CN202168276U

CN202168276U - Interconnectable inner-layer multilayer printed wiring board

Info

Publication number: CN202168276U
Application number: CN2011202424645U
Authority: CN
Inventors: 刘�东; 姜雪飞; 彭卫红; 叶应才; 高团芬; 刘克敢
Original assignee: Shenzhen Suntak Multilayer PCB Co Ltd
Current assignee: Shenzhen Suntak Multilayer PCB Co Ltd
Priority date: 2011-07-11
Filing date: 2011-07-11
Publication date: 2012-03-14
Anticipated expiration: 2021-07-11

Abstract

The utility model relates to a multilayer printed wiring board, specifically relating to an interconnectable inner-layer multilayer printed wiring board. The utility model provides an interconnectable inner-layer multilayer printed wiring board comprising at least 24 layers of signal layers which are separated from each other and are laminatingly arranged, wherein the fourth signal layer to the ninth signal layer and the sixteenth signal layer to the seventeenth signal layer are interconnected with each other through buried holes. The interconnectable inner-layer multilayer printed wiring board provided by the utility model has the advantages of improving the signal transmission performance of the multilayer printed wiring board and having less distortion.

Description

But the multilayer circuit board of internal layer interconnection

Technical field

The utility model relates to multilayer circuit board, but relates in particular to a kind of multilayer circuit board of internal layer interconnection.

Background technology

PCB (Printed Circuit Board), Chinese is a printed circuit board, claims printed circuit board (PCB), printed substrate again, is the important electron parts, is the supporter of electronic devices and components, is the supplier that electronic devices and components are electrically connected.At present, the signal transmission characteristics of multilayer circuit board is poor now, and distortion is bigger.

Summary of the invention

In order to solve the problems of the prior art, but the utility model provides a kind of multilayer circuit board of internal layer interconnection.

But the utility model provides a kind of multilayer circuit board of internal layer interconnection, comprises at least 24 layers each other across the signals layer of insulating barrier and range upon range of setting, wherein, passes through the buried via hole interconnection between the 4th～9 layer signal layer and between the 16th～17 layer signal layer respectively.

As the further improvement of the utility model, the aperture of said buried via hole is 0.2～0.5 millimeter.

As the further improvement of the utility model, the gross thickness of said buried via hole is 0.4～0.6 millimeter.

As the further improvement of the utility model, interconnect through blind hole between the 1st～12 layer signal layer.

As the further improvement of the utility model, the aperture of said blind hole is 0.2～0.5 millimeter.

As the further improvement of the utility model, the gross thickness of said blind hole is 0.8～1.2 millimeter.

As the further improvement of the utility model, interconnect through blind hole between the 13rd～24 layer signal layer.

As the further improvement of the utility model, through the clear opening interconnection, the aperture of said clear opening is 0.2～0.5 millimeter between the 1st～24 layer signal layer, and the gross thickness of said clear opening is 1.8～2.5 millimeters.

The beneficial effect of the utility model is: through such scheme, improved the signal transmission characteristics of multilayer circuit board, distortion is less.

Description of drawings

But the decomposition texture sketch map of the multilayer circuit board of Fig. 1 to be the utility model a kind of internal layer interconnection.

Embodiment

Below in conjunction with description of drawings and embodiment the utility model is further specified.

Drawing reference numeral among Fig. 1 is: the 1st layer signal layer 1; The 2nd layer signal layer 2; The 3rd layer signal layer 3; The 4th layer signal layer 4; The 5th layer signal layer 5; The 6th layer signal layer 6; The 7th layer signal layer 7; The 8th layer signal layer 8; The 9th layer signal layer 9; The 10th layer signal layer 10; 11th layer signals layer 11; The 12nd layer signal layer 12; The 13rd layer signal layer 13; The 14th layer signal layer 14; The 15th layer signal layer 15; The 16th layer signal layer 16; The 17th layer signal layer 17; The 18th layer signal layer 18; The 19th layer signal layer 19; The 20th layer signal layer 20; The 21st layer signal layer 21; The 22nd layer signal layer 22; The 23rd layer signal layer 23; The 24th layer signal layer 24.

