JP6399422B2 - Printed wiring board material, printed wiring board material manufacturing method, printed wiring board manufacturing method - Google Patents

Description

  The present invention relates to a printed wiring board material used for manufacturing a printed wiring board, a printed wiring board material manufacturing method, and a printed wiring board manufacturing method using the printed wiring board material.

  Conventionally, when manufacturing a wiring board without a core material as a printed wiring board, for example, a method for manufacturing a wiring board described in Patent Document 1 or Patent Document 2 has been proposed.

  In the manufacturing method described in Patent Document 1, first, a base layer is disposed in a wiring formation region on a prepreg. Then, by placing the copper foil on the prepreg through the base layer so that the copper foil larger than the size of the base layer is in contact with the outer peripheral portion of the wiring formation region, the prepreg is cured by heating and pressurizing. Simultaneously with obtaining the temporary substrate, a copper foil is bonded to at least one surface of the temporary substrate. Next, a build-up wiring layer including a wiring layer made of gold or the like is formed on the copper foil so as to contact the copper foil. Thereafter, the copper foil is separated from the temporary substrate by cutting a portion corresponding to the periphery of the base layer of the structure in which the base layer, the copper foil, and the build-up wiring layer are formed on the temporary substrate. A wiring member having a build-up wiring layer formed thereon is obtained. Then, by selectively removing the copper foil from the wiring layer made of gold or the like of the wiring member, the lower surface of the lowermost wiring layer of the build-up wiring layer is exposed, and a coreless wiring board is manufactured. Like to do.

  In the manufacturing method described in Patent Document 2, first, a metal foil having a size smaller than that of the support substrate is arranged on at least one surface of the support substrate so as to have a certain distance from each side of the support substrate. Next, an adhesive insulating material having a size larger than that of the metal foil is disposed on the surface of the metal foil so as to cover the peripheral portion of the end of each side of the metal foil. Next, a laminated plate or the like is disposed on the surface of the adhesive insulating material. Next, it heat-press-molds, the said edge part peripheral part of each side of the said metal foil is sealed with the said adhesive insulating material, and the board | substrate which consists of a laminated board etc. and an adhesive insulating material is manufactured. Next, the wiring board manufacturing process of interlayer conduction processing, circuit formation processing, and adhesive insulating material laminating processing is repeatedly performed on the substrate as necessary to form a multilayer. Next, the peripheral portion of the end of each sealed side of the multilayered substrate is cut, and the multilayered substrate is peeled from the support substrate. Thereby, a thin material or a substrate-less multilayer printed wiring board can be obtained.

Japanese Patent No. 4334005 Japanese Patent No. 44461912

  However, in the manufacturing methods described in Patent Document 1 and Patent Document 2, a rectangular temporary substrate (support substrate) having a predetermined size is used, and an outer peripheral portion thereof is sealed with an insulating material in a multilayering process by a build-up method. Has been. Therefore, since it is necessary to cut the peripheral part of the outer peripheral four sides in the process of separating the temporary substrate (supporting substrate), the manufacturing man-hour is increased, and the material loss of the cut part is increased. It was something that grew.

  The present invention has been made in view of the above points. A printed wiring board material, a printed wiring board material manufacturing method, and a printed wiring board capable of manufacturing a printed wiring board at a lower manufacturing cost than conventional ones. It aims at providing the manufacturing method of a board.

The printed wiring board material according to the present invention is peelable from the long first metal layer on both sides of the long support layer not included in the printed wiring board to be produced , the first metal layer, In addition, a long second metal layer having a thickness larger than the thickness of the first metal layer, a long first insulating layer, and a long third metal layer can be laminated and integrated in this order to be wound into a roll. And both side edges of the first metal layer and the second metal layer are disposed inside the side edges of the support layer, and both side edges of the first insulating layer are the first metal layer and the first metal layer. It is arranged outside the both side edges of the bimetallic layer.

  In the printed wiring board material, it is preferable that the first metal layer and the second metal layer are formed of a peelable metal foil obtained by superimposing two metal foils.

