CN104902683A - Step-groove circuit board and processing method thereof - Google Patents
Step-groove circuit board and processing method thereof Download PDFInfo
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- CN104902683A CN104902683A CN201410081094.XA CN201410081094A CN104902683A CN 104902683 A CN104902683 A CN 104902683A CN 201410081094 A CN201410081094 A CN 201410081094A CN 104902683 A CN104902683 A CN 104902683A
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Abstract
The invention discloses a step-groove circuit board and a processing method thereof so as to solve the technical problem that when producing the step-groove circuit board, of which the inner wall is metalized, a surface pattern on the bottom portion of a step groove is easy to be short-circuited due to poor protection effect of a protection film. The method comprises the following steps: forming a first circuit layer on a first surface of a first laminated board, and arranging a pad on the first surface; laminating a second laminated board and forming a second circuit layer on the outer side surface of the second laminated board; producing a metalized blind hole, the second circuit layer being connected with the first circuit layer through the metalized blind hole; laminating a third laminated board; producing a first groove to enable a portion of the second circuit layer to be exposed on the inner wall of the first groove, and forming a metalized coating layer on the inner wall of the first groove; and producing a second groove in the bottom surface of the first groove, exposing and removing the pad, forming a required step groove, and obtaining the step-groove circuit board.
Description
Technical field
The present invention relates to circuit board technology field, be specifically related to a kind of step groove circuit board and processing method thereof.
Background technology
At present, the application scenarios of the circuit board of band step groove gets more and more, more and more higher to the requirement of step groove.
In the step groove circuit board of some types, require the inwall of step groove to metallize, realize being connected with outer-layer circuit layer etc. by the metallization inwall of step groove to enable the surperficial pinup picture shape of step groove bottom surface.
The step groove circuit board manufacturing method of said structure is generally: the surperficial pinup picture shape of step groove bottom surface protected with diaphragm, carry out heavy copper and plating, and the inwall of step groove is formed metallization coating.Wherein, the diaphragm adopted is generally adhesive tape, green oil, dry film or wet film.
There is following defect in said method: said diaphragm, in heavy copper and electroplating process, effects on surface pinup picture shape can not play good protection.Because green oil, dry film or wet film can not stand the erosion of heavy copper liquid medicine, there will be obscission, then the part that comes off can be coated with copper, surface is caused to paste short circuit; Adhesive tape, under the immersion of heavy copper and electroplating liquid medicine, easily occur loosening causing copper plating phenomenon, and make surface paste short circuit, and adhesive tape can produce cull, cannot remove.
Summary of the invention
The embodiment of the present invention provides a kind of step groove circuit board and processing method thereof, with solve prior art make inwall metallized step groove circuit board time, because of diaphragm protection ineffective bring the technical problem easily making the short circuit of step groove lower surface pinup picture shape.
First aspect present invention provides a kind of processing method of step groove circuit board, comprising:
Form first line layer at the first surface of ground floor pressing plate, and arrange pad on first line layer, described pad is positioned at step groove region;
At the first surface of described ground floor pressing plate, pressing second layer pressing plate, and form the second line layer at the outer surface of described second layer pressing plate;
Described second layer pressing plate makes metalized blind vias, and described metalized blind vias is positioned at non-step groove region, and described second line layer is connected with described first line layer by described metalized blind vias;
At the outer surface pressing third layer pressing plate of described second layer pressing plate;
On described third layer pressing plate, processing is positioned at first fluting in step groove region, makes described second line layer part be revealed in the inwall of described first fluting, and form metallization coating on the inwall of described first fluting;
Make the second fluting in the bottom surface of described first fluting, appear and remove described pad, the step groove required for formation, obtained step groove circuit board.
Second aspect present invention provides a kind of step groove circuit board, the step groove of this step groove circuit board is made up of the first fluting and the second fluting be positioned at bottom described first fluting being positioned at step groove circuit board first face, the inwall of described first fluting has metallization coating, first internal layer circuit layer segment of described step groove circuit board is revealed in the bottom surface of described second fluting, second internal layer circuit layer segment of described step groove circuit board is revealed in the inwall of described first fluting and is connected with described metallization coating, described first internal layer circuit layer is connected by metalized blind vias with described second internal layer circuit layer.
