CN104981108B - The processing method and circuit board of hanging structure golden finger - Google Patents
The processing method and circuit board of hanging structure golden finger Download PDFInfo
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- CN104981108B CN104981108B CN201410147956.4A CN201410147956A CN104981108B CN 104981108 B CN104981108 B CN 104981108B CN 201410147956 A CN201410147956 A CN 201410147956A CN 104981108 B CN104981108 B CN 104981108B
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Abstract
The invention discloses a kind of processing method and circuit board of hanging structure golden finger, to solve existing for existing golden finger circuit board, limitation is very strong, and versatility is very poor, easily causes the technical problem of the wasting of resources and cost.Method includes：The golden finger copper-clad plate of multiple different-thickness is provided；Multi-layer sheet is pressed, wherein, the multiple golden finger copper-clad plate is pressed on to the different levels of the multilayer inner cord；One group of via hole is processed beyond multiple-plate shaping area, the via hole is connected with the copper sheet in the golden finger copper-clad plate and golden finger figure；Controlled depth milling removes the part beyond multiple-plate shaping area, but retains the golden finger copper-clad plate；It is gold-plated to the golden finger figure；Each golden finger showing methods that controlled depth milling extends out the golden finger copper-clad plate are golden finger, and the circuit board with hanging structure golden finger is made.
Description
Technical field
The present invention relates to circuit board technology field, and in particular to a kind of processing method and circuit of hanging structure golden finger
Plate.
Background technology
At present, the printed circuit board (PCB) with golden finger (PCB) plate, generally use golden finger online design in its structure design
Mode within the shaping area of road plate top layer.And the golden finger of plug function is provided, it should be matched with the size of connecting-disconnecting interface, golden finger
The thickness of circuit board should be consistent with the open height of connecting-disconnecting interface, when the open height of connecting-disconnecting interface is fixed, golden finger
The circuit plate thickness at place is also just therefore fixed.
When golden finger circuit board will realize multi-functional demand and need to increase thickness of slab, then supporting connecting-disconnecting interface equipment
Do whole conversion, very waste of resource and cost；Golden finger circuit board is fixed due to thickness, it is impossible to applied to various sizes of
Connecting-disconnecting interface, cause the versatility of golden finger circuit board very poor；When same equipment has multiple connecting-disconnecting interfaces, it is necessary to design multiple
The golden finger circuit board of corresponding thickness, can influence the assembly space of product, and cause the wasting of resources and cost.
To sum up, existing golden finger circuit board, limitation is very strong, and versatility is very poor, easily causes the wasting of resources and cost
Lifting.
The content of the invention
The embodiment of the present invention provides a kind of processing method and circuit board of hanging structure golden finger, to solve existing golden hand
Refer to existing for circuit board, limitation is very strong, and versatility is very poor, easily causes the technical problem of the wasting of resources and cost.
First aspect present invention provides a kind of processing method of hanging structure golden finger, it may include：
The golden finger copper-clad plate of multiple different-thickness is provided, the golden finger area of described golden finger copper-clad plate one end is with more
Individual golden finger figure and the copper sheet being connected with the multiple golden finger figure, other regions of the golden finger copper-clad plate have
Line pattern；
Multi-layer sheet is pressed, wherein, the multiple golden finger copper-clad plate is pressed on to the different levels of the multilayer inner cord,
The golden finger area part of the golden finger copper-clad plate is set to be located at beyond multiple-plate shaping area；
Process one group of via hole beyond multiple-plate shaping area, the via hole with the golden finger copper-clad plate
Copper sheet connection；
Controlled depth milling is carried out to the part beyond multiple-plate shaping area, but retains the golden finger copper-clad plate, and is protected
The part multi-layer sheet on the copper sheet of golden finger copper-clad plate is stayed, the via hole is located on the part multi-layer sheet on the copper sheet；
It is gold-plated to the golden finger figure using the multiple-plate surface metal-layer in the part on the copper sheet as electroplate lead wire；
Non- golden finger visuals controlled depth milling beyond multiple-plate shaping area is removed, formation is multiple to extend institute
The golden finger beyond multiple-plate body is stated, the circuit board with hanging structure golden finger is made.
