CN108834336A - A kind of production method of PCB - Google Patents
A kind of production method of PCB Download PDFInfo
- Publication number
- CN108834336A CN108834336A CN201810981740.6A CN201810981740A CN108834336A CN 108834336 A CN108834336 A CN 108834336A CN 201810981740 A CN201810981740 A CN 201810981740A CN 108834336 A CN108834336 A CN 108834336A
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- Prior art keywords
- slot
- substrate
- groove
- horizontal cross
- pcb
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention relates to board production technical fields, disclose the production method of PCB a kind of, include the following steps：S1, offer offer first substrate, the second substrate, the third substrate and tetrabasal for offering the second through slot of the first through slot, make line pattern on the surface of tetrabasal；S2, first substrate, the second substrate, third substrate and tetrabasal are successively overlapped, multi-layer board is made in pressing；S3, heavy copper, electroplating processes are carried out to multi-layer board, makes cell wall and the slot bottom metallization of the first groove；The slot bottom of the first groove at the top of S4, the second through slot of mill off forms the second groove；S5, third through slot is opened up in the slot bottom of the second groove.The production method of PCB of the present invention, realizes special-shaped component and a variety of different size component attachments, reduces the occupied space of PCB, makes line pattern in the slot bottom of stepped groove, is conducive to the further micromation of PCB.
Description
Technical field
The present invention relates to board production technical field more particularly to a kind of production methods of PCB.
Background technique
Printed circuit board (Printed circuit board, abbreviation PCB) is the offer of electronic component electrical connection
Person.Before printed circuit board appearance, the interconnection between electronic component is all to be directly connected to by electric wire and form complete line
Road.In the present age, circuit board is intended only as effective experimental tool and exists, and printed circuit board has accounted in the electronics industry
According to the status of empery.
It is required to meet highly dense attachment or the crimping of printed circuit board, stepped groove is outputed in design on multilayer printed circuit board
For mode to reduce assembly volume, current stepped groove design shows as single order metallization or non-metallic stepped groove, applies
Microwave radio product is embedded to power amplifier component in stepped locations, and existing design has the following disadvantages：
1) single order ladder groove shape is single, cannot achieve with abnormally-structured component attachment；
2) single metallization or non-metallic stepped groove not can be implemented simultaneously the extraordinary group reload request of component, or integrated
Other more power amplifying devices.
Therefore the production method of PCB a kind of is needed, making, there is the stepped groove of multi-step to solve the above problems.
Summary of the invention
The purpose of the present invention is to provide the production methods of PCB a kind of, to form the ladder with multi-step on PCB
Slot realizes special-shaped component and a variety of different size component attachments, reduces the occupied space of PCB, in the slot bottom system of stepped groove
Make line pattern, is conducive to the further micromation of PCB.
For this purpose, the present invention uses following technical scheme：
A kind of production method of PCB, includes the following steps：
S1, offer offer the first substrate of the first through slot, the second substrate, the third substrate for offering the second through slot and
Tetrabasal makes line pattern on the surface of the tetrabasal；
S2, the first substrate, the second substrate, third substrate and tetrabasal are successively overlapped, make first through slot with
The second substrate forms the first groove, and the line pattern on the tetrabasal is located at the second through slot bottom of the third substrate
Second through slot in portion, the third substrate is located at below first groove, and multi-layer board is made in pressing；
S3, heavy copper, electroplating processes are carried out to the multi-layer board, makes cell wall and the slot bottom metallization of first groove；
The slot bottom of first groove at the top of second through slot described in S4, mill off forms the second groove；
S5, third through slot is opened up in the slot bottom of second groove.
Specifically, firstly, three-level stepped groove is arranged on the multi-layer board of pressing, it is able to achieve the component with polymorphic structure
Attachment, moreover it is possible to realize that the component of different structure fits together and be mounted on PCB, the component of polymorphic structure or assembling
Component is placed into stepped groove, not only takes full advantage of the space of stepped groove, is also saved the installation space of PCB, is contracted significantly
The small assembly volume of PCB；Secondly, the cell wall of the first groove is made to metallize, convenient for the attachment of component, be conducive to component
Signal shielding is carried out, so that the slot bottom of the first groove is metallized, improves the radiating efficiency of component；Finally, the slot of the second groove
Bottom is equipped with line pattern, is conducive to the further micromation of PCB.
