JP2008235761A - Printed wiring substrate with cavity and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pattern of a cavity substrate which can connect substrates in a multi-pin manner, and can increase wiring density in the substrate, and its manufacturing method. <P>SOLUTION: The printed wiring substrate with the cavity is composed of a first substrate 4 in which a through space is formed, a second substrate 3 in which the first substrate 4 is laminated and the bottom of the through space is formed, and a third substrate 5 on which the second substrate 3 is laminated. A recess to mount and hold a component is formed at the printed wiring substrate with a cavity, and the wiring of the surface of the recess and the wiring of surface of the first substrate 4 connected with the wiring have the same patterns 2 as that formed via the side wall of space of the first substrate 4, and the wiring of the surface of the recess and the third substrate 5 laminated on the back of the second substrate 3 are connected with each other through a via hole 7 filled with conductive paste. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a semiconductor package substrate widely used in various electronic devices such as personal computers, mobile communication telephones, and video cameras, and a method for manufacturing the same.

  Recently, personal computers, digital cameras, mobile phones, etc. have become widespread as mobile products. Especially, there are strong demands for small size, thinness, light weight, high definition, multi-functionality, etc.・ Low profile and 3D mounting are progressing. A method using a cavity substrate is known as one method for easily realizing such a low-profile and three-dimensional mounting of a semiconductor package.

  Hereinafter, the configuration of the conventional cavity substrate will be described with reference to FIGS.

  In FIG. 11, 111 is a glass cloth layer, 112 is a glass clothless layer, and 113 is a cavity formed by eliminating the central portion of the laminated portion of the glass clothless layer 112. 115 is a conductor pattern for drawing out the wiring formed in the cavity, and 116 is a through hole for drawing out these conductor patterns on the upper and lower surfaces of the cavity substrate. By mounting a semiconductor component or the like in the cavity 113, a reduction in thickness as a mounting body is achieved.

  In addition, as shown in FIG. 12, since the component mounting portion in the cavity 113 and the conductor pattern 117 formed on the substrate surface are formed along the substrate surface, compared to a method of connecting using via holes or through holes, Connection reliability is improved and it is easy to cope with higher pin count.

For example, Patent Documents 1 and 2 are known as prior art document information related to the application of the present invention.
JP 2002-111226 A JP 2001-274324 A

  In order to draw out the wiring in the cavity, the conventional cavity substrate is drawn out to the outer periphery of the cavity, and the interlayer connection, rewiring connection, and connection with another substrate are performed only at the outer periphery. For example, when a three-dimensional connection is made with another component-mounted board such as a stack package, a cavity board having a structure as shown in FIG. 11 can sufficiently cope with a small number of terminals to be connected. As the number increases, the number of via holes and through holes for interlayer connection increases, which increases the area required for the outer periphery of the cavity and increases the size of the package. On the other hand, the cavity substrate having the structure as shown in FIG. 12 can cope with an increase in the number of terminals necessary for inter-substrate connection. However, the wiring net to be rewired in the same substrate was once pulled out to the outer periphery of the cavity. Later, it is difficult to increase the wiring density in the board because it is connected to other layers with via holes or through holes, and it is difficult to increase the wiring density in the board, and lands other than the terminals necessary for board-to-board connection are also generated in the outer periphery of the cavity For this reason, it is difficult to reduce the size of the substrate. The present invention has been made in view of the above problems, and provides a form of a cavity substrate that can be connected between multiple pins and can increase the wiring density in the substrate, and a method for manufacturing the same. It is.

  In order to achieve the above object, the present invention provides a first substrate in which a through gap is formed, a second substrate in which the first substrate is stacked to form the bottom of the through gap, and the second substrate. In a printed wiring board with a cavity formed with a recess for mounting and housing a component, the first substrate connected to the wiring on the surface of the recess. The wiring on the surface of the substrate is the same wiring pattern formed via the gap side wall surface of the first substrate, and is laminated on the wiring on the surface of the recess and the back surface of the second substrate. A printed wiring board with cavities characterized in that the third board is connected via a via hole filled with a conductive paste. By such a configuration, a multi-pin inter-board connection is achieved. Possible and substrate It is possible to increase also the wiring density.

  As described above, the present invention enables multi-pin connection between substrates and increases the wiring density in the substrate, so that the mobile device is small, thin, lightweight, high-definition, multifunctional, etc. Therefore, it is possible to provide a package form that can easily realize a small size, a low profile, and a three-dimensional mounting corresponding to the high-performance and multi-pin semiconductor required for realizing the above.

(Embodiment 1)
Embodiment 1 of the present invention will be described below with reference to the drawings.

