CN104981114B - The processing method and circuit board of hanging golden finger - Google Patents
The processing method and circuit board of hanging golden finger Download PDFInfo
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- CN104981114B CN104981114B CN201410149057.8A CN201410149057A CN104981114B CN 104981114 B CN104981114 B CN 104981114B CN 201410149057 A CN201410149057 A CN 201410149057A CN 104981114 B CN104981114 B CN 104981114B
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Abstract
The invention discloses a kind of processing method and circuit board of hanging golden finger, to solve existing for existing golden finger circuit board, limitation is very strong, and versatility is very poor, easily causes the technical problem of the wasting of resources and cost.Method includes：Golden finger copper-clad plate with golden finger figure is pressed on multiple-plate internal layer；One group of via hole is processed beyond multiple-plate shaping area, the via hole is connected by the big copper sheet in the golden finger copper-clad plate with the golden finger figure；Controlled depth milling manifests the golden finger figure；It is gold-plated to the golden finger figure；Non- golden finger visuals controlled depth milling beyond multiple-plate shaping area is removed, forms golden finger, the circuit board with hanging structure golden finger is made.
Description
Technical field
The present invention relates to circuit board technology field, and in particular to a kind of processing method and circuit board of hanging golden finger.
Background technology
At present, the printed circuit board (PCB) with golden finger (PCB) plate, generally use golden finger online design in its structure design
Mode within the shaping area of road plate top layer.And the golden finger of plug function is provided, it should be matched with the size of connecting-disconnecting interface, golden finger
The thickness of circuit board should be consistent with the open height of connecting-disconnecting interface, when the open height of connecting-disconnecting interface is fixed, golden finger
The circuit plate thickness at place is also just therefore fixed.
When golden finger circuit board will realize multi-functional demand and need to increase thickness of slab, then supporting connecting-disconnecting interface equipment
Do whole conversion, very waste of resource and cost；Golden finger circuit board is fixed due to thickness, it is impossible to applied to various sizes of
Connecting-disconnecting interface, cause the versatility of golden finger circuit board very poor；When same equipment has multiple connecting-disconnecting interfaces, it is necessary to design multiple
The golden finger circuit board of corresponding thickness, can influence the assembly space of product, and cause the wasting of resources and cost.
To sum up, existing golden finger circuit board, limitation is very strong, and versatility is very poor, easily causes the wasting of resources and cost
Lifting.
The content of the invention
The embodiment of the present invention provides a kind of processing method and circuit board of hanging golden finger, to solve existing golden finger electricity
Existing for the plate of road, limitation is very strong, and versatility is very poor, easily causes the technical problem of the wasting of resources and cost.
First aspect present invention provides a kind of processing method of hanging golden finger, it may include：
Golden finger copper-clad plate is provided, the golden finger area of described golden finger copper-clad plate one end have multiple golden finger figures and
Big copper sheet, the golden finger figure are divided into the pressing area for appearing area and the remote big copper sheet being connected with the big copper sheet,
The non-golden finger area of the golden finger copper-clad plate has line pattern；
Multi-layer sheet is pressed, wherein, the golden finger copper-clad plate is pressed on multiple-plate internal layer, makes the golden finger
Figure appear area and the big copper sheet is located at beyond multiple-plate shaping area；
Process one group of via hole beyond multiple-plate shaping area, the via hole with the golden finger copper-clad plate
Big copper sheet connection；
Controlled depth milling is carried out to multiple-plate part corresponding to the golden finger figure, manifests the golden finger figure
Shape；
The multiple-plate surface metal-layer in part retained using the big copper sheet region is electroplate lead wire, to the golden finger figure
Shape is gold-plated；
Non- golden finger visuals controlled depth milling beyond multiple-plate shaping area is removed, formation extends described more
Multiple golden fingers beyond the body of laminate, the circuit board with hanging golden finger is made.
Second aspect of the present invention provides a kind of circuit board with hanging golden finger, it may include：
Circuit board body and at least one hanging golden finger, one end of the hanging golden finger are embedded in the circuit board body
In, the other end extends from a side wall of the circuit board body, and the golden finger is gold-plated structure for covering copper plate.
