CN108882510B

CN108882510B - High-heat-dissipation multilayer circuit board structure

Info

Publication number: CN108882510B
Application number: CN201810977587.XA
Authority: CN
Inventors: 陈赵军
Original assignee: Shenzhen Huaqiu Electronics Co ltd
Current assignee: Shenzhen Huaqiu Electronics Co.,Ltd.
Priority date: 2018-08-27
Filing date: 2018-08-27
Publication date: 2021-12-21
Anticipated expiration: 2038-08-27
Also published as: CN108882510A

Abstract

The invention discloses a high-heat-dissipation multilayer circuit board structure, which comprises a circuit board body, a plurality of electronic elements, heat-conducting columns, a heat-conducting insulating film, a heat-conducting adhesive layer, a heat-dissipation layer, a welding layer, a first metal sheet, a second metal sheet, heat-dissipation balls and working medium gas, wherein the plurality of electronic elements are arranged on the surface of the circuit board body; this high radiating multilayer circuit board structure, reasonable in design through the setting of heat dissipation ball and bimetallic strip in the heat dissipation layer, turns into mechanical energy with heat energy, has realized effectual heat dissipation.

Description

High-heat-dissipation multilayer circuit board structure

Technical Field

The invention relates to the technical field of electronics, in particular to a high-heat-dissipation multilayer circuit board structure.

Background

Multiple substrates are manufactured by stacking two or more circuits on top of each other with a reliable predetermined interconnection between them. This technique violates the conventional fabrication process from the outset because drilling and plating are completed before all layers are laminated together. The innermost two layers are composed of conventional double-sided panels, while the outer layers are different and are composed of separate single-sided panels. The inner substrate is drilled, through hole plated, pattern transferred, developed and etched prior to lamination. The outer layer to be drilled is the signal layer which is plated through in such a way that a uniform ring of copper is formed at the inner edge of the through hole. The layers are then laminated together to form a multi-substrate that can be interconnected using wave soldering. The crushing may be done in a hydraulic press or in an overpressure chamber. In a hydraulic press, the prepared material (for pressure stacking) is placed under cold or preheated pressure. The glass transition temperature is the temperature at which the amorphous regions of an amorphous polymer or partially crystalline polymer change from a hard, relatively brittle state to a viscous, rubbery state.

Multiple substrates are used in professional electronic equipment (computers, military equipment), especially in the case of heavy and bulky overloads. However, this can only be traded for increased space and reduced weight with the increased cost of multiple substrates. Multiple boards are also useful in high speed circuits, providing more than two levels of board area for routing wires and providing large ground and power areas for printed circuit board designers. The multilayer board does make the wiring of the circuit board more convenient, but simultaneously, because of the increase of the lines, the heat productivity is increased, and the heat dissipation pressure of the circuit board is greatly increased. The increase of the heat dissipation pressure of the circuit board not only increases the power consumption, but also shortens the service life of the circuit board, and even affects the electronic components.

Disclosure of Invention

In order to overcome the defects of the prior art, the invention provides a high-heat-dissipation multilayer circuit board structure which is reasonable in design, heat energy is converted into mechanical energy through the arrangement of heat dissipation balls and bimetallic strips in a heat dissipation layer, effective heat dissipation is realized, and the heat conduction columns, the heat conduction insulating films and the heat conduction adhesive layers realize normal heat conduction and circuit safety operation of the circuit board, so that the whole circuit board can uniformly and effectively realize functions of heat conduction, heat dissipation and the like, the service life of an electronic element is effectively controlled, the electrical property safety of the surface of a substrate body is further stabilized, and the phenomenon of electric leakage of the circuit board is prevented.

The technical scheme adopted by the invention for solving the technical problems is as follows: the invention comprises a circuit board body, a plurality of electronic elements, a heat conduction column, a heat conduction insulating film, a heat conduction glue layer, a heat dissipation layer, a welding layer, a first metal sheet, a second metal sheet, a heat dissipation ball and working medium gas. The circuit board body surface is equipped with a plurality of electronic component, circuit board surface four corners limit is equipped with four heat conduction posts respectively, circuit board surface adhesion one deck heat conduction insulating film, the circuit board opposite side is equipped with heat-conducting adhesive layer, heat-conducting adhesive layer bottom side is equipped with the heat dissipation layer, the welding layer is connected down to the heat dissipation layer, the heat conduction insulating film is adhered to equally to the welding layer opposite side, be equipped with first sheetmetal and second sheetmetal in the heat dissipation layer, first sheetmetal and second sheetmetal are the ring form that does not seal, be equipped with the heat dissipation ball in first sheetmetal and the second sheetmetal, fill working medium gas in the heat dissipation ball.

