CN104981109B - The processing method and circuit board of hanging structure golden finger - Google Patents
The processing method and circuit board of hanging structure golden finger Download PDFInfo
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- CN104981109B CN104981109B CN201410147958.3A CN201410147958A CN104981109B CN 104981109 B CN104981109 B CN 104981109B CN 201410147958 A CN201410147958 A CN 201410147958A CN 104981109 B CN104981109 B CN 104981109B
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Abstract
The invention discloses a kind of processing method of hanging structure golden finger and circuit board, to solve existing golden finger circuit board presence, limitation is very strong, and versatility is very poor, is easily caused the technical problem of the wasting of resources and cost.Method includes：The golden finger copper mold block of multiple different-thickness is provided；Multi-layer sheet is pressed, wherein, the multiple golden finger copper mold block is pressed on to the different levels of the multilayer inner cord；One group of via hole is processed beyond multiple-plate shaping area, the via hole is connected with the copper coin area of the golden finger copper mold block；Controlled depth milling removes the part beyond multiple-plate shaping area, but retains the golden finger copper mold block；It is gold-plated to the copper bar of the golden finger module；Non- copper bar part controlled depth milling beyond multiple-plate shaping area is removed so that the copper bar turns into the golden finger of hanging structure.
Description
Technical field
The present invention relates to circuit board technology field, and in particular to the processing method and circuit of a kind of hanging structure golden finger
Plate.
Background technology
At present, with golden finger generally used golden finger online design in printed circuit board (PCB) (PCB) plate, its structure design
Mode within the shaping area of road plate top layer.And the golden finger of plug function is provided, it should be matched with the size of connecting-disconnecting interface, golden finger
The thickness of circuit board should be consistent with the open height of connecting-disconnecting interface, when the open height of connecting-disconnecting interface is fixed, golden finger
The circuit plate thickness at place is also just therefore fixed.
When golden finger circuit board will realize multi-functional demand and need increase thickness of slab, then supporting connecting-disconnecting interface equipment
Do whole conversion, very waste of resource and cost；Golden finger circuit board is fixed due to thickness, it is impossible to applied to various sizes of
Connecting-disconnecting interface, causes the versatility of golden finger circuit board very poor；When same equipment has multiple connecting-disconnecting interfaces, it is necessary to design multiple
The golden finger circuit board of correspondence thickness, can influence the assembly space of product, and cause the wasting of resources and cost.
To sum up, existing golden finger circuit board, limitation is very strong, and versatility is very poor, is easily caused the wasting of resources and cost
Lifting.
The content of the invention
The embodiment of the present invention provides the processing method and circuit board of a kind of hanging structure golden finger, to solve existing golden hand
Refer to what circuit board was present, limitation is very strong, and versatility is very poor, is easily caused the technical problem of the wasting of resources and cost.
First aspect present invention provides a kind of processing method of hanging structure golden finger, it may include：
There is provided the golden finger copper mold block of multiple different-thickness, the golden finger copper mold block includes copper coin area and from copper coin area
At least copper bar that side is extended, the copper bar is divided into close to the pressing area for appearing area and remote copper coin area in copper coin area；
Multi-layer sheet is pressed, wherein, the multiple golden finger copper mold block is pressed on to the different levels of the multilayer inner cord,
The copper coin area of the golden finger copper mold block and the area that appears of the copper bar is set to be located at beyond multiple-plate shaping area；
One group of via hole, the via hole and the golden finger copper mold block are processed beyond multiple-plate shaping area
Copper coin area is connected；
Controlled depth milling is carried out to the part beyond multiple-plate shaping area, but retains the golden finger copper mold block, and is protected
The part multi-layer sheet in the copper coin area of golden finger module is stayed, the via hole is located on the part multi-layer sheet that the copper coin area retains；
The multiple-plate surface metal-layer in part using copper coin area reservation is electroplate lead wire, to the golden finger module
Copper bar to appear area gold-plated；
Non- copper bar part controlled depth milling beyond multiple-plate shaping area is removed so that the copper bar turns into hanging knot
The golden finger of structure, is made the circuit board with hanging structure golden finger.
Second aspect of the present invention provides a kind of circuit board with hanging structure golden finger, it may include：
Circuit board body and hanging structure golden finger, one end of the hanging structure golden finger are embedded in the circuit board body
In, the other end extends from a side wall of circuit board body, and the hanging structure golden finger includes multilayer, each layer of bag
At least one golden finger is included, the golden finger is gold-plated copper bar structure.
