CN211372332U

CN211372332U - Base plate structure that thermal efficiency is high

Info

Publication number: CN211372332U
Application number: CN201922213544.7U
Authority: CN
Inventors: 张勇; 胡利红
Original assignee: Hangzhou Yongcheng Machinery Co ltd
Current assignee: Hangzhou Yongcheng Machinery Co ltd
Priority date: 2019-12-11
Filing date: 2019-12-11
Publication date: 2020-08-28
Anticipated expiration: 2029-12-11

Abstract

The utility model relates to the technical field of LED lamp substrates, in particular to a substrate structure with high thermal efficiency, which comprises a substrate main body, a fixed plate, a mounting groove and a heat dissipation copper sheet, wherein an epoxy resin layer is fixedly arranged at the top of the substrate main body, a glass medium layer is fixedly arranged at the top of the epoxy resin layer, a fixed plate is fixedly arranged at the center of the top of the glass medium layer, the mounting groove is fixedly arranged at the center of the fixed plate, a circuit is fixedly arranged in the substrate main body, an interlayer is arranged at the bottom of the substrate main body, a bottom plate is fixedly arranged at the bottom of the interlayer, the heat dissipation copper sheet is fixedly arranged at the bottom of a connecting block, and a heat dissipation coating is fixedly coated at the bottom of the heat dissipation copper sheet. And the heat dissipation coating is matched for rapid heat dissipation, so that the substrate has better heat dissipation performance and quicker heat dissipation.

Description

Base plate structure that thermal efficiency is high

Technical Field

The utility model relates to a LED lamp base plate technical field specifically is a base plate structure that the thermal efficiency is high.

Background

The substrate is a basic material for manufacturing a PCB (printed circuit board), generally, the substrate is a copper clad laminate, in the manufacturing process of a single-sided printed circuit board and a double-sided printed circuit board, hole machining, chemical copper plating, electrolytic copper plating, etching and other machining are selectively carried out on the substrate material-the copper clad laminate to obtain a required circuit pattern, the manufacturing of another type of multilayer printed circuit board also takes an inner core thin copper clad laminate as a base, and a conductive pattern layer and a prepreg are alternately laminated and bonded together at one time to form interconnection among more than 3 conductive pattern layers. It has functions of conduction, insulation and support, and the performance, quality, processability in manufacturing, manufacturing cost, manufacturing level, etc. of the printed board depend on the substrate material to a great extent.

The existing base plate has many kinds, but most of the existing base plates are just the change of the style, the base plate has not much functional improvement, when the existing base plate is used, especially when the base plate of the LED lamp is used, because the LED lamp can generate a large amount of high temperature when in use, the existing base plate has no good heat radiation, when the temperature reaches the critical hot junction point, the LED can fail, therefore, the base plate structure with high heat efficiency is needed to change the current situation.

Disclosure of Invention

An object of the utility model is to provide a base plate structure that the thermal efficiency is high to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

a substrate structure with high thermal efficiency comprises a substrate main body, a fixing plate, a mounting groove and a heat dissipation copper sheet, wherein an epoxy resin layer is fixedly mounted at the top of the substrate main body, a glass medium layer is fixedly mounted at the top of the epoxy resin layer, a mounting block is fixedly mounted at the center of the top of the glass medium layer, the mounting groove is fixedly formed in the center of the mounting block, a mounting head is fixedly mounted in the mounting groove, the mounting block is fixedly mounted at the top of the mounting head, a lamp holder is fixedly mounted at the top of the mounting block, a connecting piece is fixedly mounted at the bottom of the mounting groove, a contact is fixedly mounted at one end of the connecting piece, a circuit is fixedly mounted in the substrate main body, an interlayer is arranged at the bottom of the substrate main body, a rubber, the side seal board outside fixed mounting has the mounting panel, fixed mounting has the connecting block on the bottom plate, connecting block bottom fixed mounting has the heat dissipation copper sheet, heat dissipation copper sheet bottom fixed coating has heat dissipation coating.

Preferably, the bottom of the contact on the connecting piece is fixedly connected with the circuit.

