CN103547065A - Protruding copper structure PCB and manufacturing process of protruding copper structure PCB - Google Patents
Protruding copper structure PCB and manufacturing process of protruding copper structure PCB Download PDFInfo
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- CN103547065A CN103547065A CN201310537699.0A CN201310537699A CN103547065A CN 103547065 A CN103547065 A CN 103547065A CN 201310537699 A CN201310537699 A CN 201310537699A CN 103547065 A CN103547065 A CN 103547065A
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Abstract
The invention discloses a protruding copper structure PCB and a manufacturing process of the protruding copper structure PCB. The PCB comprises a substrate, protruding copper layers, a bottom layer welding resisting layer and a bottom layer, the outer surfaces of the positions, corresponding to large-current wiring parts on the substrate, of the bottom layer welding resisting layer are covered with the protruding copper layers, the surface of the bottom layer is covered with the bottom layer welding resisting layer, and the thicknesses of the protruding copper layers are set according to current bearing requirements. According to the protruding copper structure PCB and the manufacturing process of the protruding copper structure PCB, the large-current wiring parts are determined in the initial stage of PCB design, the protruding copper layers are additionally arranged, the current bearing capacity of the PCB is improved, copper foil wiring of the PCB is prevented from being brunt out, the production process is simplified, and the protruding copper layers are only additionally arranged on the large-current parts so that the coincidence of finished products can be guaranteed.
Description
Technical field
The present invention relates to pcb board technical field, relate in particular to a kind of protruding steel structure pcb board and manufacturing process thereof.
Background technology
PCB is the abbreviation of printed circuit board (PCB) (Printed Circuit Board).Printed circuit board (PCB) is the substrate that assembling electronic component is used, and is by the printed board of connection and printed component between predetermined design formation point on general substrate.The major function of this product is to make various electronic components form the connection of predetermining circuit, plays relay transmission, is the crucial electronic interconnection part of electronic product, has the title of " mother of electronic product ".In Electric Machine Control design, drive motors part need to be compared with large-drive-current, integrated along with modern product, miniaturization, this just requires us when design motor driver, to use reduced size pcb board, while using larger electric current in design in the past, designer generally can adopt the welding resistance of large current segment cabling on pcb board is removed, can be manually zinc-plated on the Copper Foil top layer of pcb board, thereby increase current carrying capacity, the method is comparatively convenient, in daily middle relatively extensive use, but, the current carrying capacity of circuit improves undesirable, and increased manual operation link, to the homogeneity of product of producing in enormous quantities, cannot ensure.
Summary of the invention
The object of the invention is to, by a kind of protruding steel structure pcb board and manufacturing process thereof, solve the problem that above background technology is partly mentioned.
For reaching this object, the present invention by the following technical solutions:
A steel structure pcb board, it comprises substrate, protruding copper layer, bottom solder mask and bottom; Described protruding copper layer covers the large electric current cabling outer surface on bottom solder mask counterpart substrate, and described bottom solder mask is covered in bottom surface, and wherein, described protruding copper layer thickness requires to arrange according to current load.
Especially, described substrate is selected epoxy glass substrate.
Especially, described bottom solder mask is selected welding resistance ink.
The invention also discloses a kind of protruding steel structure pcb board manufacturing process, it comprises the steps:
A, at the PCB design initial stage, determine manual zinc-plated part, the i.e. concrete position of large electric current cabling;
B, the large electric current cabling outer surface on bottom solder mask counterpart substrate are removed solder mask, cover the protruding copper layer of one deck, increase copper thickness.
Protruding steel structure pcb board provided by the invention and manufacturing process thereof have improved the loaded current ability of pcb board Copper Foil cabling, prevent that pcb board Copper Foil cabling from blowing, simplify production technology simultaneously, only at large electric current position, increased protruding copper layer, improved the consistency of finished product.
Accompanying drawing explanation
The protruding steel structure pcb board plan structure schematic diagram that Fig. 1 provides for the embodiment of the present invention;
The protruding steel structure pcb board cross-sectional view that Fig. 2 provides for the embodiment of the present invention;
The protruding steel structure pcb board manufacturing process flow diagram that Fig. 3 provides for the embodiment of the present invention.
Embodiment
Below in conjunction with drawings and Examples, the invention will be further described.Be understandable that, specific embodiment described herein is only for explaining the present invention, but not limitation of the invention.It also should be noted that, for convenience of description, in accompanying drawing, only show part related to the present invention but not full content.
Please refer to shown in Fig. 1 and Fig. 2, the present embodiment convexity steel structure pcb board specifically comprises substrate 101, protruding copper layer 102, bottom solder mask 103 and bottom 104.
Described protruding copper layer 102 covers the large electric current cabling outer surface on bottom solder mask 103 counterpart substrates 101.Wherein, described protruding copper layer 102 thickness require to arrange according to current load.Described large electric current cabling refers to the zinc-plated part of craft of traditional PCB plate post-processed.
Described bottom solder mask 103 is covered in bottom 104 surfaces.In the present embodiment, described substrate 101 is selected epoxy glass substrate 101.Described bottom solder mask 103 is selected welding resistance ink.
As shown in Figure 3, the protruding steel structure pcb board manufacturing process flow diagram that Fig. 3 provides for the embodiment of the present invention.