Therefore, the embodiment of the present invention is used presses golden finger copper mold block in multi-layer sheet, makes golden hand by controlled depth milling
The copper bar for referring to copper mold block extends out from multi-layer sheet plate ladder, and the technical scheme as hanging structure golden finger achieves following skill
Art effect：
Golden finger thickness design can be carried out according to the open height of connecting-disconnecting interface, and then meets different connecting-disconnecting interface plugs
Demand；Because golden finger is hanging structure, golden finger thickness is unrelated with circuit plate thickness, therefore suffered limitation is reduced, general
Property is stronger, it is not easy to cause the wasting of resources and cost.
When circuit board will realize multi-functional demand and increase thickness of slab, because golden finger is the standalone module of hanging structure,
Will not therefore it change, it is not necessary to change original connecting-disconnecting interface equipment, saved resource and cost；
When various sizes of connecting-disconnecting interface is needed with a circuit board, it is only necessary to increase or decrease the golden finger of implantation
Thickness, without changing circuit plate thickness, simple and convenient, highly versatile.
, only need to be at of the invention one without providing multiple corresponding circuit boards when same equipment has multiple interfaces
The golden finger of multiple hanging structures is designed on circuit board, thus the assembly space of product can be saved, cost and resource is reduced
Waste.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, below will be to institute in embodiment and description of the prior art
The accompanying drawing needed to use is briefly described, it should be apparent that, drawings in the following description are only some implementations of the present invention
Example, for those of ordinary skill in the art, on the premise of not paying creative work, can also be obtained according to these accompanying drawings
Obtain other accompanying drawings.
Fig. 1 is a kind of flow chart of the processing method of hanging structure golden finger provided in an embodiment of the present invention；
Fig. 2 a to 2g are the schematic diagrames in each stage using present invention method processing circuit board.
Embodiment
The embodiment of the present invention provides the processing method and circuit board of a kind of hanging structure golden finger, to solve existing golden hand
Refer to what circuit board was present, limitation is very strong, and versatility is very poor, is easily caused the technical problem of the wasting of resources and cost.
In order that those skilled in the art more fully understand the present invention program, below in conjunction with the embodiment of the present invention
Accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only
The embodiment of a part of the invention, rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill people
The every other embodiment that member is obtained under the premise of creative work is not made, should all belong to the model that the present invention is protected
Enclose.
Below by specific embodiment, it is described in detail respectively.
Embodiment one,
Fig. 1 is refer to, the embodiment of the present invention provides a kind of processing method of hanging structure golden finger, it may include：
110th, the golden finger copper mold block of multiple different-thickness is provided, the golden finger copper mold block includes copper coin area and from copper coin
At least copper bar that the side in area is extended, the copper bar is divided into the pressing for appearing area and remote copper coin area close to copper coin area
Area.
In the embodiment of the present invention, as shown in Figure 2 a, the golden finger copper mold block 20 includes copper to the golden finger copper mold block provided
Plate area 21 and at least copper bar 22 extended from copper coin area side, copper bar 22 can be divided into appears area 2201 close to copper coin area
With the pressing area 2202 away from copper coin area.In a kind of embodiment, the preparation method of the golden finger copper mold block 20 is as follows：Foundation is set
The open height of standby connecting-disconnecting interface, prepares the copper coin of respective thickness；Profile milling is worked out according to designed golden finger figure demand
Program, using milling machine by copper coin milling into pre-designed golden finger figure.
In the embodiment of the present invention, described copper bar 22 will subsequently turn into golden finger, and the pressing area 2202 of copper bar subsequently will be by
Multiple-plate internal layer is pressed together on, conducting and connection function is played；Copper bar appears area 2201 and will subsequently extended from multiple-plate side
Out, the golden finger as hanging structure；Described copper coin area 21 simply helps out in manufacturing process, on the one hand, can be with
Fixation is played, prevents many copper bars 22 (golden finger) position in bonding processes from offseting；On the one hand, due to connecting with golden finger
Connect, subsequently by the part as golden finger gold plated lead, for conduction, assist gold-plated to golden finger；After the completion of gold-plated, entirely
Controlled depth is milled and removed by copper coin area.