Preferably, the connecting block passes through the bottom plate to be in contact with the interlayer.

Preferably, the heat dissipation copper sheet is provided with two layers, and a gap is arranged between the two layers.

Preferably, an internal thread is arranged inside the mounting groove, and an external thread is arranged outside the mounting head.

Preferably, the side sealing plate is fixedly connected with the outer sides of the substrate main body, the glass medium layer and the epoxy resin layer.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses in, through the glass dielectric layer and the epoxy layer that set up, when the base plate used, because the temperature is higher, utilize the characteristic of glass dielectric layer and epoxy layer for the base plate reaches high temperature resistant, anticorrosion and quick radiating function, makes when the base plate used, and the function is better.

2. The utility model discloses in, through the heat dissipation copper sheet and the heat dissipation coating that set up, when the base plate uses, through connecting block joint substrate and heat dissipation copper sheet, through the good thermal diffusivity of heat dissipation copper sheet to carry out quick heat dissipation through the heat dissipation coating cooperation, when making the base plate use, the thermal diffusivity is better, and the heat dissipation is rapider.

3. The utility model discloses in, through the mounting groove and the installation head that set up, when the base plate used, especially when the base plate of LED lamp used, because the LED lamp damaged easily, and traditional connected mode is the welding, it is convenient inadequately to maintain to change, through installation head fixed mounting lamp holder, and through installation head and mounting groove threaded connection for when the base plate used, it was more convenient to maintain to change.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is an enlarged structural view of the area A of the present invention;

FIG. 3 is an enlarged view of the area B of the present invention;

in the figure: 1-substrate body, 2-fixing plate, 3-mounting block, 4-lamp holder, 5-mounting head, 6-mounting groove, 7-glass medium layer, 8-epoxy resin layer, 9-side sealing plate, 10-mounting plate, 11-bottom plate, 12-connecting block, 13-radiating copper sheet, 14-radiating coating, 15-connecting piece, 16-contact, 17-circuit, 18-interlayer and 19-rubber cushion block

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, rather than all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative work belong to the protection scope of the present invention based on the embodiments of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution:

a high-thermal-efficiency substrate structure comprises a substrate main body 1, a fixing plate 2, a mounting groove 6 and a heat dissipation copper sheet 13, wherein an epoxy resin layer 8 is fixedly mounted at the top of the substrate main body 1, a glass medium layer 7 is fixedly mounted at the top of the epoxy resin layer 8, and the glass medium layer 7 and the epoxy resin layer 8 are arranged, so that when the substrate is used, due to the fact that the temperature is high, the substrate achieves the functions of high temperature resistance, corrosion resistance and rapid heat dissipation by utilizing the characteristics of the glass medium layer 7 and the epoxy resin layer 8, when the substrate is used, the functions are better, the fixing plate 2 is fixedly mounted at the center of the top of the glass medium layer 7, the mounting groove 6 is fixedly formed in the center of the fixing plate 2, and when the substrate is used, particularly when the substrate of an LED lamp is used, and the traditional connection mode is welding, the maintenance and the replacement are not convenient enough, the lamp holder 4 is fixedly installed by the installation head 5, and the installation head 5 is in threaded connection with the installation groove 6, so that the maintenance and the replacement are more convenient when the substrate is used, an internal thread is arranged in the installation groove 6, an external thread is arranged outside the installation head 5, the installation head 5 is fixedly installed in the installation groove 6, the installation block 3 is fixedly installed at the top of the installation head 5, the lamp holder 4 is fixedly installed at the top of the installation block 3, the connecting piece 15 is fixedly installed at the bottom of the installation groove 6, the bottom of the contact 16 on the connecting piece 15 is fixedly connected with the circuit 17, the contact 16 is fixedly installed at one end of the connecting piece 15, the circuit 17 is fixedly installed in the substrate main body 1, the interlayer 18, a bottom plate 11 is fixedly installed at the bottom of the interlayer 18, side sealing plates 9 are fixedly installed on the outer side of the bottom plate 11, the side sealing plates 9 are fixedly connected with the outer sides of the substrate main body 1, the glass medium layer 7 and the epoxy resin layer 8, an installation plate 10 is fixedly installed on the outer side of the side sealing plates 9, a connection block 12 is fixedly installed on the bottom plate 11, a heat dissipation copper sheet 13 is fixedly installed at the bottom of the connection block 12, when the substrate is used, the substrate and the heat dissipation copper sheet 13 are connected through the connection block 12, good heat dissipation performance is realized through the heat dissipation copper sheet 13, and rapid heat dissipation is realized through the cooperation of the heat dissipation coating 14, so that when the substrate is used, the heat dissipation performance is better, the heat dissipation is quicker, the heat dissipation copper sheet 13 is provided with two layers, a gap is arranged between the two layers, the connection, has certain popularization value.

The utility model discloses work flow: when the LED lamp is used, due to the fact that the glass medium layer 7 and the epoxy resin layer 8 are arranged, when the substrate is used, due to the fact that the temperature is high, the substrate achieves the functions of high temperature resistance, corrosion resistance and rapid heat dissipation by utilizing the characteristics of the glass medium layer 7 and the epoxy resin layer 8, when the substrate is used, the substrate is better in function, when the substrate is used, the substrate and the heat dissipation copper sheet 13 are connected through the connecting block 12, the heat dissipation performance is good through the heat dissipation copper sheet 13, the heat dissipation is rapid through the cooperation of the heat dissipation coating 14, when the substrate is used, the heat dissipation performance is better and the heat dissipation is quicker, when the substrate is used, particularly when the substrate of the LED lamp is used, due to the fact that the LED lamp is easy to damage, the traditional connection mode is welding, the maintenance and the replacement are not convenient enough, the lamp holder 4 is fixedly installed, and the mounting head 5 is in threaded connection with the mounting groove 6, so that the substrate is more convenient to maintain and replace when in use, and has certain popularization value.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a base plate structure that thermal efficiency is high, includes base plate main part (1), fixed plate (2), mounting groove (6) and heat dissipation copper sheet (13), its characterized in that: the glass substrate comprises a substrate body (1), wherein an epoxy resin layer (8) is fixedly mounted at the top of the substrate body (1), a glass medium layer (7) is fixedly mounted at the top of the epoxy resin layer (8), a fixing plate (2) is fixedly mounted at the center of the top of the glass medium layer (7), a mounting groove (6) is fixedly formed in the center of the fixing plate (2), a mounting head (5) is fixedly mounted inside the mounting groove (6), a mounting block (3) is fixedly mounted at the top of the mounting head (5), a lamp cap (4) is fixedly mounted at the top of the mounting block (3), a connecting piece (15) is fixedly mounted at the bottom of the mounting groove (6), a contact (16) is fixedly mounted at one end of the connecting piece (15), a circuit (17) is fixedly mounted inside the substrate body (1), an interlayer (18) is arranged at, interlayer (18) bottom fixed mounting has bottom plate (11), bottom plate (11) outside fixed mounting has side seal board (9), side seal board (9) outside fixed mounting has mounting panel (10), fixed mounting has connecting block (12) on bottom plate (11), connecting block (12) bottom fixed mounting has heat dissipation copper sheet (13), heat dissipation copper sheet (13) bottom fixed coating has heat dissipation coating (14).

2. A thermally efficient substrate structure according to claim 1, wherein: the bottom of the upper contact (16) of the connecting piece (15) is fixedly connected with a circuit (17).

3. A thermally efficient substrate structure according to claim 1, wherein: the connecting block (12) penetrates through the bottom plate (11) to be in contact with the interlayer (18).

4. A thermally efficient substrate structure according to claim 1, wherein: the heat dissipation copper sheet (13) is provided with two layers, and a gap is arranged between the two layers.

5. A thermally efficient substrate structure according to claim 1, wherein: the mounting structure is characterized in that internal threads are arranged inside the mounting groove (6), and external threads are arranged outside the mounting head (5).

6. A thermally efficient substrate structure according to claim 1, wherein: and the side sealing plates (9) are fixedly connected with the outer sides of the substrate main body (1), the glass medium layer (7) and the epoxy resin layer (8).