As optimal technical scheme, the horizontal cross-section projection of first groove covers the horizontal cross-section of second groove
Projection.
As optimal technical scheme, include between step S2 and step S3：Step S21, in the slot of first groove
Bottom processes via hole, and the via hole does not pass through second through slot.
As optimal technical scheme, in step s3, heavy copper, electroplating processes is carried out to the multi-layer board, make the via hole
The via hole.
Specifically, via hole is processed in the slot bottom of the first groove, and makes the via hole of via hole by heavy copper, plating,
The via hole of the via hole is for connecting multiple-plate inner line figure.
As optimal technical scheme, the horizontal cross-section projection of second groove covers the horizontal cross-section of the third through slot
Projection.
Specifically, the horizontal section area of the first groove, the second groove and third through slot is sequentially reduced, and forms T-shape rank
Terraced slot is suitable for installation heterotype element device.
As optimal technical scheme, in step s 2, overlaps and be provided between the second substrate and the first substrate
The prepreg of through slot, and the horizontal cross-sectional profile of the through slot on the prepreg is logical greater than first on the first substrate
The horizontal cross-sectional profile of slot.
As optimal technical scheme, in step s 2, overlaps and be provided between the third substrate and the second substrate
The prepreg of through slot, and the horizontal cross-sectional profile of through slot is greater than the second through slot on the third substrate on the prepreg
Horizontal cross-sectional profile.
As optimal technical scheme, in step s 2, overlaps and be provided between the third substrate and the tetrabasal
The prepreg of through slot, and the horizontal cross-sectional profile of through slot is greater than the second through slot on the third substrate on the prepreg
Horizontal cross-sectional profile.
Specifically, the prepreg is used to be bonded third substrate and the second substrate and third substrate and tetrabasal,
So that the through slot on prepreg is slightly larger than the second through slot of third substrate, the gummosis of pressing prepreg is avoided to flow into the second through slot
It is interior.
Specifically, the prepreg can may be multiple prepregs for a prepreg, according to actual
It presses situation and overlaps prepreg.
As optimal technical scheme, the first substrate, the second substrate, third substrate and tetrabasal be core plate and/or
The daughter board as made of the pressing of multiple core plates.
Beneficial effects of the present invention：Firstly, three-level stepped groove is arranged on the multi-layer board of pressing, being able to achieve has abnormity knot
The attachment of the component of structure, moreover it is possible to it realizes that the component of different structure fits together and is mounted on PCB, first device of polymorphic structure
Part or the component of assembling are placed into stepped groove, not only take full advantage of the space of stepped groove, and the installation for also saving PCB is empty
Between, greatly reduce the assembly volume of PCB；Secondly, making the cell wall of the first groove metallize, convenient for the attachment of component, favorably
In carrying out signal shielding to component, so that the slot bottom of the first groove is metallized, improve the radiating efficiency of component；Finally, the
The slot bottom of two grooves is equipped with line pattern, is conducive to the further micromation of PCB.
Detailed description of the invention
Fig. 1 is the production method flow chart of PCB described in the embodiment of the present invention；
Fig. 2 is that first substrate described in the embodiment of the present invention, the second substrate, third substrate and tetrabasal closed state show
It is intended to；
Fig. 3 is described in the embodiment of the present invention to the status diagram after multi-layer board copper facing；
Fig. 4 is the status diagram that stepped groove is formed on multi-layer board described in the embodiment of the present invention.
In figure：
1, tetrabasal；2, third substrate；3, the second substrate；4, first substrate；5, the first groove；6, the second groove；7,
Third through slot；8, layers of copper；9, the second through slot；10, the first through slot；11, prepreg.
Specific embodiment
To further illustrate the technical scheme of the present invention below with reference to the accompanying drawings and specific embodiments.It is understood that
It is that specific embodiment described herein is used only for explaining the present invention rather than limiting the invention.It further needs exist for illustrating
, only the parts related to the present invention are shown for ease of description, in attached drawing and it is not all.
