CN103124469A - Step printed circuit board and manufacture method of the step printed circuit board - Google Patents
Step printed circuit board and manufacture method of the step printed circuit board Download PDFInfo
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- CN103124469A CN103124469A CN2011103692299A CN201110369229A CN103124469A CN 103124469 A CN103124469 A CN 103124469A CN 2011103692299 A CN2011103692299 A CN 2011103692299A CN 201110369229 A CN201110369229 A CN 201110369229A CN 103124469 A CN103124469 A CN 103124469A
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- step trough
- printed circuit
- circuit board
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- 238000000034 method Methods 0.000 title claims abstract description 69
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000012545 processing Methods 0.000 claims abstract description 21
- 238000003801 milling Methods 0.000 claims abstract description 16
- 238000005516 engineering process Methods 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 9
- 238000005530 etching Methods 0.000 claims abstract description 8
- 229910052802 copper Inorganic materials 0.000 claims description 29
- 239000010949 copper Substances 0.000 claims description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 27
- 238000003475 lamination Methods 0.000 claims description 18
- 238000004381 surface treatment Methods 0.000 claims description 8
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 6
- 230000003628 erosive effect Effects 0.000 claims description 6
- 238000002203 pretreatment Methods 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 3
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 3
- 239000001569 carbon dioxide Substances 0.000 claims description 3
- 238000000608 laser ablation Methods 0.000 claims description 3
- 238000001020 plasma etching Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 230000007547 defect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 8
- 241000894007 species Species 0.000 description 8
- 238000004590 computer program Methods 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 230000002950 deficient Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 239000000741 silica gel Substances 0.000 description 5
- 229910002027 silica gel Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 239000000499 gel Substances 0.000 description 3
- 210000002421 cell wall Anatomy 0.000 description 2
- 150000001879 copper Chemical class 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 241000931705 Cicada Species 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
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Abstract
The invention belongs to the technical field of printed circuit board and in particular to a step printed circuit board and a manufacture method of the step printed circuit board. Deep milling processing technology is controlled, step grooves are roughly manufactured at preset step groove positions on a multilayer printed circuit board manufactured by an outer layer circuit, and then the roughly manufactured step grooves are further exacted to a preset depth through etching technology. The step printed circuit board and the manufacture method of the step printed circuit board have the advantages of being simple in process, easy to control, high in processing reliability and wide in application range, step groove lateral walls manufactured by the method are flat and little in defects, and accordingly high yield can be ensured. Simultaneously, the method does not need to consume auxiliary materials, and manufactured cost is saved.
Description
Technical field
The present invention relates to the printed-board technology field, particularly species stage printed circuit board (PCB) and preparation method thereof.
Background technology
In prior art, the ladder printed circuit board (PCB) refers to have the multilayer board of step trough.Multilayer board comprises conventional ladder printed circuit board (PCB) and special ladder printed circuit board (PCB).When at present making special ladder printed circuit board (PCB), often adopt that lazy flow prepreg (low-flow PP) is windowed, utilize control deeply to mill after lamination or the laser cutting mode is made step trough.But use low-flow PP easily insufficient because of gummosis in lamination process, inhomogeneously cause tack coat local cavity or groove position distortion.
In prior art, utilize the damping characteristics of " aluminium flake+silica gel piece ", gummosis is evenly distributed, weaken simultaneously the horizontal stretch dynamics of silica gel piece, avoid lamination cavity or groove position distortion.But the method is strict to laminating technology parameter, fluting dimensional requirement, and technological process is comparatively complicated, has the defectives such as step trough copper face removing residual glue mark, cell wall be irregular, can consume the supplies such as aluminium flake, silica gel piece simultaneously.
In prior art, also utilize the processing method at padded coamings such as internal layer fluting filling gels, can process cell wall neat, the accurate step trough of the degree of depth.But use the method for the padded coamings such as filling gel, may be because of silica gel and step trough size matching deficiency, exist space or dislocation to cause the defectives such as step trough distortion after lamination, pressing warpage, the excessive excessive glue in groove position or gummosis deficiency.Simultaneously, at size, the vpg connection of step trough, certain limitation is arranged, and more difficultly realize that there is the processing of the stepped plate of via in the step trough zone.
