CN105451469B - A kind of preparation method of circuit edge connector - Google Patents
A kind of preparation method of circuit edge connector Download PDFInfo
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- CN105451469B CN105451469B CN201410494457.2A CN201410494457A CN105451469B CN 105451469 B CN105451469 B CN 105451469B CN 201410494457 A CN201410494457 A CN 201410494457A CN 105451469 B CN105451469 B CN 105451469B
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- Prior art keywords
- circuit board
- golden finger
- via hole
- gold
- plated
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a kind of preparation method of circuit edge connector, methods described includes：The via hole of region processing first of golden finger is preset in circuit board, then first via hole is filled up into resin；The outer graphics of the circuit board are made, the golden finger figure positioned at the region for presetting golden finger is formed in the first surface of the circuit board, the glodclad wire being connected with first via hole is formed in the second surface of the circuit board；It is gold-plated on the golden finger figure, produce golden finger.The embodiment of the present invention also provides a kind of circuit board.The embodiment of the present invention is used to solve makes the problems of golden finger in the prior art.
Description
Technical field
The present invention relates to circuit board technology field, and in particular to a kind of preparation method and circuit board of circuit edge connector.
Background technology
Golden finger is one of conventional structure of current circuit board, and it is widely used as plug purposes.With optical module and
The application environment of connector is more and more harsher, to golden finger surface requirements also more and more higher, to avoid golden finger in severe ring
Failure is used in border, it is proposed that new standard, it is desirable to do not allow to reveal copper around golden finger, and golden finger wants gold-plated must draw plating
Golden wire can be gold-plated.
The technique used at present to solve above-mentioned technical problem has：Prior art one is from golden finger termination lead and then led to
Cross profile or copper removal is removed in etching；Prior art two is that (internal layer is outer for lead on circuit out of circuit board that be connected with golden finger
Layer), realize that golden finger is gold-plated；Prior art three is drilled on golden finger figure, gold-plated by being carried out after hole metallization
Conducting.
Following defect be present in above prior art：The golden finger circuit board that the technique of prior art one is made has wire
Remain in around golden finger front end or golden finger and reveal copper, customer requirement can not be met；The technique of prior art two runs into golden finger
With circuit in circuit board it is unconnected in the case of (as isolated golden finger) if can not use such a technique, and work as circuit in circuit board
When very fine and closely woven, glodclad wire can not be drawn by then being occurred using circuit board lead technique；The golden hand of the technique of prior art three
Refer on figure and hole be present, using this hole turn on gold-plated, then when follow-up golden finger easily occur and doing plug function, plug shell fragment
Snap among the through hole of golden finger surface and cause loose contact.
The content of the invention
The embodiment of the present invention provides a kind of preparation method and circuit board of circuit edge connector, solves and makes in the prior art
Make the problems of golden finger.
First aspect present invention provides a kind of preparation method of circuit edge connector, including：Gold is preset in circuit board
The via hole of region processing first of finger, then first via hole is filled up into resin；The outer graphics of the circuit board are made,
The golden finger figure positioned at the region for presetting golden finger is formed in the first surface of the circuit board, in the circuit
The second surface of plate forms the glodclad wire being connected with first via hole；It is gold-plated on the golden finger figure, produce
Golden finger.
Second aspect of the present invention provides a kind of circuit board, including：The first surface of circuit board is provided with golden finger, it is described
Golden finger is connected to the second surface of the circuit board by filling up the metallization buried via hole of resin.
Therefore the embodiment of the present invention uses the via hole of region processing first that golden finger is preset in circuit board,
First via hole is filled up into resin again；The outer graphics of the circuit board are made, in the first surface shape of the circuit board
Into the golden finger figure positioned at the region for presetting golden finger, formed and described the in the second surface of the circuit board
The glodclad wire of one via hole connection；It is gold-plated on the golden finger figure, produce the technical scheme of golden finger, achieve with
Lower technique effect：Because elder generation in circuit board processes via hole, the via hole is the hole of metallization, then carries out filling holes with resin, then
Make the outer graphics of circuit board so that the first surface of circuit board forms golden finger figure, in the second surface shape of circuit board
Into glodclad wire, so, hole and glodclad wire are not present on golden finger figure, are then not in that follow-up golden finger does plug function
When, plug shell fragment snaps among golden finger surface through hole and causes loose contact, and golden finger figure is by via hole and gold-plated leads
Line connects, further gold-plated on golden finger figure, produces golden finger, is not in dew copper around golden finger, Ke Yiman
Foot makes the relevant criterion of golden finger, without directly drawing gold-plated guide passage from golden finger figure.Therefore, the present invention solves
The problems of golden finger is made in the prior art.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, below will be to institute in embodiment and description of the prior art
The accompanying drawing needed to use is briefly described, it should be apparent that, drawings in the following description are only some implementations of the present invention
Example, for those of ordinary skill in the art, on the premise of not paying creative work, can also be obtained according to these accompanying drawings
Obtain other accompanying drawings.