Second aspect of the present invention provides a kind of circuit board with hanging structure golden finger, it may include：
Circuit board body and hanging structure golden finger, one end of the hanging structure golden finger are embedded in the circuit board body
In, the other end extends from a side wall of circuit board body, and the hanging structure golden finger includes multilayer, each layer of bag
At least one golden finger is included, the golden finger is gold-plated structure for covering copper plate.
Therefore the embodiment of the present invention uses and golden finger copper-clad plate is pressed in multi-layer sheet, by controlled depth milling by golden hand
Refer to the technical scheme that the golden finger showing methods on the copper of copper-clad plate are hanging structure golden finger, achieve following technique effect：
Golden finger thickness design can be carried out according to the open height of connecting-disconnecting interface, and then meet different connecting-disconnecting interface plugs
Demand；Because golden finger is hanging structure, golden finger thickness is unrelated with circuit plate thickness, therefore suffered limitation is reduced, general
Property is stronger, it is not easy to causes the wasting of resources and cost.
When circuit board will realize multi-functional demand and increase thickness of slab, because golden finger is the standalone module of hanging structure,
Will not therefore it change, it is not necessary to change original connecting-disconnecting interface equipment, saved resource and cost；
When various sizes of connecting-disconnecting interface is needed with a circuit board, it is only necessary to increase or decrease the golden finger of implantation
Thickness, it is simple and convenient without changing circuit plate thickness, it is versatile.
, only need to be at one of the present invention without providing multiple corresponding circuit boards when same equipment has multiple interfaces
The golden finger of multiple hanging structures is designed on circuit board, thus the assembly space of product can be saved, reduces cost and resource
Waste.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, below will be to institute in embodiment and description of the prior art
The accompanying drawing needed to use is briefly described, it should be apparent that, drawings in the following description are only some implementations of the present invention
Example, for those of ordinary skill in the art, on the premise of not paying creative work, can also be obtained according to these accompanying drawings
Obtain other accompanying drawings.
Fig. 1 is a kind of flow chart of the processing method of hanging structure golden finger provided in an embodiment of the present invention；
Fig. 2 a to 2h are the schematic diagrames using each stage of present invention method processing circuit board.
Embodiment
The embodiment of the present invention provides a kind of processing method and circuit board of hanging structure golden finger, to solve existing golden hand
Refer to existing for circuit board, limitation is very strong, and versatility is very poor, easily causes the technical problem of the wasting of resources and cost.
In order that those skilled in the art more fully understand the present invention program, below in conjunction with the embodiment of the present invention
Accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only
The embodiment of a part of the invention, rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill people
The every other embodiment that member is obtained under the premise of creative work is not made, it should all belong to the model that the present invention protects
Enclose.
Below by specific embodiment, it is described in detail respectively.
Embodiment one,
Fig. 1 is refer to, the embodiment of the present invention provides a kind of processing method of hanging structure golden finger, it may include：
The 110th, the golden finger copper-clad plate of multiple different-thickness, the golden finger area tool of described golden finger copper-clad plate one end are provided
There are multiple golden finger figures and the copper sheet being connected with the multiple golden finger figure, other regions of the golden finger copper-clad plate
With line pattern.
In the embodiment of the present invention, as shown in figures 2 a and 2b, the golden finger copper-clad plate 20 is wrapped for the golden finger copper-clad plate provided
The dielectric 201 of centre and the metal level on two sides are included, its one end is designed with golden finger area, the metal level quilt of golden finger area
It is processed as multiple golden finger figures 203 and the copper sheet 204 being connected with multiple golden finger figures, the metal beyond golden finger area
Layer is then processed into line pattern 202.Golden finger figure 203 can be divided into appears area 2031 and away from copper sheet close to copper sheet 204
204 pressing area 2302.In a kind of embodiment, the preparation method of the golden finger copper-clad plate 20 is as follows：Connect according to equipment plug
The open height of mouth, prepares the copper-clad plate of respective thickness；According to designed golden finger figure and line pattern, carry out figure and turn
Move and etch, in the golden finger area processing golden finger figure 203 needed and the copper sheet being connected with multiple golden finger figures
204, required line pattern is gone out in other region processings.In preferred embodiment, golden finger copper-clad plate is double face copper, and
The golden finger figure on two sides is identical symmetrical.