  FIG. 1 is a cross-sectional structure diagram of a printed wiring board with a cavity according to the first embodiment of the present invention. The printed wiring board with a cavity according to the present embodiment includes a wiring 2a formed on the surface of the second substrate 3 constituting the bottom surface of the cavity 1 and a wiring on the surface of the side wall of the cavity 1 connected to the wiring. 2b is the same wiring pattern 2 formed through the cavity inner wall surface of the first substrate 4 constituting the side wall portion, and the third wiring layer 2a and the second substrate 3 are laminated on the back surface. The wiring pattern 6 of the substrate 5 is connected via a via hole 7 filled with a conductive paste.

  Here, the second substrate 3 constituting the bottom surface part for forming the cavity 1 and the first substrate 4 constituting the side wall part are composed of a composite insulating material (hereinafter referred to as composite) made of an epoxy resin kneaded with inorganic filler. And a composite base material in which the resin fluidity is suppressed so that the resin flow is not generated as much as possible at the time of lamination in the vacuum hot press process.

  In the present embodiment, the wiring pattern 2 is made of a metal material rich in ductility such as gold, silver, copper, and aluminum. For example, a rolled copper foil or an electrolytic copper foil is preferably used such that a copper recrystallization is promoted by applying a temperature about the same as that of hot pressing to increase crystal grains.

  The third substrate 5 is a double-sided substrate in FIG. 1, but may be a multilayer substrate. There is no particular problem whether the interlayer connection structure is an all-layer IVH structure or a through-hole structure, and a desired printed wiring board can be applied.

  Hereinafter, the manufacturing method of the first embodiment will be described with reference to FIG. FIG. 6 is a process cross-sectional view illustrating the method for manufacturing the printed wiring board with a cavity according to the first embodiment.

  First, a press intermediate material 64 comprising three layers of a release film 61, a deformation layer 62, and a cover sheet 63 is prepared. The release film 61 is a resin film made of a fluororesin, and is selected from materials that have low elasticity, a high tensile elongation, and can easily follow a shape having a recess such as a cavity. Moreover, if it is the roughening surface of copper foil, it can also be temporarily crimped | bonded by the anchor effect of a roughening part. Utilizing such characteristics, a copper foil is temporarily pressure-bonded to the release film 61, and wiring is formed by a subtractive method to form the wiring pattern 2. Next, the 1st board | substrate 4 which comprises the cavity side wall part which processed the desired shape size in the desired position is prepared. Here, the inner wall shape of the cavity of the first substrate 4 is desirably an inner wall shape with a taper that is as gentle as possible. By using such an inner wall shape, the transfer of the wiring pattern 2 to the cavity inner wall surface can be more reliably performed.

  Next, through-hole processing is performed at a desired position, and a second substrate 3 is prepared that has a via hole 7 filled with a conductive paste in the through-hole and that constitutes the bottom surface of the cavity. Finally, a third substrate 5 is prepared, and all these members are overlapped and temporarily fixed while being aligned as shown in FIG.

  Then, it heats and pressurizes into a cross-sectional structure as shown in FIG.6 (b) using a vacuum hot press apparatus. At this time, the deformation layer 62 flows so as to fill the cavity 1 by heating and pressurizing. At the same time, the release film 61 is stretched together with the wiring pattern 2 and is in close contact with the surface and wall surface of the second substrate 3 constituting the bottom surface portion of the cavity 1 and the first substrate 4 constituting the side wall portion. The wiring pattern 2 is bonded together with the curing reaction of the substrate 3 and the first substrate 4. On the other hand, when the bottom and side walls are heated / pressurized, a slight resin flow occurs and attempts to flow into the cavity 1 and the outer periphery of the substrate together with the kneaded filler, but the deformation layer 62 is deformed, Resin flow into the cavity 1 is prevented. At the same time, the wiring 2a and the wiring pattern 6 of the third substrate 5 laminated on the back surface of the second substrate 3 are connected through the via hole 7 filled with the conductive paste.

  Here, since the deformable layer 62 uses a crystalline olefin polymer and can reduce the viscosity at the time of melting, it is possible to easily follow the shape of a recess such as a cavity. As the deformable layer 62, a normal glass epoxy prepreg or a B-stage epoxy resin can also be applied. Moreover, as the cover sheet 63, copper foil, a heat resistant resin film, etc. can be used. In addition, as the conductive paste for forming the via hole 7, an alloy-based conductive paste in which a copper paste or metal filler is alloy-bonded can be used.

  Finally, as shown in FIG. 6 (c), the press intermediate material 64 is peeled off from the interface between the release film 61 and the wiring pattern 2, and the second substrate 3 and the side wall constituting the bottom surface of the cavity 1. By transferring to the surface of the first substrate 4 constituting the part, the printed wiring board with a cavity in the first embodiment can be obtained.