Summary of the invention
Species stage printed circuit board (PCB) that the embodiment of the present invention provides and preparation method thereof in order to process reliability and the rate of finished products that improves the ladder printed circuit board (PCB), and reduces costs.
The embodiment of the present invention provides the manufacture method of a species stage printed circuit board (PCB), comprising:
Deeply mill processing technology by controlling, the elementary step trough of predetermined step groove position making on multilayer board, the groove depth of described elementary step trough is less than predetermined step trough groove depth;
Adopt etch process, the degree of depth of deepening described elementary step trough reaches predetermined step trough groove depth;
To reaching predetermined step trough groove depth, and complete the multilayer board that outer circuit is made, carry out surface treatment and mill sheet metal forming.
Accordingly, the embodiment of the present invention also provides a species stage printed circuit board (PCB), adopts said method to make.
The embodiment of the present invention provides species stage printed circuit board (PCB) and preparation method thereof, deeply mill processing technology by controlling, make roughly step trough in the predetermined step groove position of completing on the multilayer board that outer circuit makes, more further be accurate to desired depth by the step trough that etch process will be made roughly.The method flow process is simple, be easy to control, and process reliability is high, applied widely, and is smooth due to the step trough sidewall that adopts the method to make, defective is few, so can guarantee higher rate of finished products.Simultaneously, the method does not need to consume auxiliary material, has saved cost of manufacture.
Description of drawings
Fig. 1 is the manufacture method schematic flow sheet of ladder printed circuit board (PCB) in the embodiment of the present invention;
Fig. 2 is the schematic diagram of the structure of multilayer board in the embodiment of the present invention;
Fig. 3 is the structural representation of processing for the first time in the embodiment of the present invention after step trough;
Fig. 4 is the structural representation of processing for the second time in the embodiment of the present invention after step trough;
Fig. 5 is the manufacture method schematic flow sheet of ladder printed circuit board (PCB) in another embodiment of the present invention;
Fig. 6 is that in the embodiment of the present invention, the step trough position exists when leading the copper hole, makes the schematic diagram of step trough.
Embodiment
Below in conjunction with Figure of description, the embodiment of the present invention is described in further detail.
The embodiment of the present invention provides the manufacture method of a species stage printed circuit board (PCB), as shown in Figure 1, comprises the following steps:
Concrete, when making the ladder printed circuit board (PCB), need to first make a plurality of printed circuit board (PCB) laminations; With a plurality of printed circuit board (PCB) laminations, carry out the lamination lamination, form multilayer board.And, sink after copper electroplates on the multilayer board surface, make outer circuit.As shown in Figure 2, take four layer printed circuit boards as example, after every layer printed circuit board 1 is completed the internal layer circuit making, place with other printed circuit board (PCB) laminations by dielectric layer 2 and carry out the lamination lamination, form multilayer board.Because the more common prepreg of the cost of lazy flow prepreg exceeds 2～3 times, and the restriction of pressing parameter is tighter, 2 common prepregs of need of dielectric layer herein, saved production cost, reduce technology difficulty, avoided simultaneously the insufficient and inhomogeneous problem of lazy flow prepreg gummosis.Better, the thickness of this dielectric layer 2 is 0.35mm ± 0.05mm.
If make via hole according to the circuit design needs, can hole to this multilayer board after forming multilayer board this moment, forms through hole; The copper that sinks is for the first time electroplated, and realizes the conducting of this through hole; Then adopt resin material to clog this through hole.Before making outer circuit, the copper that sinks is for the second time electroplated.
Then, utilization can be controlled the milling machine of milling depth, be preferably the high accuracy milling machine that accurately to control milling depth, carry out Milling Process in the predetermined step groove position of completing on the multilayer board that outer circuit makes, obtain elementary step trough, the groove depth of this step trough is less than the predetermined step groove deep.For example, as shown in Figure 3, when using high accuracy milling machine processing step trough, milling extremely approaches but does not injure the step trough copper face 3 that needs reservation, control thickness of dielectric layers h residual on the step trough copper face less than the predetermined thickness threshold value, as 100um, namely the difference of the groove depth of elementary step trough and predetermined step groove deep is less than 100um.