Method for manufacturing a printed wiring board materials according to the present invention, a sheet material support layer long not included in the printed wiring board to be manufactured, the width of the seat material for the support layer in the long A short first metal foil, a long second metal foil having a width shorter than the thickness of the support layer sheet material and a thickness greater than the thickness of the first metal foil, and a long first metal The first metal foil is provided on both sides of the sheet material for the support layer while continuously conveying the first insulating sheet material having a longer width than the foil and the second metal foil and the long third metal foil. The second metal foil, the first insulating sheet material, and the third metal foil are stacked in this order, and both side edges of the first metal foil and the second metal foil are on both sides of the support layer sheet material. Arranged on the inner side of the edge, and both side edges of the first insulating sheet material are the first metal foil and Serial and is characterized in that the heat pressure molded in a state arranged outside the side edges of the second metal foil.

  The method for manufacturing a printed wiring board according to the present invention includes a step of stacking and integrating a buildup layer on both sides of the printed wiring board material to form a laminated structure, and the first metal layer and the second metal layer. Removing the both ends of the laminated structure in the width direction at positions inside both side edges in the width direction, and peeling at the interface between the first metal layer and the second metal layer, thereby supporting the support And removing the layer and the first metal layer to obtain a multilayer substrate composed of the build-up layer.

  According to the present invention, the printed wiring board material has a long shape that can be wound into a roll, and after the build-up layers are laminated and integrated on both surfaces thereof, the interface between the first metal layer and the second metal layer A printed wiring board can be manufactured by peeling and separating. At the time of this separation, not only the entire outer periphery of the printed wiring board material, but only the side edges in the width direction are cut off, so that material loss is reduced compared to the conventional method, and the manufacturing cost is reduced. Can be manufactured.

An example of the material for printed wiring boards is shown, (a) is the sectional view on the AA line of (b), (b) is a top view. An example of the manufacturing method of the material for printed wiring boards is shown, (a) (b) is sectional drawing. It is a front view which shows an example of the manufacturing method of the material for printed wiring boards. An example of the manufacturing method of a printed wiring board is shown, (a)-(g) is sectional drawing.

  Embodiments of the present invention will be described below.

  FIG. 1 shows an example of a printed wiring board material 1. This printed wiring board material 1 includes a long first metal layer 31, a long second metal layer 32 that can be peeled from the first metal layer 31, and a long first metal layer 31 on both sides of a long support layer 2. One insulating layer 51 and a long third metal layer 33 are laminated and integrated in this order so that they can be wound into a roll. In the following, when the printed wiring board material 1 is viewed in plan view, the direction substantially parallel to the longitudinal direction (longitudinal direction) (the direction parallel to the line AA in FIG. 1B) is the width direction. Will be described. And in said printed wiring board material 1, as shown to Fig.1 (a), the both-sides edge of the 1st metal layer 31 and the 2nd metal layer 32 is arrange | positioned inside the both-sides edge of the support body layer 2. As shown in FIG. Has been. Further, both side edges of the first insulating layer 51 are disposed outside both side edges of the first metal layer 31 and the second metal layer 32.

  Next, the support body layer 2, the first metal layer 31, the second metal layer 32, the first insulating layer 51, and the third metal layer 33 constituting the printed wiring board material 1 will be described.

  The support layer 2 is not particularly limited as long as it is a long one having sufficient strength as a core material. As the support layer sheet material 20 for forming such a support layer 2, for example, a long base material was impregnated with a resin composition, and this was heated and dried and semi-cured. A long prepreg can be used. The support layer 2 can be formed by making the semi-cured support layer sheet material 20 into a completely cured state. As a base material, organic fiber base materials, such as inorganic fiber sheets, such as a glass woven fabric (glass cloth) and a glass nonwoven fabric (glass paper), an aramid fiber, etc. can be used, for example. The thickness of the substrate is preferably 20 to 200 μm. The resin composition can contain a thermoplastic resin or a thermosetting resin. Examples of the thermoplastic resin that can be used include solvent-soluble polyimide and polyamideimide. As the thermosetting resin, for example, an epoxy resin, a phenol resin, a cyanate resin, a melamine resin, an imide resin, or the like can be used. Although the thickness of the support body layer 2 is 20-200 micrometers, for example, it is not limited to this.

