201218900 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種製造一上面安裝有各種電氣及電子 組件之佈線基板的方法。 【先前技術】 習慣上’關於一上面安裝有各種電氣及電子組件之佈線基 板’已知一具有多層結構之金屬核心基板，其具有在一金屬 板之正面及背面上提供之絕緣層及在該等絕緣層上形成之 導電層。依據該金屬核心層，藉由該金屬板順利地輕射該等 電氣及電子組件之熱（例如，參考專利文獻1及2)。 關於一製造該佈線基板之方法，已知一使具有銅箔之絕緣 薄片在該金屬板之正面及背面上層壓及積層之層壓形成方 法(例如，參考專利文獻3至5)。 [專利文獻 l]JP-A_2003-46022 [專利文獻 2]JP-A-2002-353584 [專利文獻 3]JP-A-2001-189536 [專利文獻 4]JP-A-2009-218305 [專利文獻 5]JP-A-62-179200 為了如圖16所示連接一電線束等至一佈線基板1，在該 佈線基板1上安裝及固定連接器2。當安裝該連接器2時， 需要將在該連接器2中所提供之複數個連接接腳3插入在該 佈線基板1之一安裝表面la上所形成之通孔中及將其焊接 100138609 4 201218900 成導體圖案之麻煩安裝操作，此增加該佈線基板1之製造成 本。此外，亦增加具有該等連接接腳3之該連接器2的單位 價格，以致於亦進一步增加上面安裝有該等連接器2之該佈 線基板1的成本。 【發明内容】 本發明係要解決上述問題。本發明之一目的係提供一種能 以低成本輕易地製造一佈線基板之方法，其中該佈線基板可 連接至一電線束等且具有絕佳散熱能力。 為了達成該目的，依據本發明之一種佈線基板之製造方法 的特徵如下： (1)一種佈線基板之製造方法，該佈線基板包括一基板， 在該基板中一具有一導電層之絕緣層係積層在一板狀金屬 核心之正面及背面中之至少一者上且該導電層係配置在該 金屬核心之相對側上及一具有該導電層之導電圖案的表面 係做為電氣或電子組件之一安裝表面，以及該佈線基板包括 一由該金屬核心之一部分所形成且具有一端做為一固定至 該基板之固定部而另一端做為一從該基板之一側邊緣延伸 之端部的連接端，該方法包括： 在一成為該金屬核心之金屬板中形成該連接端之該固定 部的形成製程； 在一上面積層該金屬板之該絕緣層的表面上以一遮罩材 料覆蓋一端部形成區域之遮罩製程，該端部形成區域包括一 100138609 5 201218900 要形成該連接端之該端部的區域； 在該金屬板上積層及層壓具有該導電層之該絕緣層，以將 該絕緣層整合在該金屬板上之積層製程 移除在該端部形成區域中之該絕緣層及該導電層，以暴露 該金屬板之移除製程；以及 處理該暴露金屬板，以形成該連接端之該端部的形成製 程。 (2) 依據（1)之方法，其中該積層製程包括在層壓該絕緣層 後，加熱及加壓該經層壓之金屬板及絕緣層，以平坦化該絕 緣層之一表面的平坦化製程。 (3) 依據（1)或(2)之方法，進一步包括在該遮罩製程後，粗 才造化該金屬板之一上面積層有該絕緣層之表面的粗彳造化製 程。 (4) 依據（1)或(2)之方法，其中在該遮罩製程中，使用一遮 罩膠帶做為該遮罩材料及使該遮罩膠帶黏附在該金屬板 上，以及在該移除製程中，沿著該端部形成區域之内周圍擴 孔該絕緣層，以形成一凹部，以及然後，移除該遮罩膠帶， 以移除在該端部形成區域中之該絕緣層及該導電層。 (5) 依據(4)之方法，其中在該移除製程中，擴孔該絕緣層 之一成為一用以突出該端部形成區域之端部之端面的部 分，以形成一非穿透凹部，以及另外，從該非穿透凹部之兩 個端部朝該佈線基板之一側形成穿透凹部。 100138609 ⑧ 201218900 ⑹依據(5)之方法，其中該穿透凹部之—部分係保有該遮 罩膠帶或該遮罩膠帶上積層之該絕緣層而形成。..... 在上述⑴之該佈線基板之製造方法中，可且 有該連接端之該佈線基板，其中該連接端可* —電線^等連 接而不使關㈣昂貴連㈣。此外，因為藉由該層壓製程 在該金屬板上整合及積層該絕緣層，所以相較於壓合技術 (lammatingpresstechnique) ’彳實施連續製程而不需保持製 程中庫存inve咖·γ)，以有利地整合及積層該等 絕緣層’同時防止配置該絕緣層之預浸體的樹脂之空隙，以 及減少該紐體。並且，因為在料要成為該連接端之端部 的部分及因而㈣該部分之狀態中積層該絕緣層，所以可保 持_成端部之表面的平坦。於是，可平順地且牢固地連接 該端部至相對連接端。 亦即’因為可利地連接該電線束等及使要成為該金屬核心 之°亥金屬板的一部分成為該連接端，所以可以低成本輕易地 製造具有多層結構及有利散熱能力之該佈線基板。 在上述(2)之該佈線基板之製造方法中，因為藉由該平垣 化製程來平坦化該絕緣層之表面（該表面做為電氣及電子組 件之安骏表面），所以可製造能有利地安裝該等電氣及電子 組件之高品質的該佈線基板。 在上述(3)之該佈線基板之製造方法中，粗糙化該金屬板 之表面（在該表面上積層該絕緣層），所以可顯著地增加該金 100138609 201218900 屬板與該絕緣層間之附著力。 在上述(4)之該佈線基板之製造方法中，擴孔該絕緣層， 以形成該凹部。因此，可輕易地移除在該端部形成區域中之 該絕緣層及該導電層。 在上述(5)之該佈線基板之製造方法中，因為形成該等穿 透凹部，所以可更輕易地移除在該端部形成區域中之該絕緣 層及該導電層。 在上述(6)之該佈線基板之製造方法中，因為在該穿透凹 部中保留該遮罩膠帶或該遮罩膠帶上所積層之該絕緣層，所 以可藉由使用該對應部更輕易地分離及移除在該端部形成 區域中之該絕緣層與該導電層。 依據本發明，可提供一種能以低成本輕易地製造佈線基板 之方法，其中該佈線基板可連接至一電線束等且具有絕佳散 熱能力。 已簡單地描述本發明。經由下面參考圖式來描述本發明之 具體例，將更清楚知道本發明之詳細配置。 【實施方式】 以下，將參考圖式來描述本發明之具體例。 圖1係藉由一依據本發明之一具體例之佈線基板之製造 方法所製造之一佈線基板的立體圖，以及圖2係沿著圖1 之線II-II所取得之剖面圖。 如圖1及2所示，藉由一依據本發明之一具體例之佈線基 100138609 8 201218900 板之製造方法所製造之一佈線基板11具有一基板21及在該 基板21上所提供之複數個連接端31。 該基板21在其厚度方向上之中心處具有一由銅、銅合金 等所製成之板狀金屬核心22。在該金屬核心22之正面及背 面上以兩層分別形成由諸如具有熱固及絕緣特性之合成樹 脂的材料所製成之絕緣層23。 每一絕緣層23之表面形成有一構成一導體圖案之銅箔 (導電層）24。在該等絕緣層23之暴露至該基板21之外面的 外表面上配置要安裝電氣或電子組件之安裝表面21a。並 且，使該等個別絕緣層23之該等銅箔24(構成電路圖案）藉 由具有電鍍内周圍之通孔25彼此導電，藉此形成一電路。 此外，亦使構成該電路圖案之該等銅箔24藉由該等通孔25 與該金屬核心22導電。同時，可以使該電路之形成包含該 金屬核心22。 如所述，該基板21係一具有該金屬核心22之金屬核心基 板及因而具有絕佳散熱及熱均勻性能力。並且，該基板21 係一具有5層（包括該金屬核心22及在該金屬核心之正面及 背面上所積層之複數個絕緣層23)之多層基板。在由該多層 基板所構成之該基板21的正面及背面之安裝表面21 a上安 裝各種電氣及電子組件。該金屬核心22平穩地使因該基板 21(它係金屬核心基板）之電氣及電子組件所產生之熱均勻 及將該熱輻射至外面。 100138609 9 201218900 該基板21在相對侧邊緣部21b形成 接端31以姆齊方式從配置該等凹部26 . P26。複數個連 等連接端31藉由在該基板21中所之底端部分延伸。該 該電路圖案之該等銅羯24導電。^亥通孔25與構成 5亥等連接端31係由該金屬核心22之〜Λ 等絕緣層23夾住及固定。 〜。卩分所形成及被該 戎連接端31(被該等絕緣層23夹住 分)做為一固定邱u 之一端（底端部 口疋。卩32及從該基板21之 暴露至外面的另一 、、彖21 b延伸且 鸲（頂端部分)做為一端部 關於如上述. 卩33。 q配置之佈線基板；Π201218900 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a method of manufacturing a wiring substrate on which various electrical and electronic components are mounted. [Prior Art] Conventionally, regarding a wiring substrate on which various electrical and electronic components are mounted, a metal core substrate having a multilayer structure having an insulating layer provided on a front surface and a back surface of a metal plate is known. A conductive layer formed on the insulating layer. According to the metal core layer, the heat of the electrical and electronic components is smoothly lighted by the metal plate (for example, refer to Patent Documents 1 and 2). As for a method of manufacturing the wiring board, a lamination forming method in which an insulating sheet having a copper foil is laminated and laminated on the front and back surfaces of the metal sheet is known (for example, refer to Patent Documents 3 to 5). [Patent Document 1] JP-A-2003-46022 [Patent Document 2] JP-A-2002-353584 [Patent Document 3] JP-A-2001-189536 [Patent Document 4] JP-A-2009-218305 [Patent Document 5] JP-A-62-179200 In order to connect a wire harness or the like to a wiring substrate 1 as shown in Fig. 16, the connector 2 is attached and fixed to the wiring substrate 1. When the connector 2 is mounted, the plurality of connection pins 3 provided in the connector 2 need to be inserted into the through holes formed in the mounting surface 1a of the wiring substrate 1 and soldered thereto. 