CN202697020U - PCB plate - Google Patents
PCB plate Download PDFInfo
- Publication number
- CN202697020U CN202697020U CN 201220095796 CN201220095796U CN202697020U CN 202697020 U CN202697020 U CN 202697020U CN 201220095796 CN201220095796 CN 201220095796 CN 201220095796 U CN201220095796 U CN 201220095796U CN 202697020 U CN202697020 U CN 202697020U
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- layer
- pcb board
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- utility
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Abstract
The utility model discloses a PCB plate, which comprises a plurality of wiring layers and insulating layers, the PCB plate is composed of several single-layer boards and continuous-layer boards through pressing. The PCB plate composed of the continuous-layer boards and the single-layer boards has the advantage of low cost.
Description
Technical field
The utility model relates to a kind of pcb board.
Background technology
PCB (Printed Circuit Board), Chinese is printed circuit board, claims again printed circuit board (PCB), printed substrate, is important electronic unit, is the supporter of electronic devices and components, is the supplier of electronic devices and components electrical connection.Because it is to adopt electron printing to make, therefore be called as " printing " circuit board.
Design of printed circuit board is take circuit theory diagrams as basis, realizes the needed function of circuit designers.The design of printed circuit board (PCB) mainly refers to layout design, need to consider the various factorss such as the optimizing distribution of the optimizing distribution of the outside layout that connects, internal electronic element, metal connecting line and through hole, electromagnetic protection, heat dissipation.Outstanding layout design can save production cost, and reaches good circuit performance and heat dispersion.The layer that printed circuit board need to be exported has wiring layer (comprising top layer, bottom, middle wiring layer), bus plane (comprising VCC layer and GND layer), silk-screen layer (comprising top layer silk-screen, bottom silk-screen), solder mask (comprising top layer welding resistance and bottom welding resistance), also will generate in addition boring file (NC Drill).
At present the HD6870 that mainly produces of market adopts is 8 layers PCB, along with brief, and green, the going deep into of the theory of environmental protection, people are seeking the pcb board of more simplifying.
The utility model content
In order to solve above technical problem, the utility model provides a kind of pcb board.
The utility model discloses a kind of pcb board, comprise a plurality of wiring layers and a plurality of insulating barrier, described pcb board comprises the integration lamina, and described integration lamina is integrated into respectively other individual layer by the GND layer in a plurality of laminas and POWER layer and forms.
GND layer and POWER layer are ground plane/bus plane. the layer of the type only is used for multi-layer sheet, is mainly used in arranging power line and earth connection.
In pcb board described in the utility model, described pcb board is six layers.
In pcb board described in the utility model, the top layer of described pcb board, the second layer, the 3rd layer, bottom are lamina, and the 4th layer, layer 5 are the integration lamina.
Implement pcb board of the present utility model, have following useful technique effect:
Multi-layer sheet and lamina are combined into pcb board, save cost.
Description of drawings
Fig. 1 a is the pcb board structural representation of this prior art;
Fig. 1 b is the enlarged diagram among Fig. 1 a;
Fig. 2 a is the structural representation of pcb board of the present utility model;
Fig. 2 b is the structural representation of the pcb board of Fig. 2 a.
Embodiment
By describing technology contents of the present utility model, structural feature in detail, being realized purpose and effect, below in conjunction with execution mode and cooperate accompanying drawing to give in detail explanation.
See also Fig. 1 a and Fig. 1 b, a kind of pcb board existing structure comprises: pcb board 10 has 8 layers, is respectively: top layer 101, the second layer 102, the 3rd layer 103, the 4th layers 104, layer 5 105, layer 6 106, layer 7 107, the 8th layer 108.Can from figure, be expressed by A section enlarged drawing.
Further, this pcb board model is: HD6870, existing HD6870 are 8 layers structure.
Our company is improved the HD6870 of existing 8 layers structure, see also Fig. 2 a and Fig. 2 b, a kind of pcb board of the present utility model comprises: pcb board 10 has 6 layers, is respectively: top layer 101, the second layer 102, the 3rd layer 103, the 4th layers 1041, layer 5 1051, bottom 108.