Therefore the embodiment of the present invention adopts and makes step groove stage by stage, just metallize afterwards producing the first fluting, then, then make the second fluting in the bottom of the first fluting, the final technical scheme forming step groove, achieves following technique effect:
Surperficial pinup picture shape bottom step groove, by metalized blind vias between the line layer of place level and another sandwich circuit layer, be connected with another sandwich circuit layer said, and another sandwich circuit layer segment said is revealed in step groove inwall and be connected with the metallization coating on step groove inwall, thus, surperficial pinup picture shape is connected with the metallization coating on step groove inwall, meets the requirement of the type circuit board;
Wherein, during owing to metallizing, step groove makes shaping not yet completely, and the surperficial pinup picture shape bottom it does not reveal yet, and therefore, metallization process can not effects on surface pinup picture shape have any impact, and such as, can not cause surperficial pinup picture shape short circuit etc.; Solve in prior art because of the ineffective technical problem easily causing the short circuit of surperficial pinup picture shape of diaphragm protection.
Accompanying drawing explanation
In order to be illustrated more clearly in embodiment of the present invention technical scheme, be briefly described to the accompanying drawing used required in embodiment and description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the flow chart of the processing method of a kind of step groove circuit board that the embodiment of the present invention provides;
At the schematic diagram of each production phase when Fig. 2 a-2f is embodiment of the present invention making step groove circuit board.
Embodiment
The embodiment of the present invention provides a kind of step groove circuit board and processing method thereof, with solve prior art make inwall metallized step groove circuit board time, because of diaphragm protection ineffective bring the technical problem easily making the short circuit of step groove lower surface pinup picture shape.
The present invention program is understood better in order to make those skilled in the art person, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the embodiment of a part of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, should belong to the scope of protection of the invention.
Below by specific embodiment, be described in detail respectively.
Embodiment one,
Please refer to Fig. 1, the embodiment of the present invention provides a kind of processing method of step groove circuit board, can comprise:
110, form first line layer at the first surface of ground floor pressing plate, and arrange pad on first line layer, described pad is positioned at step groove region.
As shown in Figure 2 a, this step the first surface of ground floor pressing plate 21 capable become first line layer 2101.Ground floor pressing plate 21 comprises each layer of the non-step groove level of final obtained step groove circuit board, specifically can comprise two layers of surface metal level and at least one deck internal layer circuit layer, and the insulating barrier between above-mentioned each layer.The common process such as etching can be adopted, the coating metal layer of ground floor pressing plate 21 first surface is processed as first line layer 2101, this first line layer 2101 can comprise: the surperficial pinup picture shape 2102 being positioned at the step groove region that will form step groove, this surperficial pinup picture shape 2102 finally will be revealed in the bottom surface of step groove, can be used for being connected with electronic devices such as the chips installed in step groove.In this step, also pad 2103 is set in the step groove region of ground floor pressing plate 21 first surface, so that effects on surface pinup picture shape 2102 is protected.Said pad 2103 can be adhesive tape or rubber cushion or Teflon or silica gel etc.
120, at the first surface of described ground floor pressing plate, pressing second layer pressing plate, and form the second line layer at the outer surface of described second layer pressing plate.
As shown in Figure 2 b, this step at the first surface being provided with pad 2103 of ground floor pressing plate 21, pressing second layer pressing plate 22.And after pressing, the metal level of second layer pressing plate outer surface is processed as the second line layer 2201.In some embodiments, second layer pressing plate 22 can comprise an insulating barrier and a metal level, as shown in Figure 2 b; In other embodiment, second layer pressing plate 22 also can comprise at least one sandwich circuit layer and a metal level and the insulating barrier between above-mentioned each layer.Wherein, before pressing, preferentially at the position processing holding tank corresponding to pad 2103 of second layer pressing plate 22, so that pressing.
130, on described second layer pressing plate, make metalized blind vias, described metalized blind vias is positioned at non-step groove region, and described second line layer is connected with described first line layer by described metalized blind vias.
As shown in Figure 2 c, in this step in the above-mentioned making metalized blind vias 2202 of second layer pressing plate 22.Manufacturing process comprises boring and heavy copper and plating etc., no longer describes in detail.Made metalized blind vias 2202 should be positioned at the region beyond step groove, and this metalized blind vias 2202 one end is connected with the second line layer 2201, and the other end is connected with first line layer 2101.Further, first line layer 2101 also can include the connection line pasting circuit 2102 and described metalized blind vias 2202 for connecting described surface.