Therefore the embodiment of the present invention uses and the golden finger copper-clad plate with golden finger figure is pressed in multi-layer sheet
Layer, and controlled depth milling manifests golden finger figure so as to gold-plated, last controlled depth milling processes the technical scheme of hanging golden finger, obtains
Following technique effect：
Golden finger thickness design can be carried out according to the open height of connecting-disconnecting interface, and then meet different connecting-disconnecting interface plugs
Demand；Because golden finger is hanging structure, golden finger thickness is unrelated with circuit plate thickness, therefore suffered limitation is reduced, general
Property is stronger, it is not easy to causes the wasting of resources and cost.
When circuit board will realize multi-functional demand and increase thickness of slab, because golden finger is the standalone module of hanging structure,
Will not therefore it change, it is not necessary to change original connecting-disconnecting interface equipment, saved resource and cost；
When various sizes of connecting-disconnecting interface is needed with a circuit board, it is only necessary to increase or decrease the golden finger of implantation
Thickness, it is simple and convenient without changing circuit plate thickness, it is versatile.
, only need to be at one of the present invention without providing multiple corresponding circuit boards when same equipment has multiple interfaces
The golden finger of multiple hanging structures is designed on circuit board, thus the assembly space of product can be saved, reduces cost and resource
Waste.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, below will be to institute in embodiment and description of the prior art
The accompanying drawing needed to use is briefly described, it should be apparent that, drawings in the following description are only some implementations of the present invention
Example, for those of ordinary skill in the art, on the premise of not paying creative work, can also be obtained according to these accompanying drawings
Obtain other accompanying drawings.
Fig. 1 is a kind of flow chart of the processing method of hanging structure golden finger provided in an embodiment of the present invention；
Fig. 2 a to 2e are the schematic diagrames using each stage of present invention method processing circuit board.
Embodiment
The embodiment of the present invention provides a kind of processing method and circuit board of hanging golden finger, to solve existing golden finger electricity
Existing for the plate of road, limitation is very strong, and versatility is very poor, easily causes the technical problem of the wasting of resources and cost.
In order that those skilled in the art more fully understand the present invention program, below in conjunction with the embodiment of the present invention
Accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only
The embodiment of a part of the invention, rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill people
The every other embodiment that member is obtained under the premise of creative work is not made, it should all belong to the model that the present invention protects
Enclose.
Below by specific embodiment, it is described in detail respectively.
Embodiment one,
Fig. 1 is refer to, the embodiment of the present invention provides a kind of processing method of hanging golden finger, it may include：
110th, golden finger copper-clad plate is provided, the golden finger area of described golden finger copper-clad plate one end has multiple golden finger figures
Shape and big copper sheet, the golden finger figure are divided into the pressing for appearing area and the remote big copper sheet being connected with the big copper sheet
Area, the non-golden finger area of the golden finger copper-clad plate have line pattern.
In the embodiment of the present invention, the golden finger copper-clad plate provided as shown in Figure 2 a, during the golden finger copper-clad plate 20 includes
Between dielectric and two sides metal level, its one end is designed with golden finger area, and the metal level of golden finger area is processed into
Multiple golden finger figures 203 and the big copper sheet 204 being connected with multiple golden finger figures, the metal level beyond golden finger area is then
It is processed into line pattern 202.Golden finger figure 203 can be divided into appears area 2031 and away from big copper sheet close to big copper sheet 204
204 pressing area 2302.In a kind of embodiment, the preparation method of the golden finger copper-clad plate 20 is as follows：Connect according to equipment plug
The open height of mouth, prepares the copper-clad plate of respective thickness；According to designed golden finger figure and line pattern, carry out figure and turn
Move and etch, in the golden finger area processing golden finger figure 203 needed and the big copper sheet being connected with multiple golden finger figures
204, required line pattern is gone out in other region processings.In preferred embodiment, golden finger copper-clad plate is double face copper, and
The golden finger figure on two sides is identical symmetrical.