100138609 4 201218900 The troublesome mounting operation of the conductor pattern increases the manufacturing cost of the wiring substrate 1. In addition, the unit price of the connector 2 having the connecting pins 3 is also increased, so that the cost of the wiring board 1 on which the connectors 2 are mounted is further increased. SUMMARY OF THE INVENTION The present invention is to solve the above problems. SUMMARY OF THE INVENTION An object of the present invention is to provide a method for easily manufacturing a wiring substrate at a low cost, wherein the wiring substrate can be connected to a wire harness or the like and has excellent heat dissipation capability. In order to achieve the object, a method of manufacturing a wiring substrate according to the present invention is characterized as follows: (1) A method of manufacturing a wiring substrate, the wiring substrate comprising a substrate in which an insulating layer having a conductive layer is laminated And at least one of a front side and a back side of a plate-shaped metal core and the conductive layer is disposed on an opposite side of the metal core and a surface having a conductive pattern of the conductive layer is one of electrical or electronic components a mounting surface, and the wiring substrate includes a connecting end formed by a portion of the metal core and having one end fixed as a fixing portion to the substrate and the other end as an end extending from a side edge of the substrate The method includes: forming a fixing portion of the connecting end in a metal plate that becomes the metal core; forming an end portion of the insulating layer on the surface of the insulating layer of the upper metal layer with a mask material a masking process of the region, the end forming region comprising a region of 100138609 5 201218900 to form the end of the connecting end; Laminating and laminating the insulating layer having the conductive layer, and integrating the insulating layer on the metal plate to remove the insulating layer and the conductive layer in the end formation region to expose the metal a process of removing the plate; and processing the exposed metal plate to form a formation process of the end of the connection end. (2) The method according to (1), wherein the laminating process comprises heating and pressing the laminated metal plate and the insulating layer after laminating the insulating layer to planarize planarization of a surface of the insulating layer Process. (3) The method according to (1) or (2), further comprising, after the masking process, roughening the roughening process of the surface layer of the one of the metal sheets having the surface of the insulating layer. (4) The method according to (1) or (2), wherein in the masking process, a masking tape is used as the masking material and the masking tape is adhered to the metal sheet, and in the shifting In addition to the process, the insulating layer is reamed along the periphery of the end forming region to form a recess, and then the masking tape is removed to remove the insulating layer in the end forming region and The conductive layer. (5) The method according to (4), wherein in the removing process, one of the insulating layers is reamed to become a portion for projecting an end surface of the end portion of the end forming region to form a non-penetrating concave portion And, in addition, a penetrating recess is formed from one end of the non-penetrating recess toward one side of the wiring substrate. (6) The method according to (5), wherein the portion of the penetrating recess is formed by retaining the insulating tape layered on the masking tape or the masking tape. In the method of manufacturing the wiring board of the above (1), the wiring board of the connection terminal may be provided, wherein the connection terminal may be connected to the electric wire without being connected (four). In addition, since the insulating layer is integrated and laminated on the metal plate by the layer pressing process, the continuous process is performed without the need to maintain the inventory inveca gamma in the process compared to the lamination technique (lammating press technology) It is advantageous to integrate and laminate the insulating layers' while preventing the voids of the resin of the prepreg in which the insulating layer is disposed, and to reduce the new body. Further, since the insulating layer is laminated in a state where the material is to be the end portion of the connection end and thus the portion is (4), the surface of the end portion can be kept flat. Thus, the end portion can be smoothly and firmly connected to the opposite connection end. In other words, since the electric wire bundle or the like is connected and a part of the metal plate to be the metal core is used as the connection end, the wiring board having a multilayer structure and favorable heat dissipation capability can be easily manufactured at low cost. In the method of manufacturing the wiring board of the above (2), since the surface of the insulating layer is planarized by the planarization process (the surface is used as a surface of electrical and electronic components), it can be advantageously manufactured. The high quality wiring board of these electrical and electronic components is mounted. In the method of manufacturing the wiring board of the above (3), the surface of the metal plate is roughened (the insulating layer is laminated on the surface), so that the adhesion between the gold 100138609 201218900 and the insulating layer can be remarkably increased. . In the method of manufacturing a wiring board according to the above (4), the insulating layer is expanded to form the concave