  Said resin composition may contain a filler, a hardening | curing agent, and a hardening accelerator. As the filler, for example, an inorganic filler such as silica, aluminum hydroxide, magnesium hydroxide, calcium carbonate, talc, and alumina, or an organic filler made of a resin material can be used. The content of the filler is not particularly limited, and a predetermined amount of filler can be appropriately blended according to the purpose, but the filler is contained in an amount of 20 to 80% by mass with respect to the total amount of the resin composition. Is preferred. Further, the curing agent can be appropriately selected from known materials from the viewpoint of adaptability in combination with a thermosetting resin, such as a phenolic curing agent, an amine curing agent, a dicyandiamide curing agent, and the like. Can be used. Moreover, as a hardening accelerator, imidazoles, a phenol compound, amines, organic phosphines, etc. can be used, for example.

  The first metal layer 31 can be formed by the first metal foil 311. The first metal foil 311 is not particularly limited as long as it is long and has a width shorter than the width of the support layer sheet material 20. For example, a copper foil or the like can be used. Although the thickness of the 1st metal foil 311 is 2-5 micrometers, for example, it is not limited to this. The surface of the first metal foil 311 that is stacked on the support layer sheet material 20 is preferably roughened, that is, a mat surface, in order to improve the adhesion to the support layer 2. In order to improve the peelability from the second metal layer 32, the surface of the first metal foil 311 that is overlapped with the second metal foil 322 is preferably mirror-finished, that is, a shiny surface.

  The second metal layer 32 can be formed by the second metal foil 322. The second metal foil 322 is not particularly limited as long as it is peelable from the first metal layer 31 and is long and has a width shorter than the width of the sheet material 20 for support layer. For example, copper foil or the like can be used. The width of the second metal foil 322 may be the same as or different from the width of the first metal foil 311. Although the thickness of the 2nd metal foil 322 is 5-70 micrometers, for example, it is not limited to this. In order to improve the peelability from the first metal layer 31, the surface of the second metal foil 322 that overlaps the first metal foil 311 is preferably mirror-finished, that is, a shiny surface. The surface of the second metal foil 322 overlaid on the first insulating sheet material 511 is preferably roughened, that is, a matte surface, in order to improve adhesion to the first insulating layer 51. In FIG. 1 and the like, the mat surface of the second metal layer 32 is schematically illustrated by fine irregularities.

  Here, the first metal layer 31 and the second metal layer 32 are peelable metal foils 6 (super thin with support metal foils) in which two metal foils (first metal foil 311 and second metal foil 322) are superposed. It is preferable that the metal foil is formed. That is, the peelable metal foil 6 is formed by laminating the first metal foil 311 (ultra-thin metal foil) serving as the first metal layer 31 on the surface of the second metal foil 322 (support metal foil) serving as the second metal layer 32. In addition, it is integrally formed with a peelable strength by a relatively weak external force in advance. As such a peelable metal foil 6, a commercially available one can be used. In this case, it is preferable that the surface of the first metal foil 311 superimposed on the second metal foil 322 and the surface of the second metal foil 322 superimposed on the first metal foil 311 are shiny surfaces. Thereby, although the 1st metal layer 31 and the 2nd metal layer 32 are normally adhere | attached, it can peel easily at the interface of the 1st metal layer 31 and the 2nd metal layer 32 as needed. A release layer (not shown) may be provided at the interface between the first metal layer 31 and the second metal layer 32. The release layer can be formed of a fluororesin or can be formed of a polyester or polyethylene terephthalate (PET) film that has been subjected to silicone release treatment on both sides. Also in this case, it can be easily peeled off at the interface between the first metal layer 31 and the second metal layer 32 as necessary.