(Embodiment 2)
Embodiment 2 of the present invention will be described below with reference to the drawings.

  FIG. 2 is a sectional structural view of a printed wiring board with a cavity according to the second embodiment of the present invention. The printed wiring board with a cavity according to the present embodiment constitutes a wiring 2a formed on the surface of the second substrate 3 constituting the bottom surface portion of the cavity 1 and a side wall portion of the cavity 1 connected to the wiring. The wiring 2b on the surface of the first substrate 4 is the same wiring pattern 2 formed on the side wall surface of the first substrate 4 via a hollow space, and is stacked on the wiring 2a and the back surface of the cavity 1. The wiring pattern 6 of the third substrate 5 is connected via a via hole 7 filled with a conductive paste.

  Here, the second substrate 3 constituting the bottom surface part for forming the cavity 1 and the first substrate 4 constituting the side wall part are composed of a composite base material as in the first embodiment.

  In the present embodiment, the wiring pattern 2 is made of a metal material rich in ductility such as gold, silver, copper, and aluminum. For example, a rolled copper foil or an electrolytic copper foil is preferably used such that a copper recrystallization is promoted by applying a temperature about the same as that of hot pressing to increase crystal grains.

  The third substrate 5 is a double-sided substrate in FIG. 2, but may be a multilayer substrate. There is no particular problem whether the interlayer connection structure is an all-layer IVH structure or a through-hole structure, and a desired printed wiring board can be applied.

  Hereinafter, the manufacturing method according to the second embodiment will be described with reference to FIG. FIG. 7 is a process cross-sectional view illustrating the method for manufacturing the printed wiring board with the cavity according to the second embodiment.

  First, a press intermediate material 64 comprising three layers of a release film 61, a deformation layer 62, and a cover sheet 63 is prepared. The release film 61 is a resin film made of a fluororesin, and is selected from materials that have low elasticity, a high tensile elongation, and can easily follow a shape having a recess such as a cavity. Moreover, if it is the roughening surface of copper foil, it can also be temporarily crimped | bonded by the anchor effect of a roughening part. Utilizing such characteristics, a copper foil is temporarily pressure-bonded to the release film 61, and wiring is formed by a subtractive method to form the wiring pattern 2. Next, the 1st board | substrate 4 which comprises the cavity side wall part which processed the desired shape size in the desired position is prepared. Here, unlike the first embodiment, the shape of the cavity inner wall of the first substrate 4 is preferably a vertical inner wall shape having as little taper as possible. By adopting such an inner wall shape, it is possible to secure a larger area of the bottom surface of the cavity and accommodate more mounting components. Next, through-hole processing is performed at a desired position, and a second substrate 3 is prepared that has a via hole 7 filled with a conductive paste in the through-hole and that constitutes the bottom surface of the cavity. Finally, a third substrate 5 is prepared, and all these members are overlapped and temporarily fixed while being aligned as shown in FIG.

  Then, it heats and pressurizes to a cross-sectional structure as shown in FIG.7 (b) using a vacuum hot press apparatus. At this time, the deformation layer 62 flows so as to fill the cavity 1 by heating and pressurizing. At the same time, the release film 61 is stretched together with the wiring pattern 2 and is in close contact with the surface and wall surface of the second substrate 3 constituting the bottom surface portion of the cavity 1 and the first substrate 4 constituting the side wall portion. The wiring pattern 2 is bonded together with the curing reaction of the substrate 3 and the first substrate 4. Depending on the degree of deformation of the deformation layer 62, a gap is generated between the wiring pattern 2 and the cavity inner wall surface without being in close contact with the cavity inner wall surface. Here, when the deformation layer 62 is sufficiently deformed and the inside of the cavity 1 is completely filled, or when the gap is filled with the resin flow from the cavity bottom and side walls, description will be given in the first embodiment. It becomes the structure. On the other hand, when the bottom and side walls are heated / pressurized, a slight resin flow occurs and attempts to flow into the cavity 1 and the outer periphery of the substrate together with the kneaded filler, but the deformation layer 62 is deformed, Resin flow into the cavity 1 is prevented to some extent. At the same time, the wiring 2a and the wiring pattern 6 of the third substrate 5 laminated on the back surface of the second substrate 3 are connected through the via hole 7 filled with the conductive paste.

  Finally, as shown in FIG. 7C, the press intermediate material 64 is peeled off from the interface between the release film 61 and the wiring pattern 2, so that the wiring substrate 2 and the side wall constituting the bottom surface of the cavity 1 are separated from the wiring pattern 2. The printed circuit board with a cavity in the second embodiment can be obtained by transferring it onto the surface of the first substrate 4 constituting the part.

