embodiment includes a board 21 and a plurality of connection terminals 31 provided on the board 21. .

  The substrate 21 has a plate-like metal core 22 formed of copper or a copper alloy at the center in the thickness direction, and a synthetic resin having thermosetting and insulating properties on the front and back surfaces of the metal core 22. Two insulating layers 23 made of each of these are laminated.

  A copper foil (conductive layer) 24 that forms a conductor pattern is formed on the surface of each insulating layer 23, and electrical and electronic components are mounted on the outer surface of the insulating layer 23 exposed to the outside of the substrate 21. The mounting surface 21a is used. Further, the copper foil 24 forming the circuit pattern of each insulating layer 23 is electrically connected by a through hole 25 plated on the inner peripheral side to form an electric circuit. Further, the copper foil 24 forming the circuit pattern is electrically connected to the metal core 22 through the through hole 25. An electric circuit including the metal core 22 may be formed.

  Thus, this board | substrate 21 is a metal core board | substrate with which the metal core 22 was provided and was excellent in heat dissipation and soaking | uniform-heating property. In addition, the substrate 21 is a multilayer substrate in which a plurality of insulating layers 23 are laminated on the front and back surfaces of the metal core 22 to form a five-layer structure including the metal core 22. The substrate 21 made of this multilayer substrate has various electric / electronic components mounted on the mounting surfaces 21a on the front and back surfaces. The heat of the electric / electronic components and the like generated on the substrate 21 which is the metal core substrate is smoothly heated by the metal core 22 and radiated to the outside.

  Concave portions 26 are formed in the side edge portions 21 b facing each other on the substrate 21, and a plurality of connection terminals 31 are extended in an aligned state from the bottom sides in the longitudinal direction constituting the concave portions 26. These connection terminals 31 are electrically connected to, for example, a copper foil 24 that forms a circuit pattern through a through hole 25 formed in the substrate 21.

  The connection terminal 31 is formed from a part of the metal core 22 and is sandwiched and fixed by the insulating layer 23.

  The connection terminal 31 has one end (base end portion) sandwiched and fixed by the insulating layer 23 as a fixing portion 32, and is extended to the outside at the side edge portion 21 b of the substrate 21 and exposed. The end (tip portion) is a terminal portion 33.

  In the wiring board 11 configured as described above, for example, the connection terminal 31 can be connected to another wiring board, or a component such as a connector housing can be attached to the connection terminal 31.

  According to this wiring board 11, since the connection terminal 31 extends from the side edge portion 21b of the board 21, a complicated mounting operation such as soldering and connecting the connector connection pins to the mounting surface 21a is performed. This can be eliminated, and the manufacturing cost can be minimized. Further, an expensive connector having a large number of connection pins can be eliminated, and the cost can be reduced.

  Next, a method of manufacturing a wiring board according to this embodiment for manufacturing the wiring board 11 having the above structure will be described with reference to FIGS.

  3 to 5 are views for explaining a method of manufacturing a wiring board according to the embodiment, in which (a) is a plan view of a work and (b) is an enlarged plan view of the work. FIG. 6 to FIG. 9 are plan views of a wiring board in the middle of manufacture for explaining a method of manufacturing the wiring board according to the embodiment. FIG. 10 is a diagram for explaining the method for manufacturing the wiring board according to the embodiment, wherein (a) to (c) are cross-sectional views of a part of the workpiece, and FIG. 11 is a method for manufacturing the wiring board according to the embodiment. (A) to (c) are cross-sectional views of a part of the wiring board.

(Fixed part forming process)
As shown in FIGS. 3A, 3B and 10A, a metal plate 41 capable of forming a plurality of (for example, twelve) metal cores 22 is prepared, and the metal plate 41 is pressed. By performing the processing, the hole portion 42 through which the fixing portion 32 of the connection terminal 31 and the through hole 25 are passed is formed. The fixing portion 32 is formed by forming the comb-shaped opening 43 so as to be arranged substantially parallel to the side edge portion of the metal plate 41.

