TWI539874B - Embedded component package structure and manufacturing method thereof - Google Patents

Description

Buried component packaging structure and manufacturing method thereof

The present invention relates to a package structure and a method of fabricating the same, and more particularly to a buried component package structure and a method of fabricating the same.

A printed circuit board can be roughly divided into a rigid circuit board and a flexible circuit board (or a flexible board), wherein the flexible circuit board is a circuit board supported by a soft dielectric material. Used in continuous dynamic bending products. It is currently widely used in packaging for LCD driver ICs, portable electronic products, and wearable electronic products, such as smart watches, smart phones, tablets, notebook computers, and digital cameras.

In general, the design of a flexible circuit board is to bond the component to a circuit layer on a soft dielectric material that is less advantageous for bonding the component to it due to the flexible nature of the flexible dielectric material. On the other hand, between the rigid circuit board and the flexible circuit board, or between the flexible circuit board and the flexible circuit board, the connector is mostly used as a connection interface. However, the rigid circuit board can be connected through the connector Flexible circuit boards, or the connection of flexible circuit boards and flexible circuit boards, will inevitably consume a part of the configuration space, so that the overall structure volume can not be effectively reduced, which is not conducive to the application of thin design electronic products. .

The present invention provides a buried component package structure having a relatively thin thickness.

The invention provides a method for fabricating a buried component package structure, which can reduce the overall thickness of the package structure.

The present invention provides a buried component package structure including a first flexible circuit board, a second flexible circuit board, an element, and a line connection structure. The second flexible circuit board is disposed opposite the first flexible circuit board, wherein the first flexible circuit board and the second flexible circuit board have a gap therebetween. The component is buried in the gap. The line connection structure includes a connection layer and a first connection line layer. The connection layer connects the first flexible circuit board and the second flexible circuit board and fills the gap to cover the component. The first connecting circuit layer is located on the upper surface of the connecting layer, wherein the first flexible circuit board and the second flexible circuit board are electrically connected to the component through the first connecting circuit layer, respectively.

In an embodiment of the invention, the buried component package structure further includes a third flexible circuit board disposed in parallel with the first flexible circuit board. The third flexible circuit board connects the first flexible circuit board and the second flexible circuit board through the connection layer, wherein the line connection structure further comprises a second connection circuit layer on the lower surface of the connection layer, and the third The flexible circuit board is electrically connected to the second connection circuit layer.

The invention provides a method for fabricating a buried component package structure, which comprises the following steps. Providing at least two flexible substrates disposed opposite each other and having a gap between the at least two flexible substrates, wherein each of the flexible substrates is formed with an opposite first conductive layer and a second conductive layer. The component is buried in the gap. Providing a first dielectric material layer and a second dielectric material layer respectively on opposite sides of the at least two flexible substrates, wherein a third conductive layer is formed on the first dielectric material layer, and the second dielectric layer is A fourth conductive layer is formed on the material layer. Moving the first layer of dielectric material toward the gap to press fit to the first conductive layer of the at least two flexible substrates, and moving the second layer of dielectric material toward the gap to press fit to the at least two flexible groups The second conductive layer of the material. A portion of the first dielectric material layer and a portion of the second dielectric material layer are respectively filled into the gap and connected to each other to form a connection layer. The tie layer joins the at least two flexible substrates and covers the component. The third conductive layer is patterned to form a first connecting wiring layer. A plurality of conductive blind vias are formed on the connection layer to electrically connect the first conductive layer and the first connection circuit layer and the electrical connection component and the first connection circuit layer.

In an embodiment of the present invention, the method for fabricating the embedded component package structure further includes: patterning the first conductive layer and the second layer on each flexible substrate after forming the conductive blind vias in the connection layer Conductive layers to form a first patterned wiring layer and a second patterned wiring layer, respectively.

In an embodiment of the present invention, the method for fabricating the embedded component package structure further includes forming a cap layer on the first conductive layer and the second conductive layer on each flexible substrate after patterning And a patterned circuit layer and the first connecting circuit layer, wherein the covering layer exposes a portion of the first connecting circuit layer.

In an embodiment of the present invention, the method for fabricating the embedded component package structure further includes forming a cap layer on the first conductive layer and the second conductive layer on each flexible substrate after patterning Two patterned circuit layers and a fourth conductive layer.