  The first insulating layer 51 can be formed of the first insulating sheet material 511. The first insulating sheet material 511 is not particularly limited as long as it is made of a long insulating material and functions as an adhesive layer. For example, as the first insulating sheet material 511, the prepreg described as an example of the support layer sheet material 20 can be used. However, the width of the first insulating sheet material 511 is longer than the width of the first metal foil 311 and the second metal foil 322.

  The third metal layer 33 can be formed by the third metal foil 333. As the 3rd metal foil 333, the thing similar to the 2nd metal foil 322 can be used. The surface of the third metal foil 333 that is overlapped with the first insulating sheet material 511 is preferably roughened, that is, a matte surface, in order to improve adhesion to the first insulating layer 51. In FIG. 1 and the like, the mat surface of the third metal layer 33 is also schematically illustrated by fine irregularities. The surface of the third metal foil 333 opposite to the surface superimposed on the first insulating sheet material 511 is preferably a matte surface when it is multilayered by the build-up method, but may be a shiny surface.

  Next, a method for producing the printed wiring board material 1 will be described. In addition, although the 1st metal foil 311 and the 2nd metal foil 322 may be used separately, since the printed wiring board material 1 can be manufactured easily, the example using the peelable metal foil 6 is demonstrated.

  As shown in FIG. 3, on the start end side of the manufacturing process of the printed wiring board material 1, the feeder 11 for the support layer sheet material 20, the two feeders 12 for the peelable metal foil 6, and the first insulation are provided. Two feeding machines 13 for the sheet material 511 and two feeding machines 14 for the third metal foil 333 are provided. The feeding machine 11 is obtained by winding a long sheet material 20 for a support layer into a coil shape. The feeding machine 12 is obtained by winding a long peelable metal foil 6 in a coil shape. The feeding machine 13 is obtained by winding a long first insulating sheet material 511 in a coil shape. The feeding machine 14 is obtained by winding a long third metal foil 333 in a coil shape. The support layer sheet material 20, the peelable metal foil 6, the first insulating sheet material 511, and the third metal foil 333 are continuously fed from the feeding machine 11, the feeding machine 12, the feeding machine 13, and the feeding machine 14, respectively. It has become. On the terminal side of the manufacturing process of the printed wiring board material 1, a winder 15 for the printed wiring board material is provided. The winder 15 winds the printed wiring board material 1 after manufacture into a coil shape.

  As shown in FIG. 3, a double belt press device 16 is disposed between the feeding machines 11, 12, 13, 14 and the winder 15. The double belt press device 16 includes a plurality of sheet materials (in the present invention, the support layer sheet material 20, the peelable metal foil 6, the first insulating sheet material 511, and the third metal) between a pair of endless belts 17 arranged vertically. The foil 333) is continuously fed, and the above-mentioned sheet material is hot-pressed through the endless belt 17 by the hot-pressure device 18 to obtain the printed wiring board material 1.

  The endless belt 17 is made of a material such as stainless steel. Each endless belt 17 is suspended between two drums 19 and 20, and rotates when the drums 19 and 20 rotate. A sheet material can pass between the two endless belts 17, and while the sheet material passes between the endless belts 17, each endless belt 17 is in surface contact with both sides of the sheet material, and the sheet material The surface pressure can be applied to. Each endless belt 17 is provided with a heat pressure device 18, and the heat pressure device 18 pressurizes and heats the sheet material via the endless belt 17. For example, a hydraulic plate that heats and pressurizes the sheet material via the endless belt 17 by the hydraulic pressure of the heated liquid medium can be used as the thermal pressure device 18.