In the embodiment of the present invention, described golden finger figure 203 appears area and will be subsequently revealed in outside multi-layer sheet body
As golden finger, pressing area will subsequently be pressed together on multiple-plate internal layer, play conducting and connection function；Described copper sheet 204
It is to be helped out in manufacturing process, due to being connected with golden finger figure, subsequently by as a part for golden finger gold plated lead,
For conduction, assist gold-plated to golden finger figure；After the completion of gold-plated, the whole region of copper sheet 204, which mills controlled depth, removes.
In order to meet the connecting-disconnecting interface of different-thickness, the embodiment of the present invention provides two or more copper-clad plates, makes multigroup
The golden finger copper-clad plate of different-thickness, to meet various sizes of connecting-disconnecting interface.
120th, multi-layer sheet is pressed, wherein, the multiple golden finger copper-clad plate is pressed on to the difference of the multilayer inner cord
Level, the golden finger area part of the golden finger copper-clad plate is set to be located at beyond multiple-plate shaping area.
As shown in Figure 2 c, this step middle level laminates conjunction multi-layer sheet, the multi-layer sheet may include at least one layer of internal layer circuit layer and
Two outer layers metal level, and the dielectric layer between each line layer and metal level.Wherein, golden finger copper-clad plate 20 is pressed
Together in the different levels of the internal layer of multi-layer sheet 30, and make the golden finger area of the golden finger copper-clad plate 20 is predominantly located in multilayer
Beyond the shaping area of plate, the pressing area of golden finger figure is only set to be located within shaping area.Also, can be in order to protect golden finger
The two sides patch double faced adhesive tape 301 of the golden finger figure 203, is set on the golden finger figure 203 and copper sheet 204 for having pasted double faced adhesive tape
Pad 302.Described pad can be false core plate (being etched the copper-clad plate for removing copper foil layer) either duroplasts or iron
Fluorine dragon etc..
In a kind of embodiment, as shown in Figure 2 c, the laminated construction of multi-layer sheet 30 includes：Double face copper positioned at centre
31, the two sides of the double face copper 31 has formed internal layer circuit；Dielectric layer 32 positioned at double face copper two sides, the dielectric layer can
To be prepreg；It is located at two golden finger copper-clad plates 20 on the surface of two layer medium layer 32 respectively, and in golden finger copper-clad plate 20
Golden finger area be located at side, pressing area 2302 and the location overlap of double face copper 31 of golden finger figure 203, golden finger area
The other parts in domain are then located at beyond double face copper；Respectively positioned at the dielectric layer 32 on two surfaces of golden finger copper-clad plate 20；Two
Post double faced adhesive tape 301, the golden finger area of two golden finger copper-clad plates in the two sides of the golden finger figure of individual golden finger copper-clad plate
Between and the outer surface of golden finger area on be equipped with pad 302；The outermost layer of multi-layer sheet 30 is outer layer metal layer 33.Pressure
Close the multi-layer sheet formed as shown in Figure 2 d.
Pad between two layers of golden finger copper-clad plate adds the thickness of adhesive tape, required design between equal to two layers golden finger
Difference in height, i.e., the vertical drop of two layers slotting of connecting-disconnecting interface of corresponding equipment；Pad above every layer of golden finger adds adhesive tape
Thickness >=0.1mm.The fixed bonding of pad, a part bond by adhesive tape, and a part depends on prepreg (the i.e. PP of dielectric layer
Piece) bond.The dielectric layer 32 may include multilayer PP pieces, wherein, at least one layer of PP pieces near outer layer metal layer 33 should be
Whole PP pieces, to play preferable bonding and iris action.
130th, one group of via hole is processed beyond multiple-plate shaping area, the via hole covers copper with the golden finger
Copper sheet connection on plate.
As shown in Figure 2 e, this step is drill process.In this step, one group can be processed beyond the shaping area of multi-layer sheet 30
Via hole 34, the via hole 34 are connected with the copper sheet 204 of the golden finger copper-clad plate 20.By via hole 34 by outer layer metal
Layer 33 is connected with copper sheet 204 and golden finger figure 203 so that, subsequently can be right by the use of outer layer metal layer 33 as electroplate lead wire
Golden finger figure 203 carries out gold-plated.
In this step, one group of plated-through hole 35, each metal can be also processed within the shaping area of the multi-layer sheet 30
Change through hole 35 to be connected with the pressing area of a golden finger figure 203.By the golden finger figure 203 of plated-through hole 35 can with it is more
One or more layers line layer connection of laminate, realizes circuit board function.