In an embodiment of the present invention, the method for fabricating the embedded device package structure further includes forming a reinforcing plate on the cover layer after forming the cover layer on the second patterned circuit layer and the fourth conductive layer. Wherein the reinforcing plate is disposed corresponding to the connecting layer, and the covering layer is located between the connecting layer and the reinforcing plate.

In an embodiment of the present invention, the method for fabricating the embedded component package structure further includes forming at least one conductive via hole on each flexible substrate to electrically connect each component before embedding the component in the gap. a first conductive layer and a second conductive layer on the flexible substrate. Next, the first conductive layer and the second conductive layer on each flexible substrate are patterned to form a first patterned circuit layer and a second patterned line, respectively.

In an embodiment of the present invention, the method for fabricating the embedded component package further includes forming a first cap layer after patterning the first conductive layer and the second conductive layer on each flexible substrate. The first patterned circuit layers and the second cover layer are formed on the second patterned circuit layers. A portion of the conductive via hole is electrically connected to the first patterned circuit layer, and a portion of the conductive via hole is electrically connected to the second patterned layer to electrically connect to at least one of the second patterned circuit layer.

In an embodiment of the invention, the method for fabricating the embedded component package structure further includes patterning the fourth conductive layer while patterning the third conductive layer. To form a second connecting circuit layer. The second connection line layer is electrically connected to at least one of the second patterned circuit layer through at least one of the conductive via holes penetrating the second cover layer.

Based on the above, in the embedded component package structure of the present invention and the manufacturing method thereof, the permeable line connection structure is used as a connection interface of two oppositely disposed flexible circuit boards, wherein components (such as active components or passive components) can be The invention is embedded in a gap between the two oppositely disposed flexible circuit boards, and is covered by a connection layer of the line connection structure filled in the gap. On the other hand, the aforementioned components can be electrically connected to the respective flexible circuit boards through the connection wiring layers of the line connection structure. Therefore, the embedded component package structure of the present invention and the connector layer of the present invention are connected to the circuit layer on the flexible dielectric material by a conventional technique and connected to the two oppositely disposed flexible circuit boards through the connector The manufacturing method can effectively reduce the overall thickness of the package structure for use in thin-formed electronic products.

The above described features and advantages of the invention will be apparent from the following description.

100, 100A‧‧‧ buried component package junction

110‧‧‧First flexible circuit board

110’‧‧‧ Third flexible circuit board

111, 121‧‧‧Flexible substrate

111a, 121a‧‧‧ conductive through holes

112, 122‧‧‧ first conductive layer

112a, 122a‧‧‧ first patterned circuit layer

113, 123‧‧‧Second conductive layer

113a, 123a‧‧‧Second patterned circuit layer

120‧‧‧Second flexible circuit board

130‧‧‧ components

140‧‧‧Line connection structure

141‧‧‧First dielectric material layer

142‧‧‧Second dielectric material layer

143‧‧‧ Third conductive layer

143a‧‧‧First connection circuit layer

144‧‧‧4th conductive layer

144a‧‧‧Second connection circuit layer

145‧‧‧Connection layer

146‧‧‧ Conductive blind holes

150, 160‧‧ ‧ overlay

151, 152‧‧‧ first cover

153, 154‧‧‧second cover

170‧‧‧ reinforcing plate

S‧‧‧ gap

1A to FIG. 1I are schematic diagrams showing a manufacturing process of a buried component package structure according to an embodiment of the invention.

2A to 2J are schematic diagrams showing a manufacturing process of a buried component package structure according to another embodiment of the present invention.

1A to FIG. 1I are schematic diagrams showing a manufacturing process of a buried component package structure according to an embodiment of the invention. Referring first to FIG. 1A, at least two flexible substrates 111, 121 (two are schematically shown in FIGS. 1A to 1I) disposed opposite each other are provided, and a gap is maintained between the flexible substrates 111, 121. S. In general, the flexible substrates 111, 121 may be composed of polyimide (PI) or other suitable flexible materials, such as polyethylene terephthalate (PET). Polyethersulfone (PES) or polyethylene naphthalate (PEN). On the other hand, the thickness of the flexible substrate 111 and the thickness of the flexible substrate 121 may be the same or different, wherein the thickness of the flexible substrate 111 is smaller than the thickness of the flexible substrate 121. Note, but the invention is not limited thereto.