  When manufacturing the printed wiring board material 1, first, as shown in FIG. 3, the sheet material 20 for the support layer, the peelable metal foil 6, and the first from each of the feeding machines 11, 12, 13, and 14, respectively. The insulating sheet material 511 and the third metal foil 333 are fed out and continuously conveyed to the double belt press device 16. And as shown to Fig.2 (a), the peelable metal foil 6, the 1st insulating sheet material 511, and the 3rd metal foil 333 are each laminated | stacked in this order on both surfaces of the sheet | seat material 20 for support body layers. In this state, the sheet is conveyed between the two endless belts 17. At this time, as shown in FIGS. 1 and 2, the first metal layer 31 of the peelable metal foil 6 is overlapped with the sheet material 20 for the support layer, and the second metal layer 32 of the peelable metal foil 6 is the first insulating sheet material 511. Overlay on. Further, both side edges of the peelable metal foil 6 are arranged inside the both side edges of the support layer sheet material 20, and both side edges of the first insulating sheet material 511 are arranged outside the both side edges of the peelable metal foil 6. To do. Thereby, as shown in FIGS. 1A and 2B, both end portions of the support layer 2 and both end portions of the first insulating layer 51 are in direct contact with each other in the width direction.

  In the double belt press device 16, the support layer sheet material 20, the peelable metal foil 6, the first insulating sheet material 511, and the third metal foil 333 are sandwiched between the two endless belts 17. 17 is conveyed. The endless belt 17 rotates in synchronization with the conveyance speed of the support layer sheet material 20, the peelable metal foil 6, the first insulating sheet material 511, and the third metal foil 333. While the support layer sheet material 20, the peelable metal foil 6, the first insulating sheet material 511, and the third metal foil 333 are conveyed between the two endless belts 17, the support layer sheet material 20, the peelable metal foil 6. A surface pressure is applied to the first insulating sheet material 511 and the third metal foil 333 via the endless belt 17 by the hot press device 18 and heated. The conditions of the hot pressing at this time are preferably, for example, that the temperature is 200 to 350 ° C., the pressure is 20 to 60 MPa, and the time is 2 to 60 minutes. By carrying out hot pressing as described above, the support layer sheet material 20 and the first insulating sheet material 511 are melted and softened, and as shown in FIG. 2, the support layer 2, the peelable metal foil 6, the first insulating layer. 51. The third metal layer 33 is thermocompression bonded and integrated. At this time, both ends of the support layer 2 and both ends of the first insulating layer 51 are directly thermocompression bonded in the width direction. And the printed wiring board material 1 manufactured in this way is conveyed from the double belt press apparatus 16 as shown in FIG. 3, and is wound up in a coil shape by the winder 15 at the terminal side of the manufacturing process.

  Next, a method for manufacturing the printed wiring board 10 using the printed wiring board material 1 obtained as described above will be described. Since the printed wiring board material 1 is formed in a roll shape so that it can be wound up, a roll-to-roll process should be used in manufacturing the printed wiring board 10 in the following process. Can do.

  First, in the steps shown in FIGS. 4A to 4C, the buildup layer 81 is laminated and integrated on both surfaces of the printed wiring board material 1 to form the laminated structure 8. Each buildup layer 81 can be formed as follows, for example.

  First, as shown in FIG. 4A, a via hole 91 for electrically connecting the second metal layer 32 and the third metal layer 33 is formed as necessary. The via hole 91 can be formed, for example, by drilling the first insulating layer 51 with a drill or a laser, and the inside of the hole is plated or filled with a conductive paste to conduct electricity. Can be planned. In addition, when drilling is performed by laser, even if the third metal layer 33 is irradiated with laser from the top, the third metal layer 33 at the location where the hole is to be drilled is removed with an etching solution or the like, and then exposed. The first insulating layer 51 may be pierced with a laser. Other via holes can be formed in the same manner.

  Next, as shown in FIG. 4B, a second conductor pattern layer 72 is formed from the third metal layer 33 of the printed wiring board material 1. The second conductor pattern layer 72 can be formed by dissolving and removing unnecessary portions of the third metal layer 33 with an etching solution to form a pattern (patterning). At this time, both ends of the support layer 2 and both ends of the first insulating layer 51 are fused and integrated in the width direction of the printed wiring board material 1, so that the etching solution is used in the inner peelable metal foil 6. Intrusion into the interface between the first metal layer 31 and the second metal layer 32 is suppressed. When the second conductor pattern layer 72 is formed, a via hole 91 for electrically connecting the second conductor pattern layer 72 and the second metal layer 32 is formed as necessary.