In the embodiment of the present invention, described golden finger figure 203 appears area and will be subsequently revealed in outside multi-layer sheet body
As golden finger, pressing area will subsequently be pressed together on multiple-plate internal layer, play conducting and connection function；Described big copper sheet 204
Simply helped out in manufacturing process, due to being connected with golden finger figure, subsequently by as the one of golden finger gold plated lead
Point, for conduction, assist gold-plated to golden finger figure；After the completion of gold-plated, the whole big region of copper sheet 204, which mills controlled depth, removes.
120th, multi-layer sheet is pressed, wherein, the golden finger copper-clad plate is pressed on multiple-plate internal layer, makes the gold
Finger figure appear area and the big copper sheet is located at beyond multiple-plate shaping area.
As shown in Figure 2 b, this step middle level, which laminates, closes multi-layer sheet 30, and the multi-layer sheet 30 may include that described golden finger covers copper
Plate 20, and the other line layers and dielectric layer on golden finger copper-clad plate two sides are layered in, and positioned at outermost outer layer metal
Layer 33.Wherein, make the major part of the golden finger area of the golden finger copper-clad plate 20, i.e. golden finger figure 203 appear area and
Big copper sheet 204, beyond multiple-plate shaping area, the pressing area of golden finger figure 203 is then located within shaping area.Also,
, can be in the double spreading band 301 of the golden finger figure 203, in the golden finger figure 203 taped in order to protect golden finger
Pad 302 is set.Described pad can be the false core plate copper-clad plate of copper foil layer (be etched remove) or duroplasts or
Person's Teflon etc..Described adhesive tape 301 can be double faced adhesive tape.
The pad of golden finger figure one side adds thickness >=0.1mm of adhesive tape.The fixed bonding of pad, a part lean on glue
Band bonds, and a part bonds by the prepreg (i.e. PP pieces) of dielectric layer.Dielectric layer may include multilayer PP pieces, the correspondence of dielectric layer
It can be slotted in advance in the position of pad 302, to accommodate pad 302.
130th, one group of via hole is processed beyond multiple-plate shaping area, the via hole covers copper with the golden finger
Big copper sheet connection on plate.
Still as shown in Figure 2 b, this step is drill process.In this step, one can be processed beyond the shaping area of multi-layer sheet 30
Group via hole 34, the via hole 34 are connected with the big copper sheet 204 of the golden finger copper-clad plate 20.By via hole 34 by outer layer
Metal level 33 is connected with big copper sheet 204 and golden finger figure 203 so that, subsequently it can be used as plating by the use of outer layer metal layer 33
Lead, golden finger figure 203 is carried out gold-plated.
In this step, one group of plated-through hole 35, each metal can be also processed within the shaping area of the multi-layer sheet 30
Change through hole 35 to be connected with the pressing area of a golden finger figure 203.By the golden finger figure 203 of plated-through hole 35 can with it is more
One or more layers line layer connection of laminate, realizes circuit board function.
The step of processing via hole 34 and plated-through hole 35, includes：Through hole is first drilled out, then is metallized, i.e. is carried out
Heavy copper and plating.
140th, controlled depth milling is carried out to multiple-plate part corresponding to the golden finger figure, manifests the golden hand
Refer to figure.
As shown in Figure 2 c, the operation of first time milling profile is carried out in this step to multi-layer sheet 30.By the golden finger copper-clad plate
The multi-layer sheet controlled depth milling for appearing area two sides of 20 golden finger figure 203 removes, and manifests the golden finger figure 203.This
In the outer layer operation of milling, retain whole golden finger copper-clad plates 20, and the part multi-layer sheet 36 in the big region of copper sheet 204, the conducting
Hole 34 is located at 36 on the part multi-layer sheet.The operation of first time milling profile specifically may include：To corresponding to for the multi-layer sheet 30
The region controlled depth milling for appearing area of the golden finger figure 203, until manifesting the pad 302, then removes the pad
302 and the adhesive tape 301, reveal the golden finger figure 203.