(Masking process)
Next, as shown in FIGS. 4A, 4 </ b> B, and 10 </ b> B, the portion where the terminal portion 33 of the connection terminal 31 is formed on the front and back surfaces where the insulating layer 23 of the metal plate 41 is laminated is included. A masking material 44 is affixed to the terminal portion formation region. That is, the masking material 44 covers the opposite side of the opening 43 from the end of the fixed portion 32. As the masking material 44, a heat-resistant resin tape or the like can be used. For example, a masking tape 44 made of polyimide or PET (polyethylene terephthalate) can be used.

(Roughening process)
After the masking tape 44 is applied to mask the terminal portion formation region, the front and back surfaces of the metal plate 41 on which the insulating layer 23 is laminated are roughened by, for example, sand blasting or chemicals. At this time, since the terminal portion forming region is masked by the masking tape 44, it is not roughened.

(Insulating layer lamination process)
Next, the insulating layer 23 having the conductive layer (copper foil) 24 on the front and back surfaces of the metal plate 41 is laminated by a laminate molding method.

Here, the case where the insulating layer 23 is laminated by the laminate molding method will be described.
FIG. 12 shows a laminate forming apparatus that performs laminate forming.

  As shown in FIG. 12, the laminate molding apparatus is an upper part that winds up the transport PET upper film (film) 50 unwound from the transport PET upper film unwinding roll 51 by the transport PET upper film take-up roll 52. A transport system, a lower transport system for winding the transport PET lower film (film) 60 unwound from the transport PET lower film unwinding roll 61 by a transport PET lower film take-up roll 62, an upper transport system and a lower transport system A first stage 70 that performs a laminating process in which a product conveyed by being sandwiched between conveyance systems is first heated and pressed to be laminated, and flattening that heats and pressurizes the front and back surfaces of the product to flatten the front and back surfaces. It comprises a second stage 80 that performs processing.

  In the laminate molding apparatus, the insulating layer 23 is laminated on the front and back surfaces of the metal plate 41 by the following operation.

  First, the work W in which the insulating layer 23 having the copper foil 24 is laminated two layers on the upper and lower sides of the metal plate 41 so that the copper foil 24 is located on the side opposite to the metal plate 41 side is formed on the PET lower film 60 for transportation. It is placed on the upstream side and transported toward the downstream side. On the way, the transport PET upper film 50 is coated on the work W, and the work W is sandwiched between the transport PET upper film 50 and the transport PET lower film 60 and transported to the first stage 70.

  In the first stage 70, the workpiece W is heated and pressed under vacuum to laminate the insulating layer 23 on the metal plate 41, and the laminating process is also performed to laminate the laminated insulating layers 23 together. Specifically, the vacuum chamber is sealed and the inside is depressurized, and the movable plate made of a rubber diaphragm is brought close to the fixed plate to clamp the hot plate to prepreg the insulating layer 23 between the hot plates and The copper foil 24 is laminated by heating and pressing. Thus, as shown in FIGS. 5A and 5B, the insulating layer 23 and the conductive layer (copper foil) 24 are integrated and adhered to the metal plate 41 so as to cover the front and back surfaces thereof. Thus, as shown in FIG. 10C, the workpiece W has a five-layer structure in which the two insulating layers 23 having the conductive layer 24 are integrated and laminated on the front and back surfaces of the metal plate 41, respectively. It becomes.

  As the prepreg of the insulating layer 23, for example, a glass cloth impregnated with a thermosetting resin is used. Then, the insulating layer 23 made of the prepreg is heated and melted in the laminating process so that the opening 43 in which the fixing portion 32 of the metal plate 41 is formed, the through hole 25 and the like. Enter the hole 42 without any voids or gaps. Further, since the metal plate 41 is roughened except for the portion where the masking tape 44 is attached, the resin of the insulating layer 23 is firmly adhered to the front and back surfaces.

