CN207053875U - A kind of multiple layers of high strength printed circuit board (PCB) - Google Patents
A kind of multiple layers of high strength printed circuit board (PCB) Download PDFInfo
- Publication number
- CN207053875U CN207053875U CN201721029436.9U CN201721029436U CN207053875U CN 207053875 U CN207053875 U CN 207053875U CN 201721029436 U CN201721029436 U CN 201721029436U CN 207053875 U CN207053875 U CN 207053875U
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- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- pcb
- plate
- bottom plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Insulated Metal Substrates For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model discloses a kind of multiple layers of high strength printed circuit board (PCB) of circuit board technology field,Including radiating bottom plate,Heat-conducting plate is provided with the top of the radiating bottom plate,Single-layer printed circuit plate is provided with the top of the heat-conducting plate,Dielectric layer is provided between single-layer printed circuit plate described in every two groups,Using substrate of the epoxy glass cloth laminated board of high intensity as printed circuit board (PCB),Epoxy glass cloth laminated board is in impact resistance,Bending strength,Angularity,Dimensional stability and resistance to welding heat impact etc. have good performance,Also have both good electric property simultaneously,Improve the intensity of printed circuit board (PCB) and shock proof ability,Radiating bottom plate is also provided with the bottom plate of single-layer printed circuit plate,Heat-radiating substrate is made of metallic aluminum material,Metallic aluminium has good thermal diffusivity,Prevent due to the long aging for element or circuit occur of circuit board usage time,Improve the service life of printed circuit board (PCB).
Description
Technical field
Circuit board technology field is the utility model is related to, specially a kind of multiple layers of high strength printed circuit board (PCB).
Background technology
Printed circuit board (PCB) (Printed Circuit Board, PCB) is almost the basis of any electronic product, with electricity
The rapid development of sub- industry, the printed circuit board applications as electronic product basic building block are more and more extensive, although electronic product
Function not only strengthen, the expansion of application field is wide, particularly the high speed information epoch development driving under, apply in electronic product
In printed circuit board (PCB) requirement it is also more and more, especially to printed circuit board (PCB) in the transmission quality of signal, speed etc.
Requirement constantly lifted.Existing printed circuit board (PCB) intensity is too low, and impact resistance is low, usually occur when in use bending or
The problems such as deformation, moreover, existing printed circuit board radiating poor performance, component ageing speed is high, and product service life is low, is
This, it is proposed that a kind of multiple layers of high strength printed circuit board (PCB).
Utility model content
The purpose of this utility model is to provide a kind of multiple layers of high strength printed circuit board (PCB), to solve in above-mentioned background technology
The existing printed circuit board (PCB) intensity proposed is too low, and impact resistance is low, usually occurs that bending or deformation etc. are asked when in use
Topic, moreover, existing printed circuit board radiating poor performance, the problem of component ageing speed is high, and product service life is low.
To achieve the above object, the utility model provides following technical scheme：A kind of multiple layers of high strength printed circuit board (PCB), bag
Radiating bottom plate is included, heat-conducting plate is provided with the top of the radiating bottom plate, single-layer printed circuit is provided with the top of the heat-conducting plate
Plate, and single-layer printed circuit plate is three groups of structure identical, and dielectric layer is provided between single-layer printed circuit plate described in every two groups,
The single-layer printed circuit plate includes high-strength substrate, and layers of copper is provided with the top of the high-strength substrate.
Preferably, the radiating bottom plate is metal aluminum soleplate, and through hole is uniformly provided with radiating bottom plate, and the heat-conducting plate is
Insulating heat-conductive plate.
Preferably, be evenly arranged with projection at the top of the radiating bottom plate, the bottom even of the radiating bottom plate be provided with
The groove that projection is engaged.
Preferably, the high-strength substrate is epoxy glass cloth laminated board.
Preferably, the single-layer printed circuit plate is be bonded into a single integrated structure by adhesive layer with dielectric layer.
Compared with prior art, the beneficial effects of the utility model are：The utility model proposes a kind of multiple layers of high strength
Printed circuit board (PCB), using substrate of the epoxy glass cloth laminated board of high intensity as printed circuit board (PCB), epoxy glass cloth laminated board
There is good performance in impact resistance, bending strength, angularity, dimensional stability and resistance to welding heat impact etc., simultaneously
Also have both good electric property, the intensity of printed circuit board (PCB) and shock proof ability are improved, in single-layer printed circuit plate
Bottom plate is also provided with radiating bottom plate, and heat-radiating substrate is made of metallic aluminum material, and metallic aluminium has good thermal diffusivity, it is therefore prevented that
Due to the long aging for element or circuit occur of circuit board usage time, the service life of printed circuit board (PCB) is improved.
Brief description of the drawings
Fig. 1 is the utility model structure diagram；
Fig. 2 is the utility model single-layer printed circuit board structure schematic diagram；
Fig. 3 is the utility model radiating bottom plate and heat-conducting plate attachment structure schematic diagram.
In figure：1 radiating bottom plate, 11 projections, 2 heat-conducting plates, 21 grooves, 3 single-layer printed circuit plates, 31 high-strength substrates, 32
Layers of copper, 4 dielectric layers.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belong to the scope of the utility model protection.