In order to meet the connecting-disconnecting interface of different-thickness, the embodiment of the present invention provides the copper coin of two or more different-thickness,
The golden finger copper mold block of multigroup different-thickness is made, to meet various sizes of connecting-disconnecting interface.
120th, multi-layer sheet is pressed, wherein, the multiple golden finger copper mold block is pressed on to the difference of the multilayer inner cord
Level, makes the copper coin area of the golden finger copper mold block and the area that appears of the copper bar be located at beyond multiple-plate shaping area.
As shown in Figure 2 b, this step middle level laminates conjunction multi-layer sheet, the multi-layer sheet may include at least one layer of internal layer circuit layer and
Two outer layers metal level, and the dielectric layer between each line layer and metal level.Wherein, golden finger copper mold block 20 is pressed
Together in the different levels of the internal layer of multi-layer sheet 30, and make the copper coin area 21 of the golden finger copper mold block 20 and showing for the copper bar 22
Reveal area 2201 to be located at beyond multiple-plate shaping area.Also, can be in the aobvious of the copper bar 22 in order to protect golden finger copper mold block 20
Reveal the two sides patch double faced adhesive tape 301 in area 2201, set in appear area and the copper coin area of having pasted double faced adhesive tape of the golden finger copper mold block 20
Put pad 302.Described pad can be the false core plate copper-clad plate of copper foil layer (be etched remove) or duroplasts or
Teflon etc..
In a kind of embodiment, as shown in Figure 2 b, the laminated construction of multi-layer sheet 30 includes：Positioned at middle double face copper
31, the two sides of the double face copper 31 has formed internal layer circuit；Two layer medium layer 32 positioned at double face copper two sides, the medium
Layer can be prepreg；It is located at two golden finger copper mold blocks 20 in two layer medium layer 32, and golden finger copper mold block position respectively
In the side of double face copper, only the pressing area 2202 of the copper bar of golden finger copper mold block and the location overlap of double face copper 31,
The other parts of golden finger copper mold block 20 are then located at beyond double face copper；The copper bars of two golden finger copper mold blocks appears area
Post between double faced adhesive tape 301, two golden finger copper mold blocks and be equipped with pad on the outer surface of golden finger copper mold block in two sides
Piece 302；The outermost layer of multi-layer sheet 30 is outer layer metal layer 33.The multi-layer sheet of pressing is as shown in Figure 2 c.
Design required for pad between two layers of golden finger copper mold block adds between the thickness of adhesive tape, equal to two layers golden finger
Difference in height, i.e., the vertical drop of two layers slotting of connecting-disconnecting interface of corresponding equipment；Pad above every layer of golden finger adds adhesive tape
Thickness >=0.1mm.The fixed bonding of pad a, part is bonded by adhesive tape, and a part depends on prepreg (the i.e. PP of dielectric layer
Piece) bond.The region corresponding to golden finger copper mold block 20 and pad 302 of dielectric layer 32 in multi-layer sheet 30 will be offered in advance
The groove of receiving.The dielectric layer 32 may include multilayer PP pieces, wherein, at least one layer of PP pieces near outer layer metal layer 33 should
For it is complete, the PP pieces of groove are not opened up, to play preferable bonding and iris action.
130th, one group of via hole, the via hole and the golden finger copper mold are processed beyond multiple-plate shaping area
The copper coin area connection of block.
As shown in Figure 2 d, this step is drill process.In this step, one group can be processed beyond the shaping area of multi-layer sheet 30
Via hole 34, the via hole 34 is connected with the copper coin area 21 of the golden finger copper mold block 20.It is by via hole 34 that outer layer is golden
Category floor 33 is connected with copper coin area 21 and copper bar 22 so that, subsequently can be by the use of outer layer metal layer 33 as electroplate lead wire, to copper bar
22 progress are gold-plated.
In this step, one group of plated-through hole 35, each metal can be also processed within the shaping area of the multi-layer sheet 30
Change through hole 35 to be connected with the pressing area of a copper bar 22.Make it that copper bar 22 (golden finger) can be with multi-layer sheet by plated-through hole 35
One or more layers line layer connection, realize circuit board function.
The step of processing via hole 34 and plated-through hole 35, includes：Through hole is first got out, then is metallized, i.e. is carried out
Heavy copper and plating.
140th, controlled depth milling, but the reservation golden finger copper mold block are carried out to the part beyond multiple-plate shaping area,
And the part multi-layer sheet in the copper coin area of preserving capital finger module, the part multi-layer sheet that the via hole retains positioned at the copper coin area
On.