140, at the outer surface pressing third layer pressing plate of described second layer pressing plate.
As shown in Figure 2 d, in this step at the outer surface pressing third layer pressing plate 23 of second layer pressing plate 22.Third layer pressing plate 23 can comprise at least one deck internal layer circuit layer and one deck table surface metal-layer and the multilayer dielectric layer between above-mentioned each layer.After pressing, obtain multilayer laminate, this multilayer laminate comprises multilayer internal layer circuit layer and two layers of surface metal level.
150, on described third layer pressing plate, processing is positioned at first fluting in step groove region, makes described second line layer part be revealed in the inwall of described first fluting, and form metallization coating on the inwall of described first fluting.
As shown in Figure 2 e, in this step, make the first fluting 2301 in the step groove region of third layer pressing plate 23.Concrete, the dark miller skill of control can be adopted, in the step groove region of third layer pressing plate 23, make the first fluting 2301 that the degree of depth arrives at default stopping surface, described stopping surface is between the upper surface and the lower surface of described second line layer 2201 of described pad 2103, to make the part extending to step groove region of described second line layer 2201 be cut, thus part is revealed in the inwall of described first fluting 2301.But pad 2103 is not revealed in the first fluting 2301.Wherein, described first fluting 2301 is greater than described pad 2103.
In this step, also heavy copper and plating are carried out to the first fluting 2301, the inwall of the first fluting 2301 is formed metallization coating.The part being revealed in the first fluting 2301 inwall of the second line layer 2201 is connected with described metallization coating.Thus make, the metallization coating on these the first fluting 2301 inwalls, by the second line layer 2201, metalized blind vias 2202, and the connection line in first line layer 2101, be connected with described surperficial pinup picture shape 2102.Wherein, because the groove depth of the first fluting 2301 is limited, pad 2103 is not cruelly spilt, still kept apart by second layer pressing plate 22 between pad 2103 and the first fluting 2301, therefore, heavy copper and electroplating process effects on surface pinup picture shape 2102 are completely harmless, can not have any impact.
Wherein, in second layer pressing plate 22 and each line layer included by third layer pressing plate 23, need each line layer be connected with the metallization inwall of the first fluting 2301, in previous processing, step groove region can be extended to, makes, cut in the grooving operations of this step, thus be revealed in the inwall of the first fluting 2301, and then after heavy copper and plating, be connected with the metallization coating of row.
160, make the second fluting in the bottom surface of described first fluting, appear and remove described pad, the step groove required for formation, obtained step groove circuit board.
As shown in figure 2f, this step makes the second fluting 2302 in the bottom surface of the first fluting 2301.Concrete, open and comprise: adopt the dark miller skill of control, in the bottom surface of described first fluting 2301, make the second fluting 2302 that the degree of depth arrives at described pad 2103, described second fluting 2302 is greater than described pad 2103 but is less than described first fluting 2301; Remove the described pad 2103 be revealed in bottom described second fluting 2302, make described surperficial pinup picture shape 2102 be revealed in the bottom surface of described second fluting 2302, the step groove 24 required for described first fluting 2301 and described second fluting 2302 are formed jointly.Afterwards, also can comprise a decontamination step, by removals such as the pollutant of formation in step groove 24 and dust.
Thus, obtained step groove circuit board as shown in figure 2f.The step groove 24 of this step groove circuit board is made up of jointly the first fluting 2301 and the second fluting 2302, and metallization coating is only positioned on the inwall of the first fluting 2301, and the inwall of the second fluting 2302 is isolation material.Be revealed in the surperficial pinup picture shape 2102 of described step groove 24 bottom surface, by the connection line included by first line layer 2201 and metalized blind vias 2202 and the second line layer 2201, be connected with the metallization coating that the inwall of the first fluting 2301 is formed, and then each layer that also can be connected with the coating that metallizes realizes connecting.
In some embodiments of the invention, said method also can comprise: on the two sides of obtained step groove circuit board, forms the step of top layer line layer respectively, and carry out surface treatment, such as welding resistance, the gold-plated step waiting process, describes in detail herein no longer one by one.