By above-mentioned description as can be known, the manufacture method of the ladder printed circuit board (PCB) that the use embodiment of the present invention provides, deeply mill processing technology by controlling, make roughly step trough in the predetermined step groove position of completing on the multilayer board that outer circuit makes, more further be accurate to desired depth by the step trough that etch process will be made roughly.The method flow process is simple, be easy to control, and process reliability is high, applied widely, and is smooth due to the step trough sidewall that adopts the method to make, defective is few, so can guarantee higher rate of finished products.Simultaneously, the method does not need to consume auxiliary material, has saved cost of manufacture.
Below by specific embodiment, the method that the embodiment of the present invention provides is described in detail.As shown in Figure 5, when the method that the use embodiment of the present invention provides is made the ladder printed circuit board (PCB), carry out following steps:
Above-mentioned steps 505 is also nonessential, if when not carrying out step 505, the mode that available highly basic is stung erosion in step 508 is carried out etching to elementary step trough.In addition, the order between step 506 and step 507,508 needn't limit successively, can make outer circuit after the step trough moulding again.Sometimes some clients can require, and the copper surface in step trough also need make line pattern, so implementation step 505 again after step 508 can be made the outer-layer circuit figure simultaneously with the outer PCB multi-layer sheet outer surface of step trough.
The embodiment of the present invention also is applicable to the making that there is the ladder printed circuit board (PCB) of through hole (such as being the copper via, this sentences and leads the copper hole is example) in the step trough position.Need to prove that the mode of filling gel or " aluminium flake+silica gel piece " in the employing correlation technique can't be applicable to step trough position existence and lead the designing requirement in copper hole.As shown in Figure 6, when the copper hole is led in step trough position existence, use the described method of above-described embodiment, through after above-mentioned steps 507, at the copper post 4 of the residual certain altitude of step trough copper face meeting.Owing to only removing dielectric layer in step 508, so this copper post 4 still can keep after step 508, but in the surface treatment of follow-up step 509 of carrying out, can be reduced or eliminate, such as sandblasting and chemical microetch pre-treatment etc. of the volcanic ash nog plate pre-treatment of anti-welding procedue, chemical gilding processing procedure.So when having the design of leading the copper hole in the step trough position, suggestion is carried out above-mentioned steps 507 with the high accuracy milling machine that can accurately control milling depth, make the residual height of copper post 4 within thickness threshold value h scope, be recommended as 100um, even so residual this copper post, the copper post height within 0.1mm can not affect step trough position planarization and component encapsulation yet.
Based on same invention conception, the embodiment of the present invention also provides a species stage printed circuit board (PCB), adopts said method to make.
By above-mentioned description as can be known, ladder printed circuit board (PCB) that the use embodiment of the present invention provides and preparation method thereof, deeply mill processing technology by controlling, make roughly step trough in the predetermined step groove position of completing on the multilayer board that outer circuit makes, more further be accurate to desired depth by the step trough that etch process will be made roughly.The method flow process is simple, be easy to control, and process reliability is high, applied widely, and is smooth due to the step trough sidewall that adopts the method to make, defective is few, so can guarantee higher rate of finished products.Simultaneously, the method does not need to consume auxiliary material, has saved cost of manufacture.
Those skilled in the art should understand, embodiments of the invention can be provided as method, system or computer program.Therefore, the present invention can adopt complete hardware implementation example, implement software example or in conjunction with the form of the embodiment of software and hardware aspect fully.And the present invention can adopt the form that wherein includes the upper computer program of implementing of computer-usable storage medium (including but not limited to magnetic disc store, CD-ROM, optical memory etc.) of computer usable program code one or more.
