CN203554784U - Convex copper structure PCB - Google Patents

Convex copper structure PCB Download PDF

Info

Publication number
CN203554784U
CN203554784U CN201320685778.1U CN201320685778U CN203554784U CN 203554784 U CN203554784 U CN 203554784U CN 201320685778 U CN201320685778 U CN 201320685778U CN 203554784 U CN203554784 U CN 203554784U
Authority
CN
China
Prior art keywords
layer
pcb
protruding
copper layer
pcb board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201320685778.1U
Other languages
Chinese (zh)
Inventor
邹星
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuxi City Xi Cheng Microtronics AS
Original Assignee
Wuxi City Xi Cheng Microtronics AS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuxi City Xi Cheng Microtronics AS filed Critical Wuxi City Xi Cheng Microtronics AS
Priority to CN201320685778.1U priority Critical patent/CN203554784U/en
Application granted granted Critical
Publication of CN203554784U publication Critical patent/CN203554784U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

The utility model discloses a convex copper structure PCB comprising a substrate, a convex copper layer, a bottom layer solder-resisting layer and a bottom layer. The convex copper layer is covered on an external surface of high current wiring of the substrate corresponding to the bottom layer solder-resisting layer. The bottom layer solder-resisting layer is covered on the surface of the bottom layer. The thickness of the convex copper layer is arranged according to requirements of current bearing. A high current wiring part is confirmed in the initial stage of PCB design, and the convex cooper layer is additionally arranged so that current-bearing capacity of the PCB is enhanced and burn-out of wiring of copper foils of the PCB is prevented. Besides, production technology is simplified, and the convex copper layer is additionally arranged only on the high current part so that consistency of finished products is ensured.

Description

A kind of protruding steel structure pcb board
Technical field
The utility model relates to pcb board technical field, relates in particular to a kind of protruding steel structure pcb board.
Background technology
PCB is the abbreviation of printed circuit board (PCB) (Printed Circuit Board).Printed circuit board (PCB) is the substrate that assembling electronic component is used, and is by the printed board of connection and printed component between predetermined design formation point on general substrate.The major function of this product is to make various electronic components form the connection of predetermining circuit, plays relay transmission, is the crucial electronic interconnection part of electronic product, has the title of " mother of electronic product ".In Electric Machine Control design, drive motors part need to be compared with large-drive-current, integrated along with modern product, miniaturization, this just requires us when design motor driver, to use reduced size pcb board, while using larger electric current in design in the past, designer generally can adopt the welding resistance of large current segment cabling on pcb board is removed, can be manually zinc-plated on the Copper Foil top layer of pcb board, thereby increase current carrying capacity, the method is comparatively convenient, in daily middle relatively extensive use, but, the current carrying capacity of circuit improves undesirable, and increased manual operation link, to the homogeneity of product of producing in enormous quantities, cannot ensure.
Utility model content
The purpose of this utility model is, by the protruding steel structure pcb board of one, to solve the problem that above background technology part is mentioned.
For reaching this object, the utility model by the following technical solutions:
A kind of protruding steel structure pcb board, it comprises substrate, protruding copper layer, bottom solder mask and bottom; Described protruding copper layer covers the large electric current cabling outer surface on bottom solder mask counterpart substrate, and described bottom solder mask is covered in bottom surface, and wherein, described protruding copper layer thickness requires to arrange according to current load.
Especially, described substrate is selected epoxy glass substrate.
Especially, described bottom solder mask is selected welding resistance ink.
The protruding steel structure pcb board that the utility model provides has improved the loaded current ability of pcb board Copper Foil cabling, prevents that pcb board Copper Foil cabling from blowing, and has simplified production technology simultaneously, only at large electric current position, increases protruding copper layer, has improved the consistency of finished product.
Accompanying drawing explanation
The protruding steel structure pcb board plan structure schematic diagram that Fig. 1 provides for the utility model embodiment;
The protruding steel structure pcb board cross-sectional view that Fig. 2 provides for the utility model embodiment.
Embodiment
Below in conjunction with drawings and Examples, the utility model is described in further detail.Be understandable that, specific embodiment described herein is only for explaining the utility model, but not to restriction of the present utility model.It also should be noted that, for convenience of description, in accompanying drawing, only show the part relevant to the utility model but not full content.
Please refer to shown in Fig. 1 and Fig. 2, the present embodiment convexity steel structure pcb board specifically comprises substrate 101, protruding copper layer 102, bottom solder mask 103 and bottom 104.
Described protruding copper layer 102 covers the large electric current cabling outer surface on bottom solder mask 103 counterpart substrates 101.Wherein, described protruding copper layer 102 thickness require to arrange according to current load.Described large electric current cabling refers to the zinc-plated part of craft of traditional PCB plate post-processed.
Described bottom solder mask 103 is covered in bottom 104 surfaces.In the present embodiment, described substrate 101 is selected epoxy glass substrate 101.Described bottom solder mask 103 is selected welding resistance ink.
The technical solution of the utility model is just determined large circuit trace position at the initial stage of PCB design, increase protruding copper layer, not only improved the ability of pcb board loaded current, prevent that pcb board Copper Foil cabling from blowing, and simplified production technology, only at large electric current position, increase protruding copper layer, guaranteed the consistency of finished product.
Note, above are only preferred embodiment of the present utility model and institute's application technology principle.Skilled person in the art will appreciate that the utility model is not limited to specific embodiment described here, can carry out for a person skilled in the art various obvious variations, readjust and substitute and can not depart from protection range of the present utility model.Therefore, although the utility model is described in further detail by above embodiment, but the utility model is not limited only to above embodiment, in the situation that not departing from the utility model design, can also comprise more other equivalent embodiment, and scope of the present utility model is determined by appended claim scope.