portion. Therefore, the insulating layer and the conductive layer in the end formation region can be easily removed. In the method of manufacturing the wiring board of the above (5), since the through recesses are formed, the insulating layer and the conductive layer in the end formation region can be more easily removed. In the method of manufacturing the wiring board of the above (6), since the masking tape or the insulating layer laminated on the masking tape is retained in the penetrating recess, it is easier to use the corresponding portion. The insulating layer and the conductive layer in the end formation region are separated and removed. According to the present invention, it is possible to provide a method of easily manufacturing a wiring substrate at a low cost, wherein the wiring substrate can be connected to a wire bundle or the like and has excellent heat dissipation capability. The invention has been briefly described. The detailed configuration of the present invention will be more apparent from the following description of the embodiments of the invention. [Embodiment] Hereinafter, a specific example of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing a wiring board manufactured by a method of manufacturing a wiring board according to a specific example of the present invention, and Fig. 2 is a cross-sectional view taken along line II-II of Fig. 1. As shown in FIGS. 1 and 2, a wiring substrate 11 manufactured by a method of manufacturing a wiring substrate 100138609 8 201218900 according to a specific example of the present invention has a substrate 21 and a plurality of substrates provided thereon. Connection end 31. The substrate 21 has a plate-like metal core 22 made of copper, a copper alloy or the like at the center in the thickness direction thereof. On the front and back sides of the metal core 22, an insulating layer 23 made of a material such as a synthetic resin having thermosetting and insulating properties is formed in two layers. A surface of each of the insulating layers 23 is formed with a copper foil (conductive layer) 24 constituting a conductor pattern. A mounting surface 21a on which an electrical or electronic component is to be mounted is disposed on an outer surface of the insulating layer 23 exposed to the outer surface of the substrate 21. Further, the copper foils 24 (constituting circuit patterns) of the individual insulating layers 23 are electrically conducted to each other by the through holes 25 having the periphery of the plating, thereby forming an electric circuit. In addition, the copper foils 24 constituting the circuit pattern are also electrically conducted to the metal core 22 by the through holes 25. At the same time, the formation of the circuit can include the metal core 22. As described, the substrate 21 is a metal core substrate having the metal core 22 and thus has excellent heat dissipation and thermal uniformity. Further, the substrate 21 is a multilayer substrate having five layers (including the metal core 22 and a plurality of insulating layers 23 laminated on the front and back surfaces of the metal core). Various electrical and electronic components are mounted on the mounting surface 21a of the front and back surfaces of the substrate 21 composed of the multilayer substrate. The metal core 22 smoothly homogenizes the heat generated by the electrical and electronic components of the substrate 21 (which is a metal core substrate) and radiates the heat to the outside. 100138609 9 201218900 The substrate 21 is formed with the ends 31 at the opposite side edge portions 21b so as to be arranged in the manner of the recesses 26 and P26. A plurality of connection terminals 31 extend through a bottom end portion of the substrate 21. The copper pads 24 of the circuit pattern are electrically conductive. The through hole 25 and the connection end 31 of the structure 5 are sandwiched and fixed by the insulating layer 23 such as Λ of the metal core 22. ~. The bismuth portion is formed and held by the 戎 connection end 31 (which is sandwiched by the insulating layers 23) as one end of the fixed ridge u (the bottom end port 疋 32 and the other from the substrate 21 exposed to the outside) 1. 彖21 b extends and 鸲 (top part) as an end portion of the wiring substrate as described above. 卩33. q configuration;
至另-佈線基板或 了連接蝴接端W 連接端31。 、 S °妾杰之外殼的部分至該等 依據該佈線基板 側邊部2ib延伸’ 1為該等連接端31從該基板21之 腳至該等安裝表面*要焊接及連接—連制之連接接 本。此外，不需要〜 致於可儘可能多地降低製造成 具有複數個連接接腳之昂貴連接器，以 致於可進-步降低成*。 以下，參考圖3至η十h 11來描述一依據製造具有上述配置之 佈線基板11的具辦合 、趙例之佈線基板之製造方法。 圖3至5描述〜伊诚& q屎该具體例之該佈線基板之製造方法， 其中在每一圖中，「 (a)係—工作件之平面圖及(b)係該工作件 之放大平面圖。圖6 5 〇〆 主9係在該製造期間該佈線基板之平面 100138609 201218900 圖，其描述依據該具體例之該佈線基板之製造方法。圖ίο 描述依據該具體例之該佈線基板之製造方法，其中（a)至（c) 係一工作件之部分剖面圖。圖11描述依據本發明之該具體 例之該佈線基板之製造方法，其中（a)至（c)係該佈線基板之 部分剖面圖。 (固定部之形成製程） 如圖3(a)及3(b)及圖10(a)所示，製備一金屬板41，其中 以該金屬板41可形成複數個（例如，12個）金屬核心22。藉 由衝壓該金屬板41 ’形成該等連接端31之固定部32及孔 部42 ’其中該等通孔25荨穿過該等孔部42。同時，藉由以 大致平行於該金屬板41之側邊緣部方式配置具有梳狀之開 口部43，以形成該等固定部32。 (遮罩製程） 接下來，如4(a)及4(b)及圖10(b)所示，在上面要積層該 等絕緣層23之該金屬板41的正面及背面上將遮罩材料44 黏附至包括要形成該等連接端31之端部33的部分之端部形 成區域中。換句話說’以該等遮罩材料44從該等固定部32 之端部覆蓋至該等開口部43之相對側。做為該遮罩材料 44，可以使用一具有耐熱性等之樹脂膠帶。例如，可以使用 由聚醯亞胺或PET(聚對苯二甲酸乙二酯）所製成之遮罩膠 帶44 〇 (粗糙化製程） 100138609 11 201218900 在黏附該等遮罩膠帶44，以遮罩該等端部形成區域後， 藉由喷砂或化學劑粗糙化該金屬板41之正面及背面，其中 在該金屬板41之正面及背面上要積層該等絕緣層23。同 時，因此該等端部形成區域被該等遮罩膠帶44所遮蔽，所 以沒有使該等區域粗糙化。 (絕緣層之積層製程） 接下來，藉由該層壓形成方法在該金屬板41之正面及背 面上積層具有該等導電層（銅箔）24之該等絕緣層23。 在此，描述以該層壓形成方法來積層該等絕緣層23。圖 12顯示一用以實施層壓形成之層壓形成裝置。 如圖12所示，該層壓形成裝置包括一用以藉由一捲繞滾 筒52捲繞一自一饋送滾筒51饋送之輸送PET上膜（或只是 一薄膜）50之上輸送系統、一用以藉由一捲繞滾筒62捲繞 一自一饋送滾筒61饋送之輸送PET下膜（或只是一薄膜)60 之下輸送系統、一位於該上輸送系統與該下輸送系統間及用 以實施先加熱、加壓及積層一輸送產品之層壓製程的第一平 台70及一用以實施加熱及加壓該產品之正面及背面以平坦 化該正面及背面之平坦化製造的第二平台80。 在該層壓形成裝置中，藉由下面操作在該金屬板41之正 面及背面上積層該等絕緣層23。 首先，將一工作件W放置在自該輸送PET下膜60起之 上游側及朝下游側輸送，其中該工作件W包括在該金屬板 100138609 12 ⑧ 201218900 41上下方以兩層方式所分別積層之具有該等銅箔24的該等 絕緣層23，以致於該等銅箔24位於該金屬板41，之相對側 上。在該輸送期間，以該輸送PET上膜50覆蓋該工作件w， 以及然後，該工作件w被輸送至該第一平台7〇且失在該輸 送PED上膜50與該用於輸入之pet下膜60間。 在該第一平台7〇中，實施在真空下加熱及加壓該工作件 及接著在該金屬板41上層壓該等絕緣層23及亦層壓該等堆 疊絕緣層23之層壓製程。特別地，使一真空室密封，以減 少其内之壓力，使一由橡皮薄膜(rubber diaphragm)所構成之 可動板接近一固定板，以夾壓熱板，以便加熱、加壓及因而 積層該等絕緣層23之預浸體及該等銅箔24。因此，如圖5(a) 及5(b)所示，將該等絕緣層23及該等導電層（銅箔）24整合 及黏附至該金屬板41 ’以致於它們覆蓋該金屬板之正面及 背面。從而’如圖10(c)所示’該工作件w具有一 5層結構， 其中在該金屬板41之正面及背面上分別整合及積層具有該 等導電層24之該兩層絕緣層23。 同時，做為該絕緣層23之預浸體，使用内部浸潰有熱固 性樹脂之玻璃布。在該層壓製程中加熱及熔化由該預浸體所 製成之該絕緣層23的該熱固性樹脂，以便將它嵌入内部形 成有該金屬板41之固定部32的該等開口 43中及成為該等 通孔25等之該等孔部42中。此外，因為粗縫化除了該遮罩 膠帶44的黏著部之外的該金屬板41，所以該等絕緣層23 100138609 13 201218900 之樹脂牢固地黏附在該金屬板之正面及背面上。 在該第〜平台70中，在可充分地熔化及固化在該絕緣層 23中所使用之該熱固性樹脂的範圍内，沒有特別限制加熱 及加壓條件。 同時’最好是使用上面已事先以蝕刻製程形成有電路圖案 之銅落來做為要被提供至該等個別絕緣層23之該等銅馆 24 °可以以一隨後蝕刻製程使在該等絕緣層23之外表面上 所提供之該等銅箔24形成有電路圖案。 將在該第一平台70中層壓之該工作件W攜出該第—平台 70及攜入該第二平台80。 在該第二平台80中，實施加熱及加壓該工作件w(其中該 工作件W在真空中被加熱及加壓及因構成電路圖案之該等 銅箔24而在其正面及背面上具有不均勻度）及因而平坦化 該工作件W之正面及背面的平坦化製程。特別地，以一用 以配置該第二平台80之平壓機（flattening press)在預定溫度 下加壓該工作件W，以便平坦化該工作件w之正面及背 面。該平壓機具有一固定上板、一由橡皮薄膜（rubber diaphragm)所構成之面對該上板且可相對於該上板移動之 下板以及一垂直地移動該下板且與該上板配合實施爽壓 (pressure-clamping)之驅動裝置。以一加熱袈置來加熱該工 作件W，以及當以該驅動裝置移動該下板時，夾壓該工作 件W，以便實施用以平坦化該正面及背面之二次處理。 100138609 14 201218900 在該第二平台80中， 面的不均勻度之範圍内 具有在該第二平台80 W被攜出該第二平台8〇 送PET下膜60。 在可平坦化該工作件w之正面及背 ’沒有特別限制加熱及加壓條件。 中平坦化之正面及背面的該工作件 且夹在該輸送PET上膜50與該輪 將用於輪狀PET膜相馳在T游叙職送PET上 膜之捲繞滾筒52及該輪送PET下膜之捲繞滾筒62上。同 時，將該工作件W傳送至外面。 (切割及分離製程） 在該金屬板41之正面及背面上分別形成具有該等導電層 24之兩層絕緣層23及因而具有如上述之5層結構後，切割 及分離具有5層結構之該工作件w，以如圖6所示製造戽 有由該金屬板41所構成之該金屬核心22的5層結構之複麩 個佈線基板11。 然後’如圖7所示，以一電鑽等在預定位置上形成該等通 孔25，以及如需要的話，電鍍其内周圍，以導電該等鋼每 24、該金屬核心22及該等連接端31，藉以構成一電路。 (絕緣層之移除製程） 接著’移除在該佈線基板11之端部形成區域中之絕緣層 23及銅24，以暴露該金屬核心22。 特別地，如圖7及圖11⑷所示，以一擴孔器（reamer)或研 磨機(milling machine)從該佈線基板11之正面及背面擴孔該 100138609 15 201218900 等絕緣層23及該等導電層24之要做為可讓該端部形成區域 之端部自此突出之端面的部分，以便形成非穿透凹部46。 同時，該擴孔製程所形成之該非穿透凹部46具有在移除該 遮罩膠帶44時可接觸或稍微切割該金屬核心22之深度。接 著，以一切割機(router)朝該佈線基板11在大致正交於該等 非穿透凹部46之方向上的側面切割該等非穿透凹部46之兩 端，以便形成穿透凹部47。 然後，當從該等非穿透凹部46之側完全移除在該端部形 成區域中上面具有該等絕緣層23及該等導電層24之遮罩膠 帶44時，只暴露在該端部形成區域中之金屬核心22。 (端部之形成製程） 如圖9及11(c)所示，藉由使用該切割機之衝壓製程或切 割製程來處理在該端部形成區域中之暴露金屬核心22,以 便形成對應於該等連接端31之固定部32的端部33。然後， 以錫之類電鍍該等連接端31之端部33。 藉由上述製程，可輕易地製造具有該正面及背面做為該等 安裝表面21a及該等連接端31從該等側邊緣部21b延伸之 5層結構的佈線基板11。 如以上所述，依據上述該佈線基板之製造方法，可輕易地 製造具有可與一電線束之類連接而不需使用個別的高價連 接器之該等連接端31的該佈線基板11。此外，因為藉由該 層壓製程在該金屬板41上整合及積層該等絕緣層23，所以 100138609 16 ⑧ 201218900 相較於壓合技術(laminating press technique)，可實施連續製 程而不需保持製程中庫存（in-process inventory)，以有利地 整合及積層該等絕緣層，同時防止配置該等絕緣層23之預 浸體的樹脂之空隙，以及減少該預浸體。並且，因為在遮罩 要做為該等連接端31之端部33的部分及因而保護該部分之 狀態中積層該等絕緣層24，所以可保持該等形成端部33之 表面的平坦。於是，可平順地且牢固地連接該等端部至匹配 連接端。 亦即，可輕易地以低成本製造該佈線基板11，該佈線基 板11可連接至該電線束，以及該金屬核心22可確保有利的 散熱能力。 並且，因為以平坦化製程來平坦化該等最外絕緣層23之 表面（該等表面做為該等電氣及電子組件之安裝表面21a)， 所以可製造能有利地安裝該等電氣及電子組件之高品質的 佈線基板11。 另外，因為粗糙化該金屬板41之表面（在該等表面上積層 該等絕緣層23)，所以可顯著地增加該金屬板41與該等絕 緣層23間之附著力。 此外，擴孔該等絕緣層23，以形成該等非穿透凹部46。 因此，可輕易地一起>多除在該端部形成區域中之絕緣層23 及導電層24與該等遮罩膠帶44。 又，在該金屬板41之兩個表面上積層具有該等銅箔24(導 100138609 17 201218900 電層24)之該複數個絕緣層23，以便形成該多層結構。因 此，可使該佈線基板11適合於一複雜電路設計，同時抑制 該佈線基板11之面積。 本發明並非侷限於上述具體例及可適當地被修改、改良 等。在可具體化本發明之範圍内，在上述具體例中之個別構 成元件的材料、形狀、尺寸、配置位置等係任選的及並非侷 限於上面所述。 例如，在該絕緣層之移除製程中，必須只移除在該端部形 成區域中上之絕緣層23及導電層24。換句話說，可以藉由 沿著該端部形成區域之内周圍擴孔該等絕緣層23來形成該 等非穿透凹部及然後移除該等遮罩膠帶44，以移除該等絕 緣層及該等導電層。 例如，在上述具體例中，在積層該絕緣層之製程後，實施 將該工作件W切割成個別佈線基板11之切割及分離製程。 然而，如圖13(a)及13(b)所示，可能將做為可讓該端部形成 區域中之端部自此突出之端面的部分擴孔，以在該工作件W 之狀態中形成該等非穿透凹部46，以及然後，實施該切割 製程，以切割該佈線基板11，以及在該端部形成區域中形 成該等穿透凹部47。 並且，在本發明中，可以在該佈線基板11中形成該等通 孔25前，實施該端部形成製程。 此外，在本發明中，在該絕緣層之移除製程中，當形成該 100138609 18 ⑧ 201218900 等穿透凹部47時，可以調整該切割製程之深度，以形成該 等穿透凹部47且如圖14(a)所示保留該遮罩膠帶44之一端 部44a，或者保留在該遮罩膠帶44上所積層之絕緣層23的 一端部23a。關於所保留之該遮罩膠帶44的端部44a，因為 該遮罩膠帶44從該金屬核心22突出，所以可藉由使用該遮 罩膠帶44非常容易地移除該等絕緣層23及該等導電層 24。又，關於所保留之該絕緣層23的端部23a，因為使該 遮罩膠帶44與在該遮罩膠帶44上所積層之該絕緣層23彼 此黏附，所以當移除該絕緣層23時，可完全一起移除該遮 罩膠帶44與該等絕緣層23及該等導電層24。 同時，當在該金屬核心22之兩個表面上積層該等絕緣層 23及該等導電層24時，從該表面切割在該端部形成區域中 之一穿透凹部47及從背面切割另一穿透凹部47,以形成該 遮罩膠帶44及該絕緣層23之殘留端部23a及44a。 此外，圖15顯示製造具有該等連接端31之該佈線基板 11之方法的另一具體例。在此具體例中，在該金屬核心22 之端部形成區域中配置事先製備之連接端31，以及然後， 以一膠帶48等來保持該等連接端31。之後，在該金屬核心 22之正面及背面上層壓及積層該等絕緣層23，並保持該等 連接端31，宛如該等絕緣層覆蓋該等連接端31之固定部 32。因此，可製造具有從該基板21之側邊緣部21b延伸之 連接端31的佈線基板11。 100138609 19 201218900 在本發明之該等具體例中，已描述具有包括該金屬核心 22之5層結構的佈線基板11。然而，該結構沒有特別之限 制及可以具有2至4層及6層或更多層。 【圖式簡單說明】 圖1係藉由-依據本發明之_具體例之佈線基板之製造 方法所製造之一佈線基板的立體圖。 圖2係沿著圖1之線π-H所取得之剖面圖。 圖3描述依據本發明之該具體例之佈線基板之製造方 法，其中⑷係一工作件之平面圖及(b)係該工作件之放大平 面圖。 圖4描述依據本發明之該具體例之佈線基板之製造方 法，其卡（a)係該工作件之平面圖及(b)係該工作件之放大平 面圖。 圖5描述依據本發明之該具體例之佈線基板之製造方 法’其中⑷係該工作件之平面圖及⑻係該工作件之放大平 面圖。 圖6係在製造期間該佈線基板之平面圖，其描述依據本發 明之該具體例之佈線基板之製造方法。 圖7係在製造期間該佈線基板之平面圖，其描述依據本發 明之該具體例之佈線基板之製造方法。 圖8係在製造期間該佈線基板之平面圖，其描述依據本發 明之該具體例之佈線基板之製造方法。 100138609 20 201218900 圖9係在製造期間該佈線基板之平面圖，其描述依據本發 明之該具體例之佈線基板之製造方法。 圖10描述依據本發明之該具體例之佈線基板之製造方 法，其中（a)至（c)係一工作件之部分剖面圖。 圖11描述依據本發明之該具體例之佈線基板之製造方 法，其中（a)至（c)係該佈線基板之部分剖面圖。 圖12係一用以實施層壓形成之層壓形成裝置的示意側面 圖。 圖13描述一依據本發明之另一具體例之佈線基板之製造 方法，其中（a)係一工作件之平面圖及(b)係該工作件之放大 平面圖。 圖14描述一依據本發明之又另一具體例之佈線基板之製 造方法，其中當從一佈線基板之縱向觀看時，（a)及(b)係一 工作件之部分剖面圖。 圖15係在製造期間一佈線基板之部分平面圖，其描述一 具有連接端之佈線基板之製造方法的又另一具體例。 圖16係一佈線基板之立體圖，其顯示該佈線基板之安裝 範例。 