(Embodiment 3)
Embodiment 3 of the present invention will be described below with reference to the drawings.

  FIG. 3 is a cross-sectional structure diagram of a printed wiring board with a cavity according to a third embodiment of the present invention. The printed wiring board with a cavity according to the present embodiment constitutes a wiring 2a formed on the surface of the second substrate 3 constituting the bottom surface portion of the cavity 1 and a side wall portion of the cavity 1 connected to the wiring. The wiring 2b on the surface of the first substrate 4 is the same wiring pattern 2 formed via the cavity inner wall surface of the side wall, and the third substrate 5 laminated on the wiring 2a and the back surface of the cavity 1 is used. Are connected via via holes 7 filled with conductive paste, and the wiring pattern 6 of the third substrate 5 laminated on the back surface of the second substrate 3 is connected to the wiring pattern 6 of the third substrate 5. The cavity 1 is connected via a via hole 8 formed in the vicinity of the side wall of the side wall portion. Here, as in the first embodiment, the second substrate 3 constituting the bottom surface portion forming the cavity 1 and the first substrate 4 constituting the side wall portion are composed of a composite base material. In the present embodiment, the wiring pattern 2 is made of a metal material rich in ductility such as gold, silver, copper, and aluminum. For example, a rolled copper foil or an electrolytic copper foil is preferably used such that a copper recrystallization is promoted by applying a temperature about the same as that of hot pressing to increase crystal grains.

  The third substrate 5 is a double-sided substrate in FIG. 3, but may be a multilayer substrate. There is no particular problem whether the interlayer connection structure is an all-layer IVH structure or a through-hole structure, and a desired printed wiring board can be applied.

  Hereinafter, the manufacturing method of the third embodiment will be described with reference to FIG. FIG. 8 is a process cross-sectional view illustrating a method for manufacturing a printed wiring board with a cavity according to the third embodiment.

  First, a press intermediate material 64 comprising three layers of a release film 61, a deformation layer 62, and a cover sheet 63 is prepared. The release film 61 is a resin film made of a fluororesin, and is selected from materials that have low elasticity, a high tensile elongation, and can easily follow a shape having a recess such as a cavity. Moreover, if it is the roughening surface of copper foil, it can also be temporarily crimped | bonded by the anchor effect of a roughening part. Utilizing such characteristics, a copper foil is temporarily pressure-bonded to the release film 61, and wiring is formed by a subtractive method to form the wiring pattern 2. Next, the 1st board | substrate 4 which comprises the cavity side wall part which processed the desired shape size in the desired position is prepared. Further, the first substrate 4 is subjected to through hole processing at a desired position, and a via hole 8 filled with a conductive paste is formed in the through hole. Next, through-hole processing is performed at a desired position, and a second substrate 3 is prepared that has a via hole 7 filled with a conductive paste in the through-hole and that constitutes the bottom surface of the cavity. Finally, a third substrate 5 is prepared, and all these members are superimposed and temporarily fixed while being aligned as shown in FIG.

  Then, it heats and pressurizes in a cross-sectional structure as shown in FIG.8 (b) using a vacuum hot press apparatus. At this time, the deformation layer 62 flows so as to fill the cavity 1 by heating and pressurizing. At the same time, the release film 61 is stretched together with the wiring pattern 2 and is in close contact with the surface and wall surface of the second substrate 3 constituting the bottom surface portion of the cavity 1 and the first substrate 4 constituting the side wall portion. The wiring pattern 2 is bonded together with the curing reaction of the substrate 3 and the first substrate 4. On the other hand, when the bottom and side walls are heated / pressurized, a slight resin flow occurs and attempts to flow into the cavity 1 and the outer periphery of the substrate together with the kneaded filler, but the deformation layer 62 is deformed, Resin flow into the cavity 1 is prevented to some extent. At the same time, the wiring 2a and the wiring pattern 6 of the third substrate 5 laminated on the back surface of the cavity 1 are connected via the via hole 7 filled with the conductive paste, and the wiring 2b and the second substrate are connected. 3 is connected to the wiring pattern 6 of the third substrate 5 laminated on the back surface of the substrate 3 through a via hole 8 filled with a conductive paste.

  Finally, as shown in FIG. 8C, the press intermediate material 64 is peeled off from the interface between the release film 81 and the wiring pattern 32, and the wiring pattern 32 is removed from the bottom surface 33, the side wall surface, and the side wall surface 34. The printed wiring board with the cavity in the third embodiment can be obtained by transferring to the above.

(Embodiment 4)
Embodiment 4 of the present invention will be described below with reference to the drawings.