  Next, as shown in FIG. 4C, the second insulating sheet material 522 and the fourth metal foil 344 are stacked in this order on the surface of the second conductor pattern layer 72. This lamination can also be performed by hot pressing using the double belt press device 16. At this time, as the second insulating sheet material 522, the same material as the first insulating sheet material 511 can be used. The second insulating sheet material 522 forms the second insulating layer 52. As the fourth metal foil 34, the same one as the second metal foil 32 can be used. The fourth metal foil 34 forms the fourth metal layer 34. The surface of the fourth metal foil 344 overlaid on the second insulating layer 52 is preferably roughened, that is, a matte surface, in order to improve adhesion with the second insulating layer 52. In FIG. 4 and the like, the mat surface of the fourth metal layer 34 is also schematically illustrated by fine irregularities. The surface of the fourth metal layer 34 opposite to the surface overlapped with the second insulating layer 52 is preferably a mat surface when multilayered by a build-up method, but may be a shiny surface. In this way, the build-up layers 81 can be formed on both surfaces of the printed wiring board material 1. The buildup layer 81 shown in FIG. 4C is formed by laminating the second metal layer 32, the first insulating layer 51, the second conductor pattern layer 72, the second insulating layer 52, and the fourth metal layer 34. However, the number of layers is not limited to this. If necessary, further multilayering may be performed using a build-up method. From the viewpoint of manufacturing efficiency of the printed wiring board 10, this multi-layering is preferably performed before the step of cutting off both ends of the laminated structure 8 described later. Moreover, although the example which forms each insulation layer in the buildup layer 81 by a prepreg was shown in said form, you may form each insulation layer with a resin film etc. of a base materialless. Each conductor pattern layer has a subtractive method in which the pattern is formed by etching the fourth metal layer 34 in the above embodiment, but in addition, a pattern is formed on the second insulating layer 52 by using an additive method by plating. It may be formed. The laminated structure 8 is formed by laminating and building up build-up layers 81 on both surfaces of the printed wiring board material 1.

  Next, in the step shown in FIG. 4D, both end portions in the width direction of the laminated structure 8 are cut off at positions inside both side edges in the width direction of the first metal layer 31 and the second metal layer 32. Specifically, both side edges of the printed wiring board material 1 are cut by cutting the inside of both sides of the peelable metal foil 6 (the first metal layer 31 and the second metal layer 32) with a cutting device such as a shear cutter. Cut off. In FIG. 4D, the cut portion is indicated by a broken line.

  FIG. 4E shows the laminated structure 8 with both ends in the width direction cut away. When both side edges of the printed wiring board material 1 are cut off as described above, the portion where the support layer 2 and the first insulating layer 51 are fused and integrated is removed as shown in FIG. The interface between the first metal layer 31 and the second metal layer 32 is exposed to the outside at both end faces in the width direction of the wiring board material 1.

  In the step shown in FIG. 4 (f), the support layer 2 and the first metal layer 31 are removed by peeling at the interface between the first metal layer 31 and the second metal layer 32. A multilayer substrate 82 is obtained. Compared with the adhesive force between the support layer 2 and the first insulating layer 51, the adhesive force between the first metal layer 31 and the second metal layer 32 is weak, so that it can be easily peeled off at this interface. As shown in FIG. 4 (f), a multilayer substrate 82 composed of build-up layers 81 can be obtained on both sides of the support layer 2. In this case, one outermost layer of the multilayer substrate 82 is the second metal layer 32, and the other outermost layer is the fourth metal layer 34.

  Thereafter, as shown in FIG. 4G, the first conductor pattern layer 71 is formed from the second metal layer 32 of each multilayer substrate 82, and the third conductor pattern layer 73 is formed from the fourth metal layer 34 as necessary. Form. The first conductor pattern layer 71 and the third conductor pattern layer 73 can be formed by dissolving and removing unnecessary portions of the second metal layer 32 and the fourth metal layer 34 with an etching solution, respectively. When the third conductor pattern layer 73 is formed, a via hole 92 for electrically connecting the third conductor pattern layer 73 and the second conductor pattern layer 72 is formed in the same manner as described above. In addition, when using the 2nd metal layer 32 or the 4th metal layer 34 as a ground layer, it is not necessary to perform pattern formation in the outermost layer.