As shown in Figure 1, a kind of production method of PCB, includes the following steps：
It offers the first substrate 4 of the first through slot 10, the second substrate 3 Step 1: providing, offer the of the second through slot 9
Three substrates 2 and tetrabasal 1 make line pattern on the surface of the tetrabasal 1.
The first substrate 4, the second substrate 3, third substrate 2 and tetrabasal 1 are respectively core plate or by multiple core plate pressures
Daughter board made of conjunction can also select core plate and/or daughter board to be combined according to design requirement, to obtain the layers of copper for meeting demand
Quantity；Also, the combination of these core plates and/or daughter board can first be pressed into force fit plate in this step, can also be in subsequent step
It is pressed together after overlapping in rapid.The first through slot 10 on first substrate 4 and the second through slot 9 on third substrate 2 can pass through milling
Bed is processed.
In the present embodiment, the horizontal cross-section projection of the second through slot 9 on third substrate 2 is located at the first of first substrate 4
In the horizontal cross-section drop shadow spread of through slot 10.In addition, the upper surface production of tetrabasal 1 has line pattern, but not only limit to
Line pattern is made in the upper surface of tetrabasal 1, lower surface can also make line pattern.
In the present embodiment, first through slot 10 is provided on first substrate 4, in addition, can also basis on first substrate 4
The quantity of attachment component is provided with multiple first through slots 10.
Step 2: the first substrate 4, the second substrate 3, third substrate 2 and tetrabasal 1 are successively overlapped, such as Fig. 2 institute
Show, so that the first through slot 10 and the second substrate 3 on first substrate 4 is formed the first groove 5, the line map on the tetrabasal 1
Morpheme is located at first groove 5 in 9 bottom of the second through slot of the third substrate 2, the second through slot 9 of the third substrate 2
Multi-layer board is made in lower section, pressing.Wherein, filling resistance blob of viscose may be selected in the first through slot 10 and the second through slot 9, half when avoiding pressing
Cured sheets flow into slot.
Specifically, the third substrate 2 is provided with the second through slot 9, first substrate 4, the second substrate 3, third substrate 2 and the 4th
When substrate 1 is superimposed together, the horizontal section area of second through slot 9 is less than the horizontal section area of first groove 5.
Specifically, the prepreg 11 for being provided with through slot is overlapped between the second substrate 3 and the first substrate 4, and
The horizontal cross-sectional profile of through slot on the prepreg 11 is greater than the horizontal cross-section of the first through slot 10 on the first substrate 4
Profile.
Overlapping is provided with the prepreg 11 of through slot between the third substrate 2 and the second substrate 3, and on prepreg 11
The horizontal cross-sectional profile of through slot is greater than the horizontal cross-sectional profile of the second through slot 9 on third substrate 2.
Overlapping is provided with the prepreg 11 of through slot between the third substrate 2 and tetrabasal 1, and on prepreg 11
The horizontal cross-sectional profile of through slot is greater than the horizontal cross-sectional profile of the second through slot 9 on third substrate 2.Above-mentioned chamfered shape is identical.
Above-mentioned prepreg 11 can be a prepreg 11 and be also possible to multiple prepregs being superimposed together
11, prepreg 11 is overlapped according to actual pressing situation.
Step 3: the slot bottom in first groove 5 processes via hole, the via hole does not pass through second through slot 9.
As shown in figure 3, in the present embodiment, processing a via hole in the slot bottom of the first groove 5, passing through the side of machine drilling
Formula processes via hole.In addition, the number of the via hole of processing is not limited solely to one, it can also be multiple.
Step 4: carrying out heavy copper, electroplating processes to the multi-layer board, make the cell wall and slot bottom metal of first groove 5
Change, make the via hole of via hole, forms hole wall copper.
As shown in figure 3, so that the cell wall of the first groove 5 is metallized with slot bottom the layers of copper 8 to be formed and be connected to by heavy copper, plating,
Cell wall, which metallizes, realizes the attachment of component, is conducive to carry out signal shielding to component, makes the slot bottom metal of the first groove 5
Change, improves the radiating efficiency of component.
Make the via hole of via hole by heavy copper, plating, the via hole of the via hole is for connecting multiple-plate internal layer
Line pattern.The layers of copper 8 is connected to hole wall copper, can also make line pattern in the layers of copper 8 of the slot bottom of the first groove 5,
And each sandwich circuit image hotpoint electrical communication on the line pattern and multi-layer board on 5 slot bottom of the first groove.