The present invention is that reference is described according to flow chart and/or the block diagram of method, equipment (system) and the computer program of the embodiment of the present invention.Should understand can be by the flow process in each flow process in computer program instructions realization flow figure and/or block diagram and/or square frame and flow chart and/or block diagram and/or the combination of square frame.Can provide these computer program instructions to the processor of all-purpose computer, special-purpose computer, Embedded Processor or other programmable data processing device to produce a machine, make the instruction of carrying out by the processor of computer or other programmable data processing device produce to be used for the device of realizing in the function of flow process of flow chart or a plurality of flow process and/or square frame of block diagram or a plurality of square frame appointments.
These computer program instructions also can be stored in energy vectoring computer or the computer-readable memory of other programmable data processing device with ad hoc fashion work, make the instruction that is stored in this computer-readable memory produce the manufacture that comprises command device, this command device is realized the function of appointment in flow process of flow chart or a plurality of flow process and/or square frame of block diagram or a plurality of square frame.
These computer program instructions also can be loaded on computer or other programmable data processing device, make on computer or other programmable devices and to carry out the sequence of operations step producing computer implemented processing, thereby be provided for realizing the step of the function of appointment in flow process of flow chart or a plurality of flow process and/or square frame of block diagram or a plurality of square frame in the instruction of carrying out on computer or other programmable devices.
Although described the preferred embodiments of the present invention, in a single day those skilled in the art get the basic creative concept of cicada, can make other change and modification to these embodiment.So claims are intended to all changes and the modification that are interpreted as comprising preferred embodiment and fall into the scope of the invention.
Obviously, those skilled in the art can carry out various changes and modification and not break away from the spirit and scope of the present invention the present invention.Like this, if within of the present invention these are revised and modification belongs to the scope of claim of the present invention and equivalent technologies thereof, the present invention also is intended to comprise these changes and modification interior.
Claims (9)
1. the manufacture method of a species stage printed circuit board (PCB), is characterized in that, comprising:
Deeply mill processing technology by controlling, the elementary step trough of predetermined step groove position making on multilayer board, the groove depth of described elementary step trough is less than predetermined step trough groove depth;
Adopt etch process, the degree of depth of deepening described elementary step trough reaches predetermined step trough groove depth;
To reaching predetermined step trough groove depth, and complete the multilayer board that outer circuit is made, carry out surface treatment and mill sheet metal forming.
2. manufacture method as claimed in claim 1, is characterized in that, describedly deeply mills processing technology by controlling, and completes before predetermined step groove position on the multilayer board that outer circuit makes makes elementary step trough, also comprises:
Make a plurality of printed circuit board (PCB) laminations;
With a plurality of printed circuit board (PCB) laminations, carry out the lamination lamination, form described multilayer board;
Described manufacture method further comprises: sink after copper electroplates on described multilayer board surface, make outer circuit.
3. manufacture method as claimed in claim 2, is characterized in that, after described formation multilayer board, also comprises:
Described multilayer board is holed, form through hole;
The copper that sinks is for the first time electroplated, and realizes the conducting of described through hole;
Adopt resin material to clog described through hole;
Before described making outer circuit, the copper that sinks is for the second time electroplated.
4. manufacture method as claimed in claim 1, is characterized in that, describedly deeply mills processing technology by controlling, and the predetermined step groove position on multilayer board makes elementary step trough, comprising:
The high accuracy milling machine of milling depth can be accurately controlled in utilization, carries out Milling Process and obtains elementary step trough completing predetermined step groove position on the multilayer board that outer circuit makes.
5. described manufacture method as arbitrary in claim 1～4, is characterized in that, the difference of the setting groove depth of the groove depth of described elementary step trough and described predetermined step trough is less than the predetermined thickness threshold value.
6. manufacture method as claimed in claim 5, is characterized in that, described predetermined thickness threshold value is 100um.
7. manufacture method as claimed in claim 1, is characterized in that, described employing etch process is deepened the degree of depth of described elementary step trough to the setting groove depth of predetermined step trough, specifically comprises:
Adopt carbon dioxide laser ablation, plasma etching, strong acid to sting the mode that erosion or highly basic are stung erosion, described elementary step trough is carried out etching, the degree of depth of described elementary step trough is deepened to predetermined step trough groove depth.