The A standard laid down by the ministries or commissions of the Central Government is shown partial enlarged drawing among the figure.
Confirm through practice, with the pcb board model be: the 4th layer of the existing structure of HD6870 and the 5th lamination are synthetic double-deck, become of the present utility model the 4th layer 1041, with the 6th layer and the synthetic bilayer of the 7th lamination, become 1051 of layer 5 of the present utility model, can realize identical technique effect equally, but quality is lighter, the space that takies is less.
Implement pcb board of the present utility model, have following useful technique effect:
Multi-layer sheet and lamina are combined into pcb board, save cost.
The above is described embodiment of the present utility model by reference to the accompanying drawings; but the utility model is not limited to above-mentioned embodiment; above-mentioned embodiment only is schematic; rather than restrictive; those of ordinary skill in the art is under enlightenment of the present utility model; not breaking away from the scope situation that the utility model aim and claim protect, also can make a lot of forms, these all belong within the protection range of the present utility model.
Claims (3)
1. a pcb board comprises a plurality of wiring layers and a plurality of insulating barrier, it is characterized in that, described pcb board comprises the integration lamina, and described integration lamina is integrated into respectively other individual layer by the GND layer in a plurality of laminas and POWER layer and forms.
2. pcb board according to claim 1 is characterized in that, described pcb board is six layers.
3. pcb board according to claim 2 is characterized in that, the top layer of described pcb board, the second layer, the 3rd layer, bottom are lamina, and the 4th layer, layer 5 are the integration lamina.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220095796 CN202697020U (en) | 2012-03-14 | 2012-03-14 | PCB plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220095796 CN202697020U (en) | 2012-03-14 | 2012-03-14 | PCB plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202697020U true CN202697020U (en) | 2013-01-23 |
Family
ID=47552569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220095796 Expired - Fee Related CN202697020U (en) | 2012-03-14 | 2012-03-14 | PCB plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202697020U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105183986A (en) * | 2015-09-07 | 2015-12-23 | 上海飞斯信息科技有限公司 | PCB signal integrity design method for DDRs |
-
2012
- 2012-03-14 CN CN 201220095796 patent/CN202697020U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105183986A (en) * | 2015-09-07 | 2015-12-23 | 上海飞斯信息科技有限公司 | PCB signal integrity design method for DDRs |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHENZHEN ZHIRUITONG INDUSTRIAL CO., LTD. Free format text: FORMER OWNER: SHENZHEN MICROZ ELECTRONIC TECHNOLOGY DEVELOPMENT CO., LTD. Effective date: 20150615 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150615 Address after: 518000 Guangdong city of Shenzhen province Qianhai Shenzhen Hong Kong cooperation area before Bay Street, Qianhai road at the Shenzhen Hong Kong Cooperation Area Management Bureau office building A Room 201 (Qianhai settled in Shenzhen City, Secretary of Commerce Co. Ltd.) Patentee after: Shenzhen wisdom industry Co., Ltd. Address before: 510620, Guangdong, Baoan District Longhua street, pine tenth Industrial Zone, aerospace science and engineering, 1, 4, court, Shenzhen Patentee before: Shenzhen Weizheng Electronic Science & Technology Development Co., Ltd. |
|
| ASS | Succession or assignment of patent right |
Owner name: JIUZHOU ELECTRICAL APPLIANCES GROUP CO., LTD., SIC Free format text: FORMER OWNER: SHENZHEN ZHIRUITONG INDUSTRIAL CO., LTD. Effective date: 20150818 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150818 Address after: 621000 Mianyang province Sichuan City Jiuhua Road No. 6 Patentee after: Jiuzhou Electrical Appliances Group Co., Ltd., Sichuan Address before: 518000 Guangdong city of Shenzhen province Qianhai Shenzhen Hong Kong cooperation area before Bay Street, Qianhai road at the Shenzhen Hong Kong Cooperation Area Management Bureau office building A Room 201 (Qianhai settled in Shenzhen City, Secretary of Commerce Co. Ltd.) Patentee before: Shenzhen wisdom industry Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130123 Termination date: 20200314 |