CN204707342U - There is the multilayer circuit board of radiating effect - Google Patents
There is the multilayer circuit board of radiating effect Download PDFInfo
- Publication number
- CN204707342U CN204707342U CN201520479594.9U CN201520479594U CN204707342U CN 204707342 U CN204707342 U CN 204707342U CN 201520479594 U CN201520479594 U CN 201520479594U CN 204707342 U CN204707342 U CN 204707342U
- Authority
- CN
- China
- Prior art keywords
- dividing plate
- circuit board
- ground plane
- top layer
- radiating effect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model discloses a kind of multilayer circuit board with radiating effect, comprise some layers of metal flat, metal flat comprises top layer, bottom and the bus plane be located between top layer and bottom and ground plane, heat dissipating layer is equipped with between bus plane and top layer and between ground plane and bottom, one deck dividing plate is provided with between bus plane and ground plane, dividing plate two ends are provided with bolt, and dividing plate is also provided with via hole, and bolt and via hole are all through top layer, bus plane, heat dissipating layer, ground plane, dividing plate and bottom.The utility model, for carrying out heat insulation and dissipation targetedly to the easy position producing amount of heat such as bus plane and ground plane respectively, adds overall radiating effect; The utility model not only increases the firm performance of circuit board entirety, effectively can also reduce the electromagnetic interference between each layer.
Description
Technical field
The utility model relates to electronic technology field, particularly a kind of multilayer circuit board with radiating effect.
Background technology
Printed circuit board (PCB) as the carrier of each electronic component and signal path, extensive use in various electronic product.Along with the development of electronic technology, the quantity of the electronic devices and components on circuit board gets more and more, and power is increasing, and therefore circuit board requires also more and more higher to multiple stratification development and to the radiating effect of circuit board entirety.And increasing along with the number of plies, worse and worse, firm performance is also deteriorated the connection tightness between each layer.Traditional circuit board not only radiating effect is not good, and the stablizing effect of entirety is poor, can not meet the demand of present high performance components application.
Above-mentioned defect, is worth solving.
Summary of the invention
In order to overcome the deficiency of existing technology, the utility model provides a kind of multilayer circuit board with radiating effect.
Technical solutions of the utility model are as described below:
There is the multilayer circuit board of radiating effect, comprise some layers of metal flat, it is characterized in that, described metal flat comprises top layer, bottom and the bus plane be located between described top layer and described bottom and ground plane, heat dissipating layer is equipped with between described bus plane and described top layer and between described ground plane and described bottom, one deck dividing plate is provided with between described bus plane and described ground plane, described dividing plate two ends are provided with bolt, described bolt is through described top layer, described bus plane, described heat dissipating layer, described ground plane, described dividing plate and described bottom, described dividing plate is also provided with via hole, described via hole is through described top layer, described bus plane, described heat dissipating layer, described ground plane, described dividing plate and described bottom.
Further, be provided with via hole inside described via hole and protect glue.
Further, described via hole protects glue is that insulating radiation shaped material is made.
Further, described dividing plate is that insulated heat shaped material is made.
Further, described bolt central authorities are provided with the through hole for being fixed installation.
According to the utility model of said structure, its beneficial effect is, the utility model, for carrying out heat insulation and dissipation targetedly to the easy position producing amount of heat such as bus plane and ground plane respectively, adds overall radiating effect; The utility model arranges dividing plate and bolt between each layer of circuit board, not only increases the firm performance of circuit board entirety, effectively can also reduce the electromagnetic interference between each layer; In addition, the utility model production technology is simple, and is conducive to installation, the debugging of later stage electronic devices and components.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
In the drawings, 1, top layer; 2, bottom; 3, bus plane; 4, ground plane; 5, via hole; 6, via hole protects glue; 7, through hole; 8, heat dissipating layer; 9, dividing plate; 10, bolt.
Embodiment
Below in conjunction with accompanying drawing and execution mode, the utility model is conducted further description:
As shown in Figure 1, the utility model provides a kind of multilayer circuit board with radiating effect, comprise some layers of metal flat, metal flat comprises top layer 1, bottom 2 and the bus plane 3 be located between top layer 1 and bottom 2 and ground plane 4, heat dissipating layer 8 is equipped with between bus plane 3 and top layer 1 and between ground plane 4 and bottom 2, be provided with one deck dividing plate 9 between bus plane 3 and ground plane 4, dividing plate 9 is made for insulated heat shaped material.