【主要元件符號說明】 1 佈線基板 la 安裝表面 2 連接器 100138609 21 連接接腳 佈線基板 基板 安裝表面 側邊緣部 板狀金屬核心 絕緣層 端部 銅箔（導電層） 通孔 凹部 連接端 固定部 端部 金屬板 孔部 開口部 遮罩材料 端部 非穿透凹部 穿透凹部 膠帶 22 201218900 50 輸送PET上膜 51 饋送滾筒 52 捲繞滾筒 60 輸送PET下膜 61 饋送滾筒 62 捲繞滾筒 70 第一平台 80 第二平台 W 工作件 100138609 23To the other wiring substrate or the connection terminal W of the connection terminal W. The portion of the outer casing of the S ° 至 至 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到 到Pick up this. In addition, it is not necessary to reduce the number of expensive connectors manufactured to have a plurality of connection pins as much as possible so that it can be further reduced to *. Hereinafter, a method of manufacturing a wiring substrate according to the present invention, which is based on the wiring substrate 11 having the above-described configuration, will be described with reference to Figs. 3 to ηh h 11 . 3 to 5 illustrate a method of manufacturing the wiring substrate of the specific example of the present invention, wherein in each of the drawings, "(a) is a plan view of the workpiece and (b) is an enlargement of the workpiece Fig. 6 is a plan view of the wiring substrate 100138609 201218900 during the manufacturing process, which describes a method of manufacturing the wiring substrate according to the specific example. Fig. Illustrates the manufacture of the wiring substrate according to the specific example. The method, wherein (a) to (c) are partial cross-sectional views of a working member. Fig. 11 illustrates a method of manufacturing the wiring substrate according to the specific example of the present invention, wherein (a) to (c) are the wiring substrate Partial sectional view. (Forming process of fixing portion) As shown in Figs. 3(a) and 3(b) and Fig. 10(a), a metal plate 41 is prepared, in which a plurality of metal plates 41 can be formed (for example, 12) metal core 22. The fixing portion 32 and the hole portion 42' of the connecting end 31 are formed by punching the metal plate 41', wherein the through holes 25 are passed through the holes 42. A comb-shaped opening portion 43 is disposed substantially parallel to a side edge portion of the metal plate 41 To form the fixing portions 32. (Mask process) Next, as shown in 4(a) and 4(b) and FIG. 10(b), the metal plates 41 of the insulating layers 23 are laminated thereon. The masking material 44 is adhered to the end forming regions of the portion including the end portions 33 of the connecting ends 31 on the front and back sides. In other words, the masking materials 44 are from the fixing portions 32. The end portion covers the opposite side of the opening portion 43. As the masking material 44, a resin tape having heat resistance or the like can be used. For example, polyimide or PET (polyethylene terephthalate) can be used. Masking tape made of diester) 〇 (roughening process) 100138609 11 201218900 After the masking tape 44 is adhered to cover the end forming regions, the sandblasting or chemical roughening is used. The front surface and the back surface of the metal plate 41 are laminated on the front surface and the back surface of the metal plate 41. At the same time, the end portion forming regions are shielded by the mask tapes 44, so that the Area roughening. (Lamination process of insulating layer) Next, by the laminate shape In the method, the insulating layers 23 having the conductive layers (copper foils) 24 are laminated on the front and back surfaces of the metal plate 41. Here, the lamination forming method is used to laminate the insulating layers 23. A laminating forming apparatus for performing lamination formation is shown. As shown in Fig. 12, the laminating forming apparatus includes a film for transporting PET fed from a feeding roller 51 by a winding drum 52. (or just a film) 50 on the transport system, a transport system for transporting PET under the film (or just a film) 60, fed by a winding drum 62, and a transport system a first platform 70 between the upper conveying system and the lower conveying system for performing a layering process of heating, pressurizing and laminating a product, and a front and a back for heating and pressing the product to be flat The second platform 80 of the front and back flattening is produced. In the laminate forming apparatus, the insulating layers 23 are laminated on the front and back surfaces of the metal plate 41 by the following operation. First, a workpiece W is placed on the upstream side and the downstream side from the film PET film 60, wherein the workpiece W is laminated on the metal plate 100138609 12 8 201218900 41 in two layers. The insulating layers 23 of the copper foils 24 are such that the copper foils 24 are located on opposite sides of the metal plate 41. During the transport, the work piece w is covered with the transport PET upper film 50, and then the work piece w is transported to the first stage 7 and lost on the transport PED film 50 and the pet for input The lower membrane is 60. In the first stage 7, a working process of heating and pressurizing the workpiece under vacuum and then laminating the insulating layers 23 on the metal plate 41 and also laminating the stacked insulating layers 23 is carried out. In particular, a vacuum chamber is sealed to reduce the pressure therein so that a movable plate composed of a rubber diaphragm approaches a fixed plate to pinch the hot plate