As shown in Figure 2 e, first time milling profile is carried out to multi-layer sheet 30 in this step to operate.Including：To the multi-layer sheet 30
Shaping area beyond part carry out controlled depth milling, but retain the golden finger copper mold block 20, and the copper of preserving capital finger module 20
The part multi-layer sheet 36 in plate area 21, the via hole 34 is located at 36 on the part multi-layer sheet that the copper coin area retains.That is, using control
Deep miller skill by it is beyond the shaping area of the multi-layer sheet 30, corresponding to the copper bar 22 appear area 2201 part remove,
And remove the pad 302 and the double faced adhesive tape 301.Obtain structure as shown in Figure 2 e.
In concrete application, after the drilling step, carry out before the operation of first time milling profile, multi-layer sheet can be carried out first
Outer-layer circuit is processed, including：Using common process, outer-layer circuit is made on the surface of the multi-layer sheet 30, and described outer
Solder mask is set on sandwich circuit.
150th, the multiple-plate surface metal-layer in part using copper coin area reservation is electroplate lead wire, to the golden finger mould
The copper bar of block to appear area gold-plated.
Gold-plated to copper bar 22 in this step, make copper bar 22 appears area as required golden finger.When gold-plated, it can adopt
With the plating resist film such as adhesive tape, multiple-plate other region overlays are protected, that only exposes copper bar 22 appears area 2201；Then, with portion
The surface metal-layer 33 for dividing multi-layer sheet 36 is electroplate lead wire, and plating gold is carried out to the area 2201 that appears revealed.
160th, the non-copper bar part controlled depth milling beyond multiple-plate shaping area is removed so that the copper bar appears
Area turns into the golden finger of hanging structure, and the circuit board with hanging structure golden finger is made.
As shown in figure 2f, second of milling profile operation is carried out in this step.Will be non-beyond multiple-plate shaping area
Copper bar part controlled depth milling is removed, including：Controlled depth milling removes the copper coin area 21 and the copper coin area of the golden finger copper mold block 20
The part multi-layer sheet 36 of reservation, and the part gone between copper bar 22 unless each so that the copper bar 22 turns into the gold of hanging structure
Finger 37, is made the circuit board with hanging structure golden finger 37.Golden finger 37 can be protected with adhesive tape during controlled depth milling
Shield, controlled depth milling removes adhesive tape after terminating.
It is the top view of the final obtained circuit board with hanging structure golden finger 37 as shown in Figure 2 g.Can be with from Fig. 2 g
Find out, extend at least two layers golden finger 37 with different-thickness on a side of obtained circuit board, and each layer can
With multiple golden fingers 37.The golden finger thickness of same layer is identical, but the golden finger thickness of different layers can be differed.In same layer
The width of multiple golden fingers can be with identical, can also be different.
More than, the embodiments of the invention provide a kind of processing method of hanging structure golden finger, this method is used in multilayer
Golden finger copper mold block is pressed in plate, the copper bar for making golden finger copper mold block by controlled depth milling extends out from multi-layer sheet plate ladder, turned into
The technical scheme of hanging structure golden finger, achieves following technique effect：
Golden finger thickness design can be carried out by the open height according to connecting-disconnecting interface, and then meet different connecting-disconnecting interfaces
Plug demand；Because golden finger is hanging structure, golden finger thickness is unrelated with circuit plate thickness, therefore suffered limitation is reduced,
Versatility is stronger, it is not easy to cause the wasting of resources and cost.
When circuit board will realize multi-functional demand and increase thickness of slab, because golden finger is the standalone module of hanging structure,
Will not therefore it change, it is not necessary to change original connecting-disconnecting interface equipment, saved resource and cost；
When various sizes of connecting-disconnecting interface is needed with a circuit board, it is only necessary to increase or decrease the golden finger of implantation
Thickness, without changing circuit plate thickness, simple and convenient, highly versatile.
, only need to be at of the invention one without providing multiple corresponding circuit boards when same equipment has multiple interfaces
The golden finger of multiple hanging structures is designed on circuit board, thus the assembly space of product can be saved, cost and resource is reduced
Waste.