Dividing plate 9 two ends are provided with bolt 10, and bolt 10 is through top layer 1, bus plane 3, heat dissipating layer 8, ground plane 4, dividing plate 9 and bottom 2, and bolt 10 central authorities are provided with the through hole 7 for being fixed installation.Dividing plate 9 is also provided with via hole 5, and via hole 5 is through top layer 1, bus plane 3, heat dissipating layer 8, ground plane 4, dividing plate 9 and bottom 2.
Be provided with via hole inside via hole 5 and protect glue 6, preferably, via hole protects glue 6 for insulating radiation shaped material and makes.
Should be understood that, for those of ordinary skills, can be improved according to the above description or convert, and all these improve and convert the protection range that all should belong to the utility model claims.
By reference to the accompanying drawings exemplary description is carried out to the utility model patent above; the realization of obvious the utility model patent is not subject to the restrictions described above; as long as have employed the various improvement that method is conceived and technical scheme is carried out of the utility model patent; or the design of the utility model patent and technical scheme directly applied to other occasion, all in protection range of the present utility model without to improve.
Claims (5)
1. there is the multilayer circuit board of radiating effect, comprise some layers of metal flat, it is characterized in that, described metal flat comprises top layer, bottom and the bus plane be located between described top layer and described bottom and ground plane, heat dissipating layer is equipped with between described bus plane and described top layer and between described ground plane and described bottom, one deck dividing plate is provided with between described bus plane and described ground plane, described dividing plate two ends are provided with bolt, described bolt is through described top layer, described bus plane, described heat dissipating layer, described ground plane, described dividing plate and described bottom, described dividing plate is also provided with via hole, described via hole is through described top layer, described bus plane, described heat dissipating layer, described ground plane, described dividing plate and described bottom.
2. the multilayer circuit board with radiating effect according to claim 1, is characterized in that, is provided with via hole and protects glue inside described via hole.
3. the multilayer circuit board with radiating effect according to claim 2, is characterized in that, it is that insulating radiation shaped material is made that described via hole protects glue.
4. the multilayer circuit board with radiating effect according to claim 1, is characterized in that, described dividing plate is that insulated heat shaped material is made.
5. the multilayer circuit board with radiating effect according to claim 1, is characterized in that, described bolt central authorities are provided with the through hole for being fixed installation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520479594.9U CN204707342U (en) | 2015-07-07 | 2015-07-07 | There is the multilayer circuit board of radiating effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520479594.9U CN204707342U (en) | 2015-07-07 | 2015-07-07 | There is the multilayer circuit board of radiating effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204707342U true CN204707342U (en) | 2015-10-14 |
Family
ID=54286931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520479594.9U Expired - Fee Related CN204707342U (en) | 2015-07-07 | 2015-07-07 | There is the multilayer circuit board of radiating effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204707342U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106535532A (en) * | 2016-12-27 | 2017-03-22 | 成都芯通科技股份有限公司 | Positioning and installing device and positioning method for circuit system |
| CN108882510A (en) * | 2018-08-27 | 2018-11-23 | 陈赵军 | The Multi-layer circuit board structure of height heat dissipation |
-
2015
- 2015-07-07 CN CN201520479594.9U patent/CN204707342U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106535532A (en) * | 2016-12-27 | 2017-03-22 | 成都芯通科技股份有限公司 | Positioning and installing device and positioning method for circuit system |
| CN108882510A (en) * | 2018-08-27 | 2018-11-23 | 陈赵军 | The Multi-layer circuit board structure of height heat dissipation |
| CN108882510B (en) * | 2018-08-27 | 2021-12-21 | 深圳华秋电子有限公司 | High-heat-dissipation multilayer circuit board structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180504 Address after: 333000 No. 2, Yu Li Industrial Zone, Changjiang District, Jingdezhen, Jiangxi Patentee after: Jingdezhen Hongyi Electronic Technology Co., Ltd. Address before: 518000 B, 1801 Bauhinia Garden, Bauhinia Road, Futian District, Shenzhen, Guangdong Patentee before: Su Wencang |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151014 Termination date: 20190707 |