8. as arbitrary described manufacture method in claim 1～4, it is characterized in that, when there was through hole in described predetermined step groove position, described surface treatment comprised: volcanic ash nog plate pre-treatment and/or sandblast and chemical microetch pre-treatment.
9. a species stage printed circuit board (PCB), is characterized in that, made by the arbitrary described method of claim 1～8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110369229.9A CN103124469B (en) | 2011-11-18 | 2011-11-18 | A kind of ladder printed circuit board (PCB) and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110369229.9A CN103124469B (en) | 2011-11-18 | 2011-11-18 | A kind of ladder printed circuit board (PCB) and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103124469A true CN103124469A (en) | 2013-05-29 |
| CN103124469B CN103124469B (en) | 2015-08-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110369229.9A Active CN103124469B (en) | 2011-11-18 | 2011-11-18 | A kind of ladder printed circuit board (PCB) and preparation method thereof |
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Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103167735A (en) * | 2011-12-12 | 2013-06-19 | 深南电路有限公司 | Method for processing printed circuit board (PCB) with step-shaped groove and multilayer PCB |
| CN103402314A (en) * | 2013-07-26 | 2013-11-20 | 东莞生益电子有限公司 | Method for manufacturing PCB (Printed Circuit Board) board and manufactured PCB board |
| CN104349598A (en) * | 2013-08-05 | 2015-02-11 | 北大方正集团有限公司 | Stepped circuit board manufacturing method and stepped circuit board |
| CN104582271A (en) * | 2013-10-09 | 2015-04-29 | 北大方正集团有限公司 | Manufacturing method of power amplification tank, printed circuit board with power amplification tank and manufacturing method of printed circuit board |
| CN104582272A (en) * | 2013-10-09 | 2015-04-29 | 珠海方正科技高密电子有限公司 | Method and device for manufacturing metalized step trough on side wall |
| CN104582302A (en) * | 2013-10-10 | 2015-04-29 | 北大方正集团有限公司 | Method and device for manufacturing step trough |
| CN104582236A (en) * | 2013-10-17 | 2015-04-29 | 北大方正集团有限公司 | PCB (printed circuit board) and manufacturing method |
| CN104640354A (en) * | 2013-11-11 | 2015-05-20 | 珠海方正科技多层电路板有限公司 | Printed circuit board and back-bore forming method thereof |
| CN104902683A (en) * | 2014-03-06 | 2015-09-09 | 深南电路有限公司 | Step-groove circuit board and processing method thereof |
| CN104902684A (en) * | 2014-03-07 | 2015-09-09 | 深南电路有限公司 | Stepped groove circuit board and processing method for the same |
| CN105163499A (en) * | 2015-08-31 | 2015-12-16 | 北大方正集团有限公司 | Method for manufacturing stepped groove of printed circuit board (PCB) |
| CN105578771A (en) * | 2015-12-31 | 2016-05-11 | 广州兴森快捷电路科技有限公司 | Circuit board inner groove machining method |
| CN105722301A (en) * | 2014-12-03 | 2016-06-29 | 北大方正集团有限公司 | Connection module, multi-layer printed circuit board and connection module production method |
| CN107172815A (en) * | 2017-05-15 | 2017-09-15 | 昆山沪利微电有限公司 | A kind of preparation method of bent printed circuit board |
| WO2017167256A1 (en) * | 2016-04-01 | 2017-10-05 | 广州兴森快捷电路科技有限公司 | Method for manufacturing blind groove on double-sided board |
| CN108271315A (en) * | 2017-01-04 | 2018-07-10 | 北大方正集团有限公司 | The production method of stepped circuit board and stepped circuit board |
| CN108323002A (en) * | 2017-01-16 | 2018-07-24 | 中兴通讯股份有限公司 | A kind of printed circuit board and method |
