CN212677474U - Multifunctional circuit board - Google Patents
Multifunctional circuit board Download PDFInfo
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- CN212677474U CN212677474U CN202021185164.3U CN202021185164U CN212677474U CN 212677474 U CN212677474 U CN 212677474U CN 202021185164 U CN202021185164 U CN 202021185164U CN 212677474 U CN212677474 U CN 212677474U
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Abstract
The utility model relates to the field of circuit boards, and discloses a multifunctional circuit board, which comprises a circuit board, wherein a front copper wire layer and a back copper wire layer are respectively arranged on the front and back sides of the circuit board, a high-insulation metal ink layer is arranged on the upper surface of the front copper wire layer, the upper part of the high-insulation metal ink layer is a printed silver oil circuit layer, and the upper part of the printed silver oil circuit layer is a printed covering layer; the printing of silver paste ink is realized by adding the high-insulation metal ink layer on the double-layer circuit board, the extremely low cost can be realized, the original double-layer circuit board is made into a three-layer circuit structure with a layer of printed circuit, one circuit board has two functions, and the cost is reduced by 60% compared with the conventional process for manufacturing the three-layer circuit board.
Description
Technical Field
The utility model relates to a circuit board field, concretely relates to multifunctional circuit board.
Background
The most common circuit board produced generally is a double-layer board, namely, copper wires are arranged on the front side and the back side, if the function of a layer of circuit board needs to be added, the cost of raw materials and the processing cost are increased by multiple times, and based on the thought, a circuit board which is low in cost and can realize the functions of a three-layer circuit board is designed.
SUMMERY OF THE UTILITY MODEL
The utility model provides a technical problem provide a multifunctional circuit board.
The utility model provides a technical scheme that its technical problem adopted is: the utility model provides a multifunctional circuit board, includes the circuit board, the circuit board positive and negative is provided with positive copper line layer and back copper line layer respectively, positive copper line layer upper surface is provided with high insulating metal printing ink layer, high insulating metal printing ink layer upper portion is printing silver oil circuit layer, printing silver oil circuit layer upper portion is the printing overburden.
Furthermore, the circuit board is provided with a positioning hole.
Further, the high-insulation metal ink layer is provided with two layers.
Further, the printed silver oil circuit layer is in a pre-designed circuit pattern shape.
The utility model has the advantages that: the printing of silver paste ink is realized by adding the high-insulation metal ink layer on the double-layer circuit board, the extremely low cost can be realized, the original double-layer circuit board is made into a three-layer circuit structure with a layer of printed circuit, one circuit board has two functions, and the cost is reduced by 60% compared with the conventional process for manufacturing the three-layer circuit board.
Drawings
Fig. 1 is a sectional view of a multifunctional circuit board;
labeled as: 1. a circuit board; 2. a front copper wire layer; 3. a back copper wire layer; 4. a high-insulation metal ink layer; 5. printing a silver oil circuit layer; 6. printing a covering layer;
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
A multifunctional circuit board 1 as shown in fig. 1 comprises a circuit board 1, wherein a front copper wire layer 2 and a back copper wire layer 3 are respectively arranged on the front and back sides of the circuit board 1, a high-insulation metal ink layer 4 is arranged on the upper surface of the front copper wire layer 2, a printed silver oil circuit layer 5 is arranged on the upper portion of the high-insulation metal ink layer 4, and a printed covering layer 6 is arranged on the upper portion of the printed silver oil circuit layer 5;
the principle is as follows: designing a positioning hole on a circuit board 1, then printing two layers of high-insulation metal ink layers 4 on a front copper wire layer 2 on the upper part of the whole circuit board 1, wherein the high-insulation metal ink layers 4 have good insulativity, continuously printing silver paste ink on the upper surfaces of the high-insulation metal ink layers 4 according to a pre-designed circuit pattern by using a screen printing process, continuously adding a printing covering layer 6 on the upper surface of a printed silver oil circuit layer 5, and the printing covering layer 6 can play a good protection role on the printed silver oil layer; the cost of manufacturing the three-layer circuit board 1 can be greatly reduced by this process.
On the basis, the circuit board 1 is provided with a positioning hole; the positioning function is realized, and the production and the test are convenient.
On the basis, two layers of high-insulation metal ink layers 4 are arranged; the upper circuit and the lower circuit are prevented from being influenced mutually by printing the two layers of high-insulation metal ink layers 4, and the insulation performance between the two layers of circuits is ensured.
On the basis, the shape of the printed silver oil circuit layer 5 is a preset circuit pattern, the circuit pattern can be flexibly designed according to requirements, and the production cost is greatly reduced.
The above-mentioned embodiments, further detailed description of the objects, technical solutions and advantages of the present invention, it should be understood that the above-mentioned embodiments are only specific embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (4)
1. A kind of multi-functional circuit board, its characterized in that: including circuit board (1), circuit board (1) positive and negative are provided with front copper line layer (2) and back copper line layer (3) respectively, front copper line layer (2) upper surface is provided with high insulating metal printing ink layer (4), high insulating metal printing ink layer (4) upper portion is printing silver oil circuit layer (5), printing silver oil circuit layer (5) upper portion is printing overburden (6).
2. The multifunctional circuit board of claim 1, wherein: the circuit board (1) is provided with a positioning hole.
3. The multifunctional circuit board of claim 1, wherein: the high-insulation metal ink layer (4) is provided with two layers.
4. The multifunctional circuit board of claim 1, wherein: the shape of the printed silver oil circuit layer (5) is a pre-designed circuit pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021185164.3U CN212677474U (en) | 2020-06-23 | 2020-06-23 | Multifunctional circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021185164.3U CN212677474U (en) | 2020-06-23 | 2020-06-23 | Multifunctional circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212677474U true CN212677474U (en) | 2021-03-09 |
Family
ID=74818026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021185164.3U Active CN212677474U (en) | 2020-06-23 | 2020-06-23 | Multifunctional circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212677474U (en) |
-
2020
- 2020-06-23 CN CN202021185164.3U patent/CN212677474U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Multifunctional circuit board Effective date of registration: 20211008 Granted publication date: 20210309 Pledgee: Bank of China Limited Suzhou Yangtze River Delta integration Demonstration Zone Branch Pledgor: SUZHOU SPLENDID ELECTRONICS Co.,Ltd. Registration number: Y2021980010377 |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215000 east of pangjin Road, north of xiajiabang, Wujiang Economic Development Zone, Suzhou City, Jiangsu Province Patentee after: Suzhou spranti Technology Co.,Ltd. Address before: 215000 east of pangjin Road, north of xiajiabang, Wujiang Economic Development Zone, Suzhou City, Jiangsu Province Patentee before: SUZHOU SPLENDID ELECTRONICS CO.,LTD. |