Fig. 1-3 are referred to, the utility model provides a kind of technical scheme：A kind of multiple layers of high strength printed circuit board (PCB), including
Radiating bottom plate 1, the top of the radiating bottom plate 1 are provided with heat-conducting plate 2, and the top of the heat-conducting plate 2 is provided with individual layer printing electricity
Road plate 3, and single-layer printed circuit plate 3 is three groups of structure identical, and Jie is provided between single-layer printed circuit plate 3 described in every two groups
Matter layer 4, the single-layer printed circuit plate 3 include high-strength substrate 31, and the top of the high-strength substrate 31 is provided with layers of copper 32.
Wherein, the radiating bottom plate 1 is metal aluminum soleplate, and through hole is uniformly provided with radiating bottom plate 1, and metallic aluminium has good
Good heat conductivility, serves radiating effect, through hole is also provided with radiating bottom plate 1, further improve heat dispersion, and metal
Aluminium also has good intensity and toughness, further increases the intensity of printed circuit board (PCB), and the heat-conducting plate 2 is insulating heat-conductive
Plate, insulating effect is played, prevent leaky, the top of the radiating bottom plate 1 is evenly arranged with projection 11, the radiating
The bottom even of bottom plate 1 is provided with the groove 21 being engaged with projection 11, improves the contact between radiating bottom plate 1 and heat-conducting plate 2
Area, radiating effect is further improved, the high-strength substrate 31 is epoxy glass cloth laminated board, and oxygen glass cloth laminated board is anti-
Impact, bending strength, angularity, dimensional stability and resistance to welding heat impact etc. have good performance, while also simultaneous
Standby good electric property, the intensity of printed circuit board (PCB) and shock proof ability are improved, the single-layer printed circuit plate 3 is with being situated between
Matter layer 4 is bonded into a single integrated structure by adhesive layer.
Specifically, the upper surface that layers of copper 32 is incorporated into high-strength substrate 31 using hot pressing forms single-layer printed circuit plate
3, interlocked by three groups of single-layer printed circuit plates 3 with two groups of dielectric layers 4 and be superimposed to form multilayer board, high-strength substrate 31
For epoxy glass cloth laminated board, epoxy glass cloth laminated board is in impact resistance, bending strength, angularity, dimensional stability and resistance to
Welding heat impact etc. has good performance, while also has both good electric property, improves the strong of printed circuit board (PCB)
Degree and shock proof ability, are provided with heat-conducting plate 2 and radiating bottom plate 1, radiating bottom plate 1 is in the bottom of multilayer board 3
Metal aluminum soleplate, metallic aluminium have good heat conductivility, serve radiating effect, and metallic aluminium also has good intensity
And toughness, further increase the intensity of printed circuit board (PCB).
While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out with a variety of changes in the case where not departing from principle of the present utility model and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of multiple layers of high strength printed circuit board (PCB), including radiating bottom plate (1), it is characterised in that：The top of the radiating bottom plate (1)
Portion is provided with heat-conducting plate (2), and single-layer printed circuit plate (3), and single-layer printed circuit plate are provided with the top of the heat-conducting plate (2)
(3) it is three groups of structure identical, dielectric layer (4), the individual layer print is provided between single-layer printed circuit plate (3) described in every two groups
Printed circuit board (3) includes high-strength substrate (31), and layers of copper (32) is provided with the top of the high-strength substrate (31).
A kind of 2. multiple layers of high strength printed circuit board (PCB) according to claim 1, it is characterised in that：The radiating bottom plate (1)
For metal aluminum soleplate, and through hole is uniformly provided with radiating bottom plate (1), the heat-conducting plate (2) is insulating heat-conductive plate.
A kind of 3. multiple layers of high strength printed circuit board (PCB) according to claim 1, it is characterised in that：The radiating bottom plate (1)
Top be evenly arranged with raised (11), the bottom even of the radiating bottom plate (1) is provided with the groove being engaged with projection (11)
(21)。
A kind of 4. multiple layers of high strength printed circuit board (PCB) according to claim 1, it is characterised in that：The high-strength substrate
(31) it is epoxy glass cloth laminated board.
A kind of 5. multiple layers of high strength printed circuit board (PCB) according to claim 1, it is characterised in that：The single-layer printed circuit
Plate (3) is be bonded into a single integrated structure by adhesive layer with dielectric layer (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721029436.9U CN207053875U (en) | 2017-08-17 | 2017-08-17 | A kind of multiple layers of high strength printed circuit board (PCB) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721029436.9U CN207053875U (en) | 2017-08-17 | 2017-08-17 | A kind of multiple layers of high strength printed circuit board (PCB) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207053875U true CN207053875U (en) | 2018-02-27 |
Family
ID=61503131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721029436.9U Expired - Fee Related CN207053875U (en) | 2017-08-17 | 2017-08-17 | A kind of multiple layers of high strength printed circuit board (PCB) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207053875U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108631208A (en) * | 2018-06-01 | 2018-10-09 | 河南森源电气股份有限公司 | Gas-insulated switchgear and its insulation cover plate |
-
2017
- 2017-08-17 CN CN201721029436.9U patent/CN207053875U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108631208A (en) * | 2018-06-01 | 2018-10-09 | 河南森源电气股份有限公司 | Gas-insulated switchgear and its insulation cover plate |
| CN108631208B (en) * | 2018-06-01 | 2023-11-21 | 河南森源电气股份有限公司 | Gas-insulated switchgear and insulating cover plate therefor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180227 Termination date: 20210817 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |