CN109379840A - A kind of processing method and circuit board of hanging golden finger - Google Patents
A kind of processing method and circuit board of hanging golden finger Download PDFInfo
- Publication number
- CN109379840A CN109379840A CN201811236641.1A CN201811236641A CN109379840A CN 109379840 A CN109379840 A CN 109379840A CN 201811236641 A CN201811236641 A CN 201811236641A CN 109379840 A CN109379840 A CN 109379840A
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- CN
- China
- Prior art keywords
- golden finger
- plate
- circuit board
- copper
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Abstract
The technical issues of the invention discloses the processing methods and circuit board of a kind of hanging golden finger, and to solve existing for existing golden finger circuit board, limitation is very strong, and versatility is very poor, are easy to cause the wasting of resources and cost.Method includes: that the golden finger copper-clad plate with golden finger figure is pressed on multiple-plate internal layer；One group of via hole is processed other than multiple-plate shaping area, the via hole is connected by the big copper sheet in the golden finger copper-clad plate with the golden finger figure；Controlled depth milling manifests the golden finger figure；It is gold-plated to the golden finger figure；By the non-golden finger visuals controlled depth milling removal other than multiple-plate shaping area, golden finger is formed, the circuit board with hanging structure golden finger is made.
Description
Technical field
The present invention relates to circuit board technology fields, and in particular to a kind of processing method and circuit board of hanging golden finger.
Background technique
Currently, printed circuit board (PCB) plate with golden finger, structure, which designs to generally use, is related to golden finger online
Mode within the shaping area of road plate surface layer.And the golden finger of plug function is provided, it should be matched with the size of connecting-disconnecting interface, golden finger
The thickness of circuit board should be consistent with the open height of connecting-disconnecting interface, when the open height of connecting-disconnecting interface is fixed, golden finger
The circuit plate thickness at place is also just therefore fixed.
When golden finger circuit board will realize multi-functional demand and need to increase plate thickness, then matched connecting-disconnecting interface equipment
Do whole transformation, very waste of resource and cost；Golden finger circuit board may not apply to various sizes of since thickness is fixed
Connecting-disconnecting interface causes the versatility of golden finger circuit board very poor；When same equipment has multiple connecting-disconnecting interfaces, it is necessary to design multiple
The golden finger circuit board of corresponding thickness, will affect the assembly space of product, and lead to the wasting of resources and cost.
To sum up, existing golden finger circuit board, limitation is very strong, and versatility is very poor, is easy to cause the wasting of resources and cost
It is promoted.
Summary of the invention
The embodiment of the present invention provides the processing method and circuit board of a kind of hanging golden finger, to solve existing golden hand
The technical issues of referring to that limitation is very strong, and versatility is very poor existing for circuit board, being easy to cause the wasting of resources and cost.
First aspect present invention provides a kind of processing method of hanging golden finger, it may include:
Golden finger copper-clad plate is provided, the golden finger area of golden finger copper-clad plate one end have multiple golden finger figures and
Big copper sheet, the golden finger figure are divided into the pressing area for appearing area and the separate big copper sheet being connected with the big copper sheet,
The non-golden finger area of the golden finger copper-clad plate has line pattern；
Press multi-layer board, wherein the golden finger copper-clad plate is pressed on multiple-plate internal layer, makes the golden finger
Figure appear area and the big copper sheet is located at other than multiple-plate shaping area；
One group of via hole is processed other than multiple-plate shaping area, on the via hole and the golden finger copper-clad plate
Big copper sheet connection；
Controlled depth milling is carried out to multiple-plate part corresponding to the golden finger figure, manifests the golden finger figure
Shape；
The multiple-plate surface metal-layer in part retained using the big copper sheet region is electroplate lead wire, to the golden finger figure
Shape is gold-plated；
By the non-golden finger visuals controlled depth milling removal other than multiple-plate shaping area, formation extends described more
The circuit board with hanging golden finger is made in multiple golden fingers other than the ontology of laminate.
Second aspect of the present invention provides a kind of circuit board with hanging golden finger, it may include:
One end of circuit board body and at least one hanging golden finger, the hanging golden finger is embedded in the circuit board body
In, the other end extends from a side wall of the circuit board body, and the golden finger is gold-plated structure for covering copper plate.