In concrete application, after the drilling step, before carrying out the operation of first time milling profile, multi-layer sheet can be carried out first
Outer-layer circuit is processed, including：Using common process, outer-layer circuit is made on the surface of the multi-layer sheet 30, and described outer
Solder mask is set on sandwich circuit.
150th, the multiple-plate surface metal-layer in part retained using the big copper sheet region is electroplate lead wire, to the golden hand
It is gold-plated to refer to figure.
It is gold-plated to the golden finger figure 203 that reveals in this step, make the area that appears of golden finger figure 203 turn into institute
The golden finger needed.When gold-plated, the plating resist films such as adhesive tape can be used, multiple-plate other region overlays are protected, expose golden finger
Figure 203 appears area；Then, it is electroplate lead wire with the surface metal-layer 33 of part multi-layer sheet 36, to golden finger figure 203
Appear area and carry out plating gold.
160th, the non-golden finger visuals controlled depth milling beyond multiple-plate shaping area is removed, formation extends institute
Multiple golden fingers beyond multiple-plate body are stated, the circuit board with hanging golden finger is made.
As shown in Figure 2 d, second of milling profile operation is carried out in this step.Beyond the shaping area of the multi-layer sheet 30
Non- golden finger visuals controlled depth milling removes, and forms the multiple golden fingers 37 extended beyond multiple-plate body.Wherein
Including：The big region controlled depth milling of copper sheet 204 is removed, and, the part between each golden finger figure 203 is removed；So that institute
Stating golden finger figure 203 turns into the golden finger 37 of hanging structure, and the circuit board with hanging golden finger 37 is made.Controlled depth milling process
In golden finger 37 can be protected with adhesive tape, controlled depth milling removes adhesive tape after terminating.
It is the top view of the final obtained circuit board with hanging structure golden finger 37 as shown in Figure 2 e.From Fig. 2 d and 2e
As can be seen that extend multiple golden fingers 37 on a side of obtained circuit board.The width of multiple golden fingers can with identical,
Can also be different.
More than, the embodiments of the invention provide a kind of processing method of hanging golden finger, this method use will have golden hand
The golden finger copper-clad plate for referring to figure is pressed on multilayer inner cord, and controlled depth milling manifests golden finger figure so as to gold-plated, finally controls
Deep Milling Machining goes out the technical scheme of hanging golden finger, achieves following technique effect：
Golden finger thickness design can be carried out by the open height according to connecting-disconnecting interface, and then meet different connecting-disconnecting interfaces
Plug demand；Because golden finger is hanging structure, golden finger thickness is unrelated with circuit plate thickness, therefore suffered limitation is reduced,
Versatility is stronger, it is not easy to causes the wasting of resources and cost.
When circuit board will realize multi-functional demand and increase thickness of slab, because golden finger is the standalone module of hanging structure,
Will not therefore it change, it is not necessary to change original connecting-disconnecting interface equipment, saved resource and cost；
When various sizes of connecting-disconnecting interface is needed with a circuit board, it is only necessary to increase or decrease the golden finger of implantation
Thickness, it is simple and convenient without changing circuit plate thickness, it is versatile.
, only need to be at one of the present invention without providing multiple corresponding circuit boards when same equipment has multiple interfaces
The golden finger of multiple hanging structures is designed on circuit board, thus the assembly space of product can be saved, reduces cost and resource
Waste.
Embodiment two,
Fig. 2 d and 2e are refer to, the embodiment of the present invention provides a kind of circuit board with hanging golden finger, and the circuit board can
Including：
Circuit board body 30 and at least one hanging golden finger 37, one end of the hanging golden finger 37 are embedded in the circuit
In plate body 30, the other end extends from a side wall of circuit board body 30, and the golden finger 37 is gold-plated copper-clad plate knot
Structure.
The circuit board body may include multilayer line layer, each golden finger 37 can by plated-through hole 35 with it is described
At least one layer in multilayer line layer is connected.
Circuit board provided in an embodiment of the present invention can be made using the method for embodiment one.More detailed description refer to implementation
Example one.
