CN214046152U - Copper-clad plate with cold spraying bonding pad structure - Google Patents
Copper-clad plate with cold spraying bonding pad structure Download PDFInfo
- Publication number
- CN214046152U CN214046152U CN202120205888.8U CN202120205888U CN214046152U CN 214046152 U CN214046152 U CN 214046152U CN 202120205888 U CN202120205888 U CN 202120205888U CN 214046152 U CN214046152 U CN 214046152U
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- China
- Prior art keywords
- copper
- foil layer
- layer
- welding
- clad plate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000010288 cold spraying Methods 0.000 title claims abstract description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 53
- 238000003466 welding Methods 0.000 claims abstract description 42
- 239000011889 copper foil Substances 0.000 claims abstract description 41
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 27
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000010949 copper Substances 0.000 claims abstract description 13
- 229910052802 copper Inorganic materials 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 11
- 239000007921 spray Substances 0.000 claims abstract description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000011888 foil Substances 0.000 claims description 17
- 238000004512 die casting Methods 0.000 claims description 4
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 230000006872 improvement Effects 0.000 description 10
- 238000005507 spraying Methods 0.000 description 6
- 239000005030 aluminium foil Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
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- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The utility model relates to the technical field of copper-clad plates, in particular to a copper-clad plate with a cold spraying bonding pad structure, which comprises a substrate layer, a copper foil layer connected with the substrate layer, a connecting layer arranged between the copper foil layer and the substrate layer, and a bonding pad formed on the surface of the copper foil layer by cold spraying; the copper foil layer is provided with a welding groove, the welding disc is sprayed in the welding groove, and the welding disc is an aluminum welding disc, a copper welding disc or a tin welding disc; the utility model discloses a pad that cold spray mode formed makes things convenient for the structural weld, can weld to arbitrary material, and the welding is convenient, and the structure is reliable.
Description
Technical Field
The utility model relates to a copper-clad plate technical field especially relates to a copper-clad plate that possesses cold spray welding dish structure.
Background
The copper clad laminate is also called as a copper clad laminate and is divided into a single-sided copper clad laminate and a double-sided copper clad laminate, wherein the single-sided copper clad laminate is a plate-shaped material prepared by soaking electronic glass fiber cloth or other reinforcing materials with resin and covering copper foil on one side and hot-pressing, and various printed circuit boards with different forms and different functions are all processed, etched, drilled, plated with copper and the like on the copper clad laminate selectively.
The copper-clad plate mainly plays roles of interconnection, conduction, insulation and support for the printed circuit board, and has great influence on the transmission speed, energy loss, characteristic impedance and the like of signals in the circuit, so that the performance, quality, processability in manufacturing, manufacturing level, manufacturing cost, long-term reliability and stability of the printed circuit board are greatly dependent on the copper-clad plate.
The existing copper-clad plate is generally formed in a copper-clad mode in the production process, the mode is a traditional process, welding can not be directly carried out on the copper-clad plate in use, and tin is required to be additionally added for connection and fixation.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, the utility model provides an adopted the cold pad that spouts the mode and form makes things convenient for the structural weld, can weld to arbitrary material, and the welding is convenient, the reliable copper-clad plate that possesses cold pad structure that spouts of structure.
The utility model adopts the technical proposal that: a copper-clad plate with a cold spraying bonding pad structure comprises a substrate layer, a copper foil layer connected to the substrate layer, a connecting layer arranged between the copper foil layer and the substrate layer, and a bonding pad formed on the surface of the copper foil layer through cold spraying; the copper foil layer is provided with a welding groove, the welding pad is sprayed in the welding groove, and the welding pad is an aluminum welding pad, a copper welding pad or a tin welding pad.
In a further improvement of the above scheme, the substrate layer is a substrate film, an aluminum substrate or a titanium alloy substrate.
The further improvement of the scheme is that the thickness dimension of the base material layer is smaller than that of the copper foil layer.
In a further improvement of the above scheme, the width dimension or the length dimension of the substrate layer is larger than the width dimension or the length dimension of the copper foil layer.
The further improvement of the scheme is that an aluminum foil layer is arranged inside the copper foil layer.
The further improvement of the scheme is that the aluminum foil layer is integrally formed inside the copper foil layer in a die-casting mode.
The further improvement of the scheme is that the aluminum foil layer is provided with a plurality of through holes.
The further improvement of the scheme is that the thickness of the aluminum foil layer is half of that of the copper foil layer.
The scheme is further improved in that the connecting layer is a connecting glue layer.
The further improvement of the scheme is that the welding groove is communicated to the aluminum foil layer, and the welding pad is connected to the aluminum foil layer.
The utility model has the advantages that:
compare traditional copper-clad plate, the utility model provides a current inconvenient problem of copper-clad plate welding, adopted the pad that the cold spray mode formed, make things convenient for the structural weld, can weld to arbitrary material, it is convenient to weld, and the structure is reliable, and an organic whole nature is strong. Specifically, a substrate layer, a copper foil layer connected to the substrate layer, a connecting layer arranged between the copper foil layer and the substrate layer, and a bonding pad formed on the surface of the copper foil layer through cold spraying are arranged; the welding groove has been seted up on the copper foil layer, the pad spraying is in this welding inslot, the pad is aluminium pad, copper pad or soldering dish, selects the pad material to carry out the spraying according to required welded material, can effectively guarantee spraying effect and service strength, and the practicality is strong.
Drawings
Fig. 1 is a schematic diagram of the explosion structure of the present invention;
fig. 2 is a schematic structural diagram of the present invention.