for heating, pressurizing and thus laminating the vacuum plate. The prepreg of the insulating layer 23 and the copper foil 24. Therefore, as shown in FIGS. 5(a) and 5(b), the insulating layers 23 and the conductive layers (copper foils) 24 are integrated and adhered to the metal plate 41' such that they cover the front side of the metal plate. And the back. Thus, as shown in Fig. 10(c), the work piece w has a five-layer structure in which the two insulating layers 23 having the conductive layers 24 are integrated and laminated on the front and back sides of the metal plate 41, respectively. Meanwhile, as the prepreg of the insulating layer 23, a glass cloth internally impregnated with a thermosetting resin was used. Heating and melting the thermosetting resin of the insulating layer 23 made of the prepreg in the layer pressing process so as to be embedded in the openings 43 in which the fixing portions 32 of the metal plate 41 are formed and become The through holes 25 and the like are in the holes 42. Further, since the metal plate 41 other than the adhesive portion of the masking tape 44 is sewed, the resin of the insulating layer 23 100138609 13 201218900 is firmly adhered to the front and back surfaces of the metal plate. In the first stage 70, the heating and pressurizing conditions are not particularly limited insofar as the thermosetting resin used in the insulating layer 23 can be sufficiently melted and solidified. At the same time, it is preferable to use the copper drop which has been previously formed with the circuit pattern by the etching process as the copper to be provided to the individual insulating layers 23, and the copper can be insulated by a subsequent etching process. The copper foils 24 provided on the outer surface of the layer 23 are formed with a circuit pattern. The work piece W laminated in the first platform 70 is carried out of the first platform 70 and carried into the second platform 80. In the second platform 80, heating and pressurizing the working member w (where the working member W is heated and pressurized in a vacuum and has the copper foil 24 constituting the circuit pattern on the front and back sides thereof) The unevenness) and thus the planarization process of the front and back sides of the workpiece W are planarized. Specifically, the work piece W is pressed at a predetermined temperature by a flattening press for arranging the second stage 80 to planarize the front side and the back side of the work piece w. The flat press has a fixed upper plate, a rubber diaphragm facing the upper plate and movable relative to the upper plate and a vertical movement of the lower plate and the upper plate Cooperate with a pressure-clamping drive unit. The workpiece W is heated by a heating device, and when the lower plate is moved by the driving means, the workpiece W is crimped to perform secondary processing for planarizing the front and back surfaces. 100138609 14 201218900 In the second platform 80, within the range of surface unevenness, the PET lower film 60 is carried out on the second platform 80 W. The heating and pressurizing conditions are not particularly limited in the front and back of the work piece w which can be flattened. The working piece on the front and back sides of the flattened and sandwiched on the transport PET film 50 and the wheel will be used for the round PET film to traverse the winding roller 52 of the PET film and the round The PET film is wound on the winding drum 62. At the same time, the work piece W is conveyed to the outside. (Cutting and Separating Process) A two-layer insulating layer 23 having the conductive layers 24 is formed on the front and back surfaces of the metal plate 41, and thus has a five-layer structure as described above, and the five-layer structure is cut and separated. The work piece w is a double-layer wiring board 11 having a five-layer structure in which the metal core 22 composed of the metal plate 41 is formed as shown in FIG. Then, as shown in FIG. 7, the through holes 25 are formed at predetermined positions by an electric drill or the like, and if necessary, the inner circumference thereof is plated to electrically conduct the steels 24, the metal cores 22, and the connecting ends. 31, thereby forming a circuit. (Removal Process of Insulating Layer) Next, the insulating layer 23 and the copper 24 in the region where the end portion of the wiring substrate 11 is formed are removed to expose the metal core 22. Specifically, as shown in FIG. 7 and FIG. 11 (4), the insulating layer 23 such as 100138609 15 201218900 and the conductive layers are reamed from the front and back surfaces of the wiring substrate 11 by a reamer or a milling machine. The layer 24 is intended to be a portion of the end face from which the end portion of the end portion is formed to form a non-penetrating recess 46. At the same time, the non-penetrating recess 46 formed by the reaming process has a depth that can contact or slightly cut the metal core 22 when the masking tape 44 is removed. Then, the ends of the non-penetrating recesses 46 are cut toward the side of the wiring substrate 11 in a direction substantially orthogonal to the non-penetrating recesses 46 by a router to form the penetration recesses 47. Then, when the mask tape 44 having the insulating layer 23 and the conductive