More than, the embodiments of the invention provide a kind of circuit board with hanging golden finger, use will have golden finger figure
The golden finger copper-clad plate of shape is pressed on multilayer inner cord, and controlled depth milling manifests golden finger figure so as to gold-plated, last controlled depth milling
The technical scheme of hanging golden finger is processed, achieves following technique effect：
Golden finger thickness design can be carried out by the open height according to connecting-disconnecting interface, and then meet different connecting-disconnecting interfaces
Plug demand；Because golden finger is hanging structure, golden finger thickness is unrelated with circuit plate thickness, therefore suffered limitation is reduced,
Versatility is stronger, it is not easy to causes the wasting of resources and cost.
When circuit board will realize multi-functional demand and increase thickness of slab, because golden finger is the standalone module of hanging structure,
Will not therefore it change, it is not necessary to change original connecting-disconnecting interface equipment, saved resource and cost；
When various sizes of connecting-disconnecting interface is needed with a circuit board, it is only necessary to increase or decrease the golden finger of implantation
Thickness, it is simple and convenient without changing circuit plate thickness, it is versatile.
, only need to be at one of the present invention without providing multiple corresponding circuit boards when same equipment has multiple interfaces
The golden finger of multiple hanging structures is designed on circuit board, thus the assembly space of product can be saved, reduces cost and resource
Waste.
In the above-described embodiments, the description to each embodiment all emphasizes particularly on different fields, and is not described in some embodiment
Part, may refer to the associated description of other embodiments.
It should be noted that for foregoing each method embodiment, in order to be briefly described, therefore it is all expressed as a series of
Combination of actions, but those skilled in the art should know, the present invention is not limited by described sequence of movement because according to
According to the present invention, some steps can use other orders or carry out simultaneously.Secondly, those skilled in the art should also know,
Embodiment described in this description belongs to preferred embodiment, and not necessarily the present invention must for involved action and module
Must.
The processing method and circuit board of a kind of hanging golden finger provided above the embodiment of the present invention have been carried out in detail
Introduce, but the explanation of above example is only intended to help to understand of the invention method and its core concept, should not be construed as pair
The limitation of the present invention.Those skilled in the art, according to the present invention thought, the invention discloses technical scope in,
The change or replacement that can be readily occurred in, it should all be included within the scope of the present invention.
Claims (7)
- A kind of 1. processing method of hanging golden finger, it is characterised in that including：Golden finger copper-clad plate is provided, the golden finger area of described golden finger copper-clad plate one end has multiple golden finger figures and big copper Piece, the golden finger figure is divided into the pressing area for appearing area and the remote big copper sheet being connected with the big copper sheet, described The non-golden finger area of golden finger copper-clad plate has line pattern；Multi-layer sheet is pressed, wherein, the golden finger copper-clad plate is pressed on multiple-plate internal layer, makes the golden finger figure Appear area and the big copper sheet is located at beyond multiple-plate shaping area；Process one group of via hole beyond multiple-plate shaping area, the via hole with it is big in the golden finger copper-clad plate Copper sheet connects；Controlled depth milling is carried out to multiple-plate part corresponding to the golden finger figure, manifests the golden finger figure；The multiple-plate surface metal-layer in part retained using the big copper sheet region plates as electroplate lead wire to the golden finger figure Gold；Non- golden finger visuals controlled depth milling beyond multiple-plate shaping area is removed, formation extends the multi-layer sheet Body beyond multiple golden fingers, be made with hanging golden finger circuit board.
- 2. according to the method for claim 1, it is characterised in that：In the multiple-plate step of pressing, taped on the surface of the golden finger figure, and in the golden finger taped Pad is set on figure.
- 3. according to the method for claim 1, it is characterised in that：In the step of processing one group of via hole beyond multiple-plate shaping area, also within multiple-plate shaping area One group of plated-through hole is processed, each plated-through hole is connected with a golden finger figure.