  FIG. 4 is a cross-sectional structure diagram of the printed wiring board with a cavity according to the first embodiment of the present invention. In the printed wiring board with a cavity according to the present embodiment, the entire surface of the printed wiring board is covered with the second substrate 3 made of an insulating resin film on the surface on which the cavity 1 is formed, and the second substrate serving as the bottom surface of the cavity 1 is formed. The wiring 2a formed on the surface of the substrate 3 and the wiring 2b on the surface of the first substrate 4 constituting the side wall portion of the cavity 1 connected to the wiring are on the second substrate 3 and the first The wiring pattern 2 of the third substrate 5 that is the same wiring pattern 2 formed through the cavity inner wall surface of the substrate 4 and is laminated on the back surface of the cavity 1 is an insulating resin film. The conductive paste is formed through a via hole 7 filled with a conductive paste.

  Here, the 2nd board | substrate 3 which comprises the bottom face part for forming the cavity 1 is comprised with the insulating resin film, and the 1st board | substrate 4 which comprises a side wall part is comprised with the composite base material.

  In the present embodiment, the insulating resin film is a high heat-resistant resin film selected from at least polyimide, polyamide, and liquid crystal polymer, and a metal film that is patterned as the wiring pattern 2 is formed on at least one surface. . This metal film may be formed directly on the insulating resin film in this embodiment, although the metal film may be in close contact with the insulating resin film via an adhesive or may be directly formed on the insulating resin film. Is preferred. The metal film is patterned to form a wiring pattern 2. The wiring pattern 2 is preferably made of a metal material rich in ductility such as gold, silver, copper, and aluminum. It is desirable to apply an adhesive to the back surface of the insulating resin film on which the wiring pattern 2 is formed. The adhesive is particularly preferably a thermosetting epoxy resin.

  The third substrate 5 is a double-sided substrate in FIG. 4, but may be a multilayer substrate. There is no particular problem whether the interlayer connection structure is an all-layer IVH structure or a through-hole structure, and a desired printed wiring board can be applied.

  Hereinafter, the manufacturing method of the fourth embodiment will be described with reference to FIG. FIG. 9 is a process cross-sectional view illustrating a method for manufacturing a printed wiring board with a cavity according to the fourth embodiment.

  First, a press intermediate material 64 comprising three layers of a release film 61, a deformation layer 62, and a cover sheet 63 is prepared. The release film 61 is a resin film made of a fluororesin, and is selected from materials that have low elasticity, a high tensile elongation, and can easily follow a shape having a recess such as a cavity. Next, an insulating resin film for constituting the second substrate 3 on which the metal film is formed is prepared. The metal film may be formed on the intermediate material 64 side. Since plated copper is used as the metal film in the present embodiment, several hundreds of Ni—Cr films are formed in advance on the insulating resin film by sputtering, and then a copper plated film is formed to have a thickness of 5 μm to 20 μm using this film as a seed layer. A wiring pattern 2 is formed by forming a wiring of this metal film by a subtractive method. Next, blind via processing is performed at a desired position of the insulating resin film, and a conductive paste is filled in the blind via hole to form the via hole 7. Next, the 1st board | substrate 4 which comprises the cavity side wall part which processed the desired shape size in the desired position is prepared. Finally, a third substrate 5 is prepared, and all these members are overlapped and temporarily fixed while being aligned as shown in FIG.

  Then, it heats and pressurizes in a cross-sectional structure as shown in FIG.9 (b) using a vacuum hot press apparatus. At this time, the deformation layer 62 flows so as to fill the cavity 1 by heating and pressurizing. At the same time, the release film 61 and the insulating resin film are stretched together with the wiring pattern 2 and are in close contact with the surface and the wall surface of the first substrate 4 constituting the bottom surface and the side wall portion of the cavity 1. The insulating resin film is bonded together with the curing reaction to form the second substrate 3. On the other hand, when the side wall is heated / pressurized, a slight resin flow is generated and tends to flow into the cavity 1 and the outer peripheral portion of the substrate together with the kneaded filler. The resin flow to the water is prevented to some extent. At the same time, the wiring 2a and the wiring pattern 6 of the third substrate 5 laminated on the back surface of the cavity 1 are connected through the via hole 7 filled with the conductive paste.

  Finally, as shown in FIG. 9C, the press intermediate material 64 is peeled off from the interface between the release film 61 and the wiring pattern 2, and the insulating resin film and the wiring pattern 2 are removed from the bottom and side surfaces of the cavity 1. By transferring to the wall surface, the printed wiring board with a cavity in the fourth embodiment can be obtained.

(Embodiment 5)
Embodiment 5 of the present invention will be described below with reference to the drawings.