Fig. 1 is one embodiment schematic diagram of the preparation method of circuit edge connector in the embodiment of the present invention；
Fig. 2 is a profile for processing the first via hole in the embodiment of the present invention on circuit boards；
Fig. 3 is by a profile of the first via hole filling holes with resin in the embodiment of the present invention；
Fig. 4 is middle level of embodiment of the present invention swaging into a profile before circuit board；
Fig. 5 is a profile of middle level of the embodiment of the present invention swaging into circuit board；
Fig. 6 is to a profile of the heavy copper plating of the first via hole in the embodiment of the present invention；
Fig. 7 is the profile that circuit board outer graphics are made in the embodiment of the present invention；
Fig. 8 is the plan that circuit board outer graphics are made in the embodiment of the present invention.
Embodiment
The preparation method that the embodiment of the present invention provides circuit edge connector, for solving to make circuit sheet metal in the prior art
The problems of finger.The embodiment of the present invention also provides corresponding circuit board.
In order that those skilled in the art more fully understand the present invention program, below in conjunction with the embodiment of the present invention
Accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only
The embodiment of a part of the invention, rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill people
The every other embodiment that member is obtained under the premise of creative work is not made, it should all belong to the model that the present invention protects
Enclose.
Below by specific embodiment, it is described in detail respectively.
Embodiment one,
Fig. 1 is refer to, the embodiment of the present invention provides a kind of preparation method of circuit edge connector, it may include：
101st, the via hole of region processing first of golden finger is preset in circuit board, then the first via hole is filled up into tree
Fat；
Present invention method, for not leaking the golden finger of copper around being produced on the surface of circuit board.It refer to Fig. 2
And Fig. 3, the first via hole of region processing 201 of golden finger is preset in circuit board 200, then the first via hole 201 is filled up
Resin 202 (i.e. dash area region in Fig. 3).
Optionally, the first via hole of region processing 201 of golden finger is preset in circuit board 200 to be included：
Bore the first via hole 201, the first conducting in the region that golden finger is preset in circuit board 200 by the way of drilling
The aperture in hole 201 is no more than 4mm；
First via hole 201 is metallized.
It is understood that the first via hole, Er Qie are bored in the region for presetting golden finger in circuit board using rig
The aperture of one via hole is no more than 4mm, and first via hole, the region of the first via hole are bored in the position of preferably each golden finger
And it is not take up the internal layer wiring space of circuit board.
Optionally, include before region the first via hole 201 of brill of golden finger is preset in circuit board 200：
It refer to Fig. 4 and Fig. 5, lamination forms circuit board 200, and the outermost layer of circuit board 200 is false core plate 203, false core plate
203 thickness is no more than 0.2mm.
It is understood that must be laminated to form circuit board before via hole is bored, the outermost layer of circuit board is false core plate,
I.e. the outmost surface of circuit board is all false core plate, and follow-up drilling, the thickness of the false core plate are no more than 0.2mm for convenience.
It should be noted that false core plate refers to the copper-clad plate without copper foil.
Optionally, by the first via hole 201 metallize including：
Fig. 6 is refer to, the copper that sunk to the first via hole 201 plating makes the first via hole 201 metallize, the metal layer of formation
204 thickness is between 5~10um.
It is understood that the first conducting hole metallization, and the thickness of the metal layer formed are made by heavy copper plating
Between 5~10um, metal layer is heavy copper electrodeposited coating.
Optionally, the first via hole 201 is filled up into resin 202 includes：
Under vacuum, using silk-screen filling holes with resin, the first via hole 201 is filled up into resin 201.
It should be noted that using silk-screen filling holes with resin, the first via hole is filled up into resin and is only to fill up resin wherein
A kind of mode, is not specifically limited herein.
It is understood that in order to avoid the rear golden finger that it is produced influences plug operation, should not exist on golden finger
Through hole, then, after the first via hole is processed, the first via hole is filled up into resin.
102nd, the outer graphics of circuit board are made, are formed in the first surface of circuit board positioned at the area for presetting golden finger
The golden finger figure in domain, the glodclad wire being connected with the first via hole is formed in the second surface of circuit board；
Fig. 7 and Fig. 8 are refer to, after the first conducting 201 is filled up into resin 202, the outer graphics of circuit board are made, in electricity
The first surface 210 of road plate 200 at least forms the golden finger figure 205 positioned at the region for presetting golden finger, in circuit board
200 second surface 220 forms the glodclad wire 206 being connected with the first via hole 201.
