CN104981109A - Processing method of suspension-structure gold finger, and circuit board - Google Patents
Processing method of suspension-structure gold finger, and circuit board Download PDFInfo
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- CN104981109A CN104981109A CN201410147958.3A CN201410147958A CN104981109A CN 104981109 A CN104981109 A CN 104981109A CN 201410147958 A CN201410147958 A CN 201410147958A CN 104981109 A CN104981109 A CN 104981109A
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Abstract
The invention discloses a processing method of a suspension-structure gold finger, and a circuit board, for solving the technical problems of quite high restrictions, very poor versatility and high proneness to waste of resources and increase of the cost existing in a conventional gold finger circuit board. The method comprises the following steps: providing multiple gold finger copper modules with different thicknesses; pressing a multilayer board, wherein the multiple g gold finger copper modules are pressed at different levels of the internal layer of the multilayer board; processing a group of conduction holes outside a formation area of the multilayer board, wherein the conduction holes are connected with copper board areas of the gold finger copper modules; removing the portion apart from the formation area of the multilayer board through controlled depth milling yet reserving the gold finger copper modules; gilding copper bars of the gold finger modules; and processing the non copper bar portion apart from the formation area of the multilayer board through controlled depth milling so as to enable the copper bars to be the gold fingers of suspension structures.
Description
Technical field
The present invention relates to circuit board technology field, be specifically related to a kind of processing method and circuit board of hanging structure golden finger.
Background technology
At present, printed circuit board (PCB) (PCB) plate of band golden finger, its structural design generally adopts the mode related to by golden finger within shaping area, wiring board top layer.And the golden finger of plug function is provided, should mate with the size of connecting-disconnecting interface, the thickness of golden finger circuit board should be consistent with the open height of connecting-disconnecting interface, and when the open height of connecting-disconnecting interface is fixed, therefore the circuit board thickness at golden finger place also just fixed.
When golden finger circuit board will realize multi-functional demand and need to increase thickness of slab, then supporting connecting-disconnecting interface equipment will do whole conversion, very wastes resource and cost; Golden finger circuit board is fixed due to thickness, can not be applied to the connecting-disconnecting interface of different size, cause the versatility of golden finger circuit board very poor; When same equipment has multiple connecting-disconnecting interface, the golden finger circuit board of multiple corresponding thickness must be designed, the assembly space of product can be affected, and cause the wasting of resources and cost.
To sum up, existing golden finger circuit board, limitation is very strong, and versatility is very poor, easily causes the wasting of resources and cost.
Summary of the invention
The embodiment of the present invention provides a kind of processing method and circuit board of hanging structure golden finger, and to solve, existing golden finger circuit board exists, and limitation is very strong, and versatility is very poor, easily causes the technical problem of the wasting of resources and cost.
First aspect present invention provides a kind of processing method of hanging structure golden finger, can comprise:
There is provided the golden finger copper mold block of multiple different-thickness, at least one copper bar that described golden finger copper mold block comprises copper coin district and extends from the side in copper coin district, described copper bar be divided near copper coin district appear district and the pressing district away from copper coin district;
Pressing multi-layer sheet, wherein, is pressed on the different levels of described multi-layer sheet internal layer by described multiple golden finger copper mold block, make the district that appears of the copper coin district of described golden finger copper mold block and described copper bar be positioned at beyond multiple-plate shaping area;
Beyond described multiple-plate shaping area, process one group of via, described via is connected with the copper coin district of described golden finger copper mold block;
Dark milling is controlled to the part beyond described multiple-plate shaping area, but retains described golden finger copper mold block, and the part multi-layer sheet in the copper coin district of preserving capital finger module, described via is positioned on the part multi-layer sheet of described copper coin block reservation;
With the multiple-plate surface metal-layer of part of described copper coin block reservation for electroplate lead wire, to the copper bar of described golden finger module to appear district gold-plated;
Non-copper bar part control beyond described multiple-plate shaping area is milled deeply and removes, make described copper bar become the golden finger of hanging structure, the obtained circuit board with hanging structure golden finger.
Second aspect present invention provides a kind of circuit board with hanging structure golden finger, can comprise:
Circuit board body and hanging structure golden finger, one end of described hanging structure golden finger embeds in described circuit board body, the other end extends from a sidewall of circuit board body, and described hanging structure golden finger comprises multilayer, every one deck comprises at least one golden finger, and described golden finger is gold-plated copper bar structure.