  In the first stage 70, the heating and pressurizing conditions are not particularly limited as long as the thermosetting resin used for the insulating layer 23 can be sufficiently melted and solidified.

  In addition, as the copper foil 24 provided in each insulating layer 23, it is preferable to use the one in which a circuit pattern is previously formed by an etching process. The copper foil 24 provided on the insulating layer 23 on the outer surface side may be etched in a subsequent process to form a circuit pattern.

  The workpiece W laminated in the first stage 70 is unloaded from the first stage 70 and loaded into the second stage 80.

  In the second stage 80, the front and back surfaces of the workpiece W are heated and pressed against the workpiece W in which irregularities are formed on the front and rear surfaces by the copper foil 24 that forms the circuit pattern by being heated and pressurized in vacuum. A smoothing process for smoothing is performed. Specifically, the workpiece W is pressurized at a predetermined temperature by a planarizing press constituting the second stage 80, and the front and back surfaces of the workpiece W are formed flat. The flattening press has a fixed upper plate, a lower plate made of a rubber diaphragm movably arranged facing the upper plate, and moves the lower plate up and down and cooperates with the upper plate. The work W is pressed by the driving means while the lower plate is moved and pressed by the driving means while being pressed by the heating means, and the work W is subjected to secondary processing for flattening the front and back surfaces.

  In the second stage 80, the heating and pressurizing conditions are not particularly limited as long as the unevenness on the front and back surfaces of the workpiece W can be leveled and formed flat.

  The workpiece W whose front and back surfaces are flattened in the second stage 80 is unloaded from the second stage while being sandwiched between the transporting PET upper film 50 and the transporting PET lower film 60.

  The PET film used for conveyance is respectively wound downstream by a conveyance PET upper film winding roll 52 and a conveyance PET lower film winding roll 62, and at that time, the workpiece W is sent out to the outside.

(Cutting and separation process)
When two layers of the insulating layer 23 having the conductive layer 24 are integrated on the front and back surfaces of the metal plate 41 as described above to form a five-layer structure, the workpiece W having the five-layer structure is cut and separated. As shown in FIG. 5, a plurality of wiring boards 11 having a five-layer structure having a metal core 22 made of a metal plate 41 are provided.

  Then, as shown in FIG. 7, by forming a through hole 25 at a predetermined location with a drill or the like and plating the inner peripheral side, the copper foil 24, the metal core 22 and the connection terminal 31 can be attached as necessary. Conduction is performed to form an electric circuit.

(Insulating layer removal process)
Next, the insulating layer 23 and the conductive layer 24 in the terminal part formation region of the wiring board 11 are removed, and the metal core 22 is exposed.

  Specifically, as shown in FIG. 7 and FIG. 11A, first, the insulating layer 23 and the conductive layer 24 from the front and back of the wiring substrate 11 are the end surfaces from which the terminal portions of the terminal portion forming region protrude. The non-penetrating groove 46 is formed by sitting with a reamer or a milling cutter. The non-penetrating groove portion 46 formed by the counterbore processing has a depth that allows the masking tape 44 to be removed to contact the metal core 22 or be slightly shaved. Subsequently, the through-groove 47 is formed by cutting both ends of the non-through-groove 46 with a router in a direction substantially perpendicular to the non-through-groove 46 toward the side of the wiring board 11.

  Then, when the insulating layer 23 and the conductive layer 24 on the terminal portion formation region are peeled off together with the masking tape 44 from the non-through groove portion 46 side, the metal in the terminal portion formation region is obtained as shown in FIGS. Only the core 22 can be exposed.

(Terminal part formation process)
As shown in FIGS. 9 and 11 (c), the exposed metal core 22 in the terminal portion forming region is processed by pressing or cutting using a router to correspond to the fixing portion 32 of the connection terminal 31. The terminal part 33 to be formed is formed. Thereafter, the terminal portion 33 of the formed connection terminal 31 is subjected to a plating process such as tin plating.