Optionally, include before making the outer graphics of circuit board 200：
The second via hole 207 is bored on circuit board 200, and the second via hole 207 is sunk copper plating.
It should be noted that the second via hole refers to other via holes in addition to the first via hole.
Optionally, make the outer graphics of circuit board includes afterwards：
Solder mask is set on circuit board 200.
It is understood that after making the outer graphics of circuit board, solder mask is set on circuit boards, specifically may include
Coat, the step such as exposed and developed.
103rd, it is gold-plated on golden finger figure, produce golden finger.
In embodiments of the present invention, it is gold-plated on golden finger figure after making the outer graphics of circuit board, produce gold
Finger.
Optionally, include before gold-plated on golden finger figure：
In the non-gold-plated region pasting protective film of circuit board, diaphragm is dry film or plastic foil.
It should be noted that diaphragm in addition to for dry film and plastics, can also be wet film, specific limit is not done herein
It is fixed.
Optionally, include after golden finger area is gold-plated：
Remove diaphragm；
Remove glodclad wire.
It is understood that after golden finger area is gold-plated, it is also necessary to remove diaphragm, remove glodclad wire, it is ensured that
It is open circuit between each golden finger, is not in short circuit phenomenon when being easy to subsequently plug.
In embodiments of the present invention, via hole is first bored on circuit boards, carries out filling holes with resin after turning on hole metallization, then
Surface above filling holes with resin is electroplated, and makes golden finger figure, that is to say, that hole is not present on golden finger figure (if gold
Hole be present on finger figure, using this hole turn on gold-plated, then when follow-up golden finger easily occur and doing plug function, plug bullet
Piece snaps among the through hole of golden finger surface and causes loose contact), and glodclad wire is used as by the hole below golden finger figure
Hole, i.e.,：Non-porous no wire is carried out gold-plated on golden finger figure, only connects the second of circuit board by the hole below golden finger figure
Glodclad wire and golden finger figure carry out gold-plated conducting in the non-board of surface, the other one side of gold-plated rear mill off on golden finger figure
Glodclad wire, allow golden finger to open a way between each other and be easy to follow-up plug to occur without short circuit.
Embodiment two,
The embodiment of the present invention provides a kind of circuit board, it may include：The first surface of circuit board is provided with golden finger, golden hand
Refer to the second surface that circuit board is connected to by filling up the metallization buried via hole of resin.
It should be noted that the via hole of circuit board is by outer layer after electroplating, circuit board first surface and second surface
Opening is blocked corresponding to upper via hole, is turned into buried via hole, is no longer revealed.
There is the more detailed description of the circuit board of golden finger on the surface, refer to retouching in the embodiment of the present invention one
State.
In summary, the embodiment of the present invention uses the via hole of region processing first that golden finger is preset in circuit board,
The first via hole is filled up into resin again；The outer graphics of circuit board are made, is located in the first surface formation of circuit board and sets in advance
The golden finger figure in the region of deposit finger, the glodclad wire being connected with the first via hole is formed in the second surface of circuit board；
It is gold-plated on golden finger figure, the technical scheme of golden finger is produced, achieves following technique effect：Because elder generation adds in circuit board
Work via hole, the via hole are the hole of metallization, then carry out filling holes with resin, then make the outer graphics of circuit board so that electricity
The first surface of road plate forms golden finger figure, glodclad wire is formed in the second surface of circuit board, so, on golden finger figure
In the absence of hole and glodclad wire, then when being not in that follow-up golden finger does plug function, plug shell fragment snaps into golden finger surface and led to
Cause loose contact among hole, golden finger figure is connected by via hole with glodclad wire, further on golden finger figure
It is gold-plated, produce golden finger, be not in dew copper around golden finger, can meet make golden finger relevant criterion, also without
Need directly to draw gold-plated guide passage from golden finger figure.Therefore, the present invention solves makes present in golden finger in the prior art
The problem of.
In the above-described embodiments, the description to each embodiment all emphasizes particularly on different fields, and is not described in some embodiment
Part, may refer to the associated description of other embodiments.
It should be noted that for foregoing each method embodiment, in order to be briefly described, therefore it is all expressed as a series of
Combination of actions, but those skilled in the art should know, the present invention is not limited by described sequence of movement because according to
According to the present invention, some steps can use other orders or carry out simultaneously.Secondly, those skilled in the art should also know,
Embodiment described in this description belongs to preferred embodiment, and not necessarily the present invention must for involved action and module
Must.
The preparation method and circuit board of the circuit edge connector provided above the embodiment of the present invention have been carried out in detail
Introduce, but the explanation of above example is only intended to help to understand of the invention method and its core concept, should not be construed as pair
The limitation of the present invention.Those skilled in the art, according to the present invention thought, the invention discloses technical scope in,
The change or replacement that can be readily occurred in, it should all be included within the scope of the present invention.