Claims (3)

1. a protruding steel structure pcb board, is characterized in that, comprises substrate, protruding copper layer, bottom solder mask and bottom; Described protruding copper layer covers the large electric current cabling outer surface on bottom solder mask counterpart substrate, and described bottom solder mask is covered in bottom surface, and wherein, described protruding copper layer thickness requires to arrange according to current load.
2. protruding steel structure pcb board according to claim 1, is characterized in that, described substrate is selected epoxy glass substrate.
3. according to the protruding steel structure pcb board described in claim 1 or 2 any one, it is characterized in that, described bottom solder mask is selected welding resistance ink.
CN201320685778.1U 2013-10-31 2013-10-31 Convex copper structure PCB Expired - Fee Related CN203554784U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320685778.1U CN203554784U (en) 2013-10-31 2013-10-31 Convex copper structure PCB

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320685778.1U CN203554784U (en) 2013-10-31 2013-10-31 Convex copper structure PCB

Publications (1)

Publication Number Publication Date
CN203554784U true CN203554784U (en) 2014-04-16

Family

ID=50472840

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320685778.1U Expired - Fee Related CN203554784U (en) 2013-10-31 2013-10-31 Convex copper structure PCB

Country Status (1)

Country Link
CN (1) CN203554784U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103547065A (en) * 2013-10-31 2014-01-29 无锡市矽成微电子有限公司 Protruding copper structure PCB and manufacturing process of protruding copper structure PCB

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103547065A (en) * 2013-10-31 2014-01-29 无锡市矽成微电子有限公司 Protruding copper structure PCB and manufacturing process of protruding copper structure PCB
CN103547065B (en) * 2013-10-31 2017-03-29 无锡市矽成微电子有限公司 A kind of convex steel structure pcb board and its manufacturing process

Similar Documents

Publication Publication Date Title
CN104681531B (en) Package substrate and method for fabricating the same
WO2012175207A3 (en) Electronic assembly and method for the production thereof
CN104349570A (en) Rigid-flexible-combined circuit board and manufacturing method thereof
EP2086297A3 (en) Printed circuit board and method of manufacturing the same
CN103052258B (en) Printed circuit board and manufacturing methods
WO2009037145A3 (en) Method for the production of an electronic assembly, and electronic assembly
WO2009037833A1 (en) Solid printed wiring board, method for manufacturing solid printed wiring board, and electronic component module
CN202488872U (en) Anti-oxidation PCB (printed circuit board)
CN204157152U (en) A kind of multilayer circuit board
CN203554784U (en) Convex copper structure PCB
US20130284504A1 (en) Printed circuit board with anti-static protection structure
EP2086295A3 (en) Printed circuit board and method of manufacturing the same
EP2086296A3 (en) Printed circuit board and method of manufacturing the same
CN103547065A (en) Protruding copper structure PCB and manufacturing process of protruding copper structure PCB
JP4933170B2 (en) Printed circuit board assembly
CN202488880U (en) PCB (printed circuit board) capable of preventing hole from being plugged in tin soldering
CN104576616A (en) Module integrated circuit packaging structure and fabricating method thereof
CN203251505U (en) Circuit board with white oil coverage layer
CN203788557U (en) PCB bonding pad
CN103209547B (en) Addition process boss printed board manufacture craft
CN205378338U (en) Electromagnetic interference resistance printed circuit board
CN203407071U (en) Circuit board with crimping blind hole
CN212677474U (en) Multifunctional circuit board
CN205051963U (en) Composite circuit board
CN109769345A (en) A kind of High density of PCB lamination

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140416

Termination date: 20151031

EXPY Termination of patent right or utility model