The first conductive layer 112 and the second conductive layer 113 are respectively formed on the opposite surfaces of the flexible substrate 111. Similarly, the first conductive layer 122 and the first surface are respectively formed on the opposite surfaces of the flexible substrate 121. Two conductive layers 123. In general, the first conductive layers 112, 113 and the second conductive layers 113, 123 may be made of copper or other suitable metal materials, such as gold, silver, tin or alloys of the above metals. Limit it.

Next, referring to FIG. 1B, the component 130 is buried in the gap S, and the first dielectric material layer 141 and the second dielectric material layer 142 are provided. The component 130 may be an active component or a passive component, and the number of the components 130 may be one or more, which is not limited by the present invention. On the other hand, the first dielectric material layer 141 and the second dielectric material layer 142 are respectively Located on opposite sides of the flexible substrates 111, 121, a third conductive layer 143 is formed on the first dielectric material layer 141, and a fourth conductive layer 144 is formed on the second dielectric material layer 142. Generally, the third conductive layer 143 and the fourth conductive layer 144 may be made of copper or other suitable metal materials, such as gold, silver, tin or an alloy of the above metal materials, which is not limited in the present invention. Moreover, the first dielectric material layer 141 and the second dielectric material layer 142 may be a dielectric colloid, a combination of a dielectric colloid and a polyimide film, a liquid crystal polymer (LCP) or Prepreg.

Next, referring to FIG. 1C, the first dielectric material layer 141 is moved toward the gap S to be pressed to the first conductive layer 112, 122 near the gap S, and the second dielectric material layer 142 is moved toward the gap S. Pressing to the second conductive layer 113, 123 near the gap S. Here, the sum of the thickness of the first dielectric material layer 141 and the thickness of the second dielectric material layer 142 is substantially larger than the thickness of the flexible substrate 111, the thickness of the first conductive layer 112, and the thickness of the second conductive layer 113. The sum of the thicknesses is also greater than the sum of the thickness of the flexible substrate 121, the thickness of the first conductive layer 122, and the thickness of the second conductive layer 123, thereby moving the first dielectric material layer 141 toward the gap S to be pressed. Up to the first conductive layer 112, 122 near the gap S, and moving the second dielectric material layer 142 toward the gap S to be pressed to the second conductive layer 113, 123 near the gap S, allowing the portion The first dielectric material layer 141 and a portion of the second dielectric material layer 142 are filled in the gaps S to be connected to each other. Specifically, the interconnected first dielectric material layer 141 and the second dielectric material layer 142 form a connection layer 145 for use in connecting the flexible substrates 111, 121. The other side In the face, the tie layer 145 covers the component 130 to secure the component 130 to the gap S.

Next, referring to FIG. 1D to FIG. 1G, the third conductive layer 143 is patterned, for example, by lithography to form the first connection circuit layer 143a, and is sequentially laser-drilled (or mechanically drilled) and plated, for example. The fabrication process forms a plurality of conductive vias 146 on the connection layer 145, wherein the conductive vias 146 are electrically connected to the first conductive layer 112 and the first connection layer 143a, the first conductive layer 122 and the first connection layer, respectively. The line connection structure 140 of the present embodiment is substantially composed of a first connection line layer 143a, a fourth conductive layer 144, a connection layer 145 and a conductive via 146. After the conductive via 146 is formed on the connection layer 145, the first conductive layer 112 and the second conductive layer 113 on the flexible substrate 111 are patterned, for example, by lithography to form a first patterned circuit layer, respectively. 112a and the second patterned circuit layer 113a. And, the first conductive layer 122 and the second conductive layer 123 on the flexible substrate 121 are patterned to form a first patterned wiring layer 122a and a second patterned wiring layer 123a, respectively. In this embodiment, the first flexible circuit board 110 is substantially composed of a flexible substrate 110, a first patterned circuit layer 112a and a second patterned circuit layer 113a, and the second flexible circuit The board 120 is substantially composed of a flexible substrate 120, a first patterned wiring layer 122a, and a second patterned wiring layer 123a.