Description of reference numerals: substrate layer 1, copper foil layer 2, welding groove 21, aluminium foil layer 22, through-hole 221, articulamentum 3, pad 4.
Detailed Description
The present invention will be further described with reference to the accompanying drawings.
As shown in fig. 1-2, a copper-clad plate with a cold spray bonding pad structure comprises a substrate layer 1, a copper foil layer 2 connected to the substrate layer 1, a connecting layer 3 arranged between the copper foil layer 2 and the substrate layer 1, and a bonding pad 4 formed on the surface of the copper foil layer 2 by cold spray; the copper foil layer 2 is provided with a welding groove 21, the bonding pad 4 is sprayed in the welding groove 21, and the bonding pad 4 is an aluminum bonding pad 4, a copper bonding pad 4 or a tin soldering pad 4.
The substrate layer 1 is a substrate film, an aluminum substrate or a titanium alloy substrate, and a half of the substrate film or the aluminum substrate is formed, so that the structure is reliable, and the stability coefficient is high.
1 thickness dimension of substrate layer is less than the thickness dimension of copper foil layer 2, and the further improvement does, and 1 width dimension of substrate layer or length dimension are greater than the width dimension or the length dimension of copper foil layer 2, make things convenient for the fixed of substrate layer 1 and install, and simple structure is reliable.
The inside aluminium foil layer 22 that is provided with of copper foil layer 2, the further improvement does, and the integrative die-casting shaping of aluminium foil layer 22 adopts integrative die-casting shaping inside copper foil layer 2, and the structure is reliable, and an organic whole nature is strong, can strengthen holistic heat transfer effect through aluminium foil layer 22.
The aluminum foil layer 22 is provided with a plurality of through holes 221, the connecting area can be enlarged through the through holes 221, and the practicability is high.
The thickness of the aluminum foil layer 22 is half of that of the copper foil layer 2, so that the aluminum foil layer 22 is conveniently coated and formed into a whole.
The connecting layer 3 is a connecting glue layer, so that the connecting effect is improved, and the integrity is strong.
The welding groove 21 is communicated to the aluminum foil layer 22, and the welding pad 4 is connected to the aluminum foil layer 22, so that the overall connection strength is guaranteed, conductive transmission is facilitated, and the stability is improved.
The utility model provides a current inconvenient problem of copper-clad plate welding, adopted the pad 4 that the cold spray mode formed, make things convenient for the structural weld, can weld to arbitrary material, the welding is convenient, and the structure is reliable, and an organic whole nature is strong. Specifically, a substrate layer 1, a copper foil layer 2 connected to the substrate layer 1, a connecting layer 3 arranged between the copper foil layer 2 and the substrate layer 1, and a bonding pad 4 formed on the surface of the copper foil layer 2 through cold spraying are arranged; welding groove 21 has been seted up to copper foil layer 2, pad 4 spraying is in this welding groove 21, pad 4 is aluminium pad 4, copper pad 4 or soldering dish 4, selects pad 4 material to carry out the spraying according to required welded material, can effectively guarantee spraying effect and use intensity, and the practicality is strong.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. The utility model provides a copper-clad plate that possesses cold spray pad structure which characterized in that: the bonding pad comprises a substrate layer, a copper foil layer connected to the substrate layer, a connecting layer arranged between the copper foil layer and the substrate layer, and a bonding pad formed on the surface of the copper foil layer through cold spraying; the copper foil layer is provided with a welding groove, the welding pad is sprayed in the welding groove, and the welding pad is an aluminum welding pad, a copper welding pad or a tin welding pad.
2. The copper-clad plate with the cold spraying bonding pad structure according to claim 1, wherein: the substrate layer is a substrate film, an aluminum substrate or a titanium alloy substrate.
3. The copper-clad plate with the cold spraying bonding pad structure according to claim 2, wherein: and the thickness dimension of the substrate layer is smaller than that of the copper foil layer.
4. The copper-clad plate with the cold spraying bonding pad structure according to claim 3, wherein: the width dimension or the length dimension of the base material layer is larger than that of the copper foil layer.
5. The copper-clad plate with the cold spraying bonding pad structure according to claim 4, wherein: and an aluminum foil layer is arranged inside the copper foil layer.
6. The copper-clad plate with the cold spraying bonding pad structure according to claim 5, wherein: the aluminum foil layer is integrally formed inside the copper foil layer in a die-casting mode.
7. The copper-clad plate with the cold spraying bonding pad structure according to claim 6, wherein: the aluminum foil layer is provided with a plurality of through holes.
8. The copper-clad plate with the cold spraying bonding pad structure according to claim 7, wherein: the thickness dimension of the aluminum foil layer is half of that of the copper foil layer.
9. The copper-clad plate with the cold spray welding pad structure according to claim 8, wherein: the connecting layer is a connecting glue layer.
10. The copper-clad plate with the cold spraying bonding pad structure according to claim 9, wherein: the welding groove is communicated to the aluminum foil layer, and the welding disc is connected to the aluminum foil layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120205888.8U CN214046152U (en) | 2021-01-26 | 2021-01-26 | Copper-clad plate with cold spraying bonding pad structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120205888.8U CN214046152U (en) | 2021-01-26 | 2021-01-26 | Copper-clad plate with cold spraying bonding pad structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214046152U true CN214046152U (en) | 2021-08-24 |
Family
ID=77347714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120205888.8U Expired - Fee Related CN214046152U (en) | 2021-01-26 | 2021-01-26 | Copper-clad plate with cold spraying bonding pad structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214046152U (en) |
-
2021
- 2021-01-26 CN CN202120205888.8U patent/CN214046152U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210824 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |