CN105101643A - Resin hole-plugging process - Google Patents
Resin hole-plugging process Download PDFInfo
- Publication number
- CN105101643A CN105101643A CN201510423295.8A CN201510423295A CN105101643A CN 105101643 A CN105101643 A CN 105101643A CN 201510423295 A CN201510423295 A CN 201510423295A CN 105101643 A CN105101643 A CN 105101643A
- Authority
- CN
- China
- Prior art keywords
- resin
- ink
- resin ink
- filling holes
- technique
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a resin hole-plugging process, which comprises the following steps: (1) cleaning substrates, wherein through holes are formed in the substrates; (2) filling the through holes with resin ink in a vacuum printing manner; (3) carrying out attrition treatment on the surfaces of the substrates filled with the resin ink; (4) inspecting whether the surfaces of the substrates are flat or not, and ejecting bad substrates; and (5) adding a coating to the surface of each substrate, and forming a line or a really installed part on each coating. According to the resin hole-plugging process, only the through holes for conducting are filled with the resin ink and are provided with the coatings; and line or component expansion can be carried out, so that miniaturization of the substrates is realized; and meanwhile, high-speed orientation of the conveying speed is achieved.
Description
Technical field
The present invention relates to PCB and manufacture field, particularly a kind of filling holes with resin technique.
Background technology
Along with continuous miniaturization, the lighting of current many electronic products, the function of electronic product increases again and again, and impel PCB in electronic product (printed substrate) size more and more less, wiring density also comes close.And for having the printed substrate of high density, high reliability requirement, as also more and more stricter in the substrate of MPU, the substrate of high frequency module, communication substrate, the substrate of mobile phone end, the requirement of electronic products substrate to size, therefore, how reducing substrate, not affecting other performances is those skilled in the art's technical problems urgently to be resolved hurrily.
Summary of the invention
The invention provides a kind of filling holes with resin technique, to solve the above-mentioned technical problem existed in prior art.
For solving the problems of the technologies described above, the invention provides a kind of filling holes with resin technique, comprising:
Step 1: cleaning base plate, with through hole on described substrate;
Step 2: the mode potting resin ink in through-holes taking Vacuum printing;
Step 3: milled processed is carried out to the substrate surface after potting resin ink;
Step 4: check described substrate, gets rid of bad substrate;
Step 5: add coating at substrate surface, and form circuit or actual load parts on coating.
As preferably, in described step 1, by acid cleaning process cleaning base plate.
As preferably, also comprise curing schedule in described step 2, described curing schedule carries out in potting resin ink process or after potting resin ink.
As preferably, in step 2, take the resin ink in heat curing process process through hole.
As preferably, in step 2, carry out the resin ink in segmented heat curing process process through hole.
As preferably, in step 3, adopt pottery brush and or the Excess resin ink on adhesive-bonded fabric grinding base plate surface.
As preferably, in step 4, adopt the substrate surface after automated optical inspection or direct visual examination grinding.
As preferably, described resin ink adopts Shan Rong chemical company model to be the chemical ink of IR-6P, IR-10F.
Compared with prior art, filling holes with resin technique of the present invention, comprising: step 1: cleaning base plate, with through hole on described substrate; Step 2: the mode potting resin ink in through-holes taking Vacuum printing; Step 3: milled processed is carried out to the substrate surface after potting resin ink; Step 4: check that whether described substrate surface is smooth, get rid of bad substrate; Step 5: add coating at substrate surface, and form circuit or actual load parts on coating.The present invention carries out the filling of resin ink to the through hole only for conducting, and arranges coating thereon, can carry out circuit or parts expansion, thus achieve the downsizing of substrate, reach the high speed of reception and registration speed simultaneously.
Accompanying drawing explanation
Fig. 1 is the flow chart of filling holes with resin technique of the present invention.
Embodiment
For enabling above-mentioned purpose of the present invention, feature and advantage become apparent more, are described in detail the specific embodiment of the present invention below in conjunction with accompanying drawing.It should be noted that, accompanying drawing of the present invention all adopts the form of simplification and all uses non-ratio accurately, only in order to object that is convenient, the aid illustration embodiment of the present invention lucidly.
As shown in Figure 1, the invention provides a kind of filling holes with resin technique, comprising:
Step 1: cleaning base plate, with through hole on described substrate; Specifically can adopt the mode cleaning base plate of pickling, guarantee substrate surface noresidue material, certainly, need after cleaning to carry out drying to substrate, avoid in through hole, having the globule to occur, make to produce bubble in follow-up resin ink.Further, described through hole inner periphery is coated with layers of copper, and this layers of copper plays the effect of conducting.
Step 2: the mode potting resin ink in through-holes taking Vacuum printing, particularly: the mode potting resin ink adopting Vacuum printing, can avoid bubble to produce, improve substrate yield.During due to printing, resin ink can be subject to the effect of larger shear strength through mesh, now the viscosity of resin ink can sharply reduce, and by after mesh, the active force put on resin ink disappears, but due to the thixotropy of resin ink, so original viscosity can not be replied at once, because the kind of resin ink is different, even if be subject to identical shear strength effect, the decrease speed of resin ink is also different, and the time that viscosity replied by resin ink is also different.Therefore, the present invention adopts Shan Rong chemical company model to be the chemical ink of IR-6P, IR-10F, and the chemical resin ink of this two profiles number all has that viscosity recovery is good, shape retention is good and the rivet shape that in through hole, resin ink is formed is independent.
Further, in step 2, also comprise curing schedule, the concrete resin ink adopted in segmented heat curing process fixed via.The chemical ink that the present invention adopts has anti-diffusion, can not produce capillarity also can not overflow through hole when heating.It should be noted that, in heat curing process, need the thermal coefficient of expansion considering resin ink, avoid over-heating to cause chemical ink to overflow.
Step 3: milled processed is carried out to the substrate surface after potting resin ink; Particularly, the present invention adopts the resin ink of pottery brush and/or adhesive-bonded fabric grinding base plate excess surface.Particularly, rotate realize removing the grinding of Excess resin ink by controlling ceramic brush wheel and adhesive-bonded fabric brush wheel, wherein, cross section due to brush wheel is circular, therefore, within the 3mil that needing caves in above the through hole after by grinding limits, so usually first use ceramic brush wheel tentatively to grind during practical operation, recycling adhesive-bonded fabric brush wheel grinds further, to control grinding depression
Step 4: check described substrate, whether particular exam substrate surface is smooth, can adopt the substrate surface after automated optical inspection or direct visual examination grinding, get rid of bad substrate;
Step 5: add coating at substrate surface, and form circuit or actual load parts on coating.
In sum, filling holes with resin technique of the present invention, comprising: step 1: cleaning base plate, with through hole on described substrate; Step 2: the mode potting resin ink in through-holes taking Vacuum printing; Step 3: milled processed is carried out to the substrate surface after potting resin ink; Step 4: check that whether described substrate surface is smooth, discharge bad substrate; Step 5: add coating at substrate surface, and form circuit or actual load parts on coating.The present invention carries out the filling of resin ink to the through hole only for conducting, and arranges coating thereon, can carry out circuit or parts expansion, thus achieve the downsizing of substrate, reach the high speed of reception and registration speed simultaneously.
Obviously, those skilled in the art can carry out various change and modification to invention and not depart from the spirit and scope of the present invention.Like this, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.
Claims (8)
1. a filling holes with resin technique, is characterized in that, comprising:
Step 1: cleaning base plate, with through hole on described substrate;
Step 2: the mode potting resin ink in through-holes taking Vacuum printing;
Step 3: milled processed is carried out to the substrate surface after potting resin ink;
Step 4: check and get rid of bad substrate;
Step 5: add coating at substrate surface, and form circuit or actual load parts on coating.