In other words, the line connection structure 140 can be used not only as the fixing component 130 in the gap S but also as the connection interface between the first flexible circuit board 110 and the second flexible circuit board 120, and the component 130 can be transmitted through the line. The conductive blind via 146 of the connection structure 140 is electrically connected to the first connection circuit layer 143a to the first flexible circuit The board 110 and the second flexible circuit board 120. The embedded component package structure of the present invention and the method of fabricating the same according to the prior art, the component is bonded to the circuit layer on the soft dielectric material, and the two oppositely disposed flexible circuit boards are connected through the connector It can effectively reduce the overall thickness of the package structure for use in thin-formed electronic products.

Thereafter, referring to FIG. 1H to FIG. 1I, in order to protect the line structure on the first flexible circuit board 110 and the second flexible circuit board 120, a cover layer 150 may be formed on the first patterned circuit layers 112a, 122a. And the first connection circuit layer 143a, wherein the cover layer 150 exposes a portion of the first connection circuit layer 143a as a connection interface electrically connected to other components. Similarly, a cover layer 160 may be formed on the second patterned circuit layers 113a, 123a and the fourth conductive layer 144, wherein in order to improve the tensile strength, bending strength, shear strength, etc. of the line connection structure 140, The first flexible circuit board 110 and the second flexible circuit board 120 are prevented from being separated from the line connection structure 140 by an external force, and the reinforcing plate 170 may be formed on the cover layer 160, wherein the reinforcing plate 170 corresponds to the connection layer 145. The cover layer 160 is disposed between the connection layer 145 and the reinforcement plate 170. Generally, the reinforcing plate 170 may be made of a material such as glass epoxy resin (FR-4) or metal. Thus far, the fabrication of the embedded component package structure 100 of the present embodiment has been substantially completed.

Other embodiments are listed below for illustration. It is to be noted that the following embodiments use the same reference numerals and parts of the above-mentioned embodiments, and the same reference numerals are used to refer to the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted portions, reference may be made to the foregoing embodiments, and the following embodiments are not repeated.

2A to 2J are schematic diagrams showing a manufacturing process of a buried component package structure according to another embodiment of the present invention. Referring first to FIG. 2A, two flexible substrates 111 and a flexible substrate 121 are provided, wherein the two flexible substrates 111 are juxtaposed, and the two flexible substrates 111 are A gap S is maintained between the flexible substrates 121. Next, referring to FIG. 2B and FIG. 2C, at least one conductive via 111a is formed on each flexible substrate 111 to electrically connect the first conductive layer 112 and the second conductive layer 113 on each flexible substrate 111. . Further, at least one conductive via 121a is formed on the flexible substrate 121 to electrically connect the first conductive layer 122 and the second conductive layer 123 on the flexible substrate 121. Generally, the conductive vias 111a are formed through through holes of the first conductive layer 112, the flexible substrate 111, and the second conductive layer 113 by laser drilling or mechanical drilling, and then plating the through holes. The holes are electrically connected to electrically connect the first conductive layer 112 and the second conductive layer 113. Similarly, the conductive vias 121a are formed through through holes of the first conductive layer 122, the flexible substrate 121 and the second conductive layer 123 by laser drilling or mechanical drilling, and then the via holes are plated. Therefore, the first conductive layer 122 and the second conductive layer 123 are electrically connected.

Next, referring to FIG. 2D and FIG. 2E, the first conductive layer 112 and the second conductive layer 113 on each flexible substrate 111 are patterned to form a first patterned circuit layer 112a and a second patterned circuit layer, respectively. 113a. And, the first conductive layer 122 and the second conductive layer 123 on the flexible substrate 121 are patterned to form a first patterned wiring layer 122a and a second patterned wiring layer 123a, respectively. In this embodiment, the first flexible circuit board 110 and the third flexible circuit board 110' are substantially composed of a flexible substrate 110, a first patterned circuit layer 112a and a second patterned circuit layer 113a. Composition, The second flexible circuit board 120 is substantially composed of a flexible substrate 120, a first patterned wiring layer 122a and a second patterned wiring layer 123a.