  Through the above steps, it is possible to easily manufacture the wiring board 11 having a five-layer structure in which the front and back surfaces are the mounting surfaces 21a and the connection terminals 31 are extended from the side edge portions 21b.

  As described above, according to the method for manufacturing a wiring board according to the above embodiment, the wiring board in which the connection terminal 31 that can be connected to a wire harness or the like is extended without using a separate expensive connector. 11 can be manufactured easily. In addition, since the insulating layer 23 is integrated and laminated on the metal plate 41 by the laminating process, continuous processing is possible without having an in-process inventory, as compared with the laminating press method. While preventing the void of the resin of the prepreg to constitute, it can be well integrated and laminated, and the prepreg can also be reduced. In addition, since the insulating layer 23 is laminated in a state where the portion to be the terminal portion 33 of the connection terminal 31 is protected by masking, the surface of the formed terminal portion 33 can be kept smooth. Therefore, it can connect with the other party's connecting terminal smoothly and reliably.

  That is, it is possible to easily manufacture the wiring board 11 that can be connected to a wire harness or the like and that has good heat dissipation by the metal core 22 at low cost.

  In addition, since the surface of the outermost insulating layer 23 that becomes the mounting surface 21a of the electric / electronic component is flattened by the flattening process, the high-quality wiring board 11 that can mount the electric / electronic component satisfactorily is manufactured. can do.

  In addition, since the surface of the metal plate 41 on which the insulating layer 23 is laminated is roughened, the adhesion between the metal plate 41 and the insulating layer 23 can be greatly improved.

  Further, by forming the non-penetrating groove 46 while sitting on the insulating layer 23, the insulating layer 23 and the conductive layer 24 in the terminal portion forming region can be easily removed together with the masking tape 44.

  Furthermore, by laminating a plurality of insulating layers 23 each having a copper foil 24 (conductive layer 24) on both the front and back surfaces of the metal plate 41, it is possible to cope with a complicated circuit design while suppressing the area of the substrate 21. A wiring board 11 can be obtained.

  In addition, this invention is not limited to embodiment mentioned above, A deformation | transformation, improvement, etc. are possible suitably. In addition, the material, shape, dimensions, number, arrangement location, and the like of each component in the above-described embodiment are arbitrary and are not limited as long as the present invention can be achieved.

  For example, in the insulating layer removing step, the insulating layer 23 and the conductive layer 24 on the terminal portion forming region may be removed, and the non-penetrating groove portion is formed by sitting on the insulating layer 23 along the inner periphery of the terminal portion forming region. It is also possible to remove the masking tape 44 after forming the mask.

  For example, in the above embodiment, a cutting and separating step for separating the work W from the individual wiring boards 11 is provided after the insulating layer stacking step. However, as shown in FIGS. The non-penetrating groove 46 is formed by sitting on the end surface of the terminal forming region where the terminal portion protrudes, and then the wiring substrate 11 is cut by router processing, and the through groove 47 in the terminal forming region is formed. good.

  In the present invention, a terminal portion forming step may be provided before the through hole 25 is formed in the wiring board 11.

Further, in the present invention, in the insulating layer removing step, the depth of the router processing is adjusted when forming the through groove portion 47, and the end portion 44a of the masking tape 44 is left as shown in FIG. As shown in FIG. 14B, the through-groove 47 may be formed with the end 23a of the insulating layer 23 laminated on the masking tape 44 remaining. Since the masking tape 44 protrudes from the metal core 22 when the end portion 44a of the masking tape 44 is left, the insulating layer 23 and the conductive layer 24 can be removed very easily using the masking tape 44 as a trigger. it can. Further, when the end portion 23a of the insulating layer 23 is left, the masking tape 44 and the insulating layer 23 laminated on the masking tape 44 are in close contact with each other. Therefore, the masking is performed by peeling off the insulating layer 23 as a trigger. The insulating layer 23 and the conductive layer 24 can be removed together with the tape 44.
In addition, when the insulating layer 23 and the conductive layer 24 are laminated on both surfaces of the metal core 22, one through groove portion 47 in the terminal portion formation region is cut from the surface, and the other through groove portion 47 is cut from the back surface. Then, the masking tape 44 and the portions where the end portions 23a and 44a of the insulating layer 23 are left may be formed.

