CN110446350A - A method of making filling holes with resin on PCB - Google Patents
A method of making filling holes with resin on PCB Download PDFInfo
- Publication number
- CN110446350A CN110446350A CN201910720656.3A CN201910720656A CN110446350A CN 110446350 A CN110446350 A CN 110446350A CN 201910720656 A CN201910720656 A CN 201910720656A CN 110446350 A CN110446350 A CN 110446350A
- Authority
- CN
- China
- Prior art keywords
- resin
- plate
- silk
- filling holes
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1178—Means for venting or for letting gases escape
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to board production manufacturing technology field, specially a kind of method that filling holes with resin is made on PCB.The present invention passes through in the bottom surface of production plate and positive silk-screen resin ink in two times, and the resin ink for the use of viscosity being 450-640dpa.s carries out silk-screen respectively in the case where vacuum degree is 40-80Pa with the speed of 15-20mm/s and 30-35mm/s, and the plumpness of resin ink in preceding hole is controlled between 60-70% in first time silk-screen resin ink, and the processing of three-level baking sheet is carried out by the temperature and time, it can prevent occur the problem of bubble in filling holes with resin, and the not full problem of consent can be effectively reduced, to solve the problems, such as that existing resin plug orifice plate copper facing injustice is occurring or do not plating copper and produce when plate crosses tin furnace that plate bursting can occur on filling holes with resin.The present invention, which passes through while controlling the parameters such as blade thickness, scraper angle, scraper speed, can further ensure silk-screen effect, preferably control the plumpness of resin ink in preceding hole, reduce the micro-bubble for including in resin ink in preceding hole.
Description
Technical field
The present invention relates to board production manufacturing technology field more particularly to a kind of sides that filling holes with resin is made on PCB
Method.
Background technique
In the production of PCB, making filling holes with resin on PCB is common practice, and this kind of PCB with filling holes with resin is known as
Resin plug orifice plate, the conventional manufacturing procedures of resin plug orifice plate are as follows: process, drilling, heavy copper, full plate electricity before internal layer circuit and pressing etc.
The rear process such as plating, consent, baking sheet, nog plate, outer-layer circuit.If not controlling technique during production resin plug orifice plate, often
Will appear that consent is not full or hole in there are the bad problem such as bubble, consent is not full to be will lead to and subsequent occurs on filling holes with resin
Copper facing is uneven or does not plate copper, and bubble, which can then cause to produce when plate crosses tin furnace because of bubble moisture absorption, in hole can occur plate bursting.At present
The manufacture craft of filling holes with resin are as follows: place air guide backing plate → production plate on the table top of filling holes with resin machine and be placed on air guide backing plate
And it positions → fixes air guide backing plate → single side and unidirectionally clog resin → baking sheet → nog plate.Its air guide of the manufacture craft of filling holes with resin effect
Fruit is bad, thus often occur that consent is not full and hole in there are problems that bubble.
Summary of the invention
The present invention for the manufacture craft of existing filling holes with resin often occur that consent is not full and hole in there are bubbles
Problem, provide it is a kind of by change resin ink silk-screen mode and optimization silk-screen resin ink when technological parameter, to solve
Certainly consent is not full and hole in there are the methods of the production filling holes with resin of air bubble problem.
To achieve the above object, the present invention uses following technical scheme.
A method of making filling holes with resin on PCB, comprising the following steps:
S1, drilling processing is carried out to production plate, drilled including the preceding hole for making filling holes with resin；Then to production plate
Heavy copper and electric plating of whole board processing are carried out, preceding hole metallization is made.
S2, the fixed production plate on the air guide backing plate of filling holes with resin machine table top, and the bottom surface of production plate is upward, then in life
Silk-screen resin ink on plate is produced, the viscosity of resin ink is 450-640dpa.s, and silk-screen speed is 15-20mm/s, and vacuum degree is
40-80Pa。
Preferably, the plumpness that resin ink in preceding hole is controlled when silk-screen resin ink is 60-70%.