The step of processing via hole 34 and plated-through hole 35, includes：Through hole is first drilled out, then is metallized, i.e. is carried out
Heavy copper and plating.
140th, controlled depth milling is carried out to the part beyond multiple-plate shaping area, but retains the golden finger copper-clad plate,
And retaining the part multi-layer sheet on the copper sheet of golden finger copper-clad plate, the via hole is located at the part multi-layer sheet on the copper sheet
On.
As shown in figure 2f, the operation of first time milling profile is carried out in this step to multi-layer sheet 30.Including：Described in controlled depth milling removes
Part beyond the shaping area of multi-layer sheet 30, but retain the golden finger copper-clad plate 20, and retain the copper of golden finger copper-clad plate 20
The part multi-layer sheet 36 in the region of piece 204, the via hole 34 are located at 36 on the part multi-layer sheet of copper coin area reservation.That is, adopt
With controlled depth milling technique by part removal beyond the shaping area of the multi-layer sheet 30, corresponding to the golden finger figure 203, but
Retain the golden finger copper-clad plate 20, and remove the pad 302 and the double faced adhesive tape 301.Obtain structure as shown in figure 2f.
In concrete application, after the drilling step, before carrying out the operation of first time milling profile, multi-layer sheet can be carried out first
Outer-layer circuit is processed, including：Using common process, outer-layer circuit is made on the surface of the multi-layer sheet 30, and described outer
Solder mask is set on sandwich circuit.
150th, using the multiple-plate surface metal-layer in the part on the copper sheet as electroplate lead wire, the golden finger figure is plated
Gold.
It is gold-plated to golden finger figure 203 in this step, make the area that appears of golden finger figure 203 turn into required golden hand
Refer to.When gold-plated, the plating resist films such as adhesive tape can be used, multiple-plate other region overlays are protected, expose the aobvious of golden finger figure 203
Reveal area；Then, it is electroplate lead wire with the surface metal-layer 33 of part multi-layer sheet 36, the area that appears of golden finger figure 203 is carried out
Plating gold.
160th, the non-golden finger visuals controlled depth milling beyond multiple-plate shaping area is removed, forms multiple extensions
Golden finger beyond multiple-plate body, the circuit board with hanging structure golden finger is made.
As shown in Figure 2 g, second of milling profile operation is carried out in this step.Including：Controlled depth milling removes the golden finger and covers copper
The region of copper sheet 204 of plate 20, the part multi-layer sheet 36 that the region of copper sheet 204 retains, and, each golden finger figure 203 it
Between useless part；So that the golden finger figure 203 turns into the golden finger 37 of hanging structure, being made has hanging structure gold hand
Refer to 37 circuit board.Golden finger 37 can be protected with adhesive tape during controlled depth milling, controlled depth milling removes adhesive tape after terminating.
It is the top view of the final obtained circuit board with hanging structure golden finger 37 as shown in fig. 2h.From Fig. 2 g and 2h
As can be seen that extend at least two layers golden finger 37 with different-thickness on a side of obtained circuit board, and it is each
Layer can have multiple golden fingers 37.The golden finger thickness of same layer is identical, but the golden finger thickness of different layers can differ.It is same
The width of multiple golden fingers can be with identical in layer, can also be different.
More than, the embodiments of the invention provide a kind of processing method of hanging structure golden finger, this method is used in multilayer
Golden finger copper-clad plate is pressed in plate, by the golden finger showing methods on the copper of golden finger copper-clad plate is hanging structure by controlled depth milling
The technical scheme of golden finger, achieve following technique effect：
Golden finger thickness design can be carried out by the open height according to connecting-disconnecting interface, and then meet different connecting-disconnecting interfaces
Plug demand；Because golden finger is hanging structure, golden finger thickness is unrelated with circuit plate thickness, therefore suffered limitation is reduced,
Versatility is stronger, it is not easy to causes the wasting of resources and cost.
When circuit board will realize multi-functional demand and increase thickness of slab, because golden finger is the standalone module of hanging structure,
Will not therefore it change, it is not necessary to change original connecting-disconnecting interface equipment, saved resource and cost；
When various sizes of connecting-disconnecting interface is needed with a circuit board, it is only necessary to increase or decrease the golden finger of implantation
Thickness, it is simple and convenient without changing circuit plate thickness, it is versatile.