Embodiment two,
Fig. 2 f and 2g are refer to, the embodiment of the present invention provides a kind of circuit board with hanging structure golden finger, the circuit
Plate may include：
Circuit board body 30 and hanging structure golden finger 37, one end of the hanging structure golden finger 37 are embedded in the circuit
In plate body, the other end extends from the side of circuit board body, and the hanging structure golden finger includes multilayer, each layer
Including at least one golden finger 37, the golden finger 37 is gold-plated copper bar structure.
The circuit board body may include multilayer line layer, and each golden finger 37 can be by more described in plated-through hole 35
At least one layer in sandwich circuit layer is connected.
Circuit board provided in an embodiment of the present invention can be made using the method for embodiment one.More detailed description refer to implementation
Example one.
More than, the embodiments of the invention provide a kind of circuit board with hanging structure golden finger, achieve following technology
Effect：
Golden finger thickness design can be carried out by the open height according to connecting-disconnecting interface, and then meet different connecting-disconnecting interfaces
Plug demand；Because golden finger is hanging structure, golden finger thickness is unrelated with circuit plate thickness, therefore suffered limitation is reduced,
Versatility is stronger, it is not easy to cause the wasting of resources and cost.
When circuit board will realize multi-functional demand and increase thickness of slab, because golden finger is the standalone module of hanging structure,
Will not therefore it change, it is not necessary to change original connecting-disconnecting interface equipment, saved resource and cost；
When various sizes of connecting-disconnecting interface is needed with a circuit board, it is only necessary to increase or decrease the golden finger of implantation
Thickness, without changing circuit plate thickness, simple and convenient, highly versatile.
, only need to be at of the invention one without providing multiple corresponding circuit boards when same equipment has multiple interfaces
The golden finger of multiple hanging structures is designed on circuit board, thus the assembly space of product can be saved, cost and resource is reduced
Waste.
In the above-described embodiments, the description to each embodiment all emphasizes particularly on different fields, and is not described in some embodiment
Part, may refer to the associated description of other embodiments.
It should be noted that for foregoing each method embodiment, in order to be briefly described, therefore it is all expressed as a series of
Combination of actions, but those skilled in the art should know, the present invention is not limited by described sequence of movement because according to
According to the present invention, some steps can use other orders or carry out simultaneously.Secondly, those skilled in the art should also know,
Embodiment described in this description belongs to preferred embodiment, and not necessarily the present invention must for involved action and module
Must.
The processing method and circuit board of a kind of hanging structure golden finger provided above the embodiment of the present invention are carried out
It is discussed in detail, but the explanation of above example is only intended to the method and its core concept for helping to understand the present invention, should not be understood
For limitation of the present invention.Those skilled in the art, according to the present invention thought, the invention discloses technical scope
Change or replacement that are interior, can readily occurring in, should all be included within the scope of the present invention.
Claims (7)
1. a kind of processing method of hanging structure golden finger, it is characterised in that including：
The golden finger copper mold block of multiple different-thickness is provided, the golden finger copper mold block includes copper coin area and the side from copper coin area
At least copper bar extended, the copper bar is divided into close to the pressing area for appearing area and remote copper coin area in copper coin area；
Multi-layer sheet is pressed, wherein, the multiple golden finger copper mold block is pressed on to the different levels of the multilayer inner cord, makes institute
The copper coin area of golden finger copper mold block and the area that appears of the copper bar is stated to be located at beyond multiple-plate shaping area；
One group of via hole, the copper coin of the via hole and the golden finger copper mold block are processed beyond multiple-plate shaping area
Area is connected；
Controlled depth milling is carried out to the part beyond multiple-plate shaping area, but retains the golden finger copper mold block, and preserving capital
The part multi-layer sheet in the copper coin area of finger module, the via hole is located on the part multi-layer sheet that the copper coin area retains；
The multiple-plate surface metal-layer in part using copper coin area reservation is electroplate lead wire, to the copper bar of the golden finger module
To appear area gold-plated；
Non- copper bar part controlled depth milling beyond multiple-plate shaping area is removed so that the copper bar turns into hanging structure
Golden finger, is made the circuit board with hanging structure golden finger.
2. according to the method described in claim 1, it is characterised in that：
In the multiple-plate step of pressing, double faced adhesive tape is pasted on the two sides for appearing area of the copper bar, in the golden finger copper mold
Appear area and the copper coin area of having pasted double faced adhesive tape of block set pad.