Preferably, further include pre-baked step before step S2, the pre-baked step is: production plate being placed at 155 DEG C and is toasted
30min。
It is furthermore preferred that further including the steps that producing plate with water high pressure washing before pre-baked step, removed in preceding hole with rinsing
Foreign matter.
S3, being face-up fixed on air guide backing plate for plate will be produced, then silk-screen resin ink, resin on production plate
The viscosity of ink is 450-640dpa.s, and silk-screen speed is 30-35mm/s, vacuum degree 40-80Pa.Silk-screen resin ink time control
The plumpness for making resin ink in preceding hole is 100-110%.
Preferably, in step S2 and S3, when silk-screen resin ink, blade thickness 30mm, scraper angle is 3 °, scraper speed
Degree is 15mm/s, and the environment temperature of workshop is 24-26 DEG C.
Preferably, the air guide backing plate with a thickness of 3mm；Improve burr, the burr on air guide backing plate.
Preferably, the silk-screen halftone used when silk-screen resin ink with a thickness of 0.3mm.When making silk-screen halftone, control
Cutting speed is 45mm/min, and pads phenolic aldehyde backing plate and make cover board with aluminium flake
S4, the processing of three-level baking sheet is carried out to production plate by following temperature, first toasts 50-60min at 70-75 DEG C, then
Temperature is increased to 105-115 DEG C of baking 50-60min, then continues to increase temperature to 150-160 DEG C of baking 50-60min.
Preferably, production plate first toasts 60min at 75 DEG C, then increases temperature to 110 DEG C of baking 60min, then after
High-temperature of continuing rising is to 155 DEG C of baking 60min.
S5, nog plate processing is carried out to production plate.
Preferably, ceramic grinding printed line nog plate is first crossed with the speed of 2.5m/min, then hand sand resin is not ground clean
The polishing of nonwoven fabric section is then crossed again with the speed of 2.5m/min in position.
Compared with prior art, the beneficial effects of the present invention are:
The present invention is by being 450- in the bottom surface of production plate and positive silk-screen resin ink in two times, and using viscosity
The resin ink of 640dpa.s carries out silk respectively in the case where vacuum degree is 40-80Pa with the speed of 15-20mm/s and 30-35mm/s
Print, and the plumpness of resin ink in preceding hole is controlled in first time silk-screen resin ink between 60-70%, and second
The processing of three-level baking sheet is carried out by the temperature and time after secondary silk-screen resin ink, can prevent occur bubble in filling holes with resin
Problem, and the not full problem of consent can be effectively reduced, it is plated on filling holes with resin to solve existing resin plug orifice plate
Copper is uneven or does not plate copper and produces the problem of plate bursting can occur when plate crosses tin furnace.The present invention passes through while controlling scraper thickness
The parameters such as degree, scraper angle, scraper speed can further ensure silk-screen effect, preferably control the full of resin ink in preceding hole
Degree, reduces the micro-bubble for including in resin ink in preceding hole.
Specific embodiment
In order to more fully understand technology contents of the invention, combined with specific embodiments below to technical solution of the present invention
It is described further and illustrates.
Embodiment
The method that the present embodiment provides a kind of to make filling holes with resin on PCB, specifically includes the following steps:
(1) double face copper as core material sawing sheet: is outputed by the jigsaw size of design requirement.
(2) it makes internal layer circuit: internal layer circuit is made on core material using negative film technique.Routinely process successively into
Row OPE punching and internal layer AOI.
(3) it presses: after carrying out pressing pre-treatment to core material, then pressing core material, prepreg, outer copper foil
Product design stacks in advance, and is pre-fixed by way of fusion and/or riveted, each layer is pre-fixed together, shape
At pre- stack structure, then pre- stack structure is press-fitted together as one, forms the production plate for the multilayer that plate thickness is 2mm.