To sum up, the embodiment of the invention discloses a kind of processing method of step groove circuit board, the method adopts and makes step groove stage by stage, just metallize afterwards producing the first fluting, then, make the second fluting in the bottom of the first fluting again, the final technical scheme forming step groove, achieves following technique effect:
Surperficial pinup picture shape bottom step groove, by metalized blind vias between the line layer of place level and another sandwich circuit layer, be connected with another sandwich circuit layer said, and another sandwich circuit layer segment said is revealed in step groove inwall and be connected with the metallization coating on step groove inwall, thus, surperficial pinup picture shape is connected with the metallization coating on step groove inwall, meets the requirement of the type circuit board; And then surperficial pinup picture shape, also by the metallization coating on step groove inwall, connects with each line layer of the connection of this metallization coating; Further, said connection is selectable, can realize being connected with required line layer, and unwanted line layer does not then connect.
During owing to metallizing, step groove makes shaping not yet completely, and the surperficial pinup picture shape bottom it does not reveal yet, and therefore, metallization process can not effects on surface pinup picture shape have any impact, and such as, can not cause surperficial pinup picture shape short circuit etc.; And, need not diaphragm protection be adopted, multiple technologies problems such as solving in prior art and easily cause the short circuit of surperficial pinup picture shape because diaphragm protection is ineffective, diaphragm remains.
Embodiment two,
Please refer to Fig. 2 f, the embodiment of the present invention provides step groove circuit board.
The step groove 24 of this step groove circuit board is made up of the first fluting 2301 and the second fluting 2302 be positioned at bottom described first fluting 2301 being positioned at step groove circuit board first face, the inwall of described first fluting 2301 has metallization coating, internal layer first line layer 2101 part of described step groove circuit board is revealed in the bottom surface of described second fluting 2302, internal layer second line layer 2201 part of described step groove circuit board is revealed in the inwall of described first fluting 2301 and is connected with described metallization coating, described internal layer first line layer 2101 is connected by metalized blind vias 2202 with described internal layer second line layer 2201.
In some embodiments of the invention, described internal layer first line layer 2101 comprises: the surperficial pinup picture shape 2102 being revealed in the bottom surface of described second fluting 2302, and, the connection line of circuit 2102 and described metalized blind vias 2202 is pasted for connecting described surface; Described metallization coating, by described internal layer second line layer 2201 and described metalized blind vias 2202 and described connection line, is connected with described surperficial pinup picture shape 2102.
In some embodiments of the invention, described first fluting 2301 is greater than described second fluting 2302.
To sum up, the embodiment of the invention discloses a kind of step groove circuit board, achieve following technique effect:
Surperficial pinup picture shape bottom step groove, by metalized blind vias between the line layer of place level and another sandwich circuit layer, be connected with another sandwich circuit layer said, and another sandwich circuit layer segment said is revealed in step groove inwall and be connected with the metallization coating on step groove inwall, thus, surperficial pinup picture shape is connected with the metallization coating on step groove inwall, meets the requirement of the type circuit board; And then surperficial pinup picture shape, also by the metallization coating on step groove inwall, connects with each line layer of the connection of this metallization coating; Further, said connection is selectable, can realize being connected with required line layer, and unwanted line layer does not then connect.
The structures shape of this step groove, when metallizing in manufacturing process, step groove makes shaping not yet completely, surperficial pinup picture shape bottom it does not reveal yet, and therefore, metallization process can not effects on surface pinup picture shape have any impact, such as, surperficial pinup picture shape short circuit etc. can not be caused; And, need not diaphragm protection be adopted, multiple technologies problems such as solving in prior art and easily cause the short circuit of surperficial pinup picture shape because diaphragm protection is ineffective, diaphragm remains.
In the above-described embodiments, the description of each embodiment is all emphasized particularly on different fields, in certain embodiment, there is no the part described in detail, can see the associated description of other embodiment.
It should be noted that, for aforesaid each embodiment of the method, in order to simple description, therefore it is all expressed as a series of combination of actions, but those skilled in the art should know, the present invention is not by the restriction of described sequence of movement, because according to the present invention, some step can adopt other order or carry out simultaneously.Secondly, those skilled in the art also should know, the embodiment described in specification all belongs to preferred embodiment, and involved action and module might not be that the present invention is necessary.