As shown in Figure 1, but the multilayer circuit board of a kind of internal layer interconnection comprises 24 layers each other across the signals layer of insulating barrier and range upon range of setting, is respectively the 1st layer signal layer 1 from top to bottom; The 2nd layer signal layer 2; The 3rd layer signal layer 3; The 4th layer signal layer 4; The 5th layer signal layer 5; The 6th layer signal layer 6; The 7th layer signal layer 7; The 8th layer signal layer 8; The 9th layer signal layer 9; The 10th layer signal layer 10; 11th layer signals layer 11; The 12nd layer signal layer 12; The 13rd layer signal layer 13; The 14th layer signal layer 14; The 15th layer signal layer 15; The 16th layer signal layer 16; The 17th layer signal layer 17; The 18th layer signal layer 18; The 19th layer signal layer 19; The 20th layer signal layer 20; The 21st layer signal layer 21; The 22nd layer signal layer 22; The 23rd layer signal layer 23; The 24th layer signal layer 24, wherein, the 4th～9 layer signal layer 4,5,6,7,8, between 9 and the 16th～17 layer signal layer 16, between 17 respectively through the buried via hole interconnection.

As shown in Figure 1, the aperture of said buried via hole is 0.2～0.5 millimeter.

As shown in Figure 1, the gross thickness of said buried via hole is 0.4～0.6 millimeter.

As shown in Figure 1, the 1st～12

layer signal layer

1,2,3,4,5,6,7,8,9,10,11, between 12 through the blind hole interconnection.

As shown in Figure 1, the aperture of said blind hole is 0.2～0.5 millimeter.

As shown in Figure 1, the gross thickness of said blind hole is 0.8～1.2 millimeter.

As shown in Figure 1, the 13rd～24

layer signal layer

13,14,15,16,17,18,19,20,21,22,23, between 24 through the blind hole interconnection.

As shown in Figure 1, the aperture of said blind hole is 0.2～0.5 millimeter.

As shown in Figure 1; The 1st～24

layer signal layer

1,2,3,4,5,6,7,8,9,10,11,12,13,14,15,16,17,18,19,20,21,22,23, between 24 through the clear opening interconnection; The aperture of said clear opening is 0.2～0.5 millimeter, and the gross thickness of said clear opening is 1.8～2.5 millimeters.

But the multilayer circuit board of a kind of internal layer that the utility model provides interconnection has improved the signal transmission characteristics of multilayer circuit board, and distortion is less.

Above content is the further explain that combines concrete preferred implementation that the utility model is done, and can not assert that the practical implementation of the utility model is confined to these explanations.For the those of ordinary skill of technical field under the utility model, under the prerequisite that does not break away from the utility model design, can also make some simple deduction or replace, all should be regarded as belonging to the protection range of the utility model.

Claims

1. but the multilayer circuit board of an internal layer interconnection is characterized in that: comprise 24 layers each other across the signals layer of insulating barrier and range upon range of setting, wherein, pass through the buried via hole interconnection between the 4th～9 layer signal layer and between the 16th～17 layer signal layer respectively at least.

2. but according to the multilayer circuit board of the said internal layer interconnection of claim 1, it is characterized in that: the aperture of said buried via hole is 0.2～0.5 millimeter.

3. but according to the multilayer circuit board of the said internal layer interconnection of claim 1, it is characterized in that: the gross thickness of said buried via hole is 0.4～0.6 millimeter.

4. but according to the multilayer circuit board of the said internal layer interconnection of claim 1, it is characterized in that: interconnect through blind hole between the 1st～12 layer signal layer.

5. but according to the multilayer circuit board of the said internal layer interconnection of claim 4, it is characterized in that: the aperture of said blind hole is 0.2～0.5 millimeter.

6. but according to the multilayer circuit board of the said internal layer interconnection of claim 4, it is characterized in that: the gross thickness of said blind hole is 0.8～1.2 millimeter.

7. but according to the multilayer circuit board of the said internal layer interconnection of claim 1, it is characterized in that: interconnect through blind hole between the 13rd～24 layer signal layer.

8. but according to the multilayer circuit board of the said internal layer interconnection of claim 7, it is characterized in that: the aperture of said blind hole is 0.2～0.5 millimeter.

9. but according to the multilayer circuit board of the said internal layer interconnection of claim 7, it is characterized in that: the gross thickness of said blind hole is 0.8～1.2 millimeter.

10. but according to the multilayer circuit board of the said internal layer interconnection of claim 1, it is characterized in that: through the clear opening interconnection, the aperture of said clear opening is 0.2～0.5 millimeter between the 1st～24 layer signal layer, and the gross thickness of said clear opening is 1.8～2.5 millimeters.