Therefore the golden finger copper-clad plate with golden finger figure is pressed in multi-layer board by use of the embodiment of the present invention
Layer, and controlled depth milling manifests golden finger figure so as to gold-plated, last controlled depth milling processes the technical solution of hanging golden finger, obtains
Following technical effect:
Golden finger thickness design can be carried out according to the open height of connecting-disconnecting interface, and then meet different connecting-disconnecting interface plugs
Demand；Since golden finger is hanging structure, golden finger thickness is unrelated with circuit plate thickness, therefore suffered limitation is reduced, general
Property is stronger, it is not easy to lead to the wasting of resources and cost.
When circuit board will realize multi-functional demand and increase plate thickness, since golden finger is the standalone module of hanging structure,
It will not therefore change, it is not necessary to change original connecting-disconnecting interface equipment, save resource and cost；
When various sizes of connecting-disconnecting interface is needed with a circuit board, it is only necessary to increase or decrease the golden finger of implantation
Thickness, it is simple and convenient without changing circuit plate thickness, it is versatile.
When same equipment there are multiple interfaces, do not have to provide multiple corresponding circuit boards, it only need to be at of the invention one
The golden finger of multiple hanging structures is designed on circuit board, thus can save the assembly space of product, reduces cost and resource
Waste.
Detailed description of the invention
Technical solution in order to illustrate the embodiments of the present invention more clearly, below will be to institute in embodiment and description of the prior art
Attached drawing to be used is needed to be briefly described, it should be apparent that, the accompanying drawings in the following description is only some implementations of the invention
Example, for those of ordinary skill in the art, without creative efforts, can also obtain according to these attached drawings
Obtain other attached drawings.
Fig. 1 is a kind of flow chart of the processing method of hanging structure golden finger provided in an embodiment of the present invention；
Fig. 2 a to 2e is the schematic diagram using each stage of present invention method processing circuit board.
Specific embodiment
The embodiment of the present invention provides the processing method and circuit board of a kind of hanging golden finger, to solve existing golden hand
The technical issues of referring to that limitation is very strong, and versatility is very poor existing for circuit board, being easy to cause the wasting of resources and cost.
In order to enable those skilled in the art to better understand the solution of the present invention, below in conjunction in the embodiment of the present invention
Attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is only
The embodiment of a part of the invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill people
The model that the present invention protects all should belong in member's every other embodiment obtained without making creative work
It encloses.
Below by specific embodiment, it is described in detail respectively.
Embodiment one,
Referring to FIG. 1, the embodiment of the present invention provides a kind of processing method of hanging golden finger, it may include:
110, golden finger copper-clad plate is provided, the golden finger area of golden finger copper-clad plate one end has multiple golden finger figures
Shape and big copper sheet, the golden finger figure are divided into the pressing for appearing area and the separate big copper sheet being connected with the big copper sheet
The non-golden finger area in area, the golden finger copper-clad plate has line pattern.
In the embodiment of the present invention, provided golden finger copper-clad plate is as shown in Figure 2 a, during which includes
Between dielectric and two sides metal layer, one end design have golden finger area, the metal layer of golden finger area is processed into
Multiple golden finger figures 203 and the big copper sheet 204 being connected with multiple golden finger figures, the metal layer other than golden finger area is then
It is processed into line pattern 202.Golden finger figure 203, which can be divided into, appears area 2031 and far from big copper sheet close to big copper sheet 204
204 pressing area 2302.In a kind of embodiment, the golden finger copper-clad plate 20 the production method is as follows: is connect according to equipment plug
The open height of mouth, prepares the copper-clad plate of respective thickness；According to designed golden finger figure and line pattern, carries out figure and turn
It moves and etches, process the golden finger figure 203 needed and the big copper sheet being connected with multiple golden finger figures in golden finger area
204, line pattern required for going out in other region processings.In preferred embodiment, golden finger copper-clad plate is double face copper, and
The golden finger figure on two sides is identical symmetrical.
In the embodiment of the present invention, the golden finger figure 203 appears that area is subsequent will to be revealed in except multi-layer board ontology
As golden finger, area is subsequent will be pressed together on multiple-plate internal layer for pressing, plays conducting and connection function；The big copper sheet 204
Only help out in manufacturing process, due to being connect with golden finger figure, subsequent one by as golden finger gold plated lead
Point, it is used to conduction, assists gold-plated to golden finger figure；After the completion of gold-plated, entire big 204 region of copper sheet, which mills controlled depth, is removed.
120, multi-layer board is pressed, wherein the golden finger copper-clad plate is pressed on multiple-plate internal layer, makes the gold
Finger figure appear area and the big copper sheet is located at other than multiple-plate shaping area.