(4) outer layer drills: drilling on production plate by drilling data, including boring preceding hole at the drilling position of multilayer production plate
And other through-holes, the preceding hole to form filling holes with resin for silk-screen resin ink after subsequent metallisation processing to make.Preceding hole packet
Include the through-hole that aperture is 0.5mm, 0.8mm, 1.0mm, 1.5mm and 1.8mm.
(5) heavy copper and electric plating of whole board: one layer of copper is deposited on production plate with the method for chemistry, then carrying out being electroplated makes layers of copper
It thickens, the preceding hole and other via metals is made with this.
(6) consent: including step S1-S6:
S1, the step of producing plate with water high pressure washing, to rinse the foreign matter removed in preceding hole.
S2, pre-baked processing is carried out to production plate, production plate is placed at 155 DEG C and toasts 30min.
S3, the fixed production plate on the air guide backing plate of filling holes with resin machine table top, and the bottom surface of production plate is upward, then in life
Produce silk-screen resin ink on plate.The condition of silk-screen resin ink is as follows:
The viscosity of resin ink is 450-640dpa.s, and silk-screen speed is 15-20mm/s, vacuum degree 40-80Pa, scraper
With a thickness of 30mm, scraper angle is 3 °, scraper speed 15mm/s, and the environment temperature of workshop is 24-26 DEG C, air guide backing plate
With a thickness of 3mm, silk-screen halftone with a thickness of 0.3mm.The plumpness for controlling resin ink in preceding hole is 60-70%.
When making silk-screen halftone, it is 45mm/min that control, which cuts speed, and pads phenolic aldehyde backing plate and make cover board with aluminium flake.
S4, being face-up fixed on air guide backing plate for plate will be produced, then the silk-screen resin ink on production plate.Silk-screen
The condition of resin ink is as follows:
The viscosity of resin ink is 450-640dpa.s, and silk-screen speed is 30-35mm/s, vacuum degree 40-80Pa, scraper
With a thickness of 30mm, scraper angle is 3 °, scraper speed 15mm/s, and the environment temperature of workshop is 24-26 DEG C, air guide backing plate
With a thickness of 3mm, silk-screen halftone with a thickness of 0.3mm.The plumpness for controlling resin ink in preceding hole is 100-110%.
S5, carry out the processing of three-level baking sheet to production plate by following temperature: production plate first toasts 60min at 75 DEG C, then
Temperature is increased to 110 DEG C of baking 60min, then continues to increase temperature to 155 DEG C of baking 60min.
S6, nog plate processing is carried out to production plate: ceramic grinding printed line nog plate is first crossed with the speed of 2.5m/min, is then beaten manually
Mill resin does not grind clean position, then crosses the polishing of nonwoven fabric section again with the speed of 2.5m/min.
By consent process, the production of filling holes with resin is completed.Resin filling in filling holes with resin directly on observation production plate
Plumpness, and slice analysis is carried out to observe the bubble situation in filling holes with resin to production plate.
The problem of plumpness for producing the filling holes with resin on plate is good, and it is not full not occur consent, aperture out-of-flatness.And
And by slice analysis result as it can be seen that being respectively the preceding hole of 0.5mm, 0.8mm, 1.0mm, 1.5mm and 1.8mm by aperture in production plate
The filling holes with resin that production is formed does not observe bubble in hole.
By using above-mentioned silk-screen mode and state modulator, can prevent be respectively by aperture 0.5mm, 0.8mm, 1.0mm,
The preceding hole of 1.5mm and 1.8mm makes the filling holes with resin to be formed and the problem of bubble in hole occurs, and it is not full effectively to solve consent
The problem of.
In other embodiments, in above-mentioned steps S5, three-level baking sheet processing can also by the time and temperature control with
In lower range: first toast 50-60min at 70-75 DEG C, then increase temperature to 105-115 DEG C of baking 50-60min, then after
High-temperature of continuing rising is to 150-160 DEG C of baking 50-60min.