3. according to the method described in claim 1, it is characterised in that：
In the step of processing one group of via hole beyond multiple-plate shaping area, also within multiple-plate shaping area
One group of plated-through hole is processed, each plated-through hole is connected with the pressing area of a copper bar.
4. according to the method described in claim 1, it is characterised in that the part beyond multiple-plate shaping area is controlled
Before deep milling, in addition to：
Outer-layer circuit is made on multiple-plate surface, and solder mask is set in the outer-layer circuit.
5. method according to claim 2, it is characterised in that controlled to the part beyond multiple-plate shaping area
Deep milling includes：
To progress controlled depth milling in the part for appearing area beyond multiple-plate shaping area, corresponding to the copper bar, but retain
The golden finger copper mold block, and remove the pad and the double faced adhesive tape.
6. a kind of circuit board with hanging structure golden finger, it is characterised in that using described in claim 1-5 any one
The processing method of hanging structure golden finger makes to be formed, and the circuit board with hanging structure golden finger includes：
Circuit board body and hanging structure golden finger, one end of the hanging structure golden finger are embedded in the circuit board body,
The other end extends from the side of circuit board body, and the hanging structure golden finger includes multilayer, and each layer is included at least
One golden finger, the golden finger is gold-plated copper bar structure.
7. circuit board according to claim 6, it is characterised in that：
The circuit board body includes multilayer line layer, and each golden finger passes through in multilayer line layer described in plated-through hole
At least one layer is connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410147958.3A CN104981109B (en) | 2014-04-14 | 2014-04-14 | The processing method and circuit board of hanging structure golden finger |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410147958.3A CN104981109B (en) | 2014-04-14 | 2014-04-14 | The processing method and circuit board of hanging structure golden finger |
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| CN104981109A CN104981109A (en) | 2015-10-14 |
| CN104981109B true CN104981109B (en) | 2017-10-10 |
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| CN201410147958.3A Active CN104981109B (en) | 2014-04-14 | 2014-04-14 | The processing method and circuit board of hanging structure golden finger |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113708112B (en) * | 2021-07-30 | 2023-07-14 | 苏州浪潮智能科技有限公司 | Board ladder connection structure and signal connector |
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| US5444188A (en) * | 1992-01-14 | 1995-08-22 | Nippon Mektron, Ltd. | Flexible circuit wiring board and method of producing the same |
| US5929375A (en) * | 1996-05-10 | 1999-07-27 | Ford Motor Company | EMI protection and CTE control of three-dimensional circuitized substrates |
| CN101441905A (en) * | 2008-11-19 | 2009-05-27 | 达昌电子科技(苏州)有限公司 | Flexible line-arranging method and structure thereof |
| TW201218900A (en) * | 2010-10-25 | 2012-05-01 | Yazaki Corp | Method of manufacturing wiring substrate |
| CN202269097U (en) * | 2011-09-30 | 2012-06-06 | 东莞市五株电子科技有限公司 | Printed circuit board and electronic device |
| CN103153000A (en) * | 2013-02-01 | 2013-06-12 | 东莞生益电子有限公司 | Manufacture method for gold finger circuit board and circuit board manufactured by method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0837380A (en) * | 1994-07-21 | 1996-02-06 | Hitachi Chem Co Ltd | Multilayred wiring board with terminal |
| US6674644B2 (en) * | 2001-11-01 | 2004-01-06 | Sun Microsystems, Inc. | Module and connector having multiple contact rows |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5444188A (en) * | 1992-01-14 | 1995-08-22 | Nippon Mektron, Ltd. | Flexible circuit wiring board and method of producing the same |
| US5929375A (en) * | 1996-05-10 | 1999-07-27 | Ford Motor Company | EMI protection and CTE control of three-dimensional circuitized substrates |
| CN101441905A (en) * | 2008-11-19 | 2009-05-27 | 达昌电子科技(苏州)有限公司 | Flexible line-arranging method and structure thereof |
| TW201218900A (en) * | 2010-10-25 | 2012-05-01 | Yazaki Corp | Method of manufacturing wiring substrate |
| CN202269097U (en) * | 2011-09-30 | 2012-06-06 | 东莞市五株电子科技有限公司 | Printed circuit board and electronic device |
| CN103153000A (en) * | 2013-02-01 | 2013-06-12 | 东莞生益电子有限公司 | Manufacture method for gold finger circuit board and circuit board manufactured by method |
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| CN104981109A (en) | 2015-10-14 |
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