  FIG. 15 shows still another embodiment of the method for manufacturing the wiring board 11 having the connection terminals 31. In this embodiment, the connection terminals 31 prepared in advance are arranged in the terminal formation region of the metal core 22. Then, the insulating layer 23 is laminated and laminated on the front and back surfaces of the metal core 22 holding the connection terminals 31 so as to be wrapped around the fixing portions 32 of the connection terminals 31. Thereby, the wiring board 11 in which the connection terminal 31 is extended from the side edge portion 21b of the board 21 can be manufactured.

  In the embodiment of the present invention, the wiring board 11 having the five-layer structure including the metal core 22 has been described. However, the structure is not particularly limited, and may be a structure of 2 to 4 layers or 6 or more layers.

DESCRIPTION OF SYMBOLS 11 Wiring board 21 Board | substrate 21a Mounting surface 21b Side edge part 22 Metal core 23 Insulating layer 24 Copper foil (conductive layer)
31 Connection terminal 32 Fixed part 33 Terminal part 44 Masking tape (masking material)
46 Non-through groove portion 47 Through groove portion 50 PET film for transport (film)
60 Under PET film for transport (film)

Claims (6)

An insulating layer having a conductive layer is laminated on at least one of the front and back surfaces of the plate-shaped metal core with the conductive layer disposed on the side opposite to the metal core side, and has a conductor pattern made of the conductive layer. A part of the metal core whose surface is a mounting surface for various components, one end is a fixing part fixed to the board, and the other end is a terminal part extending from a side edge of the board A method for manufacturing a wiring board comprising a connection terminal comprising:
A fixing part forming step of forming the fixing part of the connection terminal on the metal plate to be the metal core;
A masking step of covering a terminal part forming region including a formation part of the terminal part of the connection terminal with a masking material on the surface of the metal plate on which the insulating layer is laminated;
An insulating layer laminating step in which the insulating layer having the conductive layer is stacked on the metal plate, and the insulating layer is integrated with the metal plate by laminating;
An insulating layer removing step of removing the insulating layer and the conductive layer in the terminal portion forming region to expose the metal plate;
A terminal portion forming step of processing the exposed metal plate to form the terminal portion of the connection terminal;
A method for manufacturing a wiring board, comprising:   2. The insulating layer laminating step includes a flattening process for flattening a surface of the insulating layer by heating and pressurizing the laminated metal plate and the insulating layer after the laminating process. The manufacturing method of the wiring board as described in 2 ..   The method for manufacturing a wiring board according to claim 1, further comprising a roughening step of roughening a surface of the metal plate on which the insulating layer is laminated after the masking step. In the masking step, a masking tape is attached to the metal plate as the masking material,
In the insulating layer removing step, a groove is formed by sitting on the insulating layer along the inner periphery of the terminal portion forming region, and then the masking tape is peeled off to thereby form the insulating layer in the terminal portion forming region. The said conductive layer is removed, The manufacturing method of the wiring board as described in any one of Claims 1-3 characterized by the above-mentioned.   In the insulating layer removing step, a non-penetrating groove is formed by sitting on an insulating layer at a portion where the terminal portion of the terminal portion forming region protrudes, and from both ends of the non-penetrating groove to the wiring board side The method of manufacturing a wiring board according to claim 4, wherein the through-groove portion is formed toward the side.   6. The method for manufacturing a wiring board according to claim 5, wherein a part of the through groove is formed in a state where the masking tape or an insulating layer laminated on the masking tape is left.

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