WO2017167256A1

WO2017167256A1 - Method for manufacturing blind groove on double-sided board

Info

Publication number: WO2017167256A1
Application number: PCT/CN2017/078925
Authority: WO
Inventors: 许龙龙; 杨烈文; 彭文才; 陈黎阳
Original assignee: 广州兴森快捷电路科技有限公司; 深圳市兴森快捷电路科技股份有限公司; 广州市兴森电子有限公司
Priority date: 2016-04-01
Filing date: 2017-03-31
Publication date: 2017-10-05
Also published as: CN105792526A

Abstract

Disclosed is a method for manufacturing a blind groove on a double-sided board, comprising the following steps: S1. providing a double-sided board: the double-sided board comprising a substrate (2), an upper copper layer (1) arranged above the substrate (2), and a lower copper layer (3) arranged below the substrate (2); S2. etching: etching the upper copper layer (1) to form a window (11) for exposing the substrate (2); S3. milling: milling the part of the substrate (2) right below the window (11) to form a first recess (21) in communication with the window, and the part of the substrate (2) right below the first recess (21) forming a residual substrate layer (22); and S4. laser ablating: laser ablating the residual substrate layer (22) to form a second recess (23) for exposing the lower copper layer (3), and the window (11), the first recess (21), and the second recess (23) being in communication with each other successively to form the blind groove. By means of the combination of milling and laser ablating, the thickness to be laser ablated is reduced, thereby saving time, improving efficiency and lowering costs.

Description

Double-panel blind groove making method

Technical field

The invention relates to a method for manufacturing a blind groove of a double panel.

Background technique

The existing double panel includes a substrate, an upper copper layer disposed above the substrate, and a lower copper layer disposed under the substrate, and in the circuit board manufacturing process, it is often required to open a blind groove for the double panel. The existing double-panel blind groove manufacturing method is to first etch the top copper on the upper copper layer and form a window, and then laser ablate the portion of the substrate below the window to form a blind groove. In the existing manufacturing method, the substrate is processed only by laser ablation, resulting in a large thickness of laser ablation, and the laser ablation takes a long time, thereby seriously affecting the processing efficiency.

Summary of the invention

In order to overcome the deficiencies of the prior art, the object of the present invention is to provide a double-panel blind groove manufacturing method, which can firstly process a substrate by milling to form a first concave by using a combination of milling and laser ablation. The groove can reduce the thickness of laser ablation, save time and improve efficiency.

In order to solve the above problems, the technical solution adopted by the present invention is as follows:

A double-panel blind slot manufacturing method includes the following steps:

S1. Providing a double panel, the double panel comprising a substrate, an upper copper layer disposed above the substrate, and a lower copper layer disposed under the substrate;

S2. etching: etching a window on the upper copper layer to expose the substrate;

S3. Milling: Milling the part of the substrate directly below the window to form a connection with the window a groove, and a portion of the substrate directly under the first groove is formed as a remaining layer of the substrate;

S4. Laser ablation: laser ablation of the remaining layer of the substrate and forming a second groove to expose the lower copper layer; the window, the first groove and the second groove are sequentially connected to form a blind groove.

After step S4, step S5 is further provided: copper plating at the bottom of the groove: a copper plating layer is formed on the inner bottom wall of the blind groove, and the upper surface of the copper plating layer is lower than the upper surface of the upper copper layer.

The remaining layer of the substrate has a thickness of 0.05 mm to 0.15 mm.

In step S3, the portion of the substrate directly below the window is milled by a milling cutter, the cutting speed of the milling cutter is 10-30 mm/s, and the rotational speed is 4 to 70,000 rpm.

In step S3, the cutter has a retraction speed of 80-140 mm/s.

Compared with the prior art, the beneficial effects of the present invention are:

By adopting a combination of milling and laser ablation, the invention can firstly process the substrate by milling to form a first groove, thereby reducing the thickness of laser ablation, saving time, improving efficiency and reducing cost; Milling the substrate and laser ablation also avoids the phenomenon of copper under the milling, thus ensuring the quality of the double panel.