Step 5: the slot bottom of first groove 5 at 9 top of the second through slot described in mill off, forms the second groove 6.
Specifically, as shown in figure 4, the level that the horizontal cross-section projection of second groove 6 is located at first groove 5 is cut
In the drop shadow spread of face, the cell wall of the second groove 6 is non-metallic, and slot bottom has line pattern, and component is placed in the second groove 6
And connect with line pattern, conducive to the further micromation of PCB.
Before the slot bottom of first groove 5 at 9 top of the second through slot described in mill off, heavy copper, plating are carried out to multi-layer board, had
Conducive to the line pattern of protection 6 slot bottom of the second groove, and it is also ensured that the cell wall of the second groove 6 is non-metallic, improve plus
The efficiency of work stepped groove.
In the present embodiment, the lower section of first groove 5 is equipped with second groove 6, in the lower section of the first groove 5
Multiple second grooves 6 can be set.
Step 6: the slot bottom in second groove 6 opens up third through slot 7.
Specifically, as shown in figure 4, the level that the horizontal cross-section projection of the third through slot 7 is located at second groove 6 is cut
In the range of the projection of face, the cell wall of third through slot 7 is non-metallic, it can be achieved that the assembling of component sunk, greatly reduces PCB's
Assemble volume.
In the present embodiment, the lower section of second groove 6 is equipped with a third through slot 7, in the lower section of the second groove 6
Multiple third through slots 7 can be set.
In the present embodiment, the horizontal section area of the first groove 5, the second groove 6 and third through slot 7 is sequentially reduced, shape
At T-shape stepped groove, it is suitable for installation heterotype element device, the metallization of cell wall and slot bottom or non-metallic not only increases component
Power amplification efficiency, also improve the transmission speed of signal, reduce the loss of signal.In addition, stepped groove on PCB not only office
It is limited to three-level stepped groove, can also is stepped groove more than three-level.
The stepped groove opened up on PCB in the present embodiment can realize the component of polymorphic structure and a variety of various sizes of
The attachment of component while reducing PCB occupied space, improves the signal transmission speed for the component being mounted in stepped groove
Degree, reduces the loss of signal, and the production method simple possible of this PCB, has production.
Obviously, the above embodiment of the present invention is just for the sake of clearly illustrating examples made by the present invention, and being not is pair
The restriction of embodiments of the present invention.For those of ordinary skill in the art, may be used also on the basis of the above description
To make other variations or changes in different ways.There is no necessity and possibility to exhaust all the enbodiments.It is all this
Made any modifications, equivalent replacements, and improvements etc., should be included in the claims in the present invention within the spirit and principle of invention
Protection scope within.
Claims (9)
1. a kind of production method of PCB, which is characterized in that include the following steps：
S1, offer offer first substrate, the second substrate, the third substrate and the 4th for offering the second through slot of the first through slot
Substrate makes line pattern on the surface of the tetrabasal；
S2, the first substrate, the second substrate, third substrate and tetrabasal are successively overlapped, make first through slot with it is described
The second substrate forms the first groove, and the line pattern on the tetrabasal is located at the second through slot bottom of the third substrate,
Second through slot of the third substrate is located at below first groove, and multi-layer board is made in pressing；
S3, heavy copper, electroplating processes are carried out to the multi-layer board, makes cell wall and the slot bottom metallization of first groove；
The slot bottom of first groove at the top of second through slot described in S4, mill off forms the second groove；
S5, third through slot is opened up in the slot bottom of second groove.
2. the production method of PCB according to claim 1, which is characterized in that the horizontal cross-section of first groove projects
Cover the horizontal cross-section projection of second groove.
3. the production method of PCB according to claim 2, which is characterized in that include between step S2 and step S3：Step
Rapid S21, the slot bottom processing via hole in first groove, the via hole do not pass through second through slot.
4. the production method of PCB according to claim 3, which is characterized in that in step s3, carried out to the multi-layer board
Heavy copper, electroplating processes, make the via hole of the via hole.
5. the production method of PCB according to claim 1, which is characterized in that the horizontal cross-section of second groove projects
Cover the horizontal cross-section projection of the third through slot.