The circuit board body can be a ceramic circuit board, an alumina ceramic circuit board and an aluminum nitride ceramic circuit board.

Furthermore, the heat conduction column is made of copper.

Further, the heat-conducting insulating film material is mica.

Further, the heat-conducting glue layer is made of silica gel.

Furthermore, the first metal sheet is made of copper.

Further, the second metal sheet is made of iron.

Further, the first and second metal sheets are structurally welded together.

Further, the heat dissipation ball is an elastic ball.

Further, the working medium gas can be nitrogen or helium.

The heat dissipation structure has the advantages that the structure is simple, the design is reasonable, heat energy is converted into mechanical energy through the arrangement of the heat dissipation balls and the bimetallic strips in the heat dissipation layer, effective heat dissipation is achieved, normal heat conduction and safe circuit operation of the circuit board are achieved through the heat conduction columns, the heat conduction insulating films and the heat conduction adhesive layers, the whole circuit board can be enabled to achieve functions of heat conduction conversion, heat dissipation and the like uniformly and effectively, the service life of an electronic element is effectively controlled, electrical performance safety of the surface of the substrate body is further stabilized, and the phenomenon of electric leakage of the circuit board is prevented.

Drawings

The invention is further illustrated with reference to the following figures and examples.

FIG. 1 is a block diagram of an embodiment of the present invention.

FIG. 2 is a diagram of an embodiment of a heat sink layer.

In the figure:

1. a circuit board body;

2. a plurality of electronic components;

3. a heat-conducting column;

4. a thermally conductive insulating film;

5. a heat-conducting adhesive layer;

6. a heat dissipation layer;

7. welding the layers;

8. a first metal sheet;

9. a second metal sheet;

10. a heat dissipation ball;

11. working medium gas.

Detailed Description

In the embodiment shown in fig. 1 to 2, the invention includes a circuit board body 1, a plurality of electronic components 2, a heat-conducting pillar 3, a heat-conducting insulating film 4, a heat-conducting adhesive layer 5, a heat-dissipating layer 6, a soldering layer 7, a first metal sheet 8, a second metal sheet 9, a heat-dissipating ball 10, and a working medium gas 11. The surface of the circuit board body 1 is provided with a plurality of electronic elements 2, four corner edges of the surface of the circuit board are respectively provided with four heat conduction columns 3, one layer of heat conduction insulating film 4 is attached to the surface of the circuit board, the other side of the circuit board is provided with a heat conduction adhesive layer 5, the bottom side of the heat conduction adhesive layer is provided with a heat dissipation layer 6, a welding layer 7 is connected to the lower portion of the heat dissipation layer, the other side of the welding layer is also attached to the heat conduction insulating film 4, a first metal sheet 8 and a second metal sheet 9 are arranged in the heat dissipation layer 6, the first metal sheet 8 and the second metal sheet 9 are in an unsealed ring shape, heat dissipation balls are arranged in the first metal sheet 8 and the second metal sheet 9, and working medium gas 11 is filled in the heat dissipation balls.

Specifically, the circuit board body 1 may be a ceramic circuit board, an alumina ceramic circuit board, or an aluminum nitride ceramic circuit board. Specifically, the heat conducting column 3 is made of copper; the material of the heat-conducting insulating film 4 is mica. Specifically, the material of the heat-conducting adhesive layer 5 is silica gel. Specifically, the first metal sheet 8 is made of copper. Specifically, the second metal sheet 9 is made of iron; the first and

second metal sheets

8, 9 are structurally welded together.

Specifically, the heat dissipation ball 10 is an elastic ball; the working medium gas 11 can be nitrogen gas or helium gas.

In specific implementation, the material of the heat-conducting insulating film 4 is mica. Mica is characterized by insulation, high temperature resistance, acid resistance, alkali resistance and pressure resistance, and is mainly used as an insulation material for electrical equipment and electrical equipment in the mica industry. The heat conducting silica gel layer 5 is made of heat conducting silica gel, and can be widely applied to contact surfaces between heating body power and heat dissipation facilities in various electronic products and electrical equipment, and has the functions of heat transfer media and performances of moisture prevention, dust prevention, corrosion prevention, shock prevention and the like. And provides excellent heat conduction to the heat-generating electronic components.