DRAWINGS

Figure 1 is a schematic flow chart of the present invention;

Figure 2 is a schematic view of the present invention;

Wherein, 1, upper copper layer; 11, window; 2, substrate; 21, first groove; 22, substrate remaining layer; 23, second groove; 3, lower copper layer;

detailed description

The present invention will be further described below in conjunction with the drawings and specific embodiments.

As shown in FIG. 1 and FIG. 2, a method for manufacturing a blind groove of a double panel includes the following steps:

S1. Providing a double panel, comprising: a substrate 2, an upper copper layer disposed above the substrate 2, a lower copper layer 3 disposed under the substrate 2;

S2. etching: etching a window 11 on the upper copper layer 1 to expose the substrate 2;

S3. Milling: Milling the portion of the substrate 2 directly under the window 11 to form a first groove 21 communicating with the window 11, and the substrate 2 is formed as a remaining layer of the substrate directly under the first groove 21 twenty two;

S4. Laser ablation: laser ablation of the remaining layer 22 of the substrate and forming a second recess 23 to expose the lower copper layer 3; the window 11, the first recess 21, and the second recess 23 are sequentially connected to form a blind slot .

By adopting a combination of milling and laser ablation, the substrate 2 can be first processed by milling to form the first groove 21, thereby reducing the thickness of the laser ablation, saving time, improving efficiency, and reducing cost; First, the substrate 2 is milled, and then laser ablation is performed to avoid the phenomenon of the copper layer 3 under the milling, thereby ensuring the quality of the double panel.

Preferably, after step S4, step S5 is further provided: copper plating at the bottom of the groove: a copper plating layer 4 is formed on the inner bottom wall of the blind groove, and the upper surface of the copper plating layer 4 is lower than the upper copper layer 1 surface. By reasonably setting step S5, the height of the blind slot can also be adjusted according to actual needs.

Preferably, the remaining layer 22 of the substrate has a thickness of 0.05 mm to 0.15 mm. By appropriately setting the thickness of the remaining layer 22 of the substrate, the laser ablation time can be further reduced, thereby further improving the efficiency.

Wherein, in the actual processing, in step S3, the portion of the substrate 2 located directly below the window 11 is milled by a milling cutter, the cutting speed of the milling cutter is 10-30 mm/s, and the retracting speed is 80- 140mm / s, the speed is 40,000-70,000 rev / min; in step S4, the ablation parameter is 5-6 mil aperture, energy is 10-15 mj, pulse width is 10-15 us, excitation number is 2-5; In S5, the current density is 10-12 ASF, which further improves the processing performance.

It can be made by those skilled in the art according to the technical solutions and concepts described above. Various other changes and modifications are possible, and all such changes and modifications are intended to be included within the scope of the appended claims.

Claims

A method for manufacturing a blind groove of a double panel, comprising: the following steps:

S1. Providing a double panel, the double panel comprising a substrate, an upper copper layer disposed above the substrate, and a lower copper layer disposed under the substrate;

S2. etching: etching a window on the upper copper layer to expose the substrate;

S3. Milling: milling a portion of the substrate directly under the window to form a first groove communicating with the window, and forming a substrate directly under the first groove as a remaining layer of the substrate;

S4. Laser ablation: laser ablation of the remaining layer of the substrate and forming a second groove to expose the lower copper layer; the window, the first groove and the second groove are sequentially connected to form a blind groove.
The method for manufacturing a blind groove of a double panel according to claim 1, wherein after step S4, step S5 is further provided: copper plating at the bottom of the groove: a copper plating layer is formed on the inner bottom wall of the blind groove, The upper surface of the copper plating layer is lower than the upper surface of the upper copper layer.
The double-sided blind groove manufacturing method according to claim 1, wherein the remaining layer of the substrate has a thickness of 0.05 mm to 0.15 mm.
The method for manufacturing a double-sided blind groove according to claim 1, wherein in step S3, the portion of the substrate directly below the window is milled by a milling cutter, and the cutting speed of the milling cutter is 10-30 mm. /s, the speed is 4-7 million rev / min.
The double-sided blind groove manufacturing method according to claim 4, wherein in the step S3, the milling cutter has a retracting speed of 80-140 mm/s.