The present embodiment convexity steel structure pcb board manufacturing process specifically comprises the steps:
Step S301, at the PCB design initial stage, determine manual zinc-plated part, be also the concrete position of large electric current cabling.
Step S302, the large electric current cabling outer surface on bottom solder mask counterpart substrate are removed solder mask, cover the protruding copper layer of one deck, increase copper thickness.The size of copper thickness requires to arrange according to current load.
Technical scheme of the present invention is just determined large circuit trace position at the initial stage of PCB design, increase protruding copper layer, not only improved the ability of pcb board loaded current, prevent that pcb board Copper Foil cabling from blowing, and simplified production technology, only at large electric current position, increase protruding copper layer, guaranteed the consistency of finished product.
Note, above are only preferred embodiment of the present invention and institute's application technology principle.Skilled person in the art will appreciate that and the invention is not restricted to specific embodiment described here, can carry out for a person skilled in the art various obvious variations, readjust and substitute and can not depart from protection scope of the present invention.Therefore, although the present invention is described in further detail by above embodiment, the present invention is not limited only to above embodiment, in the situation that not departing from the present invention's design, can also comprise more other equivalent embodiment, and scope of the present invention is determined by appended claim scope.
Claims (4)
1. a protruding steel structure pcb board, is characterized in that, comprises substrate, protruding copper layer, bottom solder mask and bottom; Described protruding copper layer covers the large electric current cabling outer surface on bottom solder mask counterpart substrate, and described bottom solder mask is covered in bottom surface, and wherein, described protruding copper layer thickness requires to arrange according to current load.
2. protruding steel structure pcb board according to claim 1, is characterized in that, described substrate is selected epoxy glass substrate.
3. according to the protruding steel structure pcb board described in claim 1 or 2 any one, it is characterized in that, described bottom solder mask is selected welding resistance ink.
4. a protruding steel structure pcb board manufacturing process, is characterized in that, comprises the steps:
A, at the PCB design initial stage, determine manual zinc-plated part, the i.e. concrete position of large electric current cabling;
B, the large electric current cabling outer surface on bottom solder mask counterpart substrate are removed solder mask, cover the protruding copper layer of one deck, increase copper thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310537699.0A CN103547065B (en) | 2013-10-31 | 2013-10-31 | A kind of convex steel structure pcb board and its manufacturing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310537699.0A CN103547065B (en) | 2013-10-31 | 2013-10-31 | A kind of convex steel structure pcb board and its manufacturing process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103547065A true CN103547065A (en) | 2014-01-29 |
| CN103547065B CN103547065B (en) | 2017-03-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310537699.0A Active CN103547065B (en) | 2013-10-31 | 2013-10-31 | A kind of convex steel structure pcb board and its manufacturing process |
Country Status (1)
| Country | Link |
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| CN (1) | CN103547065B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106973494A (en) * | 2017-04-27 | 2017-07-21 | 新华三技术有限公司 | A kind of cabling processing method and printed circuit board (PCB) |
| CN110099506A (en) * | 2019-05-09 | 2019-08-06 | 深圳市锐尔觅移动通信有限公司 | A kind of electronic equipment, printed circuit board and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03283484A (en) * | 1990-03-30 | 1991-12-13 | Furukawa Electric Co Ltd:The | Large current circuit board |
| CN1705104A (en) * | 2004-05-31 | 2005-12-07 | 三洋电机株式会社 | Circuit device and manufacturing method thereof |
| CN201219327Y (en) * | 2008-06-06 | 2009-04-08 | 保锐科技股份有限公司 | Modular structure of circuit board great current area |
| CN203554784U (en) * | 2013-10-31 | 2014-04-16 | 无锡市矽成微电子有限公司 | Convex copper structure PCB |
-
2013
- 2013-10-31 CN CN201310537699.0A patent/CN103547065B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03283484A (en) * | 1990-03-30 | 1991-12-13 | Furukawa Electric Co Ltd:The | Large current circuit board |
| CN1705104A (en) * | 2004-05-31 | 2005-12-07 | 三洋电机株式会社 | Circuit device and manufacturing method thereof |
| CN201219327Y (en) * | 2008-06-06 | 2009-04-08 | 保锐科技股份有限公司 | Modular structure of circuit board great current area |
| CN203554784U (en) * | 2013-10-31 | 2014-04-16 | 无锡市矽成微电子有限公司 | Convex copper structure PCB |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106973494A (en) * | 2017-04-27 | 2017-07-21 | 新华三技术有限公司 | A kind of cabling processing method and printed circuit board (PCB) |
| CN110099506A (en) * | 2019-05-09 | 2019-08-06 | 深圳市锐尔觅移动通信有限公司 | A kind of electronic equipment, printed circuit board and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103547065B (en) | 2017-03-29 |
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Effective date of registration: 20190708 Address after: 214000 Jiangsu Province Wuxi Liyuan Development Zone Dicui Road 100 (Creative Park) Standard Factory Building No. 10, West of the second floor Patentee after: Wuxi Xincheng Microtechnology Co., Ltd. Address before: 214000 3rd floor, A2 Building, Standard Office Building, Liyuan Development Zone, Binhu District, Wuxi City, Jiangsu Province Patentee before: Wuxi City Xi Cheng Microtronics A/S |
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