In order to protect the line structure on the first flexible circuit board 110, the second flexible circuit board 120 and the third flexible circuit board 110', a first cover layer 151 may be formed on each of the flexible substrates 111. The first patterned wiring layer 112a is formed on the first patterned wiring layer 122a of the flexible substrate 121. Similarly, a second cover layer 153 may be formed on the second patterned circuit layer 113a of each flexible substrate 111, and a second cover layer 154 may be formed on the second patterned circuit layer 123a of the flexible substrate 121. on.

Next, referring to FIG. 2F and FIG. 2G, the first dielectric material layer 141 is moved toward the gap S to be pressed onto the first patterned circuit layer 112a and the second flexible circuit on the first flexible circuit board 110. The first patterned circuit layer 122a on the board 120. In detail, the first dielectric material layer 141 is substantially in contact with the first cover layer 151 on the first flexible circuit board 110 and with the first cover layer 152 on the second flexible circuit board 120. Contact. Similarly, the second dielectric material layer 142 is moved toward the gap S to be pressed to the second patterned circuit layer 113a on the third flexible circuit board 110' and the second on the second flexible circuit board 120. The wiring layer 123a is patterned. In detail, the second dielectric material layer 142 is substantially in contact with the second cover layer 153 on the third flexible circuit board 110' and the second cover layer on the second flexible circuit board 120. 154 contact. At this time, a part of the first dielectric material layer 141 and a part of the second dielectric material layer 142 are filled in the gap S and connected to each other. Specifically, the first dielectric material layer 141 and the second dielectric material layer are connected to each other The connection layer 145 is formed as a connection between the first flexible circuit board 110, the second flexible circuit board 120, and the third flexible circuit board 110'. On the other hand, the connection layer 145 covers the element 130 to fix the element 130 to the gap S.

Thereafter, please refer to FIG. 2H to FIG. 2J, for example, by patterning the third conductive layer 143 to form the first connection line layer 143a, and patterning the fourth conductive layer 144 by lithography, for example, to form The second connection circuit layer 144a. Further, a plurality of conductive blind vias 146 are formed on the connection layer 145 by, for example, laser drilling (or mechanical drilling) and filling conductive paste (or plating). In detail, a portion of the conductive via 146 is electrically connected to the first connection layer 143a and the component 130. Another portion of the conductive via 146 extends through the first cover layer 151 on the first flexible circuit board 110 to be electrically connected to the first patterned circuit layer 112a on the first flexible circuit board 110, and The first cover layer 152 penetrating the second flexible circuit board 120 is electrically connected to the first patterned circuit layer 122a on the second flexible circuit board 120. A further portion of the conductive via 146 extends through the second cover layer 153 on the third flexible circuit board 110' to electrically connect to the second patterned circuit layer 113a on the third flexible circuit board 110'.

Here, the second connection line layer 144a can be electrically connected to the third flexible circuit board 110' through the conductive blind holes 146 of the second cover layer 153 on the third flexible circuit board 110'. The second patterned circuit layer 113a. Thus far, the fabrication of the embedded component package structure 100A of the present embodiment has been substantially completed.

In summary, in the embedded component package structure of the present invention and the manufacturing method thereof, the line connection structure can be used as a connection of two oppositely disposed flexible circuit boards. a interface in which an element (for example, an active element or a passive element) is embedded in a gap between the two oppositely disposed flexible circuit boards and covered by a connection layer of the line connection structure filled in the gap . On the other hand, the aforementioned components can be electrically connected to the respective flexible circuit boards through the connection wiring layers of the line connection structure. Therefore, the embedded component package structure of the present invention and the connector layer of the present invention are connected to the circuit layer on the flexible dielectric material by a conventional technique and connected to the two oppositely disposed flexible circuit boards through the connector The manufacturing method can effectively reduce the overall thickness of the package structure for use in thin-formed electronic products.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

100‧‧‧Internal component package junction

110‧‧‧First flexible circuit board

111, 121‧‧‧Flexible substrate

112a, 122a‧‧‧ first patterned circuit layer

113a, 123a‧‧‧Second patterned circuit layer

120‧‧‧Second flexible circuit board

130‧‧‧ components

140‧‧‧Line connection structure

143a‧‧‧First connection circuit layer

144‧‧‧4th conductive layer

145‧‧‧Connection layer

146‧‧‧ Conductive blind holes

150, 160‧‧ ‧ overlay

170‧‧‧ reinforcing plate

S‧‧‧ gap

Claims (10)