As shown in Figure 2 b, this step middle layer, which laminates, closes multi-layer board 30, which may include that described golden finger covers copper
Plate 20, and it is layered in other line layers and dielectric layer and outer layer metal on the outermost side on golden finger copper-clad plate two sides
Layer 33.Wherein, make the major part of the golden finger area of the golden finger copper-clad plate 20, that is, golden finger figure 203 appear area and
Big copper sheet 204, is located at other than multiple-plate shaping area, the pressing area of golden finger figure 203 is then located within shaping area.Also,
It, can be in the double spreading band 301 of the golden finger figure 203, in the golden finger figure 203 taped in order to protect golden finger
Gasket 302 is set.Described gasket can be the false core plate copper-clad plate of copper foil layer (be etched removal) or duroplasts or
Person's Teflon etc..Described adhesive tape 301 can be double-sided adhesive.
The gasket of golden finger figure one side adds thickness >=0.1mm of adhesive tape.The fixed bonding of gasket, a part lean on glue
Band bonding, a part are bonded by the prepreg (i.e. PP piece) of dielectric layer.Dielectric layer may include multilayer PP piece, the correspondence of dielectric layer
It can slot in advance in the position of gasket 302, to accommodate gasket 302.
130, one group of via hole is processed other than multiple-plate shaping area, the via hole and the golden finger cover copper
Big copper sheet connection on plate.
Still as shown in Figure 2 b, this step is drill process.In this step, one can be processed other than the shaping area of multi-layer board 30
Group via hole 34, the via hole 34 are connect with the big copper sheet 204 of the golden finger copper-clad plate 20.By via hole 34 by outer layer
Metal layer 33 is connect with big copper sheet 204 and golden finger figure 203, so that, the subsequent outer layer metal layer 33 that can use is as plating
Lead carries out golden finger figure 203 gold-plated.
In this step, one group of plated-through hole 35, each metal can be also processed within the shaping area of the multi-layer board 30
Change through-hole 35 to connect with the pressing area of a golden finger figure 203.By plated-through hole 35 make golden finger figure 203 can with it is more
One or more layers line layer of laminate connects, and realizes circuit board function.
The step of processing via hole 34 and plated-through hole 35 includes: first to drill out through-hole, then metallize, that is, is carried out
Heavy copper and plating.
140, controlled depth milling is carried out to multiple-plate part corresponding to the golden finger figure, manifests the golden hand
Refer to figure.
As shown in Figure 2 c, milling shape operation for the first time is carried out to multi-layer board 30 in this step.By the golden finger copper-clad plate
The multi-layer board controlled depth milling removal for appearing area two sides of 20 golden finger figure 203, manifests the golden finger figure 203.This
It mills in outer layer operation, retains whole golden finger copper-clad plates 20, and the part multi-layer board 36 in big 204 region of copper sheet, the conducting
Hole 34 is located at 36 on the part multi-layer board.The operation of milling shape is specific for the first time can include: to corresponding to for the multi-layer board 30
Then the region controlled depth milling for appearing area of the golden finger figure 203 removes the gasket until manifesting the gasket 302
302 and the adhesive tape 301, reveal the golden finger figure 203.
In concrete application, after the drilling step, before carrying out milling shape operation for the first time, multi-layer board can be carried out first
Outer-layer circuit processing, comprising: use common process, make outer-layer circuit on the surface of the multi-layer board 30, and described outer
Solder mask is set on sandwich circuit.
150, the multiple-plate surface metal-layer in part retained using the big copper sheet region is electroplate lead wire, to the golden hand
Refer to that figure is gold-plated.
Gold-plated to the golden finger figure 203 revealed in this step, make golden finger figure 203 appears area as institute
The golden finger needed.When gold-plated, the plating resist film such as adhesive tape can be used, multiple-plate other region overlays are protected, golden finger is exposed
Figure 203 appears area；It then, is electroplate lead wire with the surface metal-layer 33 of part multi-layer board 36, to golden finger figure 203
Appear area and carries out electroplating gold.
160, the non-golden finger visuals controlled depth milling other than multiple-plate shaping area is removed, formation extends institute
Multiple golden fingers other than multiple-plate ontology are stated, the circuit board with hanging golden finger is made.
As shown in Figure 2 d, second of milling shape operation is carried out in this step.Other than the shaping area of the multi-layer board 30
Non- golden finger visuals controlled depth milling removal, forms the multiple golden fingers 37 extended other than multiple-plate ontology.Wherein
Include: by big 204 region controlled depth milling of copper sheet remove, and, by between each golden finger figure 203 part remove；So that institute
Stating golden finger figure 203 becomes the golden finger 37 of hanging structure, and the circuit board with hanging golden finger 37 is made.Controlled depth milling process
In golden finger 37 can be protected with adhesive tape, adhesive tape is removed after controlled depth milling.