  FIG. 5 is a sectional structural view of a printed wiring board with a cavity according to a fifth embodiment of the present invention. The printed wiring board with a cavity according to the present embodiment is formed on the surface of the bottom surface of the cavity 1 by covering the entire surface of the printed wiring board with the second substrate 3 made of an insulating resin film on the surface where the cavity 1 is formed. And the wiring 2b on the surface of the first substrate 4 constituting the side wall of the cavity 1 connected to the wiring 2a on the second substrate 3 and on the inner wall surface of the cavity of the first substrate 4 The wiring pattern 2 is the same wiring pattern 2 formed through the hollow, and the wiring pattern 6 of the third substrate 5 laminated on the back surface of the cavity 1 is formed on the insulating resin film. It is configured to be connected through a via hole 7 filled with a conductive paste.

  Here, the 2nd board | substrate 3 which comprises the bottom face part which forms the cavity 1 is an insulating resin film, and the 1st board | substrate 4 which comprises a side wall part is comprised with the composite base material.

  In the present embodiment, the insulating resin film is a high heat-resistant resin film selected from at least polyimide, polyamide, and liquid crystal polymer, and a metal film that is patterned as the wiring pattern 2 is formed on at least one surface. . This metal film may be formed directly on the insulating resin film in this embodiment, although the metal film may be in close contact with the insulating resin film via an adhesive or may be directly formed on the insulating resin film. Is preferred. The metal film is patterned to form a wiring pattern 2. The wiring pattern 2 is preferably made of a metal material rich in ductility such as gold, silver, copper, and aluminum. It is desirable to apply an adhesive to the back surface of the insulating resin film on which the wiring pattern 2 is formed. The adhesive is particularly preferably a thermosetting epoxy resin.

  The third substrate 5 is a double-sided substrate in FIG. 5, but may be a multilayer substrate. There is no particular problem whether the interlayer connection structure is an all-layer IVH structure or a through-hole structure, and a desired printed wiring board can be applied.

  Hereinafter, the manufacturing method of the fifth embodiment will be described with reference to FIG. FIG. 10 is a process cross-sectional view illustrating a method for manufacturing a printed wiring board with a cavity according to the fifth embodiment.

  First, a press intermediate material 64 comprising three layers of a release film 61, a deformation layer 62, and a cover sheet 63 is prepared. The release film 61 is a resin film made of a fluororesin, and is selected from materials that have low elasticity, a high tensile elongation, and can easily follow a shape having a recess such as a cavity. Next, an insulating resin film for constituting the second substrate 3 on which the metal film is formed is prepared. The metal film may be formed on the intermediate material 64 side. Since plated copper is used as the metal film in the present embodiment, several hundreds of Ni—Cr films are formed in advance on the insulating resin film by sputtering, and then a copper plated film is formed to have a thickness of 5 μm to 20 μm using this film as a seed layer. A wiring pattern 2 is formed by forming a wiring of this metal film by a subtractive method. Next, blind via processing is performed at a desired position of the insulating resin film, and a conductive paste is filled in the blind via hole to form the via hole 7. Next, the 1st board | substrate 4 used as the cavity side wall part which processed the desired shape size in the desired position is prepared. Here, the cavity inner wall shape of the first substrate 4 is desirably a vertical inner wall shape having no taper as much as possible, unlike the fourth embodiment. By adopting such an inner wall shape, it is possible to secure a larger area of the bottom surface of the cavity and accommodate more mounting components. Finally, a third substrate 5 is prepared, and all these members are overlapped and temporarily fixed while being aligned as shown in FIG.

  Then, it heats and pressurizes in a cross-sectional structure as shown in FIG.10 (b) using a vacuum hot press apparatus. At this time, the deformation layer 62 flows so as to fill the cavity 1 by heating and pressurizing. At the same time, the release film 61 and the insulating resin film are stretched together with the wiring pattern 2, are in close contact with the bottom surface of the cavity 1 and the surface of the first substrate 4, and the insulating resin film together with the curing reaction of the bottom surface portion and the side wall portion. Are bonded to form a second substrate 3. Depending on the degree of deformation of the deformation layer 62, a gap is generated between the insulating resin film and the cavity inner wall surface without being in close contact with the cavity inner wall surface. Here, when the deformation layer 62 is sufficiently deformed and the inside of the cavity 1 is completely filled, or when the gap is filled with the resin flow from the cavity bottom and side walls, the description will be given in the fourth embodiment. It becomes the structure. On the other hand, when the first substrate 4 is heated and pressurized, a slight resin flow occurs, and the first substrate 4 tends to flow into the cavity 1 and the outer periphery of the substrate together with the kneaded filler, but the deformation layer 62 is deformed, Resin flow into the cavity 1 is prevented to some extent. At the same time, the wiring 2a and the wiring pattern 6 of the third substrate 5 laminated on the back surface of the second substrate 3 are connected through the via hole 7 filled with the conductive paste.

  Finally, as shown in FIG. 10C, the press intermediate material 64 is peeled off from the interface between the release film 61 and the wiring pattern 2, and the second substrate 3 and the wiring pattern 2 made of an insulating resin film are removed from the cavity 1. By transferring to the bottom surface and the surface of the first substrate 4, the printed wiring board with a cavity in the fifth embodiment can be obtained.

  Since the cavity substrate according to the present invention can be formed with a thin total substrate thickness as a mounting body after component mounting, such as a personal computer, a digital camera, a mobile phone, etc., small, thin, lightweight, high definition, multi-functionality, etc. It can be used as a package substrate to cope with, and can be applied to applications related to these mounting substrates as one of the methods for easily realizing a low profile and three-dimensional mounting of a semiconductor package.

Sectional drawing which shows the wiring board in Embodiment 1 of this invention Sectional drawing which shows the wiring board in Embodiment 2 of this invention. Sectional drawing which shows the wiring board in Embodiment 3 of this invention Sectional drawing which shows the wiring board in Embodiment 4 of this invention Sectional drawing which shows the wiring board in Embodiment 5 of this invention Process sectional drawing which shows the manufacturing method of the wiring board in Embodiment 1 of this invention Process sectional drawing which shows the manufacturing method of the wiring board in Embodiment 2 of this invention Process sectional drawing which shows the manufacturing method of the wiring board in Embodiment 3 of this invention Process sectional drawing which shows the manufacturing method of the wiring board in Embodiment 4 of this invention Process sectional drawing which shows the manufacturing method of the wiring board in Embodiment 5 of this invention Sectional view showing a wiring board in the prior art Sectional view showing a wiring board in the prior art

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Cavity 2 Wiring pattern 3 2nd board | substrate 4 1st board | substrate 5 3rd board | substrate 6 Wiring pattern 7 Via hole 61 Release film 62 Deformation layer 63 Cover sheet 64 Press intermediate material

Claims (16)