A buried component package structure includes: a first flexible circuit board; a second flexible circuit board disposed opposite the first flexible circuit board, wherein the first flexible circuit board Having a gap with the second flexible circuit board; an element embedded in the gap; and a line connection structure comprising: a connection layer connecting the first flexible circuit board and the second a flexible circuit board filled in the gap to cover the component; and a first connection circuit layer on an upper surface of the connection layer, wherein the first flexible circuit board and the second flexible The circuit boards are electrically connected to the component through the first connection circuit layer. The embedded component package structure of claim 1, further comprising: a third flexible circuit board disposed in parallel with the first flexible circuit board and connected to the first through the connection layer a flexible circuit board and the second flexible circuit board, wherein the line connection structure further comprises a second connection circuit layer on a lower surface of the connection layer, and the third flexible circuit board is electrically connected To the second connection circuit layer. A method of fabricating a buried component package structure, comprising: providing at least two flexible substrates disposed oppositely, and having a gap between the at least two flexible substrates, wherein each of the flexible substrates Formed with a relative first a conductive layer and a second conductive layer; an element is buried in the gap; a first dielectric material layer and a second dielectric material layer are respectively disposed on opposite sides of the at least two flexible substrates, Forming a third conductive layer on the first dielectric material layer, and forming a fourth conductive layer on the second dielectric material layer; moving the first dielectric material layer toward the gap to press the at least The first conductive layers of the two flexible substrates, and the second dielectric material layer is moved toward the gap to be pressed to the second conductive layers of the at least two flexible substrates, part of the first a dielectric material layer and a portion of the second dielectric material layer are respectively filled into the gap and connected to each other to form a connection layer, the connection layer connecting the at least two flexible substrates and covering the component; The third conductive layer is formed to form a first connecting circuit layer; and a plurality of conductive blind holes are formed in the connecting layer to electrically connect the first conductive layer and the first connecting circuit layer and electrically connect the component And the first connecting circuit layer. The method for fabricating a buried component package structure according to claim 3, further comprising: patterning the first of the flexible substrates after forming the conductive vias in the connection layer And a conductive layer and the second conductive layer to form a first patterned circuit layer and a second patterned circuit layer, respectively. The method for fabricating a buried component package structure according to claim 4, further comprising: patterning the first conductive layer and the second conductive layer on each of the flexible substrates Thereafter, a capping layer is formed on the first patterned circuit layers and on the first connecting circuit layer, wherein the capping layer exposes a portion of the first connecting circuit layer. The method for fabricating a buried component package structure according to claim 4, further comprising: forming a first conductive layer and the second conductive layer on each of the flexible substrates after forming A cover layer is on the second patterned circuit layers and on the fourth conductive layer. The method for fabricating a buried component package structure according to claim 6, further comprising: forming a reinforcement after forming the cap layer on the second patterned circuit layer and the fourth conductive layer The plate is disposed on the cover layer, wherein the reinforcing plate is disposed corresponding to the connecting layer, and the cover layer is located between the connecting layer and the reinforcing plate. The method for fabricating a buried component package structure according to claim 3, further comprising: forming at least one conductive via hole in each of the flexible substrates before embedding the component in the gap Electrically connecting the first conductive layer and the second conductive layer on each of the flexible substrates; and patterning the first conductive layer and the second conductive layer on each of the flexible substrates to respectively A first patterned circuit layer and a second patterned circuit layer are formed. The method for fabricating a buried component package structure according to claim 8 , further comprising: patterning the first conductive layer and the second conductive layer on each of the flexible substrates Forming a first capping layer on the first patterned circuit layer and forming a second capping layer on the second patterned circuit layer, wherein a portion of the conductive blind vias extend through the first capping layer And electrically connecting to the at least one of the second patterned circuit layers. The method for fabricating a buried component package structure according to claim 9 , further comprising: patterning the third conductive layer to form a second connecting circuit layer while patterning the third conductive layer; The second connection line layer is electrically connected to at least one of the second patterned circuit layers through at least one of the conductive vias extending through the second cover layer.