It is the top view of the final circuit board obtained with hanging structure golden finger 37 as shown in Figure 2 e.From Fig. 2 d and 2e
As can be seen that extending multiple golden fingers 37 on a side of circuit board obtained.The width of multiple golden fingers can be identical,
It can also be different.
More than, the embodiment of the invention provides a kind of processing method of hanging golden finger, this method use will have golden hand
Refer to that the golden finger copper-clad plate of figure is pressed on multilayer inner cord, and controlled depth milling manifests golden finger figure so as to gold-plated, finally controls
Deep Milling Machining goes out the technical solution of hanging golden finger, achieves following technical effect:
Golden finger thickness design can be carried out by the open height according to connecting-disconnecting interface, and then meet different connecting-disconnecting interfaces
Plug demand；Since golden finger is hanging structure, golden finger thickness is unrelated with circuit plate thickness, therefore suffered limitation is reduced,
Versatility is stronger, it is not easy to lead to the wasting of resources and cost.
When circuit board will realize multi-functional demand and increase plate thickness, since golden finger is the standalone module of hanging structure,
It will not therefore change, it is not necessary to change original connecting-disconnecting interface equipment, save resource and cost；
When various sizes of connecting-disconnecting interface is needed with a circuit board, it is only necessary to increase or decrease the golden finger of implantation
Thickness, it is simple and convenient without changing circuit plate thickness, it is versatile.
When same equipment there are multiple interfaces, do not have to provide multiple corresponding circuit boards, it only need to be at of the invention one
The golden finger of multiple hanging structures is designed on circuit board, thus can save the assembly space of product, reduces cost and resource
Waste.
Embodiment two,
Fig. 2 d and 2e are please referred to, the embodiment of the present invention provides a kind of circuit board with hanging golden finger, which can
Include:
One end of circuit board body 30 and at least one hanging golden finger 37, the hanging golden finger 37 is embedded in the circuit
In plate ontology 30, the other end extends from a side wall of circuit board body 30, and the golden finger 37 is gold-plated copper-clad plate knot
Structure.
The circuit board body may include multilayer line layer, each golden finger 37 can by plated-through hole 35 with it is described
At least one layer in multilayer line layer is connected.
Circuit board provided in an embodiment of the present invention can be used one method of embodiment and be made.More detailed description please refers to implementation
Example one.
More than, the embodiment of the invention provides a kind of circuit board with hanging golden finger, use will have golden finger figure
The golden finger copper-clad plate of shape is pressed on multilayer inner cord, and controlled depth milling manifests golden finger figure so as to gold-plated, last controlled depth milling
The technical solution for processing hanging golden finger achieves following technical effect:
Golden finger thickness design can be carried out by the open height according to connecting-disconnecting interface, and then meet different connecting-disconnecting interfaces
Plug demand；Since golden finger is hanging structure, golden finger thickness is unrelated with circuit plate thickness, therefore suffered limitation is reduced,
Versatility is stronger, it is not easy to lead to the wasting of resources and cost.
When circuit board will realize multi-functional demand and increase plate thickness, since golden finger is the standalone module of hanging structure,
It will not therefore change, it is not necessary to change original connecting-disconnecting interface equipment, save resource and cost；
When various sizes of connecting-disconnecting interface is needed with a circuit board, it is only necessary to increase or decrease the golden finger of implantation
Thickness, it is simple and convenient without changing circuit plate thickness, it is versatile.
When same equipment there are multiple interfaces, do not have to provide multiple corresponding circuit boards, it only need to be at of the invention one
The golden finger of multiple hanging structures is designed on circuit board, thus can save the assembly space of product, reduces cost and resource
Waste.
In the above-described embodiments, it all emphasizes particularly on different fields to the description of each embodiment, is not described in some embodiment
Part, may refer to the associated description of other embodiments.
It should be noted that for the various method embodiments described above, for simple description, therefore, it is stated as a series of
Combination of actions, but those skilled in the art should understand that, the present invention is not limited by described sequence of movement because according to
According to the present invention, certain steps can use other sequences or carry out simultaneously.Secondly, those skilled in the art should also know that,
The embodiments described in the specification are all preferred embodiments, and not necessarily the present invention must for related actions and modules
Must.