, only need to be at one of the present invention without providing multiple corresponding circuit boards when same equipment has multiple interfaces
The golden finger of multiple hanging structures is designed on circuit board, thus the assembly space of product can be saved, reduces cost and resource
Waste.
Embodiment two,
Fig. 2 g and 2h are refer to, the embodiment of the present invention provides a kind of circuit board with hanging structure golden finger, the circuit
Plate may include：
Circuit board body 30 and hanging structure golden finger 37, one end of the hanging structure golden finger are embedded in the circuit board
In body, the other end extends from the side of circuit board body, and the hanging structure golden finger includes multilayer, each layer of bag
At least one golden finger 37 is included, the golden finger 37 is gold-plated structure for covering copper plate.
The circuit board body may include multilayer line layer, each golden finger 37 can by plated-through hole 35 with it is described
At least one layer in multilayer line layer is connected.
Circuit board provided in an embodiment of the present invention can be made using the method for embodiment one.More detailed description refer to implementation
Example one.
More than, the embodiments of the invention provide a kind of circuit board with hanging structure golden finger, achieve following technology
Effect：
Golden finger thickness design can be carried out by the open height according to connecting-disconnecting interface, and then meet different connecting-disconnecting interfaces
Plug demand；Because golden finger is hanging structure, golden finger thickness is unrelated with circuit plate thickness, therefore suffered limitation is reduced,
Versatility is stronger, it is not easy to causes the wasting of resources and cost.
When circuit board will realize multi-functional demand and increase thickness of slab, because golden finger is the standalone module of hanging structure,
Will not therefore it change, it is not necessary to change original connecting-disconnecting interface equipment, saved resource and cost；
When various sizes of connecting-disconnecting interface is needed with a circuit board, it is only necessary to increase or decrease the golden finger of implantation
Thickness, it is simple and convenient without changing circuit plate thickness, it is versatile.
, only need to be at one of the present invention without providing multiple corresponding circuit boards when same equipment has multiple interfaces
The golden finger of multiple hanging structures is designed on circuit board, thus the assembly space of product can be saved, reduces cost and resource
Waste.
In the above-described embodiments, the description to each embodiment all emphasizes particularly on different fields, and is not described in some embodiment
Part, may refer to the associated description of other embodiments.
It should be noted that for foregoing each method embodiment, in order to be briefly described, therefore it is all expressed as a series of
Combination of actions, but those skilled in the art should know, the present invention is not limited by described sequence of movement because according to
According to the present invention, some steps can use other orders or carry out simultaneously.Secondly, those skilled in the art should also know,
Embodiment described in this description belongs to preferred embodiment, and not necessarily the present invention must for involved action and module
Must.
The processing method and circuit board of a kind of hanging structure golden finger provided above the embodiment of the present invention are carried out
It is discussed in detail, but the explanation of above example is only intended to help the method and its core concept for understanding the present invention, should not be understood
For limitation of the present invention.Those skilled in the art, according to the present invention thought, the invention discloses technical scope
Change or replacement that are interior, can readily occurring in, should all be included within the scope of the present invention.
Claims (7)
- A kind of 1. processing method of hanging structure golden finger, it is characterised in that including：The golden finger copper-clad plate of multiple different-thickness is provided, the golden finger area of described golden finger copper-clad plate one end has multiple gold Finger figure and the copper sheet being connected with the multiple golden finger figure, other regions of the golden finger copper-clad plate have circuit Figure；Multi-layer sheet is pressed, wherein, the multiple golden finger copper-clad plate is pressed on to the different levels of the multilayer inner cord, makes institute The golden finger area part for stating golden finger copper-clad plate is located at beyond multiple-plate shaping area；One group of via hole, the via hole and the copper in the golden finger copper-clad plate are processed beyond multiple-plate shaping area Piece connects；Controlled depth milling is carried out to the part beyond multiple-plate shaping area, but retains the golden finger copper-clad plate, and preserving capital Part multi-layer sheet on the copper sheet of finger copper-clad plate, the via hole are located on the part multi-layer sheet on the copper sheet；It is gold-plated to the golden finger figure using the multiple-plate surface metal-layer in the part on the copper sheet as electroplate lead wire；By beyond multiple-plate shaping area non-golden finger visuals controlled depth milling remove, formed it is multiple extend it is described more Golden finger beyond the body of laminate, the circuit board with hanging structure golden finger is made.