6. the production method of PCB according to claim 1, which is characterized in that in step s 2, the second substrate with
Overlapping is provided with the prepreg of through slot between the first substrate, and the horizontal cross-sectional profile of the through slot on the prepreg is big
In the horizontal cross-sectional profile of the first through slot on the first substrate.
7. the production method of PCB according to claim 1, which is characterized in that in step s 2, the third substrate with
Overlapping is provided with the prepreg of through slot between the second substrate, and the horizontal cross-sectional profile of through slot is greater than on the prepreg
The horizontal cross-sectional profile of second through slot on the third substrate.
8. the production method of PCB according to claim 1, which is characterized in that in step s 2, the third substrate with
Overlapping is provided with the prepreg of through slot between the tetrabasal, and the horizontal cross-sectional profile of through slot is greater than on the prepreg
The horizontal cross-sectional profile of second through slot on the third substrate.
9. the production method of PCB according to claim 1, which is characterized in that the first substrate, the second substrate, third
Substrate and tetrabasal are core plate and/or the daughter board as made of the pressing of multiple core plates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810981740.6A CN108834336B (en) | 2018-08-27 | 2018-08-27 | A kind of production method of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810981740.6A CN108834336B (en) | 2018-08-27 | 2018-08-27 | A kind of production method of PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108834336A true CN108834336A (en) | 2018-11-16 |
| CN108834336B CN108834336B (en) | 2019-11-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810981740.6A Active CN108834336B (en) | 2018-08-27 | 2018-08-27 | A kind of production method of PCB |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1258190A (en) * | 1998-12-23 | 2000-06-28 | 三星电机株式会社 | Method for mfg. printed circuit board |
| CN101697660A (en) * | 2009-10-28 | 2010-04-21 | 深南电路有限公司 | Method for processing stepped groove bottom patterned circuit board |
| CN202310279U (en) * | 2011-10-17 | 2012-07-04 | 广州杰赛科技股份有限公司 | Graphical printed board at bottom of dual-step ladder groove |
| US20130097856A1 (en) * | 2007-05-30 | 2013-04-25 | Shinko Electric Industries Co., Ltd. | Method of fabricating a wiring board |
| CN103391682A (en) * | 2012-05-10 | 2013-11-13 | 深南电路有限公司 | Method for processing PCB with step groove |
| CN104902683A (en) * | 2014-03-06 | 2015-09-09 | 深南电路有限公司 | Step-groove circuit board and processing method thereof |
| CN105722302A (en) * | 2014-12-04 | 2016-06-29 | 深南电路有限公司 | Circuit board with embedded boss metal base, and machining method for circuit board |
| CN108112193A (en) * | 2016-11-24 | 2018-06-01 | 杭州天锋电子有限公司 | A kind of stepped circuit board manufacturing process |
-
2018
- 2018-08-27 CN CN201810981740.6A patent/CN108834336B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1258190A (en) * | 1998-12-23 | 2000-06-28 | 三星电机株式会社 | Method for mfg. printed circuit board |
| US20130097856A1 (en) * | 2007-05-30 | 2013-04-25 | Shinko Electric Industries Co., Ltd. | Method of fabricating a wiring board |
| CN101697660A (en) * | 2009-10-28 | 2010-04-21 | 深南电路有限公司 | Method for processing stepped groove bottom patterned circuit board |
| CN202310279U (en) * | 2011-10-17 | 2012-07-04 | 广州杰赛科技股份有限公司 | Graphical printed board at bottom of dual-step ladder groove |
| CN103391682A (en) * | 2012-05-10 | 2013-11-13 | 深南电路有限公司 | Method for processing PCB with step groove |
| CN104902683A (en) * | 2014-03-06 | 2015-09-09 | 深南电路有限公司 | Step-groove circuit board and processing method thereof |
| CN105722302A (en) * | 2014-12-04 | 2016-06-29 | 深南电路有限公司 | Circuit board with embedded boss metal base, and machining method for circuit board |
| CN108112193A (en) * | 2016-11-24 | 2018-06-01 | 杭州天锋电子有限公司 | A kind of stepped circuit board manufacturing process |
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| Publication number | Publication date |
|---|---|
| CN108834336B (en) | 2019-11-29 |
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