(7) outer-layer circuit, outer layer AOI, welding resistance and silk-screen word successively process afterwards: are carried out according to conventional technical means in the art
Symbol, surface treatment, molding, electrical testing, FQC, packaging process, complete the production of PCB.
Before obtaining above-described embodiment preferably technical solution, during making filling holes with resin, in silk-screen resin
Other technological parameters have also been attempted in ink and three-level baking sheet process, but effect is undesirable compared to above-described embodiment, still has
Part filling holes with resin has that consent is not full and there are bubbles in hole.
Such as option A, step S3 and S4 is as follows in the condition of the silk-screen resin ink on production plate: the viscosity of resin ink is
350-450dpa.s, silk-screen speed are 30-35mm/s, vacuum degree 40-80Pa, blade thickness 30mm, and scraper angle is 3 °,
Scraper speed is 15mm/s, and the environment temperature of workshop is 24-26 DEG C, air guide backing plate with a thickness of 3mm, the thickness of silk-screen halftone
Degree is 0.3mm.Other steps are consistent with above-described embodiment.
Such as option b, step S3 and S4 is as follows in the condition of the silk-screen resin ink on production plate: the viscosity of resin ink is
450-640dpa.s, silk-screen speed are 20-25mm/s, vacuum degree 40-80Pa, blade thickness 30mm, and scraper angle is 3 °,
Scraper speed is 15mm/s, and the environment temperature of workshop is 24-26 DEG C, air guide backing plate with a thickness of 3mm, the thickness of silk-screen halftone
Degree is 0.3mm.Other steps are consistent with above-described embodiment.
Such as scheme C, steps are as follows for step S5 baking sheet: carrying out the processing of second level baking sheet to production plate by following temperature: production plate
60min is first toasted at 75 DEG C, then increases temperature to 155 DEG C of baking 90min.Other steps are consistent with above-described embodiment.
Such as scheme D, steps are as follows for step S5 baking sheet: carrying out the processing of three-level baking sheet to production plate by following temperature: first 75
60min is toasted at DEG C, is then increased temperature to 125 DEG C of baking 60min, is then continued to increase temperature to 150 DEG C of baking 60min.
Other steps are consistent with above-described embodiment.
Production plate in option A, B, C, D occur part filling holes with resin there are consent is not full and hole in bubble ask
Topic.
It is described above that technology contents of the invention are only further illustrated with embodiment, in order to which reader is easier to understand,
But embodiments of the present invention are not represented and are only limitted to this, any technology done according to the present invention extends or recreation, is sent out by this
Bright protection.
Claims (10)
1. a kind of method for making filling holes with resin on PCB, which comprises the following steps:
S1, drilling processing is carried out to production plate, drilled including the preceding hole for making filling holes with resin；Then production plate is carried out
Heavy copper and electric plating of whole board processing, make preceding hole metallization；
S2, the fixed production plate on the air guide backing plate of filling holes with resin machine table top, and the bottom surface for producing plate is upward, is then producing plate
Upper silk-screen resin ink, the viscosity of resin ink are 450-640dpa.s, and silk-screen speed is 15-20mm/s, vacuum degree 40-
80Pa；
S3, being face-up fixed on air guide backing plate for plate will be produced, then silk-screen resin ink, resin ink on production plate
Viscosity be 450-640dpa.s, silk-screen speed be 30-35mm/s, vacuum degree 40-80Pa；
S4, the processing of three-level baking sheet is carried out to production plate by following temperature, first toasts 50-60min at 70-75 DEG C, then increases
Temperature then continues to increase temperature to 150-160 DEG C of baking 50-60min to 105-115 DEG C of baking 50-60min；
S5, nog plate processing is carried out to production plate.
2. the method according to claim 1 for making filling holes with resin on PCB, which is characterized in that in step S4, produce plate
60min is first toasted at 75 DEG C, is then increased temperature to 110 DEG C of baking 60min, is then continued to increase temperature to 155 DEG C of bakings
60min。
3. the method according to claim 1 for making filling holes with resin on PCB, which is characterized in that in step S2 and S3, silk
When printing resin ink, blade thickness 30mm, scraper angle is 3 °, scraper speed 15mm/s.