The heat conductive column 3 is made of copper, which has high ductility, thermal conductivity and electrical conductivity, and is therefore the most commonly used material for cables, electric and electronic components. When the circuit board body 1 works, the heat conducting insulating film 4 on one side of the electronic element 2 can absorb a large amount of heat generated by the circuit board during working due to good heat conductivity, the circuit board can be safer due to good insulating property, and in order to enable the heat conducting insulating film 4 to conduct the heat without influencing the electronic element 2, the four heat conducting columns 3 are arranged at the four corners of the circuit board, so that the heat on the surface is dispersed around the circuit board, the temperature of the dense middle part of the electronic element 2 is reduced, the service life of the electronic element 2 can be prolonged to a great extent, and the power consumption of the electronic element 2 can be reduced.

Similarly, in the implementation, the first metal sheet 8 is made of copper, the second metal sheet 9 is made of iron, the heat dissipation balls 10 are made of elastic balls, the working medium gas 11 is made of nitrogen, and the working medium is a working substance for realizing heat and power conversion. The first metal piece 8 and the second metal piece 9 are called as a bimetal piece after being welded, and the bimetal piece is in an unclosed annular shape.

Different kinds of metal sheets, under the same temperature rise, the metal sheet with large thermal expansion coefficient can increase more quickly, so that the whole metal sheet can be bent to the side with small thermal expansion coefficient. The thermal expansion coefficient of the first metal sheet 8 is larger than that of the second metal sheet 9, so that after the heating, the first metal sheet 8 and the second metal sheet 9 are welded to form a closed circular ring, namely the bimetallic sheet is bent towards the center of the sphere, the radiating ball 10 inside the bimetallic sheet is pressed, and the inside of the radiating ball 10 is filled with working medium gas 11. Because the thermal expansion cycle of the working medium gas 11 is different from that of the bimetallic strip, when the working medium gas 11 begins to expand, the bimetallic strip presses the elastic ball tightly against the working medium gas 11 to gradually expand, so that the heat dissipation ball 10 is driven to expand, the bimetallic strip can be gradually opened, the working medium gas 11 expands for a period of time, after the energy is released, the working medium gas can contract again, the original state is returned, and the bimetallic strip can also contract again. When the heat is accumulated enough again, the working medium gas 11 is expanded again, the steps are circulated continuously, and the heat energy can be converted into mechanical energy, so that the purpose of heat dissipation is achieved.

The heat-conducting glue layer 5 between the circuit board body 1 and the heat dissipation layer 6 can disperse heat concentrated on a circuit to the whole board, and the heat dissipation efficiency of the heat dissipation layer can be improved.

It will be appreciated by those skilled in the art that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The embodiments disclosed above are illustrative and not exclusive in all respects. All changes which come within the scope of or equivalence to the invention are intended to be embraced therein.

Claims

1. A high radiating multilayer circuit board structure, characterized by: the heat dissipation structure comprises a circuit board body, a plurality of electronic elements, heat conduction columns, a heat conduction insulating film, a heat conduction adhesive layer, a heat dissipation layer, a welding layer, a first metal sheet, a second metal sheet, heat dissipation balls and working medium gas, wherein the plurality of electronic elements are arranged on the surface of the circuit board body, four heat conduction columns are respectively arranged on four corners of the surface of the circuit board, the heat conduction insulating film is attached to the surface of the circuit board, the heat conduction adhesive layer is arranged on the other side of the circuit board, the heat dissipation layer is arranged on the bottom side of the heat conduction adhesive layer, the welding layer is connected with the lower portion of the heat dissipation layer, the heat conduction insulating film is also attached to the other side of the welding layer, the first metal sheet and the second metal sheet are arranged in the heat dissipation layer, the first metal sheet and the second metal sheet are in an unsealed circular ring shape, the heat dissipation balls are arranged in the first metal sheet and the second metal sheet, and the working medium gas is filled in the heat dissipation balls; the first metal sheet is made of copper; the second metal sheet is made of iron; the first and second metal sheets are structurally welded together; the heat dissipation ball is an elastic ball.

2. The high heat dissipation multilayer circuit board structure of claim 1, wherein: the circuit board body is specifically a ceramic circuit board.

3. The high heat dissipation multilayer circuit board structure of claim 2, wherein: the heat conduction column is made of copper.

4. The high heat dissipation multilayer circuit board structure of claim 2, wherein: the heat-conducting insulating film material is mica.

5. The high heat dissipation multilayer circuit board structure of claim 2, wherein: the heat-conducting glue layer is made of silica gel.

6. The high heat dissipation multilayer circuit board structure of claim 2, wherein: the working medium gas is nitrogen or helium.