Therefore the embodiment of the present invention adopts pressing golden finger copper mold block in multi-layer sheet, making the copper bar of golden finger copper mold block extend out from multi-layer sheet plate ladder, becoming the technical scheme of hanging structure golden finger, achieving following technique effect by controlling dark milling:
Golden finger Thickness Design can be carried out according to the open height of connecting-disconnecting interface, and then meet different connecting-disconnecting interface plug demand; Because golden finger is hanging structure, golden finger thickness and circuit board thickness have nothing to do, and therefore suffered limitation is reduced, and versatility is comparatively strong, is not easy to cause the wasting of resources and cost.
When circuit board will realize multi-functional demand and increase thickness of slab, because golden finger is the standalone module of hanging structure, therefore can not change, original connecting-disconnecting interface equipment need not be changed, saved resource and cost;
When the connecting-disconnecting interface of different size needs with during with a circuit board, only need the thickness increasing or reduce the golden finger implanted, without the need to changing circuit board thickness, simple and convenient, highly versatile.
When same equipment has multiple interface, the circuit board of multiple correspondence need not be provided, only need design the golden finger of multiple hanging structure on a circuit board of the present invention, thus can save the assembly space of product, reduce the waste of cost and resource.
Accompanying drawing explanation
In order to be illustrated more clearly in embodiment of the present invention technical scheme, be briefly described to the accompanying drawing used required in embodiment and description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the flow chart of the processing method of a kind of hanging structure golden finger that the embodiment of the present invention provides;
Fig. 2 a to 2g is the schematic diagram in each stage adopting embodiment of the present invention method processing circuit board.
Embodiment
The embodiment of the present invention provides a kind of processing method and circuit board of hanging structure golden finger, and to solve, existing golden finger circuit board exists, and limitation is very strong, and versatility is very poor, easily causes the technical problem of the wasting of resources and cost.
The present invention program is understood better in order to make those skilled in the art person, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the embodiment of a part of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, should belong to the scope of protection of the invention.
Below by specific embodiment, be described in detail respectively.
Embodiment one,
Please refer to Fig. 1, the embodiment of the present invention provides a kind of processing method of hanging structure golden finger, can comprise:
110, provide the golden finger copper mold block of multiple different-thickness, at least one copper bar that described golden finger copper mold block comprises copper coin district and extends from the side in copper coin district, described copper bar be divided near copper coin district appear district and the pressing district away from copper coin district.
In the embodiment of the present invention, the golden finger copper mold block provided as shown in Figure 2 a, at least one copper bar 22 that this golden finger copper mold block 20 comprises copper coin district 21 and extends from side, copper coin district, copper bar 22 can be divided near copper coin district appear district 2201 and the pressing district 2202 away from copper coin district.In a kind of execution mode, the manufacture method of this golden finger copper mold block 20 is as follows: according to the open height of equipment connecting-disconnecting interface, prepares the copper coin of respective thickness; According to the golden finger figure demand establishment profile milling program designed, adopt milling machine that copper coin milling is become pre-designed golden finger figure.
In the embodiment of the present invention, described copper bar 22 is follow-up will become golden finger, and the pressing district 2202 of copper bar is follow-up will be pressed together on multiple-plate internal layer, play conducting and connection function; Copper bar appear that district 2201 is follow-up will extend out from multiple-plate side, become the golden finger of hanging structure; Described copper coin district 21 just helps out in manufacturing process, on the one hand, can play fixation, prevents many copper bars 22(golden finger) move in the offset of bonding processes meta; On the one hand, owing to being connected with golden finger, follow-uply will become a part for golden finger gold plated lead, be used for conduction, assist golden finger gold-plated; Gold-plated complete after, controlled deeply milling is removed by whole copper coin district.
In order to meet the connecting-disconnecting interface of different-thickness, the embodiment of the present invention provides the copper coin of two or more different-thickness, makes the golden finger copper mold block of many group different-thickness, to meet the connecting-disconnecting interface of different size.
120, pressing multi-layer sheet, wherein, is pressed on the different levels of described multi-layer sheet internal layer, the copper coin district of described golden finger copper mold block and the district that appears of described copper bar is positioned at beyond multiple-plate shaping area by described multiple golden finger copper mold block.
As shown in Figure 2 b, this step middle level laminates conjunction multi-layer sheet, and this multi-layer sheet can comprise at least one deck internal layer circuit layer and two outer layers metal level, and the dielectric layer between each line layer and metal level.Wherein, golden finger copper mold block 20 is pressed on the different levels of multi-layer sheet 30 internal layer, and the copper coin district 21 of described golden finger copper mold block 20 and the district 2201 that appears of described copper bar 22 are positioned at beyond multiple-plate shaping area.Further, in order to protect golden finger copper mold block 20, double faced adhesive tape 301 can be pasted on the two sides appearing district 2201 of described copper bar 22, pad 302 is set in appear district and the copper coin district of pasting double faced adhesive tape of described golden finger copper mold block 20.Said pad can be false central layer (namely being removed the copper-clad plate of copper foil layer by etching) or duroplasts or Teflon etc.
In a kind of execution mode, as shown in Figure 2 b, the laminated construction of multi-layer sheet 30 comprises: be positioned at middle double face copper 31, the two sides of this double face copper 31 forms internal layer circuit; Be positioned at the two layer medium layer 32 on double face copper two sides, this dielectric layer can be prepreg; Lay respectively at two golden finger copper mold blocks 20 in two layer medium layer 32, and golden finger copper mold block is positioned at the side of double face copper, only have pressing district 2202 and double face copper 31 location overlap of the copper bar of golden finger copper mold block, the other parts of golden finger copper mold block 20 are then positioned at beyond double face copper; Double faced adhesive tape 301 is all posted on the two sides appearing district of the copper bar of two golden finger copper mold blocks, is equipped with pad 302 between two golden finger copper mold blocks and on the outer surface of golden finger copper mold block; The outermost layer of multi-layer sheet 30 is outer layer metal layers 33.The multi-layer sheet of pressing as shown in Figure 2 c.
Pad between two-layer golden finger copper mold block adds the thickness of adhesive tape, equals the difference in height of required design between two-layer golden finger, the vertical drop of the two-layer connecting-disconnecting interface that equipment is inserted namely; Pad above every layer of golden finger adds the thickness >=0.1mm of adhesive tape.The fixing bonding of pad, a part is by adhesive tape bonding, and a part bonds by the prepreg (i.e. PP sheet) of dielectric layer.The region corresponding to golden finger copper mold block 20 and pad 302 of the dielectric layer 32 in multi-layer sheet 30 will offer the groove held in advance.This dielectric layer 32 can comprise multilayer PP sheet, and wherein, at least one deck PP sheet near outer layer metal layer 33 should be PP sheet that is complete, that do not offer groove, to play bonding and iris action preferably.
130, beyond described multiple-plate shaping area, process one group of via, described via is connected with the copper coin district of described golden finger copper mold block.
As shown in Figure 2 d, this step is drill process.In this step, can process one group of via 34 beyond the shaping area of multi-layer sheet 30, described via 34 is connected with the copper coin district 21 of described golden finger copper mold block 20.Be connected with copper coin district 21 and copper bar 22 by outer layer metal layer 33 by via 34, make, the follow-up outer layer metal layer 33 that can utilize, as electroplate lead wire, carries out gold-plated to copper bar 22.
In this step, also can process one group of plated-through hole 35 within the shaping area of described multi-layer sheet 30, each plated-through hole 35 is connected with the pressing district of a copper bar 22.Copper bar 22(golden finger is made by plated-through hole 35) can be connected with one or more layers line layer multiple-plate, realizing circuit plate function.
The step of processing via 34 and plated-through hole 35 comprises: first get out through hole, then metallize, that is, carry out heavy copper and plating.
140, dark milling is controlled to the part beyond described multiple-plate shaping area, but retain described golden finger copper mold block, and the part multi-layer sheet in the copper coin district of preserving capital finger module, described via is positioned on the part multi-layer sheet of described copper coin block reservation.
As shown in Figure 2 e, in this step, the operation of first time milling profile is carried out to multi-layer sheet 30.Comprise: dark milling is controlled to the part beyond the shaping area of described multi-layer sheet 30, but retain described golden finger copper mold block 20, and the part multi-layer sheet 36 in the copper coin district 21 of preserving capital finger module 20, on the part multi-layer sheet that described via 34 is positioned at described copper coin block reservation 36.That is, adopt the dark miller skill of control by beyond the shaping area of described multi-layer sheet 30, remove corresponding to the part appearing district 21 of described copper bar 22, and remove described pad 302 and described double faced adhesive tape 301.Obtain structure as shown in Figure 2 e.
In embody rule, after the drilling step, before carrying out the operation of first time milling profile, first outer-layer circuit processing can be carried out to multi-layer sheet, comprise: adopt common process, make outer-layer circuit on the surface of described multi-layer sheet 30, and solder mask is set in described outer-layer circuit.
150, with the multiple-plate surface metal-layer of part of described copper coin block reservation for electroplate lead wire, to the copper bar of described golden finger module to appear district gold-plated.
In this step, gold-plated to copper bar 22, what make copper bar 22 appears the golden finger that district becomes required.Time gold-plated, can adopt the plating resist films such as adhesive tape, by multiple-plate other region overlay protection, that enters to expose copper bar 22 appears district 2201; Then, with the surface metal-layer 33 of part multi-layer sheet 36 for electroplate lead wire, electrogilding is carried out to the district 2201 that appears revealed.
160, the non-copper bar part control beyond described multiple-plate shaping area deeply milled and remove, what make described copper bar appears the golden finger that district becomes hanging structure, the obtained circuit board with hanging structure golden finger.
As shown in figure 2f, the operation of second time milling profile is carried out in this step.Non-copper bar part control beyond described multiple-plate shaping area is milled deeply and removes, comprise: the part multi-layer sheet 36 controlling copper coin the district 21 and described copper coin block reservation deeply milled except described golden finger copper mold block 20, and the part removed between each copper bar 22, described copper bar 22 is made to become the golden finger 37 of hanging structure, the obtained circuit board with hanging structure golden finger 37.Control available adhesive tape in dark milling process to protect golden finger 37, control after dark milling terminates and adhesive tape is removed.
The final obtained vertical view with the circuit board of hanging structure golden finger 37 as shown in Figure 2 g.As can be seen from Fig. 2 g, at least two-layer golden finger 37 with different-thickness is extended in a side of obtained circuit board, and every one deck can have multiple golden finger 37.The golden finger thickness of same layer is identical, but the golden finger thickness of different layers can not be identical.In same layer, the width of multiple golden finger can be identical, also can be different.
Above, embodiments provide a kind of processing method of hanging structure golden finger, the method adopts pressing golden finger copper mold block in multi-layer sheet, by controlling dark milling, the copper bar of golden finger copper mold block is extended out from multi-layer sheet plate ladder, become the technical scheme of hanging structure golden finger, achieve following technique effect:
Carry out golden finger Thickness Design by the open height according to connecting-disconnecting interface, and then meet different connecting-disconnecting interface plug demand; Because golden finger is hanging structure, golden finger thickness and circuit board thickness have nothing to do, and therefore suffered limitation is reduced, and versatility is comparatively strong, is not easy to cause the wasting of resources and cost.
When circuit board will realize multi-functional demand and increase thickness of slab, because golden finger is the standalone module of hanging structure, therefore can not change, original connecting-disconnecting interface equipment need not be changed, saved resource and cost;
When the connecting-disconnecting interface of different size needs with during with a circuit board, only need the thickness increasing or reduce the golden finger implanted, without the need to changing circuit board thickness, simple and convenient, highly versatile.
When same equipment has multiple interface, the circuit board of multiple correspondence need not be provided, only need design the golden finger of multiple hanging structure on a circuit board of the present invention, thus can save the assembly space of product, reduce the waste of cost and resource.
Embodiment two,
Please refer to Fig. 2 f and 2g, the embodiment of the present invention provides a kind of circuit board with hanging structure golden finger, and this circuit board can comprise:
Circuit board body 30 and hanging structure golden finger 37, one end of described hanging structure golden finger 37 embeds in described circuit board body, the other end extends from the side of circuit board body, and described hanging structure golden finger comprises multilayer, every one deck comprises at least one golden finger 37, and described golden finger 37 is gold-plated copper bar structure.
Described circuit board body can comprise multilayer line layer, and each golden finger 37 is connected by least one deck in multilayer line layer described in plated-through hole 35.
The circuit board that the embodiment of the present invention provides can adopt embodiment one method to obtain.More detailed description please refer to embodiment one.
Above, embodiments provide a kind of circuit board with hanging structure golden finger, achieve following technique effect:
Carry out golden finger Thickness Design by the open height according to connecting-disconnecting interface, and then meet different connecting-disconnecting interface plug demand; Because golden finger is hanging structure, golden finger thickness and circuit board thickness have nothing to do, and therefore suffered limitation is reduced, and versatility is comparatively strong, is not easy to cause the wasting of resources and cost.
When circuit board will realize multi-functional demand and increase thickness of slab, because golden finger is the standalone module of hanging structure, therefore can not change, original connecting-disconnecting interface equipment need not be changed, saved resource and cost;
When the connecting-disconnecting interface of different size needs with during with a circuit board, only need the thickness increasing or reduce the golden finger implanted, without the need to changing circuit board thickness, simple and convenient, highly versatile.