2. filling holes with resin technique as claimed in claim 1, is characterized in that, in step 1, by acid cleaning process cleaning base plate.
3. filling holes with resin technique as claimed in claim 1, it is characterized in that, also comprise curing schedule in step 2, described curing schedule carries out in potting resin ink process or after potting resin ink.
4. filling holes with resin technique as claimed in claim 3, is characterized in that, in step 2, take the resin ink in heat curing process process through hole.
5. filling holes with resin technique as claimed in claim 3, is characterized in that, in step 2, carry out the resin ink in segmented heat curing process process through hole.
6. filling holes with resin technique as claimed in claim 1, is characterized in that, in step 3, adopts the Excess resin ink on pottery brush and/or adhesive-bonded fabric grinding base plate surface.
7. filling holes with resin technique as claimed in claim 1, is characterized in that, in step 4, adopts the substrate surface after automated optical inspection or direct visual examination grinding.
8. filling holes with resin technique as claimed in claim 1, is characterized in that, described resin ink adopts Shan Rong chemical company model to be the chemical ink of IR-6P, IR-10F.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510423295.8A CN105101643A (en) | 2015-07-17 | 2015-07-17 | Resin hole-plugging process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510423295.8A CN105101643A (en) | 2015-07-17 | 2015-07-17 | Resin hole-plugging process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105101643A true CN105101643A (en) | 2015-11-25 |
Family
ID=54580846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510423295.8A Pending CN105101643A (en) | 2015-07-17 | 2015-07-17 | Resin hole-plugging process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105101643A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110446345A (en) * | 2019-07-09 | 2019-11-12 | 奥士康科技股份有限公司 | A kind of resin ground method |
| CN110446350A (en) * | 2019-08-05 | 2019-11-12 | 深圳崇达多层线路板有限公司 | A method of making filling holes with resin on PCB |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1396943A (en) * | 2000-11-29 | 2003-02-12 | 太阳油墨制造株式会社 | Liquid thermosetting resin composition, printed wiring boards and process for their production |
| JP4127442B2 (en) * | 1999-02-22 | 2008-07-30 | イビデン株式会社 | Multilayer build-up wiring board and manufacturing method thereof |
| CN101772280A (en) * | 2009-12-23 | 2010-07-07 | 深南电路有限公司 | Mesh screen plughole process method |
| CN103369871A (en) * | 2012-03-30 | 2013-10-23 | 北大方正集团有限公司 | Multi-layer printed circuit board and manufacturing method thereof |
| CN103813655A (en) * | 2012-11-09 | 2014-05-21 | 镇江华扬信息科技有限公司 | Manufacturing method for improving reliability of printed circuit board (PCB) including bonding pad structure |
-
2015
- 2015-07-17 CN CN201510423295.8A patent/CN105101643A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4127442B2 (en) * | 1999-02-22 | 2008-07-30 | イビデン株式会社 | Multilayer build-up wiring board and manufacturing method thereof |
| CN1396943A (en) * | 2000-11-29 | 2003-02-12 | 太阳油墨制造株式会社 | Liquid thermosetting resin composition, printed wiring boards and process for their production |
| CN101772280A (en) * | 2009-12-23 | 2010-07-07 | 深南电路有限公司 | Mesh screen plughole process method |
| CN103369871A (en) * | 2012-03-30 | 2013-10-23 | 北大方正集团有限公司 | Multi-layer printed circuit board and manufacturing method thereof |
| CN103813655A (en) * | 2012-11-09 | 2014-05-21 | 镇江华扬信息科技有限公司 | Manufacturing method for improving reliability of printed circuit board (PCB) including bonding pad structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110446345A (en) * | 2019-07-09 | 2019-11-12 | 奥士康科技股份有限公司 | A kind of resin ground method |
| CN110446350A (en) * | 2019-08-05 | 2019-11-12 | 深圳崇达多层线路板有限公司 | A method of making filling holes with resin on PCB |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151125 |
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| RJ01 | Rejection of invention patent application after publication |