A first substrate in which a through gap is formed, a second substrate on which the first substrate is stacked to form the bottom of the through gap, and a third substrate that is stacked on the second substrate In the printed wiring board with a cavity in which a recess for mounting and storing a component is formed, the wiring on the surface of the recess and the wiring on the surface of the first substrate connected to the wiring are the first A conductive paste is formed between the wiring on the concave surface and the third substrate laminated on the back surface of the second substrate. A printed wiring board with a cavity, which is connected through a filled via hole. A first substrate in which a through gap is formed, a second substrate on which the first substrate is stacked to form the bottom of the through gap, and a third substrate that is stacked on the second substrate In the printed wiring board with a cavity in which a recess for mounting and storing a component is formed, the wiring on the surface of the recess and the wiring on the surface of the first substrate connected to the wiring are the first A conductive paste formed of the same wiring pattern formed through the side wall surface of the substrate and the third substrate laminated on the back surface of the second substrate. A printed wiring board with a cavity, which is connected through a filled via hole. A first substrate in which a through gap is formed, a second substrate on which the first substrate is stacked to form the bottom of the through gap, and a third substrate that is stacked on the second substrate In a printed wiring board with a cavity in which a recess for mounting and housing a component is formed, the wiring on the surface of the recess and the wiring on the surface of the first substrate connected to the wiring are connected to the side wall of the recess. The printed wiring board with a cavity according to claim 1, comprising a wiring net connected via a via hole formed in the vicinity. A first substrate in which a through gap is formed, a second substrate that is stacked on the first substrate and forms the bottom of the through gap, and a third substrate that is stacked on the second substrate In the printed wiring board with cavities formed with recesses for mounting and housing components, the surface constituting the recesses is covered with a second substrate made of an insulating resin film, and the wiring on the surface of the recesses The wiring on the surface of the second substrate connected to the wiring and formed to cover the surface of the first substrate has the same wiring pattern, and the wiring on the surface of the recess and the second A printed wiring board with a cavity, wherein the third board laminated on the back surface of the board is connected via a via hole filled with a conductive paste. A first substrate in which a through gap is formed, a second substrate that is stacked on the first substrate and forms the bottom of the through gap, and a third substrate that is stacked on the second substrate In a printed wiring board with a cavity in which a recess for mounting and housing a component is formed, of the surfaces constituting the recess, only the recess side wall surface is hollow, and the other portions are made of an insulating resin film. The wiring on the surface of the concave portion and the wiring on the surface of the second wiring substrate connected to the wiring and formed on the surface of the first substrate are the same. It is a wiring pattern, and the wiring on the surface of the concave portion and the third substrate laminated on the back surface of the second substrate are connected through a via hole filled with a conductive paste. Pre with cavity Door wiring board. The wiring on the surface of the recess and the wiring on the surface of the second substrate connected to the wiring are at least a ductile metal selected from gold, silver, copper, and aluminum. The printed wiring board with a cavity in any one of -5. The insulating resin film covering the surface having a recess is a high heat-resistant resin film selected from at least polyimide, polyamide, and liquid crystal polymer, with a cavity according to any one of claims 4 to 6, Printed wiring board. The printed wiring board with a cavity according to any one of claims 4, 5, and 7, wherein a semi-cured adhesive resin is applied to at least one surface of the insulating resin film. A step of forming a desired wiring on a release film surface of a press intermediate material composed of a release film, a deformation layer, and a cover sheet, and forming a second substrate by processing through holes and filling with a conductive paste A step of superimposing the wiring formed press intermediate material, the first substrate forming the recess side wall portion, the second substrate, and the third substrate while aligning them, and heat lamination Meanwhile, the step of simultaneously connecting the vias formed on the second substrate on the surface of the formed recess, and the press intermediate material is peeled off, thereby wiring the second substrate surface and the surface of the first substrate. And a method of manufacturing a printed wiring board with a cavity having a step of transferring to the side wall surface of the recess. A step of forming a desired wiring on a release film surface of a press intermediate material composed of a release film, a deformation layer, and a cover sheet, and forming a second substrate by processing through holes and filling with a conductive paste A step of superimposing the wiring formed press intermediate material, the first substrate forming the recess side wall portion, the second substrate, and the third substrate while aligning them, and heat lamination Meanwhile, the step of simultaneously connecting the vias formed on the second substrate on the surface of the formed recess and the surface of the first substrate and the surface of the second substrate by peeling the press intermediate material A method of manufacturing a printed wiring board with a cavity having a process of transferring to a cavity. A step of forming a desired wiring on a release film surface of a press intermediate material composed of a release film, a deformation layer, and a cover sheet, and forming a second substrate by processing through holes and filling with a conductive paste A process, a process of filling a conductive paste with a through hole in a first substrate to be a recess side wall material, the first intermediate substrate with the wiring formed, the first substrate with the via formed, and the second substrate; A step of overlaying while aligning with the third substrate, and a connection between the via formed in the second substrate and the via formed in the first substrate on the surface of the formed recess while being integrally laminated by hot pressing A method of manufacturing a printed wiring board with a cavity, which includes a step of simultaneously performing the steps of: and transferring a wiring to at least the concave portion surface and the first substrate surface by peeling off the press intermediate material. A step of forming a desired wiring on the surface of the release film of the press intermediate material composed of the release film, the deformation layer, and the cover sheet; and processing the through holes in the insulating resin film and filling the conductive paste with the second. A step of forming the substrate, a step of superimposing the wiring formed press intermediate material, the second substrate, and the first substrate and the third substrate serving as the recess side wall material while aligning them, and hot pressing And the step of simultaneously connecting the second substrate and the third substrate with vias on the surface of the formed recess while integrally laminating, and by peeling off the press intermediate material, the wiring and the insulating resin film A method of manufacturing a printed wiring board with a cavity, which includes a step of transferring the surface to the recess surface, the substrate surface, and the recess side wall surface. A step of forming a desired wiring on the surface of the release film of the press intermediate material composed of the release film, the deformation layer, and the cover sheet; and processing the through holes in the insulating resin film and filling the conductive paste with the second. Forming the substrate, and forming the wiring formed press intermediate material, the second substrate, and the first substrate and the third substrate to be the concave side wall material by integrally laminating them by hot pressing. A step of simultaneously connecting the wiring and the second printed wiring board with the via formed in the insulating resin film on the surface of the recessed portion, and peeling the press intermediate material to connect the wiring and the insulating resin film to the surface of the recessed portion. A method of manufacturing a printed wiring board with a cavity, comprising a step of transferring to a substrate surface. The method for producing a printed wiring board with a cavity according to any one of claims 9 to 13, wherein at least the deformation layer of the press intermediate material is made of crystalline polyolefin. The method for manufacturing a printed wiring board with a cavity according to any one of claims 9 to 13, wherein at least the deformation layer of the press intermediate material is made of a prepreg. The method for producing a printed wiring board with a cavity according to any one of claims 9 to 13, wherein at least the deformable layer and the cover sheet are made of a resin-coated copper foil among the press intermediate material.

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