When same equipment has multiple interface, the circuit board of multiple correspondence need not be provided, only need design the golden finger of multiple hanging structure on a circuit board of the present invention, thus can save the assembly space of product, reduce the waste of cost and resource.
In the above-described embodiments, the description of each embodiment is all emphasized particularly on different fields, in certain embodiment, there is no the part described in detail, can see the associated description of other embodiment.
It should be noted that, for aforesaid each embodiment of the method, in order to simple description, therefore it is all expressed as a series of combination of actions, but those skilled in the art should know, the present invention is not by the restriction of described sequence of movement, because according to the present invention, some step can adopt other order or carry out simultaneously.Secondly, those skilled in the art also should know, the embodiment described in specification all belongs to preferred embodiment, and involved action and module might not be that the present invention is necessary.
Above the processing method of a kind of hanging structure golden finger that the embodiment of the present invention provides and circuit board are described in detail, but the explanation of above embodiment just understands method of the present invention and core concept thereof for helping, and should not be construed as limitation of the present invention.Those skilled in the art, according to thought of the present invention, in the technical scope that the present invention discloses, the change that can expect easily or replacement, all should be encompassed within protection scope of the present invention.
Claims (7)
1. a processing method for hanging structure golden finger, is characterized in that, comprising:
There is provided the golden finger copper mold block of multiple different-thickness, at least one copper bar that described golden finger copper mold block comprises copper coin district and extends from the side in copper coin district, described copper bar be divided near copper coin district appear district and the pressing district away from copper coin district;
Pressing multi-layer sheet, wherein, is pressed on the different levels of described multi-layer sheet internal layer by described multiple golden finger copper mold block, make the district that appears of the copper coin district of described golden finger copper mold block and described copper bar be positioned at beyond multiple-plate shaping area;
Beyond described multiple-plate shaping area, process one group of via, described via is connected with the copper coin district of described golden finger copper mold block;
Dark milling is controlled to the part beyond described multiple-plate shaping area, but retains described golden finger copper mold block, and the part multi-layer sheet in the copper coin district of preserving capital finger module, described via is positioned on the part multi-layer sheet of described copper coin block reservation;
With the multiple-plate surface metal-layer of part of described copper coin block reservation for electroplate lead wire, to the copper bar of described golden finger module to appear district gold-plated;
Non-copper bar part control beyond described multiple-plate shaping area is milled deeply and removes, make described copper bar become the golden finger of hanging structure, the obtained circuit board with hanging structure golden finger.
2. method according to claim 1, is characterized in that:
In the multiple-plate step of described pressing, paste double faced adhesive tape on the two sides appearing district of described copper bar, pad is set in appear district and the copper coin district of pasting double faced adhesive tape of described golden finger copper mold block.
3. method according to claim 1, is characterized in that:
Process beyond described multiple-plate shaping area in the step of one group of via, also within described multiple-plate shaping area, process one group of plated-through hole, each plated-through hole is connected with the pressing district of a copper bar.
4. method according to claim 1, is characterized in that, before controlling dark milling, also comprises the part beyond described multiple-plate shaping area:
Make outer-layer circuit on described multiple-plate surface, and solder mask is set in described outer-layer circuit.
5. method according to claim 2, is characterized in that, controls dark milling comprise the part beyond described multiple-plate shaping area:
To beyond described multiple-plate shaping area, control dark milling corresponding to the part appearing district of described copper bar, but retain described golden finger copper mold block, and remove described pad and described double faced adhesive tape.
6. there is a circuit board for hanging structure golden finger, it is characterized in that, comprising:
Circuit board body and hanging structure golden finger, one end of described hanging structure golden finger embeds in described circuit board body, the other end extends from the side of circuit board body, and described hanging structure golden finger comprises multilayer, every one deck comprises at least one golden finger, and described golden finger is gold-plated copper bar structure.
7. circuit board according to claim 6, is characterized in that:
Described circuit board body comprises multilayer line layer, and each golden finger is connected by least one deck in multilayer line layer described in plated-through hole.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410147958.3A CN104981109B (en) | 2014-04-14 | 2014-04-14 | The processing method and circuit board of hanging structure golden finger |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410147958.3A CN104981109B (en) | 2014-04-14 | 2014-04-14 | The processing method and circuit board of hanging structure golden finger |
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| CN104981109A true CN104981109A (en) | 2015-10-14 |
| CN104981109B CN104981109B (en) | 2017-10-10 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113708112A (en) * | 2021-07-30 | 2021-11-26 | 苏州浪潮智能科技有限公司 | Board card ladder connection structure and signal connector |
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| CN104981109B (en) | 2017-10-10 |
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Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
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