layer 24 in the end forming region is completely removed from the side of the non-penetrating recess 46, only the end portion is exposed. The metal core 22 in the area. (End forming process) As shown in FIGS. 9 and 11(c), the exposed metal core 22 in the end forming region is processed by using a stamping process or a cutting process of the cutter to form a corresponding The end portion 33 of the fixing portion 32 of the connecting end 31 is equal. Then, the end portions 33 of the connection terminals 31 are plated with tin or the like. According to the above process, the wiring substrate 11 having the five-layer structure in which the front surface and the back surface are the mounting surfaces 21a and the connection ends 31 extend from the side edge portions 21b can be easily manufactured. As described above, according to the above-described method of manufacturing the wiring board, the wiring board 11 having the connection ends 31 which can be connected to a wire bundle or the like without using an individual high-priced connector can be easily manufactured. In addition, since the insulating layers 23 are integrated and laminated on the metal plate 41 by the layer pressing process, 100138609 16 8 201218900 can be continuously processed without maintaining the process compared to the laminating press technique. An in-process inventory to advantageously integrate and laminate the insulating layers while preventing voids in the resin of the prepreg in which the insulating layers 23 are disposed, and reducing the prepreg. Further, since the insulating layer 24 is laminated in a state where the mask is to be the portion of the end portion 33 of the connecting end 31 and thus the portion is protected, the surface of the end portion 33 can be kept flat. Thus, the ends can be connected smoothly and securely to the mating connector. That is, the wiring substrate 11 can be easily manufactured at a low cost, the wiring substrate 11 can be connected to the wiring harness, and the metal core 22 can ensure favorable heat dissipation capability. Moreover, since the surfaces of the outermost insulating layers 23 are planarized by a planarization process (the surfaces serve as the mounting surfaces 21a of the electrical and electronic components), the electrical and electronic components can be advantageously fabricated. High quality wiring substrate 11. Further, since the surface of the metal plate 41 is roughened (the insulating layers 23 are laminated on the surfaces), the adhesion between the metal plate 41 and the insulating layers 23 can be remarkably increased. Further, the insulating layers 23 are reamed to form the non-penetrating recesses 46. Therefore, the insulating layer 23 and the conductive layer 24 and the masking tape 44 in the end forming region can be easily removed together. Further, the plurality of insulating layers 23 having the copper foils 24 (conductive layers 130138609 17 201218900 electric layer 24) are laminated on both surfaces of the metal plate 41 to form the multilayer structure. Therefore, the wiring substrate 11 can be adapted to a complicated circuit design while suppressing the area of the wiring substrate 11. The present invention is not limited to the specific examples described above, and may be appropriately modified, improved, and the like. The material, shape, size, arrangement position, etc. of the individual constituent elements in the above specific examples are optional and not limited to the above, within the scope of the invention. For example, in the removal process of the insulating layer, only the insulating layer 23 and the conductive layer 24 in the end forming region must be removed. In other words, the non-penetrating recesses can be formed by reaming the insulating layers 23 along the periphery of the end forming region and then removing the masking tapes 44 to remove the insulating layers. And the conductive layers. For example, in the above specific example, after the process of laminating the insulating layer, the cutting and separating process for cutting the workpiece W into individual wiring substrates 11 is performed. However, as shown in FIGS. 13(a) and 13(b), it is possible to ream a portion which allows the end portion of the end portion forming region to protrude therefrom to be in the state of the workpiece W. The non-penetrating recesses 46 are formed, and then, the cutting process is performed to cut the wiring substrate 11, and the through-concave recesses 47 are formed in the end forming regions. Further, in the present invention, the end forming process can be performed before the through holes 25 are formed in the wiring substrate 11. In addition, in the present invention, in the removal process of the insulating layer, when the penetrating recess 47 such as 100138609 18 8 201218900 is formed, the depth of the cutting process can be adjusted to form the penetrating recess 47 and as shown in the figure. One end portion 44a of the masking tape 44 is retained as shown in Fig. 14(a), or one end portion 23a of the insulating layer 23 laminated on the masking tape 44 is retained. With respect to the end 44a of the masking tape 44 that is retained, since the masking tape 44 protrudes from the metal core 22, the insulating layer 23 can be removed very easily by using the masking tape 44 and the