The step groove circuit board provided the embodiment of the present invention above and processing method thereof are described in detail, but the explanation of above embodiment just understands method of the present invention and core concept thereof for helping, and should not be construed as limitation of the present invention.Those skilled in the art, according to thought of the present invention, in the technical scope that the present invention discloses, the change that can expect easily or replacement, all should be encompassed within protection scope of the present invention.
Claims (8)
1. a processing method for step groove circuit board, is characterized in that, comprising:
Form first line layer at the first surface of ground floor pressing plate, and arrange pad on first line layer, described pad is positioned at step groove region;
At the first surface of described ground floor pressing plate, pressing second layer pressing plate, and form the second line layer at the outer surface of described second layer pressing plate;
Described second layer pressing plate makes metalized blind vias, and described metalized blind vias is positioned at non-step groove region, and described second line layer is connected with described first line layer by described metalized blind vias;
At the outer surface pressing third layer pressing plate of described second layer pressing plate;
On described third layer pressing plate, processing is positioned at first fluting in step groove region, makes described second line layer part be revealed in the inwall of described first fluting, and form metallization coating on the inwall of described first fluting;
Make the second fluting in the bottom surface of described first fluting, appear and remove described pad, the step groove required for formation, obtained step groove circuit board.
2. method according to claim 1, is characterized in that:
Described first line layer comprises: the surperficial pinup picture shape being revealed in the bottom surface of described step groove, and, the connection line of circuit and described metalized blind vias is pasted for connecting described surface;
The metallization coating that formed on the inwall of described first fluting, by described second line layer and described metalized blind vias and described connection line, is connected with described surperficial pinup picture shape.
3. method according to claim 2, is characterized in that, on described third layer pressing plate, processing is positioned at first fluting in step groove region, and the inwall making described second line layer part be revealed in described first fluting comprises:
Adopt the dark miller skill of control, on described third layer pressing plate, make be positioned at step groove region and the degree of depth arrive at default stopping surface first fluting, described stopping surface is between the upper surface and the lower surface of described second line layer of described pad, with the inwall making described second line layer part be revealed in described first fluting, but do not manifest described pad, wherein, described first fluting is greater than described pad.
4. method according to claim 2, is characterized in that, make the second fluting in the bottom surface of described first fluting, appear and remove described pad, the step groove required for formation comprises:
Adopt the dark miller skill of control, in the bottom surface of described first fluting, make the second fluting that the degree of depth arrives at described pad, described second fluting is greater than described pad but is less than described first fluting;
Remove the described pad be revealed in bottom described second fluting, make described surperficial pinup picture shape be revealed in the bottom surface of described second fluting, described first fluting and the step groove required for the common formation of described second fluting.
5. method according to any one of claim 1 to 4, is characterized in that, also comprises:
On the two sides of obtained step groove circuit board, form top layer line layer respectively.
6. a step groove circuit board, is characterized in that:
The step groove of this step groove circuit board is made up of the first fluting and the second fluting be positioned at bottom described first fluting being positioned at step groove circuit board first face, the inwall of described first fluting has metallization coating, the internal layer first line layer segment of described step groove circuit board is revealed in the bottom surface of described second fluting, the internal layer second line layer part of described step groove circuit board is revealed in the inwall of described first fluting and is connected with described metallization coating, and described internal layer first line layer is connected by metalized blind vias with described internal layer second line layer.
7. step groove circuit board according to claim 6, is characterized in that:
Described internal layer first line layer comprises: the surperficial pinup picture shape being revealed in the bottom surface of described second fluting, and, the connection line of circuit and described metalized blind vias is pasted for connecting described surface;
Described metallization coating, by described internal layer second line layer and described metalized blind vias and described connection line, is connected with described surperficial pinup picture shape.
8. step groove circuit board according to claim 6, is characterized in that:
Described first fluting is greater than described second fluting.
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| CN201410081094.XA CN104902683B (en) | 2014-03-06 | 2014-03-06 | Step groove circuit board and its processing method |
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| CN201410081094.XA CN104902683B (en) | 2014-03-06 | 2014-03-06 | Step groove circuit board and its processing method |
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| CN108990274A (en) * | 2018-08-27 | 2018-12-11 | 生益电子股份有限公司 | A kind of PCB with multistage stepped groove |
| CN109041459A (en) * | 2018-08-31 | 2018-12-18 | 生益电子股份有限公司 | A kind of production method and PCB of slot bottom figure stepped groove |
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