  As described above, since the printed wiring board material 1 has a long shape that can be wound up in a roll shape, the first metal layer 31 and the second metal layer are laminated and integrated with the buildup layer 81 on both surfaces thereof. The printed wiring board 10 can be manufactured by peeling and separating at the interface with 32. At the time of the separation at the time of manufacturing the printed wiring board 10, it is only necessary to cut off not only the entire outer peripheral edge of the printed wiring board material 1 but also both side edge portions in the width direction, resulting in less material loss and manufacturing costs. Thus, the printed wiring board 10 can be easily manufactured. If the printed wiring board material 1 is not a long shape but a sheet shape such as a rectangular shape, the entire outer peripheral edge must be cut off, and the manufacturing cost may not be sufficiently reduced. Further, since the printed wiring board material 1 is long, it is easy to apply a roll-to-roll process, and the precursor of the printed wiring board 10 is formed on both sides of the printed wiring board material 1. Since the multilayer substrate 82 can be formed, the productivity of the printed wiring board 10 can also be improved.

  The printed wiring board 10 shown in FIG. 4G is a multilayer printed wiring board composed of three layers of a first conductor pattern layer 71, a second conductor pattern layer 72, and a third conductor pattern layer 73. The number is not limited. The multilayering by the build-up method is preferably performed before the cutting process on both side edges of the printed wiring board material 1 shown in FIG.

DESCRIPTION OF SYMBOLS 1 Material for printed wiring boards 2 Support body layer 6 Peelable metal foil 8 Laminated structure 10 Printed wiring board 20 Sheet material for support body layers 31 1st metal layer 32 2nd metal layer 33 3rd metal layer 51 1st insulating layer 81 Build-up layer 82 Multilayer substrate 311 First metal foil 322 Second metal foil 333 Third metal foil 511 First insulating sheet material

Claims (4)

A long first metal layer, which is not included in the printed wiring board to be manufactured, can be peeled from the long first metal layer, the first metal layer, and thicker than the thickness of the first metal layer. The long second metal layer, the long first insulating layer, and the long third metal layer are laminated and integrated in this order so that they can be wound into a roll shape, and the first metal layer and the Both side edges of the second metal layer are arranged inside the both side edges of the support layer, and both side edges of the first insulating layer are arranged outside both side edges of the first metal layer and the second metal layer. A printed wiring board material characterized by being made.   2. The printed wiring board material according to claim 1, wherein the first metal layer and the second metal layer are formed of a peelable metal foil obtained by superimposing two metal foils. A sheet material for a long support layer not included in the printed wiring board to be manufactured, a first metal foil that is long and shorter in width than the sheet material for the support layer, and is a long and the support layer A second metal foil having a width shorter than that of the sheet material and having a thickness larger than that of the first metal foil, and a first longer and longer than the first metal foil and the second metal foil. While continuously conveying the insulating sheet material and the long third metal foil, the first metal foil, the second metal foil, the first insulating sheet material on both sides of the support layer sheet material, The third metal foil is stacked in this order, and both side edges of the first metal foil and the second metal foil are disposed on the inner side than both side edges of the sheet material for support layer, and the first insulating sheet A state where both side edges of the material are arranged outside both side edges of the first metal foil and the second metal foil Method for manufacturing a printed wiring board materials, which comprises hot press molding.   A step of forming a laminated structure by laminating and integrating a buildup layer on both surfaces of the printed wiring board material according to claim 1 or 2, and both side edges in the width direction of the first metal layer and the second metal layer Removing the both ends in the width direction of the laminated structure at a position on the inner side, and peeling at the interface between the first metal layer and the second metal layer, thereby the support layer and the first Removing the metal layer, and obtaining a multilayer substrate made of the build-up layer.

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