- 2. according to the method for claim 1, it is characterised in that：In the multiple-plate step of pressing, double faced adhesive tape is pasted on the two sides of the multiple golden finger figure, in the golden finger area Domain sets pad.
- 3. according to the method for claim 1, it is characterised in that：In the step of processing one group of via hole beyond multiple-plate shaping area, also within multiple-plate shaping area One group of plated-through hole is processed, each plated-through hole is connected with a golden finger figure.
- 4. according to the method for claim 1, it is characterised in that the part beyond multiple-plate shaping area is controlled Before deep milling, in addition to：Outer-layer circuit is made on multiple-plate surface, and solder mask is set in the outer-layer circuit.
- 5. according to the method for claim 2, it is characterised in that the part beyond multiple-plate shaping area is controlled Deep milling includes：Using controlled depth milling technique by it is beyond multiple-plate shaping area, corresponding to the golden finger figure part remove, And remove the pad and the double faced adhesive tape.
- 6. a kind of circuit board with hanging structure golden finger, is produced using claim 1 methods described, it is characterised in that bag Include：Circuit board body and hanging structure golden finger, one end of the hanging structure golden finger are embedded in the circuit board body, The other end extends from the side of circuit board body, and the hanging structure golden finger includes multilayer, and each layer is included at least One golden finger, the golden finger are gold-plated structure for covering copper plate.
- 7. circuit board according to claim 6, it is characterised in that：The circuit board body includes multilayer line layer, and each golden finger passes through in multilayer line layer described in plated-through hole At least one layer is connected.
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| CN201410147956.4A CN104981108B (en) | 2014-04-14 | 2014-04-14 | The processing method and circuit board of hanging structure golden finger |
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|---|---|---|---|
| CN201410147956.4A CN104981108B (en) | 2014-04-14 | 2014-04-14 | The processing method and circuit board of hanging structure golden finger |
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| CN104981108B true CN104981108B (en) | 2018-01-26 |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106714473A (en) * | 2016-12-23 | 2017-05-24 | 东莞康源电子有限公司 | Finger bifurcation multilayer FPC product processing process |
| CN109041458A (en) * | 2018-09-25 | 2018-12-18 | 郑州云海信息技术有限公司 | A kind of wiring board and its manufacturing method |
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|---|---|---|---|---|
| US5444188A (en) * | 1992-01-14 | 1995-08-22 | Nippon Mektron, Ltd. | Flexible circuit wiring board and method of producing the same |
| CN102458056A (en) * | 2010-10-25 | 2012-05-16 | 矢崎总业株式会社 | Method for manufacturing wiring substrate |
| CN202524638U (en) * | 2012-03-09 | 2012-11-07 | 昆山亿富达电子有限公司 | Flexible circuit board hollow-out golden finger adhesive pasting structure |
| CN202697021U (en) * | 2012-04-25 | 2013-01-23 | 中兴通讯股份有限公司 | Goldfinger printed circuit board |
| CN103153000A (en) * | 2013-02-01 | 2013-06-12 | 东莞生益电子有限公司 | Manufacture method for gold finger circuit board and circuit board manufactured by method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0837380A (en) * | 1994-07-21 | 1996-02-06 | Hitachi Chem Co Ltd | Multilayred wiring board with terminal |
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2014
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5444188A (en) * | 1992-01-14 | 1995-08-22 | Nippon Mektron, Ltd. | Flexible circuit wiring board and method of producing the same |
| CN102458056A (en) * | 2010-10-25 | 2012-05-16 | 矢崎总业株式会社 | Method for manufacturing wiring substrate |
| CN202524638U (en) * | 2012-03-09 | 2012-11-07 | 昆山亿富达电子有限公司 | Flexible circuit board hollow-out golden finger adhesive pasting structure |
| CN202697021U (en) * | 2012-04-25 | 2013-01-23 | 中兴通讯股份有限公司 | Goldfinger printed circuit board |
| CN103153000A (en) * | 2013-02-01 | 2013-06-12 | 东莞生益电子有限公司 | Manufacture method for gold finger circuit board and circuit board manufactured by method |
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