4. the method according to claim 3 for making filling holes with resin on PCB, which is characterized in that in step S2 and S3, silk
When printing resin ink, the environment temperature of workshop is 24-26 DEG C.
5. the method according to claim 4 for making filling holes with resin on PCB, which is characterized in that in step S2 and S3, institute
State air guide backing plate with a thickness of 3mm.
6. the method according to claim 5 for making filling holes with resin on PCB, which is characterized in that in step S2 and S3, silk
Print resin ink when use silk-screen halftone with a thickness of 0.3mm.
7. the method according to claim 1 for making filling holes with resin on PCB, which is characterized in that in step S2, silk-screen tree
The plumpness that resin ink in preceding hole is controlled when fatty oil ink is 60-70%.
8. the method according to claim 1 for making filling holes with resin on PCB, which is characterized in that further include before step S2
Pre-baked step, the pre-baked step is: production plate being placed at 155 DEG C and toasts 30min.
9. the method according to claim 8 for making filling holes with resin on PCB, which is characterized in that also wrapped before pre-baked step
The step of including with water high pressure washing production plate.
10. it is according to claim 1 on PCB make filling holes with resin method, which is characterized in that in step S5, first with
The speed of 2.5m/min crosses ceramic grinding printed line nog plate, and then hand sand resin does not grind clean position, then again with 2.5m/
The speed of min crosses the polishing of nonwoven fabric section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910720656.3A CN110446350A (en) | 2019-08-05 | 2019-08-05 | A method of making filling holes with resin on PCB |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910720656.3A CN110446350A (en) | 2019-08-05 | 2019-08-05 | A method of making filling holes with resin on PCB |
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ID=68433362
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| CN201910720656.3A Pending CN110446350A (en) | 2019-08-05 | 2019-08-05 | A method of making filling holes with resin on PCB |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111935908A (en) * | 2020-07-02 | 2020-11-13 | 深圳市博敏电子有限公司 | Method for plugging thin core plate with resin |
| CN112423476A (en) * | 2020-10-26 | 2021-02-26 | 深圳崇达多层线路板有限公司 | Method for improving poor hole plugging of PCB resin |
| CN112822841A (en) * | 2020-12-09 | 2021-05-18 | 广东科翔电子科技股份有限公司 | Manufacturing method of storage type carrier plate |
| CN113271728A (en) * | 2021-05-18 | 2021-08-17 | 大连崇达电路有限公司 | Air guide plate and method for improving poor ink hole plugging of VIA hole of circuit board window |
| CN113490341A (en) * | 2021-09-08 | 2021-10-08 | 成都航天通信设备有限责任公司 | Processing method and processing die for resin plug hole of printed board with thickness less than 0.5mm |
| CN113543483A (en) * | 2021-06-22 | 2021-10-22 | 深圳市景旺电子股份有限公司 | Solder resist hole plugging method for printed circuit board |
| CN118019231A (en) * | 2024-04-09 | 2024-05-10 | 成都航天通信设备有限责任公司 | Method for improving high-viscosity hole plugging ink processing printed board ink hole plugging quality |
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| CN113271728A (en) * | 2021-05-18 | 2021-08-17 | 大连崇达电路有限公司 | Air guide plate and method for improving poor ink hole plugging of VIA hole of circuit board window |
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| CN113490341A (en) * | 2021-09-08 | 2021-10-08 | 成都航天通信设备有限责任公司 | Processing method and processing die for resin plug hole of printed board with thickness less than 0.5mm |
| CN118019231A (en) * | 2024-04-09 | 2024-05-10 | 成都航天通信设备有限责任公司 | Method for improving high-viscosity hole plugging ink processing printed board ink hole plugging quality |
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Application publication date: 20191112 |