- 4. according to the method for claim 1, it is characterised in that to described multiple-plate corresponding to the golden finger figure Before part carries out controlled depth milling, in addition to：Outer-layer circuit is made on multiple-plate surface, and solder mask is set in the outer-layer circuit.
- 5. according to the method for claim 2, it is characterised in that to described multiple-plate corresponding to the golden finger figure Part, which carries out controlled depth milling, to be included：To multiple-plate region controlled depth milling for appearing area corresponding to the golden finger figure, until manifesting the pad Piece, the pad and the adhesive tape are then removed, reveal the golden finger figure.
- 6. a kind of circuit board with hanging golden finger, is produced using claim 1 methods described, it is characterised in that including：Circuit board body and at least one hanging golden finger, one end of the hanging golden finger are embedded in the circuit board body, The other end extends from a side wall of the circuit board body, and the golden finger is gold-plated structure for covering copper plate.
- 7. circuit board according to claim 6, it is characterised in that：The circuit board body includes multilayer line layer, and each hanging golden finger passes through plated-through hole and the multilayer line At least one layer in layer is connected.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410149057.8A CN104981114B (en) | 2014-04-14 | 2014-04-14 | The processing method and circuit board of hanging golden finger |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410149057.8A CN104981114B (en) | 2014-04-14 | 2014-04-14 | The processing method and circuit board of hanging golden finger |
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| CN104981114A CN104981114A (en) | 2015-10-14 |
| CN104981114B true CN104981114B (en) | 2018-01-26 |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104981096B (en) * | 2014-04-14 | 2018-11-02 | 深南电路有限公司 | The processing method and circuit board of hanging golden finger |
| CN107770952B (en) * | 2016-08-16 | 2020-03-06 | 新华三技术有限公司 | PCB manufacturing method and PCB structure |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5444188A (en) * | 1992-01-14 | 1995-08-22 | Nippon Mektron, Ltd. | Flexible circuit wiring board and method of producing the same |
| US5929375A (en) * | 1996-05-10 | 1999-07-27 | Ford Motor Company | EMI protection and CTE control of three-dimensional circuitized substrates |
| CN101441905A (en) * | 2008-11-19 | 2009-05-27 | 达昌电子科技(苏州)有限公司 | Flexible line-arranging method and structure thereof |
| TW201218900A (en) * | 2010-10-25 | 2012-05-01 | Yazaki Corp | Method of manufacturing wiring substrate |
| CN202269097U (en) * | 2011-09-30 | 2012-06-06 | 东莞市五株电子科技有限公司 | Printed circuit board and electronic device |
| CN103153000A (en) * | 2013-02-01 | 2013-06-12 | 东莞生益电子有限公司 | Manufacture method for gold finger circuit board and circuit board manufactured by method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0837380A (en) * | 1994-07-21 | 1996-02-06 | Hitachi Chem Co Ltd | Multilayred wiring board with terminal |
| US6674644B2 (en) * | 2001-11-01 | 2004-01-06 | Sun Microsystems, Inc. | Module and connector having multiple contact rows |
-
2014
- 2014-04-14 CN CN201410149057.8A patent/CN104981114B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5444188A (en) * | 1992-01-14 | 1995-08-22 | Nippon Mektron, Ltd. | Flexible circuit wiring board and method of producing the same |
| US5929375A (en) * | 1996-05-10 | 1999-07-27 | Ford Motor Company | EMI protection and CTE control of three-dimensional circuitized substrates |
| CN101441905A (en) * | 2008-11-19 | 2009-05-27 | 达昌电子科技(苏州)有限公司 | Flexible line-arranging method and structure thereof |
| TW201218900A (en) * | 2010-10-25 | 2012-05-01 | Yazaki Corp | Method of manufacturing wiring substrate |
| CN202269097U (en) * | 2011-09-30 | 2012-06-06 | 东莞市五株电子科技有限公司 | Printed circuit board and electronic device |
| CN103153000A (en) * | 2013-02-01 | 2013-06-12 | 东莞生益电子有限公司 | Manufacture method for gold finger circuit board and circuit board manufactured by method |
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Address after: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
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