| CN111148351A (en) * | 2019-12-18 | 2020-05-12 | 惠州市金百泽电路科技有限公司 | Processing method of 5G small-sized base station power amplifier module PCB with step groove |
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| CN103167735B (en) * | 2011-12-12 | 2016-10-26 | 深南电路有限公司 | Pcb board processing method and multi-layer PCB board with step groove |
| CN103167735A (en) * | 2011-12-12 | 2013-06-19 | 深南电路有限公司 | Method for processing printed circuit board (PCB) with step-shaped groove and multilayer PCB |
| CN103402314A (en) * | 2013-07-26 | 2013-11-20 | 东莞生益电子有限公司 | Method for manufacturing PCB (Printed Circuit Board) board and manufactured PCB board |
| CN103402314B (en) * | 2013-07-26 | 2016-03-02 | 东莞生益电子有限公司 | The manufacture method of pcb board and obtained pcb board |
| CN104349598A (en) * | 2013-08-05 | 2015-02-11 | 北大方正集团有限公司 | Stepped circuit board manufacturing method and stepped circuit board |
| CN104582271A (en) * | 2013-10-09 | 2015-04-29 | 北大方正集团有限公司 | Manufacturing method of power amplification tank, printed circuit board with power amplification tank and manufacturing method of printed circuit board |
| CN104582272A (en) * | 2013-10-09 | 2015-04-29 | 珠海方正科技高密电子有限公司 | Method and device for manufacturing metalized step trough on side wall |
| CN104582272B (en) * | 2013-10-09 | 2018-01-26 | 珠海方正科技高密电子有限公司 | A kind of method and device for making sidewall metallization step trough |
| CN104582302A (en) * | 2013-10-10 | 2015-04-29 | 北大方正集团有限公司 | Method and device for manufacturing step trough |
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| CN104902684B (en) * | 2014-03-07 | 2018-06-26 | 深南电路有限公司 | A kind of step groove circuit board and its processing method |
| CN104902684A (en) * | 2014-03-07 | 2015-09-09 | 深南电路有限公司 | Stepped groove circuit board and processing method for the same |
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| CN105722301A (en) * | 2014-12-03 | 2016-06-29 | 北大方正集团有限公司 | Connection module, multi-layer printed circuit board and connection module production method |
| CN105163499A (en) * | 2015-08-31 | 2015-12-16 | 北大方正集团有限公司 | Method for manufacturing stepped groove of printed circuit board (PCB) |
| CN105163499B (en) * | 2015-08-31 | 2018-04-13 | 北大方正集团有限公司 | A kind of preparation method of pcb board stepped groove |
| CN105578771A (en) * | 2015-12-31 | 2016-05-11 | 广州兴森快捷电路科技有限公司 | Circuit board inner groove machining method |
| WO2017167256A1 (en) * | 2016-04-01 | 2017-10-05 | 广州兴森快捷电路科技有限公司 | Method for manufacturing blind groove on double-sided board |
| CN108271315A (en) * | 2017-01-04 | 2018-07-10 | 北大方正集团有限公司 | The production method of stepped circuit board and stepped circuit board |
| CN108271315B (en) * | 2017-01-04 | 2019-12-31 | 北大方正集团有限公司 | Stepped circuit board and manufacturing method thereof |
| CN108323002A (en) * | 2017-01-16 | 2018-07-24 | 中兴通讯股份有限公司 | A kind of printed circuit board and method |
| CN107172815A (en) * | 2017-05-15 | 2017-09-15 | 昆山沪利微电有限公司 | A kind of preparation method of bent printed circuit board |
| CN111148351A (en) * | 2019-12-18 | 2020-05-12 | 惠州市金百泽电路科技有限公司 | Processing method of 5G small-sized base station power amplifier module PCB with step groove |
| WO2021120639A1 (en) * | 2019-12-18 | 2021-06-24 | 惠州市金百泽电路科技有限公司 | Machining method for 5g small-cell base station power amplifier module pcb having stepped grooves |
| CN111148351B (en) * | 2019-12-18 | 2023-03-17 | 惠州市金百泽电路科技有限公司 | Processing method of 5G small-sized base station power amplifier module PCB with step groove |
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