CN203554784U - Convex copper structure PCB - Google Patents
Convex copper structure PCB Download PDFInfo
- Publication number
- CN203554784U CN203554784U CN201320685778.1U CN201320685778U CN203554784U CN 203554784 U CN203554784 U CN 203554784U CN 201320685778 U CN201320685778 U CN 201320685778U CN 203554784 U CN203554784 U CN 203554784U
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- layer
- pcb
- protruding
- copper layer
- pcb board
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Abstract
The utility model discloses a convex copper structure PCB comprising a substrate, a convex copper layer, a bottom layer solder-resisting layer and a bottom layer. The convex copper layer is covered on an external surface of high current wiring of the substrate corresponding to the bottom layer solder-resisting layer. The bottom layer solder-resisting layer is covered on the surface of the bottom layer. The thickness of the convex copper layer is arranged according to requirements of current bearing. A high current wiring part is confirmed in the initial stage of PCB design, and the convex cooper layer is additionally arranged so that current-bearing capacity of the PCB is enhanced and burn-out of wiring of copper foils of the PCB is prevented. Besides, production technology is simplified, and the convex copper layer is additionally arranged only on the high current part so that consistency of finished products is ensured.
Description
Technical field
The utility model relates to pcb board technical field, relates in particular to a kind of protruding steel structure pcb board.
Background technology
PCB is the abbreviation of printed circuit board (PCB) (Printed Circuit Board).Printed circuit board (PCB) is the substrate that assembling electronic component is used, and is by the printed board of connection and printed component between predetermined design formation point on general substrate.The major function of this product is to make various electronic components form the connection of predetermining circuit, plays relay transmission, is the crucial electronic interconnection part of electronic product, has the title of " mother of electronic product ".In Electric Machine Control design, drive motors part need to be compared with large-drive-current, integrated along with modern product, miniaturization, this just requires us when design motor driver, to use reduced size pcb board, while using larger electric current in design in the past, designer generally can adopt the welding resistance of large current segment cabling on pcb board is removed, can be manually zinc-plated on the Copper Foil top layer of pcb board, thereby increase current carrying capacity, the method is comparatively convenient, in daily middle relatively extensive use, but, the current carrying capacity of circuit improves undesirable, and increased manual operation link, to the homogeneity of product of producing in enormous quantities, cannot ensure.
Utility model content
The purpose of this utility model is, by the protruding steel structure pcb board of one, to solve the problem that above background technology part is mentioned.
For reaching this object, the utility model by the following technical solutions:
A kind of protruding steel structure pcb board, it comprises substrate, protruding copper layer, bottom solder mask and bottom; Described protruding copper layer covers the large electric current cabling outer surface on bottom solder mask counterpart substrate, and described bottom solder mask is covered in bottom surface, and wherein, described protruding copper layer thickness requires to arrange according to current load.
Especially, described substrate is selected epoxy glass substrate.
Especially, described bottom solder mask is selected welding resistance ink.
The protruding steel structure pcb board that the utility model provides has improved the loaded current ability of pcb board Copper Foil cabling, prevents that pcb board Copper Foil cabling from blowing, and has simplified production technology simultaneously, only at large electric current position, increases protruding copper layer, has improved the consistency of finished product.
Accompanying drawing explanation
The protruding steel structure pcb board plan structure schematic diagram that Fig. 1 provides for the utility model embodiment;
The protruding steel structure pcb board cross-sectional view that Fig. 2 provides for the utility model embodiment.
Embodiment
Below in conjunction with drawings and Examples, the utility model is described in further detail.Be understandable that, specific embodiment described herein is only for explaining the utility model, but not to restriction of the present utility model.It also should be noted that, for convenience of description, in accompanying drawing, only show the part relevant to the utility model but not full content.
Please refer to shown in Fig. 1 and Fig. 2, the present embodiment convexity steel structure pcb board specifically comprises substrate 101, protruding copper layer 102, bottom solder mask 103 and bottom 104.
Described protruding copper layer 102 covers the large electric current cabling outer surface on bottom solder mask 103 counterpart substrates 101.Wherein, described protruding copper layer 102 thickness require to arrange according to current load.Described large electric current cabling refers to the zinc-plated part of craft of traditional PCB plate post-processed.
Described bottom solder mask 103 is covered in bottom 104 surfaces.In the present embodiment, described substrate 101 is selected epoxy glass substrate 101.Described bottom solder mask 103 is selected welding resistance ink.
The technical solution of the utility model is just determined large circuit trace position at the initial stage of PCB design, increase protruding copper layer, not only improved the ability of pcb board loaded current, prevent that pcb board Copper Foil cabling from blowing, and simplified production technology, only at large electric current position, increase protruding copper layer, guaranteed the consistency of finished product.
Note, above are only preferred embodiment of the present utility model and institute's application technology principle.Skilled person in the art will appreciate that the utility model is not limited to specific embodiment described here, can carry out for a person skilled in the art various obvious variations, readjust and substitute and can not depart from protection range of the present utility model.Therefore, although the utility model is described in further detail by above embodiment, but the utility model is not limited only to above embodiment, in the situation that not departing from the utility model design, can also comprise more other equivalent embodiment, and scope of the present utility model is determined by appended claim scope.
Claims (3)
1. a protruding steel structure pcb board, is characterized in that, comprises substrate, protruding copper layer, bottom solder mask and bottom; Described protruding copper layer covers the large electric current cabling outer surface on bottom solder mask counterpart substrate, and described bottom solder mask is covered in bottom surface, and wherein, described protruding copper layer thickness requires to arrange according to current load.
2. protruding steel structure pcb board according to claim 1, is characterized in that, described substrate is selected epoxy glass substrate.
3. according to the protruding steel structure pcb board described in claim 1 or 2 any one, it is characterized in that, described bottom solder mask is selected welding resistance ink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320685778.1U CN203554784U (en) | 2013-10-31 | 2013-10-31 | Convex copper structure PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320685778.1U CN203554784U (en) | 2013-10-31 | 2013-10-31 | Convex copper structure PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203554784U true CN203554784U (en) | 2014-04-16 |
Family
ID=50472840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320685778.1U Expired - Fee Related CN203554784U (en) | 2013-10-31 | 2013-10-31 | Convex copper structure PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203554784U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103547065A (en) * | 2013-10-31 | 2014-01-29 | 无锡市矽成微电子有限公司 | Protruding copper structure PCB and manufacturing process of protruding copper structure PCB |
-
2013
- 2013-10-31 CN CN201320685778.1U patent/CN203554784U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103547065A (en) * | 2013-10-31 | 2014-01-29 | 无锡市矽成微电子有限公司 | Protruding copper structure PCB and manufacturing process of protruding copper structure PCB |
| CN103547065B (en) * | 2013-10-31 | 2017-03-29 | 无锡市矽成微电子有限公司 | A kind of convex steel structure pcb board and its manufacturing process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140416 Termination date: 20151031 |
|
| EXPY | Termination of patent right or utility model |