Claims (10)
- A kind of 1. preparation method of circuit edge connector, it is characterised in that including：Bore the first via hole in the region that golden finger is preset in circuit board by the way of drilling；Hole metallization is turned on by described first, then first via hole is filled up into resin；The outer graphics of the circuit board are made, is formed in the first surface of the circuit board and presets golden finger positioned at described Region golden finger figure, form the glodclad wire that is connected with first via hole in the second surface of the circuit board；It is gold-plated on the golden finger figure, produce golden finger.
- 2. according to the method for claim 1, it is characterised in that the aperture of first via hole is no more than 4mm.
- 3. according to the method for claim 1, it is characterised in that bore the in the region that golden finger is preset in circuit board Include before one via hole：Lamination forms circuit board, and the outermost layer of the circuit board is false core plate, and the thickness of the false core plate is no more than 0.2mm.
- 4. according to the method for claim 2, it is characterised in that described to include the described first conducting hole metallization：Copper plating of being sunk to first via hole makes the first conducting hole metallization, the thickness of the metal layer of formation for 5~ Between 10um.
- 5. according to the method for claim 1, it is characterised in that described first via hole is filled up into resin to include：Under vacuum, using silk-screen filling holes with resin, first via hole is filled up into resin.
- 6. according to the method for claim 1, it is characterised in that wrapped before the outer graphics for making the circuit board Include：The second via hole is bored on the circuit board, and to the heavy copper plating of second via hole.
- 7. according to the method for claim 1, it is characterised in that wrapped after the outer graphics for making the circuit board Include：Solder mask is set on the circuit board.
- 8. according to the method for claim 1, it is characterised in that it is described it is gold-plated on the golden finger figure before include：In the non-gold-plated region pasting protective film of the circuit board, the diaphragm is dry film or plastic foil.
- 9. according to the method for claim 8, it is characterised in that described to include after the golden finger area is gold-plated：Remove the diaphragm；Remove the glodclad wire.
- A kind of 10. circuit board, it is characterised in that including：The first surface of circuit board is provided with golden finger, the golden finger is connected to institute by filling up the metallization buried via hole of resin State the second surface of circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410494457.2A CN105451469B (en) | 2014-09-24 | 2014-09-24 | A kind of preparation method of circuit edge connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410494457.2A CN105451469B (en) | 2014-09-24 | 2014-09-24 | A kind of preparation method of circuit edge connector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105451469A CN105451469A (en) | 2016-03-30 |
| CN105451469B true CN105451469B (en) | 2018-03-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410494457.2A Active CN105451469B (en) | 2014-09-24 | 2014-09-24 | A kind of preparation method of circuit edge connector |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111818739A (en) * | 2020-07-17 | 2020-10-23 | 苏州浪潮智能科技有限公司 | Method, system, equipment and medium for manufacturing golden finger on single surface |
| CN112822872A (en) * | 2021-01-31 | 2021-05-18 | 惠州中京电子科技有限公司 | Manufacturing method of lead-free residual golden finger |
| CN113260151B (en) * | 2021-04-09 | 2022-08-09 | 深圳市景旺电子股份有限公司 | Method for selectively plugging holes with resin and circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101330799A (en) * | 2007-06-22 | 2008-12-24 | 健鼎科技股份有限公司 | Non-conductor electroplating method for independent soldering pad |
| CN103052260A (en) * | 2011-10-14 | 2013-04-17 | 北大方正集团有限公司 | Golden finger processing method, printed circuit board manufacturing method, golden finger and printed circuit board |
| KR101360814B1 (en) * | 2012-03-20 | 2014-02-12 | 아페리오(주) | Device structure and method for fabricating a high-density package board |
| CN103813634A (en) * | 2012-11-12 | 2014-05-21 | 南亚科技股份有限公司 | Circuit board having tie bar buried therein and method of fabricating the same |
-
2014
- 2014-09-24 CN CN201410494457.2A patent/CN105451469B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101330799A (en) * | 2007-06-22 | 2008-12-24 | 健鼎科技股份有限公司 | Non-conductor electroplating method for independent soldering pad |
| CN103052260A (en) * | 2011-10-14 | 2013-04-17 | 北大方正集团有限公司 | Golden finger processing method, printed circuit board manufacturing method, golden finger and printed circuit board |
| KR101360814B1 (en) * | 2012-03-20 | 2014-02-12 | 아페리오(주) | Device structure and method for fabricating a high-density package board |
| CN103813634A (en) * | 2012-11-12 | 2014-05-21 | 南亚科技股份有限公司 | Circuit board having tie bar buried therein and method of fabricating the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105451469A (en) | 2016-03-30 |
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Address after: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Shennan Circuits Co., Ltd. |