The processing method and circuit board for being provided for the embodiments of the invention a kind of hanging golden finger above carry out
It is discussed in detail, but the above description of the embodiment is only used to help understand the method for the present invention and its core ideas, should not be understood
For limitation of the present invention.Those skilled in the art, according to the thought of the present invention, the invention discloses technical scope
Interior, any changes or substitutions that can be easily thought of, should be covered by the protection scope of the present invention.
Claims (7)
1. a kind of processing method of hanging golden finger characterized by comprising
Golden finger copper-clad plate is provided, the golden finger area of golden finger copper-clad plate one end has multiple golden finger figures and big copper
Piece, the golden finger figure is divided into the pressing area for appearing area and the separate big copper sheet being connected with the big copper sheet, described
The non-golden finger area of golden finger copper-clad plate has line pattern；
Press multi-layer board, wherein the golden finger copper-clad plate is pressed on multiple-plate internal layer, makes the golden finger figure
Appear area and the big copper sheet is located at other than multiple-plate shaping area；
Process one group of via hole other than multiple-plate shaping area, the via hole with it is big in the golden finger copper-clad plate
Copper sheet connection；
Controlled depth milling is carried out to multiple-plate part corresponding to the golden finger figure, manifests the golden finger figure；
The multiple-plate surface metal-layer in part retained using the big copper sheet region plates the golden finger figure as electroplate lead wire
Gold；
By the non-golden finger visuals controlled depth milling removal other than multiple-plate shaping area, formation extends the multi-layer board
Ontology other than multiple golden fingers, be made with hanging golden finger circuit board.
2. processing method according to claim 1, it is characterised in that:
In the multiple-plate step of pressing, tape on the surface of the golden finger figure, and in the golden finger taped
Gasket is set on figure.
3. processing method according to claim 1, it is characterised in that:
In the step of processing one group of via hole other than multiple-plate shaping area, also within multiple-plate shaping area
One group of plated-through hole is processed, each plated-through hole is connect with a golden finger figure.
4. processing method according to claim 1, which is characterized in that described multiple-plate corresponding to the golden finger figure
The part of shape carries out before controlled depth milling, further includes:
Outer-layer circuit is made on multiple-plate surface, and solder mask is set in the outer-layer circuit.
5. processing method according to claim 2, which is characterized in that described multiple-plate corresponding to the golden finger figure
The part of shape carries out controlled depth milling
To multiple-plate region controlled depth milling for appearing area corresponding to the golden finger figure, until manifesting the pad
Then piece removes the gasket and the adhesive tape, reveal the golden finger figure.
6. a kind of circuit board with hanging golden finger characterized by comprising
One end of circuit board body and at least one hanging golden finger, the hanging golden finger is embedded in the circuit board body,
The other end extends from a side wall of the circuit board body, and the golden finger is gold-plated structure for covering copper plate.
7. circuit board according to claim 6, it is characterised in that:
The circuit board body includes multilayer line layer, each hanging golden finger passes through plated-through hole and the multilayer line
At least one layer in layer is connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811236641.1A CN109379840A (en) | 2018-10-23 | 2018-10-23 | A kind of processing method and circuit board of hanging golden finger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811236641.1A CN109379840A (en) | 2018-10-23 | 2018-10-23 | A kind of processing method and circuit board of hanging golden finger |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109379840A true CN109379840A (en) | 2019-02-22 |
Family
ID=65401387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811236641.1A Pending CN109379840A (en) | 2018-10-23 | 2018-10-23 | A kind of processing method and circuit board of hanging golden finger |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109379840A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109041458A (en) * | 2018-09-25 | 2018-12-18 | 郑州云海信息技术有限公司 | A kind of wiring board and its manufacturing method |
| CN113708112A (en) * | 2021-07-30 | 2021-11-26 | 苏州浪潮智能科技有限公司 | Board card ladder connection structure and signal connector |
-
2018
- 2018-10-23 CN CN201811236641.1A patent/CN109379840A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109041458A (en) * | 2018-09-25 | 2018-12-18 | 郑州云海信息技术有限公司 | A kind of wiring board and its manufacturing method |
| CN113708112A (en) * | 2021-07-30 | 2021-11-26 | 苏州浪潮智能科技有限公司 | Board card ladder connection structure and signal connector |
| CN113708112B (en) * | 2021-07-30 | 2023-07-14 | 苏州浪潮智能科技有限公司 | Board ladder connection structure and signal connector |
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Application publication date: 20190222 |