like. Conductive layer 24. Further, regarding the end portion 23a of the insulating layer 23 which is retained, since the masking tape 44 and the insulating layer 23 laminated on the masking tape 44 are adhered to each other, when the insulating layer 23 is removed, The masking tape 44 and the insulating layers 23 and the conductive layers 24 can be completely removed together. Meanwhile, when the insulating layers 23 and the conductive layers 24 are laminated on both surfaces of the metal core 22, one of the end forming regions is cut from the surface to penetrate the recess 47 and the other is cut from the back side. The recess 47 is penetrated to form the mask tape 44 and the residual ends 23a and 44a of the insulating layer 23. Further, Fig. 15 shows another specific example of a method of manufacturing the wiring substrate 11 having the connection terminals 31. In this specific example, the connection ends 31 prepared in advance are disposed in the end formation region of the metal core 22, and then, the connection ends 31 are held by a tape 48 or the like. Thereafter, the insulating layers 23 are laminated and laminated on the front and back sides of the metal core 22, and the connecting ends 31 are held as if the insulating layers cover the fixing portions 32 of the connecting ends 31. Therefore, the wiring substrate 11 having the connection end 31 extending from the side edge portion 21b of the substrate 21 can be manufactured. 100138609 19 201218900 In the specific examples of the present invention, the wiring substrate 11 having the 5-layer structure including the metal core 22 has been described. However, the structure is not particularly limited and may have 2 to 4 layers and 6 or more layers. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a wiring board manufactured by a method of manufacturing a wiring board according to a specific example of the present invention. Figure 2 is a cross-sectional view taken along line π-H of Figure 1. Fig. 3 is a view showing a method of manufacturing a wiring board according to this specific example of the present invention, wherein (4) is a plan view of a workpiece and (b) is an enlarged plan view of the workpiece. Fig. 4 is a view showing a method of manufacturing a wiring board according to this specific example of the present invention, wherein a card (a) is a plan view of the workpiece and (b) is an enlarged plan view of the workpiece. Fig. 5 is a view showing a method of manufacturing a wiring board according to this specific example of the present invention, wherein (4) is a plan view of the working member and (8) is an enlarged plan view of the working member. Fig. 6 is a plan view of the wiring substrate during the manufacturing, which describes a method of manufacturing the wiring substrate according to the specific example of the present invention. Fig. 7 is a plan view of the wiring substrate during the manufacturing, which describes a method of manufacturing the wiring substrate according to the specific example of the present invention. Fig. 8 is a plan view of the wiring substrate during the manufacturing, which describes a method of manufacturing the wiring substrate according to the specific example of the present invention. 100138609 20 201218900 Fig. 9 is a plan view of the wiring substrate during manufacture, which describes a method of manufacturing a wiring substrate according to this specific example of the present invention. Fig. 10 is a view showing a method of manufacturing a wiring board according to this specific example of the present invention, wherein (a) to (c) are partial cross-sectional views of a working member. Fig. 11 is a view showing a method of manufacturing a wiring board according to this specific example of the present invention, wherein (a) to (c) are partial cross-sectional views of the wiring board. Figure 12 is a schematic side view of a lamination forming apparatus for performing lamination formation. Fig. 13 is a view showing a method of manufacturing a wiring board according to another embodiment of the present invention, wherein (a) is a plan view of a workpiece and (b) is an enlarged plan view of the workpiece. Fig. 14 is a view showing a method of manufacturing a wiring board according to still another embodiment of the present invention, wherein (a) and (b) are partial cross-sectional views of a working member when viewed from a longitudinal direction of a wiring substrate. Fig. 15 is a partial plan view showing a wiring substrate during manufacture, which is still another specific example of a method of manufacturing a wiring substrate having a connection end. Figure 16 is a perspective view of a wiring substrate showing an example of mounting of the wiring substrate. [Main component symbol description] 1 Wiring board la mounting surface 2 Connector 100138609 21 Connection pin wiring substrate Substrate mounting surface side edge plate metal core insulation layer end copper foil (conductive layer) Through hole recess connection end fixing end Part metal plate opening opening material end portion non-penetrating concave portion penetrating concave portion tape 22 201218900 50 conveying PET upper film 51 feeding roller 52 winding roller 60 conveying PET lower film 61 feeding roller 62 winding roller 70 first platform 80 second platform W work piece 100138609 23